CN105356291A - Method for quickly arranging semiconductor laser pipe caps - Google Patents
Method for quickly arranging semiconductor laser pipe caps Download PDFInfo
- Publication number
- CN105356291A CN105356291A CN201510822431.0A CN201510822431A CN105356291A CN 105356291 A CN105356291 A CN 105356291A CN 201510822431 A CN201510822431 A CN 201510822431A CN 105356291 A CN105356291 A CN 105356291A
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- China
- Prior art keywords
- pipe cap
- tray
- cap
- intermediate tray
- pipe
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
Abstract
The invention relates to a method for quickly arranging semiconductor laser pipe caps, which comprises the steps that scattered pipe caps on an initial tray are enabled to be placed in circular holes of the initial tray, and openings of the pipe caps face upward; (2) an intermediate tray is placed on the initial tray, and the two trays are overturned, so that the pipe caps are placed on circular columns of the intermediate tray according to the original arrangement, the bottom parts of the pipe caps face upward, and the openings face downward; and (3) a terminal tray is placed on the intermediate tray, the two trays are overturned, the terminal tray is enabled to be located below, each pipe cap is placed in a groove formed by four adjacent convex columns on the terminal tray in an enclosing manner, the opening of each pipe cap faces upward, and the arrangement sequence and the arrangement state of the pipe caps on the terminal tray are positions when an automatic cap sealing machine takes the pipe caps. The method provided by the invention solves a work defect that manual cap arrangement is slow in speed, the pipe caps are enabled to be orderly arranged, and matching with the pipe cap trays of the cap sealing machine is good. In addition, the number of arranged pipe caps is great in one time, continuous working of the cap sealing machine is ensured, and the work efficiency is greatly improved.
Description
Technical field
The present invention relates to a kind of for making the pipe cap of semiconductor laser arrange fast so that the method for cap sealing machine noise spectra of semiconductor lasers sealing cap, belong to semiconductor laser pipe cap permutation technology field.
Background technology
Through the development of decades, semiconductor laser is more and more known by society, and be applied in field, many places, the photoelectric conversion efficiency of semiconductor laser is more than 60%, far away higher than the photoelectric conversion efficiency of other like products, the advantages such as its energy consumption is low, and in device, heat accumulation is few, the life-span is long, collimation is good, illumination distances is far away are more and more extensive as a kind of emerging technology application in the similar industry of society.All kinds of advantages that semiconductor laser has determine its more and more higher extensive attention being subject to various circles of society.What the work of semiconductor laser was mainly leaned on is inside chip, chip projects laser after powered up, and chip price is expensive, used material is more special, and be fine in texture, itself is more fragile, easy breakage, and chip environmental requirement is higher to external world, must be dustfree environment, once be polluted or have breakage will have influence on the performance of whole semiconductor laser.Chip, as the core component of semiconductor laser, once be polluted or have breakage will bring beyond thought consequence to whole device, seriously can make whole device scrap.The visible protection to chip is an of paramount importance link in whole production process.Because product forever can not be placed in dustfree environment; and embarrass the impact that can be subject to external force and bring in operation transportation; in order to avoid the harm that external force is brought it in transport or assembling process of semiconductor laser internal core device; drop to minimum by external environment condition to the pollution level that it brings in other words, safeguard measure certain is thus inevitable.
Safeguard measure miscellaneous is there is at present in the industry; but it is excellent scarce different; at present the practical and guard method that Application comparison is many mainly above base chip placement position on a protective cap being used for protect IC is set; this protective cap well protects chip, avoids semiconductor laser affects its quality external issues in pollution, breakage, cut etc. that the operate miss of transporting in assembling process or external force cause chip.This protective cap is again pipe cap (being referred to as pipe cap in following content) at production field; what pipe cap adopted is that particulate metal quality is (because exist company to produce secret; inconvenience describes in detail); this pipe cap light quality; hardness is strong; corrosion-resistant, well coordinate the profile of semiconductor laser, and serve the effect of protection inside chip.
The effect that pipe cap wants to play protection semiconductor laser must be coupled to suitable position.In whole encapsulation work, be provided with special operation at present, protection pipe cap is coupled on semiconductor laser by this operation main purpose exactly, makes it play due effect, and this operation as its name suggests, is called sealing cap operation.Pipe cap is mainly fixed on semiconductor laser by special automatic cap sealing machine by current sealing cap work.But the work characteristics of cap sealing machine requires the location that puts in order that pipe cap must require according to it automatically, and if not will have influence on the continuation of whole sealing cap work, serious words can damage product or pipe cap.So just amplify out a problem: need to carry out special sequence to pipe cap.
Do not carry out at present the device of pipe cap arrangement specially, operator can only be free-hand by the pipe cap scratch diskette being placed in automatic cap sealing machine one by one, so that automatic cap sealing machine takes pipe cap away.So not only have impact on speed of production, and labor intensive.Next is exactly that the peculiar protective position of pipe cap determines that it can not be contaminated.Free-hand arrangement one by one by pipe cap can touch pipe cap unavoidably, can cause certain pollution to a certain extent to pipe cap, can have influence on the quality of whole semiconductor laser to a certain extent.
Chinese patent literature CN104008990A discloses a kind of self-align rack mounting method of pipe cap, in the method according to the size of pipe cap, design and embeddedly accordingly shelve quartz molds, adopt and first place the rack mounting method that weld-ring places solder and pipe cap again, do not need compression and manually just pull out, realizing the self-align of pipe cap.The Position Design in the length adopting the method can shelve locating notch by embedded, width and the degree of depth three directions realizes the self-align of pipe cap, simplifies multiple working procedure, completes the positioning sorting of pipe cap, substantially increase the consistency of pipe cap arrangement.But this method operating efficiency is too low, the workflow of needs is too loaded down with trivial details.Embedded quartz molds is heavy, is unfavorable for improving operating rate.
Summary of the invention
For the permutation technology Problems existing of existing semiconductor laser pipe cap, the invention provides a kind of pipe cap marshalling, quick aligning method with the semiconductor laser pipe cap that pipe cap pallet is worked good, operating efficiency is high of cap sealing machine.
The quick aligning method of semiconductor laser pipe cap of the present invention, comprises the following steps:
(1) taking out scattered pipe cap is arbitrarily piled up on an initial pallet, this initial pallet is distributed with the circular hole for placing pipe cap of marshalling, the external diameter of circular hole matches with the external diameter of pipe cap, round-meshed arrangement consistent with the ordered state that automatic cap sealing machine is got required for cap; Rocked by hand, make to place a pipe cap in each circular hole of initial pallet, and the opening upwards of pipe cap, unnecessary pipe cap is taken away;
(2) be placed on initial pallet by an intermediate tray, this intermediate tray is distributed with the cylinder for placing pipe cap of marshalling, the external diameter of cylinder and the diameter compatible of pipe cap close, and the arrangement of all cylinders is consistent with the arrangement of circular hole on initial pallet; Intermediate tray is placed on after on initial pallet, and the cylinder on intermediate tray inserts in the endoporus of pipe cap; Intermediate tray and initial pallet are overturn, make intermediate tray under, remove initial pallet, each like this pipe cap is all placed on the cylinder of intermediate tray by original arrangement, and, Open Side Down bottom pipe cap upwards;
(3) terminal tray is placed on intermediate tray, this terminal tray is distributed with the protruding post of marshalling, in the groove that adjacent four protruding posts surround, a pipe cap can be placed, reeded arrangement consistent with the arrangement of cylinder on intermediate tray; Terminal tray and intermediate tray are overturn, make terminal tray under, remove intermediate tray, each pipe cap has just been placed in the groove on terminal tray, and the opening upwards of pipe cap, now pipe cap on terminal tray put in order and placement state is exactly the position of automatic cap sealing machine when getting pipe cap.
Described initial pallet and terminal tray are provided with reference column.
Described intermediate tray is provided with location hole.
The invention solves the slow-footed work drawback of free-hand pendulum cap, make pipe cap marshalling, work good with cap sealing machine pipe cap pallet, and the quantity of once putting cap is comparatively large, ensure that the continuous firing of cap sealing machine, substantially increases operating efficiency.Compared with prior art, have the following advantages:
1. improve operating rate greatly, save the time;
2. avoid manual pendulum cap to the pollution of its pipe cap;
3. decrease the quantity of pendulum cap personnel, save manpower, decrease artificial amount, accomplish the effect of getting twice the result with half the effort;
4. the pallet volume used is little, and structure is simple, and processing is simple, and cost of manufacture is cheap.
Accompanying drawing explanation
Fig. 1 is the structural representation of initial pallet in the present invention.
Fig. 2 is the structural representation of intermediate tray in the present invention.
Fig. 3 is the structural representation of terminal tray in the present invention.
In figure, 1, initial pallet, 2, circular hole, 3, reference column, 4, intermediate tray; 5, location hole, 6, terminal tray.
Embodiment
The quick aligning method of semiconductor laser pipe cap of the present invention, comprises following concrete steps:
(1) make the initial pallet 1 of a structure as shown in Figure 1, this initial pallet 1 be cuboid, it is distributed with in the circular hole 2, Fig. 1 of marshalling the arrangement adopting 10 row * 20 row.The size of this circular hole 2 and the pipe cap external diameter of semiconductor laser adapt, and pipe cap can be placed in circular hole.At least being provided with in reference column 3, Fig. 1 on two angles of initial pallet 1 is on each angle, all arrange two reference columns 3.
(2) make the intermediate tray 4 of a structure as shown in Figure 2, the profile of intermediate tray 4 and size consistent with initial pallet 1.Intermediate tray 4 is distributed with the cylinder 5 of marshalling, the same arrangement adopting 10 row * 20 to arrange, and cylinder 5 position and spacing consistent with circular hole 2 on initial pallet 1.The external diameter of cylinder 5 and the pipe cap internal diameter of semiconductor laser adapt, and pipe cap can be placed on cylinder 5.At least being provided with in location hole 5, Fig. 2 on two angles of intermediate tray 4 is on each angle, all arrange two location holes 5.When initial pallet 1 is superimposed together with intermediate tray about 4, reference column on initial pallet 1 can insert location hole 5 corresponding on intermediate tray 4, initial pallet 1 is located with intermediate tray 4, and the axis of each cylinder 5 that each circular hole 2 now on initial pallet 1 is corresponding with on intermediate tray 4 overlaps.
(3) terminal tray 6 of a structure is as shown in Figure 3 made.Terminal tray 6 is finally cap sealing machine use, its profile and size consistent with intermediate tray 4.6 at least two angles are provided with the reference column the same with initial pallet 1 to terminal tray.Terminal tray 6 is distributed with the protruding post of marshalling, adopts the series arrangement of 11*21 unlike the protruding post on terminal tray 6 with initial pallet 1, among the cross recess that adjacent four protruding posts surround, a pipe cap can be placed.The arrangement of all cross recess is consistent with the cylindrical arrangement on intermediate tray 4.
(4) take out scattered pipe cap to be arbitrarily piled up on initial pallet 1, rocked by hand, make to place a pipe cap in each circular hole 2 of initial pallet 1, and the opening upwards of pipe cap, unnecessary pipe cap is taken away.
(5) intermediate tray 4 is placed on initial pallet 1, by coordinating of location hole 5 on intermediate tray 4 and reference column 3 on initial pallet 1, intermediate tray 4 and initial pallet 1 is located.Now, each cylinder on intermediate tray 4 all inserts in the pipe cap on initial pallet 1 in corresponding circular hole.Then intermediate tray 4 and initial pallet 1 are overturn, make intermediate tray 4 under, remove initial pallet 1.Each like this pipe cap is all placed in by original arrangement on the cylinder of intermediate tray 4, and, Open Side Down bottom pipe cap upwards.
(6) then according to step (5) described mode, pipe cap is transferred on terminal tray 6 by intermediate tray 4.Transfer to the series arrangement that the pipe cap on terminal tray 6 needs according to cap sealing machine, each pipe cap is positioned among the cross recess that adjacent four protruding posts surround, the opening upwards of pipe cap, such design is mainly in order to coordinate the distinctive appearance structure of automatic cap sealing machine material taking arm.That is after second time is turned over, each pipe cap is just in time placed among cross recess, and pipe cap mouth upward, and arrangement specification still arranges according to the square formation of 10*20.To get the final ordered state that 10 row * 20 required for cap arrange consistent with automatic cap sealing machine.Now pipe cap on terminal tray 6 put in order and placement state is position when automatic cap sealing machine gets pipe cap just.
Claims (3)
1. a quick aligning method for semiconductor laser pipe cap, is characterized in that, comprise the following steps:
(1) taking out scattered pipe cap is arbitrarily piled up on an initial pallet, this initial pallet is distributed with the circular hole for placing pipe cap of marshalling, the external diameter of circular hole matches with the external diameter of pipe cap, round-meshed arrangement consistent with the ordered state that automatic cap sealing machine is got required for cap; Rocked by hand, make to place a pipe cap in each circular hole of initial pallet, and the opening upwards of pipe cap, unnecessary pipe cap is taken away;
(2) be placed on initial pallet by an intermediate tray, this intermediate tray is distributed with the cylinder for placing pipe cap of marshalling, the external diameter of cylinder and the diameter compatible of pipe cap close, and the arrangement of all cylinders is consistent with the arrangement of circular hole on initial pallet; Intermediate tray is placed on after on initial pallet, and the cylinder on intermediate tray inserts in the endoporus of pipe cap; Intermediate tray and initial pallet are overturn, make intermediate tray under, remove initial pallet, each like this pipe cap is all placed on the cylinder of intermediate tray by original arrangement, and, Open Side Down bottom pipe cap upwards;
(3) terminal tray is placed on intermediate tray, this terminal tray is distributed with the protruding post of marshalling, in the groove that adjacent four protruding posts surround, a pipe cap can be placed, reeded arrangement consistent with the arrangement of cylinder on intermediate tray; Terminal tray and intermediate tray are overturn, make terminal tray under, remove intermediate tray, each pipe cap has just been placed in the groove on terminal tray, and the opening upwards of pipe cap, now pipe cap on terminal tray put in order and placement state is exactly the position of automatic cap sealing machine when getting pipe cap.
2. the quick aligning method of semiconductor laser pipe cap according to claim 1, is characterized in that, described initial pallet and terminal tray are provided with reference column.
3. the quick aligning method of semiconductor laser pipe cap according to claim 1, is characterized in that, described intermediate tray is provided with location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510822431.0A CN105356291B (en) | 2015-11-24 | 2015-11-24 | A kind of quick aligning method of semiconductor laser pipe cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510822431.0A CN105356291B (en) | 2015-11-24 | 2015-11-24 | A kind of quick aligning method of semiconductor laser pipe cap |
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| Publication Number | Publication Date |
|---|---|
| CN105356291A true CN105356291A (en) | 2016-02-24 |
| CN105356291B CN105356291B (en) | 2018-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510822431.0A Active CN105356291B (en) | 2015-11-24 | 2015-11-24 | A kind of quick aligning method of semiconductor laser pipe cap |
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| Country | Link |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129803A (en) * | 2016-08-11 | 2016-11-16 | 山东华光光电子股份有限公司 | The dress cap device of a kind of semiconductor laser sealing cap and method of work thereof |
| CN106364880A (en) * | 2016-10-25 | 2017-02-01 | 山东华光光电子股份有限公司 | Fast arranging and transferring device for semiconductor laser products and transferring method |
| CN109573642A (en) * | 2018-12-28 | 2019-04-05 | 深圳市芯思杰智慧传感技术有限公司 | A kind of TO cap material transfering device |
| CN110676687A (en) * | 2018-07-02 | 2020-01-10 | 潍坊华光光电子有限公司 | Cap mounting device and method for welding semiconductor laser tube cap |
| CN113049201A (en) * | 2019-12-26 | 2021-06-29 | 潍坊华光光电子有限公司 | Device and method for detecting sealing cap strength of semiconductor laser tube cap |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4691747A (en) * | 1986-03-27 | 1987-09-08 | Advanced Micro Devices, Inc. | Controlled deformation alignment method and apparatus |
| CN104008990A (en) * | 2014-04-21 | 2014-08-27 | 中国电子科技集团公司第五十五研究所 | Self-positioning racking method of ceramic pipe cap for packaging outer shell |
| CN204315912U (en) * | 2014-12-31 | 2015-05-06 | 山东浪潮华光光电子股份有限公司 | A kind of semiconductor laser base PD die bond fixture with guide-localization |
-
2015
- 2015-11-24 CN CN201510822431.0A patent/CN105356291B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4691747A (en) * | 1986-03-27 | 1987-09-08 | Advanced Micro Devices, Inc. | Controlled deformation alignment method and apparatus |
| CN104008990A (en) * | 2014-04-21 | 2014-08-27 | 中国电子科技集团公司第五十五研究所 | Self-positioning racking method of ceramic pipe cap for packaging outer shell |
| CN204315912U (en) * | 2014-12-31 | 2015-05-06 | 山东浪潮华光光电子股份有限公司 | A kind of semiconductor laser base PD die bond fixture with guide-localization |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129803A (en) * | 2016-08-11 | 2016-11-16 | 山东华光光电子股份有限公司 | The dress cap device of a kind of semiconductor laser sealing cap and method of work thereof |
| CN106129803B (en) * | 2016-08-11 | 2018-11-09 | 潍坊华光光电子有限公司 | A kind of the dress cap device and its working method of semiconductor laser sealing cap |
| CN106364880A (en) * | 2016-10-25 | 2017-02-01 | 山东华光光电子股份有限公司 | Fast arranging and transferring device for semiconductor laser products and transferring method |
| CN106364880B (en) * | 2016-10-25 | 2018-09-25 | 山东华光光电子股份有限公司 | A kind of semiconductor laser product quickly arranges transfer device and transfer method |
| CN110676687A (en) * | 2018-07-02 | 2020-01-10 | 潍坊华光光电子有限公司 | Cap mounting device and method for welding semiconductor laser tube cap |
| CN109573642A (en) * | 2018-12-28 | 2019-04-05 | 深圳市芯思杰智慧传感技术有限公司 | A kind of TO cap material transfering device |
| CN109573642B (en) * | 2018-12-28 | 2023-11-28 | 芯思杰技术(深圳)股份有限公司 | TO cap material transferring device |
| CN113049201A (en) * | 2019-12-26 | 2021-06-29 | 潍坊华光光电子有限公司 | Device and method for detecting sealing cap strength of semiconductor laser tube cap |
| CN113049201B (en) * | 2019-12-26 | 2022-09-16 | 潍坊华光光电子有限公司 | Device and method for detecting sealing cap strength of semiconductor laser tube cap |
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| Publication number | Publication date |
|---|---|
| CN105356291B (en) | 2018-06-05 |
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Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Applicant after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Applicant before: Shandong Huaguang Photoelectronic Co., Ltd. |
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