CN105367062A - Corrosion-resistant high-elasticity composite silicon carbide-based ceramic circuit board substrate material and preparation method thereof - Google Patents

Abstract

The invention discloses a corrosion-resistant high-elasticity composite silicon carbide-based ceramic circuit board substrate material. According to a carbide-based ceramic substrate, micron-grade silicon carbide, magnesia-alumina spinel and nanometer boron nitride powder are compositely used, so that the substrate material has excellent mechanical property and has excellent elasticity, corrosion resistance and thermal shock resistance. The powder wettability and bonding capacity are high due to a polyethylene glycol complex solvent containing transparent nanometer ceramic powder liquid, materials are evenly dispersed and coated, and high-density green bodies are manufactured. The composite ceramic substrate excellent in comprehensive performance can be obtained by utilizing the green bodies at a relatively low sintering temperature, and the composite ceramic substrate is good in electrical insulating property, high in heat conduction and heat dissipation efficiency, low in production cost, durable and huge in application potential.

Description

Silica-based ceramic circuit board baseplate material of a kind of anticorrosive elastomeric compound carbonizing and preparation method thereof

Technical field

The present invention relates to silicon carbide ceramics preparing technical field, particularly relate to silica-based ceramic circuit board baseplate material of a kind of anticorrosive elastomeric compound carbonizing and preparation method thereof.

Background technology

Along with the increase of electronic devices and components power and density, cause unit volume thermal value also to increase thereupon, require more and more higher to the over-all properties of circuit substrate, wherein ceramic substrate possesses good over-all properties, in insulativity, thermal conductivity and thermal expansivity, have outstanding performance in the aspects such as chemical stability, be widely used in gradually in baseplate material, wherein continue to use more of a specified duration mainly with aluminum oxide, beryllium oxide is as raw substrate, but alumina ceramic plate to there is thermal conductivity low, the shortcomings such as thermal expansivity and Si do not match, although beryllium oxide ceramics over-all properties is comparatively excellent, but its production cost is higher, poisonous, although aluminium nitride ceramics over-all properties is comparatively excellent, but production cost is higher, application is also restricted, otherwise then there is in use properties using silicon carbide as baseplate material comparatively significantly advantage.

Although having a extensive future of silicon carbide ceramics substrate, but the problem that has in actual production process that sintered density is low, raw material availability is low, insulativity has much room for improvement etc., govern the extensive use of this kind of material, be badly in need of doing further improvement from preparation of raw material and production technique.

Summary of the invention

The object of the invention is exactly the defect in order to make up prior art, provides silica-based ceramic circuit board baseplate material of a kind of anticorrosive elastomeric compound carbonizing and preparation method thereof.

The present invention is achieved by the following technical solutions:

The silica-based ceramic circuit board baseplate material of a kind of anticorrosive elastomeric compound carbonizing, this material is made up of the raw material of following weight part: silicon carbide 60-70, tindioxide 1-2, magnesium-aluminium spinel 10-12, nm-class boron nitride 8-10, silane coupling agent kh5501-2, glycerine 8-10, ethylene glycol 5-6, polyoxyethylene glycol 1-2, nano-ceramic powder transparent liquid 10-12, deionized water 50-60.

The preparation method of the described silica-based ceramic circuit board baseplate material of a kind of anticorrosive elastomeric compound carbonizing is:

(1) first by silicon carbide, magnesium-aluminium spinel Ball milling 12-15h, after adding nm-class boron nitride, silane coupling agent kh550 continuation mixing and ball milling dispersion 3-4h subsequently, add other leftover materials, airtight mixing and ball milling dispersion 4-5h, crosses 200-300 mesh sieve by after gained slurry complete drying;

(2) the above-mentioned powder that sieves is dropped into compression moulding in mould, gained base substrate carries out binder removal process at 400-500 DEG C, after process terminates, base substrate is sent in vacuum resistance furnace, wherein the throughput ratio of nitrogen and hydrogen is 1:0.5-0.6, and with the temperature of 1450-1550 DEG C sintering 4-5h under nitrogen and hydrogen gas mixture atmosphere, naturally cool to room temperature after terminating, obtain described composite ceramic-based panel material.

Types of silicon carbide-based ceramics substrate prepared by the present invention is with micron-sized silicon carbide, the boron nitride powder compound use of magnesium-aluminium spinel and nanometer scale, body material is made to possess excellent mechanical property, show excellent rebound resilience and corrosion-resistant, thermal shock resistance, and containing nano-ceramic powder transparent liquid polyoxyethylene glycol double solvents to the wetting property between powder and viscosifying power strong, each storeroom can be made dispersed coated, make the base substrate of high-compactness, base substrate can obtain the composite ceramic substrate of high comprehensive performance under relatively low sintering temperature, its electrical insulating property is good, heat conduction and heat radiation efficiency is high, production cost is low, durable in use, application potential is huge.

Embodiment

This embodiment stupalith is made up of the raw material of following weight part: silicon carbide 60, tindioxide 1, magnesium-aluminium spinel 10, nm-class boron nitride 8, silane coupling agent kh5501, glycerine 8, ethylene glycol 5, polyoxyethylene glycol 1, nano-ceramic powder transparent liquid 10, deionized water 50.

Its preparation method is:

(1) first by silicon carbide, magnesium-aluminium spinel Ball milling 12h, after adding nm-class boron nitride, silane coupling agent kh550 continuation mixing and ball milling dispersion 3h subsequently, add other leftover materials, airtight mixing and ball milling dispersion 4h, crosses 200 mesh sieves by after gained slurry complete drying;

(2) the above-mentioned powder that sieves is dropped into compression moulding in mould, gained base substrate carries out binder removal process at 400 DEG C, after process terminates, base substrate is sent in vacuum resistance furnace, wherein the throughput ratio of nitrogen and hydrogen is 1:0.5, and with the temperature of 1500 DEG C sintering 4.5h under nitrogen and hydrogen gas mixture atmosphere, naturally cool to room temperature after terminating, obtain described composite ceramic-based panel material.

The performance test structure of the substrate that this embodiment obtains is:

Volume density: 3.52g/cm ³; Flexural strength: 558.4MPa; Thermal conductivity: 152.6(W/m.k).

Claims (2)

1. the silica-based ceramic circuit board baseplate material of anticorrosive elastomeric compound carbonizing, it is characterized in that, this material is made up of the raw material of following weight part: silicon carbide 60-70, tindioxide 1-2, magnesium-aluminium spinel 10-12, nm-class boron nitride 8-10, silane coupling agent kh5501-2, glycerine 8-10, ethylene glycol 5-6, polyoxyethylene glycol 1-2, nano-ceramic powder transparent liquid 10-12, deionized water 50-60.

2. silica-based ceramic circuit board baseplate material of a kind of anticorrosive elastomeric compound carbonizing as claimed in claim 1 and preparation method thereof, it is characterized in that, described preparation method is:

(1) first by silicon carbide, magnesium-aluminium spinel Ball milling 12-15h, after adding nm-class boron nitride, silane coupling agent kh550 continuation mixing and ball milling dispersion 3-4h subsequently, add other leftover materials, airtight mixing and ball milling dispersion 4-5h, crosses 200-300 mesh sieve by after gained slurry complete drying;

(2) the above-mentioned powder that sieves is dropped into compression moulding in mould, gained base substrate carries out binder removal process at 400-500 DEG C, after process terminates, base substrate is sent in vacuum resistance furnace, wherein the throughput ratio of nitrogen and hydrogen is 1:0.5-0.6, and with the temperature of 1450-1550 DEG C sintering 4-5h under nitrogen and hydrogen gas mixture atmosphere, naturally cool to room temperature after terminating, obtain described composite ceramic-based panel material.