CN105349081A - Switching power supply for communication equipment - Google Patents
Switching power supply for communication equipment Download PDFInfo
- Publication number
- CN105349081A CN105349081A CN201510965930.5A CN201510965930A CN105349081A CN 105349081 A CN105349081 A CN 105349081A CN 201510965930 A CN201510965930 A CN 201510965930A CN 105349081 A CN105349081 A CN 105349081A
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- CN
- China
- Prior art keywords
- parts
- heat
- conducting glue
- power supply
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Abstract
The invention discloses a switching power supply for communication equipment. The switching power supply comprises PWM (pulse width modulation) control IC (integrated circuit), an MOS (metal oxide semiconductor) transistor and a heat dissipation structure, wherein the MOS transistor and the heat dissipation structure are fixed together through heat-conducting glue; the heat-conducting glue comprises components in parts by weight as follows: 1-2 parts of amyl acetate, 14.5 parts of halogen-free epoxy resin, 1.7 parts of hexyldecanol, 1. 3 parts of sodium oleoyl amino fatty acid, 2.3 parts of phenyltris(methylethylketoximio)silane, 0.3 parts of acetylene carbon black, 1.5 parts of diisopropylbenzene hydroperoxide, 0.6 parts of aluminium oxide and 1.3 parts of hydroxyl polyphosphate. The heat-conducting glue adopted by the switching power supply has excellent performance, and long-term service of the MOS transistor can be guaranteed.
Description
Technical field
The present invention relates to communication equipment switch power supply.
Background technology
Current communication equipment switch power supply, the heat radiation of its metal-oxide-semiconductor needs to optimize.
Summary of the invention
The object of the present invention is to provide a kind of communication equipment switch power supply, its heat-conducting glue used has excellent bonding strength, ageing-resistant performance, cold-and-heat resistent alternation performance and electrical insulation capability, and there is excellent antidetonation, protection against the tide, Inverter fed motor, anti-electric creepage performance, good heat conductivity, can ensure the life-time service of metal-oxide-semiconductor.
For achieving the above object, technical scheme of the present invention is a kind of communication equipment switch power supply of design, and comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
1 ~ 2 part of amyl acetate-n, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
Preferably, communication equipment switch power supply, comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
1 part of amyl acetate-n, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
Preferably, communication equipment switch power supply, comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
2 parts of amyl acetate-ns, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
Advantage of the present invention and beneficial effect are: provide a kind of communication equipment switch power supply, its heat-conducting glue used has excellent bonding strength, ageing-resistant performance, cold-and-heat resistent alternation performance and electrical insulation capability, and there is excellent antidetonation, protection against the tide, Inverter fed motor, anti-electric creepage performance good heat conductivity, the life-time service of metal-oxide-semiconductor can be ensured.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
The technical scheme that the present invention specifically implements is:
Embodiment 1
A kind of communication equipment switch power supply, comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
1 ~ 2 part of amyl acetate-n, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
Embodiment 2
Communication equipment switch power supply, comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
1 part of amyl acetate-n, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
Embodiment 3
Communication equipment switch power supply, comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
2 parts of amyl acetate-ns, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (3)
1. communication equipment switch power supply, is characterized in that, comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
1 ~ 2 part of amyl acetate-n, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
2. communication equipment switch power supply according to claim 1, is characterized in that, comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
1 part of amyl acetate-n, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
3. communication equipment switch power supply according to claim 1, is characterized in that, comprise pulse-width modulation control IC, metal-oxide-semiconductor and radiator structure, described metal-oxide-semiconductor and radiator structure are fixed together by heat-conducting glue; By weight, described heat-conducting glue is composed of the following components:
2 parts of amyl acetate-ns, 14.5 parts of halogen-free epoxy resins, 1.7 parts of hexyl decyl alcohol, 1.3 parts of oleoyl amino acid sodium, 2.3 parts of phenyl tributanoximo silanes, 0.3 part of acetylene carbon black, 1.5 portions of hydrop diisopropylbenzene(DIPB)s, 0.6 part of aluminum oxide, 1.3 parts of hydroxyl poly phosphates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510965930.5A CN105349081A (en) | 2015-12-22 | 2015-12-22 | Switching power supply for communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510965930.5A CN105349081A (en) | 2015-12-22 | 2015-12-22 | Switching power supply for communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105349081A true CN105349081A (en) | 2016-02-24 |
Family
ID=55325152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510965930.5A Pending CN105349081A (en) | 2015-12-22 | 2015-12-22 | Switching power supply for communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105349081A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103036447A (en) * | 2012-12-14 | 2013-04-10 | 深圳市新国都技术股份有限公司 | Maximum power adjustable switching power supply |
| CN104019586A (en) * | 2014-06-20 | 2014-09-03 | 合肥长城制冷科技有限公司 | Tube-in-sheet evaporator production technology |
-
2015
- 2015-12-22 CN CN201510965930.5A patent/CN105349081A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103036447A (en) * | 2012-12-14 | 2013-04-10 | 深圳市新国都技术股份有限公司 | Maximum power adjustable switching power supply |
| CN104019586A (en) * | 2014-06-20 | 2014-09-03 | 合肥长城制冷科技有限公司 | Tube-in-sheet evaporator production technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160224 |
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| RJ01 | Rejection of invention patent application after publication |