CN105336564B - Electronics vacuum feedthrough - Google Patents
Electronics vacuum feedthrough Download PDFInfo
- Publication number
- CN105336564B CN105336564B CN201510740626.0A CN201510740626A CN105336564B CN 105336564 B CN105336564 B CN 105336564B CN 201510740626 A CN201510740626 A CN 201510740626A CN 105336564 B CN105336564 B CN 105336564B
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- Prior art keywords
- flexible pcb
- component
- epoxide
- holder
- feedthrough
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- 239000000084 colloidal system Substances 0.000 claims abstract description 24
- 239000011159 matrix material Substances 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims description 74
- 239000003822 epoxy resin Substances 0.000 claims description 71
- 229920000647 polyepoxide Polymers 0.000 claims description 71
- 239000000463 material Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 3
- 239000000565 sealant Substances 0.000 claims 3
- 238000010943 off-gassing Methods 0.000 abstract description 16
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 8
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J47/00—Tubes for determining the presence, intensity, density or energy of radiation or particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J47/00—Tubes for determining the presence, intensity, density or energy of radiation or particles
- H01J47/001—Details
Landscapes
- Measurement Of Radiation (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
A kind of electronics vacuum feedthrough of the present invention, including flexible PCB and matrix, through hole is formed on matrix, also include the holder for clamping the flexible PCB, sealed colloid is provided between the flexible PCB and the holder, the flexible PCB and the holder are encapsulated by integrally formed flexible circuit plate-holder component by the sealed colloid, the flexible circuit plate-holder component is encapsulated in the through hole entirely through sealed colloid.The electronics vacuum feedthrough of the present invention has the advantages that high density, high-frequency low noise, low outgassing rate, less leakage rate, can reach high speed, the reading of low-noise electronics on 128 tunnels.
Description
Technical field
The present invention relates to feedthrough field, and in particular to a kind of high-speed low-noise multichannel electronic suitable for space application
Vacuum feedthrough.
Background technology
" the high-speed low-noise multichannel electronic vacuum feedthrough for being applied to space application " is for space X ray detection of gas
Designed by device.Its electronics for being mainly used in detecting universe low energy X ray detector is read.The feedthrough is also applied for other
, particularly there is the application that the electronics vacuum of strict demand is read in field to density, vacuum, outgassing rate, leak rate.
The main function of electronics vacuum feedthrough is the electrical signal in vacuum system is inputted and is exported.Mesh
The electronics vacuum feedthrough of preceding in the market mainly has following several：The single needle feedthrough of the welding of ceramics and stainless steel material,
The sealed D-sub feedthroughs of PEEK materials, the air plug feedthrough of glass-encapsulated.Above-mentioned several electronics vacuum feedthroughs are due to adopting
It is conductor material of the metalwork as electronics vacuum feedthrough, therefore, there is that density is low, way is less asks for communication
A kind of topic, feedthrough as disclosed in Chinese patent literature CN103298762A, feedthrough includes matrix, and matrix is provided with logical
It is in pin-shaped conductor to be provided with hole, through hole, and glass material is provided between conductor and through hole.
It is limited for inner space, and for communication way requirement reaches the gas detector on 128 tunnels, above-mentioned several electronics
The need for vacuum feedthrough can not meet gas detector.Existing in the market is temporarily so highdensity true without that can reach
Empty feedthrough.
The content of the invention
Therefore, the technical problem to be solved in the present invention is to overcome electronics vacuum feedthrough body of the prior art
Product is larger, and communication way is less, it is impossible to meet the defect the need for gas detector, so as to provide a kind of suitable for space application
High-speed low-noise multichannel electronic vacuum feedthrough.
Therefore, for above-mentioned technical problem, the present invention provides a kind of electronics vacuum feedthrough, including：
Flexible PCB；
Matrix, forms through hole thereon, and the flexible PCB is arranged in the through hole, the inwall of the through hole and institute
State between flexible PCB by setting sealed colloid to be packaged.
In the electronics vacuum feedthrough of the present invention, include the holder of the clamping flexible PCB, it is described soft
Property circuit board and the holder between be provided with sealed colloid, by the sealed colloid by the flexible PCB and the folder
Integrally formed flexible PCB-holder the component of gripping member encapsulation, the flexible PCB-holder component overall package is described
In through hole.
In the electronics vacuum feedthrough of the present invention, the material of the holder is ceramic material.
In the electronics vacuum feedthrough of the present invention, the flexible PCB-between holder component and the through hole
For interference fits.
In the electronics vacuum feedthrough of the present invention, one end of the through hole forms injecting glue groove.
In the electronics vacuum feedthrough of the present invention, the injecting glue groove is " V " type hole for being molded over described through hole one end.
In the electronics vacuum feedthrough of the present invention, the flexible PCB is that RO4000 series of frequencies is not less than 500
Million HZ flexible PCB.
In the electronics vacuum feedthrough of the present invention, the material of described matrix is stainless steel or titanium.
In the electronics vacuum feedthrough of the present invention, the sealed colloid is epoxide-resin glue.
In the electronics vacuum feedthrough of the present invention, the epoxide-resin glue is bi-component epoxide-resin glue.
In the electronics vacuum feedthrough of the present invention, the bi-component epoxide-resin glue is 2216Gray epoxy resin
Glue, the B component and component A of the 2216Gray epoxide-resin glues are 5 according to mass ratio:7 are matched.
In the electronics vacuum feedthrough of the present invention, the bicomponent epoxy resin glue is Torr seal epoxy resin
Glue；The component A and B component of the Torr seal epoxide-resin glues, according to mass ratio 2:1 is matched.
A kind of method of manufacture electronics vacuum feedthrough of the present invention, including
Feedthrough overall package step：
It will be inserted as the flexible PCB of the conductor material of feedthrough in the through hole of matrix；
It is packaged that to form feedthrough whole toward sealed colloid is injected between the inwall and the flexible PCB of the through hole
Body；
Feedthrough is integrally solidified.
Also include in the method for the manufacture electronics vacuum feedthrough of the present invention, before feedthrough overall package step soft
Property circuit board package step：
Flexible PCB is clamped by holder, and will toward sealed colloid is injected between flexible PCB and the holder
Integrally formed flexible PCB-holder the component of the two encapsulation；
Flexible PCB-holder component is solidified；
The flexible PCB-holder component after solidification is inserted to the through hole of matrix as the conductor material of feedthrough
It is interior.
In the method for the manufacture electronics vacuum feedthrough of the present invention, fixture pair is used in flexible PCB encapsulation step
Flexible PCB-holder component is solidified again after applying uniform pressure.
In the method for the manufacture electronics vacuum feedthrough of the present invention, the sealed colloid is epoxide-resin glue.
In the method for the manufacture electronics vacuum feedthrough of the present invention, the epoxide-resin glue is bi-component epoxide-resin
Glue.
In the method for the manufacture electronics vacuum feedthrough of the present invention, the bi-component epoxide-resin glue is 2216Gray
Epoxide-resin glue, the B component and component A of the 2216Gray epoxide-resin glues are 5 according to mass ratio:7 are matched；
The epoxy resin glue that proportioning is completed is placed in vacuum<Mix, and be evenly stirred until close in 100Pa vacuum environment
Adhesive body surface does not have obvious bubble, then passes to pure nitrogen to 1 atmospheric pressure.
In the method for the manufacture electronics vacuum feedthrough of the present invention, the bicomponent epoxy resin glue is Torr
Seal epoxide-resin glues；The component A and B component of the Torr seal epoxide-resin glues, according to mass ratio 2:1 is matched；
The epoxy resin glue that proportioning is completed is placed in vacuum<Mix, and be evenly stirred until close in 100Pa vacuum environment
Adhesive body surface does not have obvious bubble, then passes to pure nitrogen to 1 atmospheric pressure.
Technical solution of the present invention, has the following advantages that：
1st, electronics vacuum feedthrough in the present invention, electronics vacuum break-through is used as a result of flexible PCB
The conductor material of part, therefore, it is possible to cause the electronics vacuum feedthrough of the present invention that there is high-frequency low noise, highdensity spy
Point, electronics vacuum feedthrough of the invention can reach the high speed on 128 tunnels, low noise acoustic-electric in 59x8.5mm package area
The reading that son is learned.
2nd, in the present invention, first flexible PCB and ceramic holder are packaged to form flexible PCB-holder
Component, then this component and detector are packaged.This method for packing more may be used with directly encapsulation flexible PCB structure compared
Lean on, its thermal shock resistance can be significantly improved.
3rd, epoxide-resin glue of the invention is using the two-component ring for meeting the low outgassing rate standards of NASA low outgassing
Oxygen resin glue, can reduce the low outgassing rate of the electronics vacuum feedthrough of the present invention, while during bi-component epoxide-resin preparation
It is to be mixed under vacuum conditions, the bubble that this hybrid mode can largely reduce epoxy resin produced by mixing.Cause
This, the characteristics of electronics vacuum feedthrough of the invention also has less leakage rate.
In summary, electronics vacuum feedthrough of the invention has high density, high-frequency low noise, low outgassing rate, low drain
The advantage of rate.
Brief description of the drawings
, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical scheme of the prior art
The accompanying drawing used required in embodiment or description of the prior art is briefly described, it should be apparent that, in describing below
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before creative work is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the electronics vacuum feedthrough of the present invention；
Fig. 2 is the structural representation of flexible PCB-holder component of the present invention；
Description of reference numerals：
1- flexible PCBs；2- epoxide-resin glues；3- holders；
4- matrixes；5- injecting glue grooves.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
The electronics vacuum feedthrough of the present invention is applied to space application, is mainly used in detection universe low energy X ray detection
The electronics of device is read, and has the advantages that high density, high-frequency low noise, low outgassing rate, less leakage rate.Lower mask body introduces the present invention
Electronics vacuum feedthrough structure and preparation method.
Embodiment 1
As shown in Figure 1-2, a kind of electronics vacuum feedthrough of the present embodiment, including：
Flexible PCB 1, preferably described flexible PCB 1 is the flexible electrical that RO4000 series of frequencies is not less than 500,000,000 HZ
Road plate.Selected RO4000 series of flexible circuit boards meet the low outgassing rate standards of NASA low outgassing；
Matrix 4, forms through hole thereon, and the flexible PCB 1 is arranged in the through hole, the inwall of the through hole with
By setting sealed colloid to be packaged between the flexible PCB 1, the material of matrix 4 is preferably stainless steel or titanium.Sealing
Colloid is that air-tightness is good, low outgassing rate, the good colloid of intensity, preferably epoxide-resin glue 2 in vacuum.
Such scheme is the core scheme of the present invention, and electronics vacuum feedthrough is used as a result of flexible PCB 1
Conductor material, therefore, it is possible to cause the present invention electronics vacuum feedthrough there is high-frequency low noise, highdensity feature,
The density of the electronics vacuum feedthrough of the present invention is significantly larger than traditional vacuum electronics feedthrough.The punch-through of design can
With reached in 59x 8.5mm package area the high speed on 128 tunnels, low-noise electronics reading.And in structure design middle ring
Package area very little of the oxygen tree fat inside detector, can so reduce influence of the outgassing to detector of epoxy resin.Cause
This, the characteristics of electronics vacuum feedthrough of the invention also has low outgassing rate.
Further, the holder 3 of the clamping flexible PCB 1, the flexible PCB 1 and the clamping are included
Epoxide-resin glue 2 is provided between part 3, the flexible PCB 1 and the holder 3 is encapsulated by the epoxide-resin glue 2
Integrally formed flexible PCB-holder component, the flexible PCB-holder component overall package is in the through hole.
Ceramic material has low outgassing rate, and the material of preferably described holder 3 is ceramic material, and is tabular, first to flexible PCB
It is packaged to form flexible PCB-holder component with ceramic holder, then this component and detector is packaged.It is this
Method for packing and directly encapsulation flexible PCB structure compared are more reliable, can significantly improve its thermal shock resistance.
Further, the flexible PCB-between holder component and the through hole is interference fits.So in assembling
During can be to the preferable positioning of holder.
Because flexible PCB-gap between holder component and through hole is small, for convenience toward injection ring in the gap
Oxygen resin glue, one end of the through hole forms injecting glue groove 5.It is preferred that the injecting glue groove 5 is " V " for being molded over described through hole one end
Type hole.
The epoxide-resin glue is bi-component epoxide-resin glue.In the present embodiment, preferably described bi-component epoxide-resin
Glue is 2216Gray epoxide-resin glues, and the B component and component A of the 2216Gray epoxide-resin glues are 5 according to mass ratio:7 enter
Row proportioning.Error in proportioning may influence binding agent, its performance is deviateed the data form of reference.Used in experiment
It is that electronic balance is weighed and matched to binding agent, its weighing precision can reach 0.01g.For its measurement error of 5g samples
Highest<0.2%.
A kind of method of manufacture electronics vacuum feedthrough of the present invention, including
Feedthrough overall package step：
It will be inserted as the flexible PCB of the conductor material of feedthrough in the through hole of matrix；
It is packaged toward sealed colloid is injected between the inwall and the flexible PCB of the through hole；It is preferred that the sealing
Colloid is epoxide-resin glue；
The feedthrough of encapsulation is integrally solidified.
Further, it is preferable to also include flexible PCB encapsulation step before feedthrough overall package step：Pass through clamping
Part clamps flexible PCB, and the two is encapsulated into a bodily form toward injection epoxide-resin glue between flexible PCB and the holder
Into flexible PCB-holder component；Flexible PCB-holder component is solidified；By the flexible electrical after solidification
Road plate-holder component is inserted in the through hole of matrix as the conductor material of feedthrough.
Further, folder is used in the outgassing rate of epoxide-resin glue, flexible PCB encapsulation step in order to further reduce
Tool solidifies again after applying uniform pressure to flexible PCB-holder component.
Epoxy resin used in experiment is a epoxy resin for meeting vacuum requirement, and its outgassing rate meets NASA
Low outgassing standards.The epoxide-resin glue is bi-component epoxide-resin glue.It is preferred that the bi-component epoxide-resin glue
For 2216Gray epoxide-resin glues, the B component and component A of the 2216Gray epoxide-resin glues are 5 according to mass ratio:7 are carried out
Proportioning；
The epoxy resin glue that proportioning is completed is placed in vacuum<Mix, and be evenly stirred until close in 100Pa vacuum environment
Adhesive body surface does not have obvious bubble, then passes to pure nitrogen to 1 atmospheric pressure.Epoxy resin glue of the present invention is true
Mixed under Altitude, the bubble that this hybrid mode can largely reduce epoxy resin produced by mixing.And these gas
If in a large amount of sealed colloids occurred after hardening of bubble, deleterious effect can be brought to the sealing property of beryllium window, can be triggered
Gas leak phenomenon.A large amount of bubbles can influence the Gas Escaping Property of sealed colloid in a vacuum in addition, its gas efficiency is increased.Therefore, originally
The characteristics of electronics vacuum feedthrough of invention also has less leakage rate.
In order to ensure that epoxide-resin glue fully can solidify rapidly, in flexible PCB encapsulation step, by flexible PCB-
Holder component is placed in vacuum drying chamber and is heating and curing.It is preferred that heating-up temperature is 93 degrees Celsius, the heat time is 1 hour.
In feedthrough overall package step, the feedthrough after encapsulation is heating and curing in heating in vacuum case.It is preferred that heating-up temperature is 93
Degree Celsius, the heat time is 1 hour.
Embodiment 2
The difference from Example 1 of the present embodiment 2 is the species, proportioning, solidification temperature of used dual-epoxy resin
Degree is different.Specially：The bicomponent epoxy resin glue is the Torr seal epoxide-resin glues of Agilent company；The Torr
The component A and B component of seal epoxide-resin glues, according to mass ratio 2:1 is matched；The epoxy resin glue that proportioning is completed is placed in
Vacuum<Mixed in 100Pa vacuum environment, and be evenly stirred until that sealed colloid surface does not have obvious bubble, then passed to
Pure nitrogen is to 1 atmospheric pressure.
In flexible PCB encapsulation step, flexible PCB-holder component is placed in vacuum drying chamber and heat admittedly
Change.It is preferred that heating-up temperature is 60 degrees Celsius, the heat time is 2 hours.In feedthrough overall package step, to the break-through after encapsulation
Part is heating and curing in heating in vacuum case.It is preferred that heating-up temperature is 60 degrees Celsius, the heat time is 2 hours.
Finally, the multiple detector cavitys completed using helium mass spectrometer leak detector to encapsulation are hunted leak, and its leak rate is whole<
2.0E-10mbar*L/S.The leak rate demand demand of ultra-high vacuum system can be met.
Obviously, above-described embodiment is only intended to clearly illustrate example, and the not restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (17)
1. a kind of electronics vacuum feedthrough, it is characterised in that including：
Flexible PCB；
Matrix, forms through hole thereon, and the flexible PCB is arranged in the through hole, the inwall of the through hole with it is described soft
By setting sealed colloid to be packaged between property circuit board；
Also include the holder for clamping the flexible PCB, fluid sealant is provided between the flexible PCB and the holder
Body, integrally formed flexible PCB-holder is encapsulated by the sealed colloid by the flexible PCB and the holder
Component, the flexible PCB-holder component overall package is in the through hole；
The material of the holder is ceramic material.
2. electronics vacuum feedthrough according to claim 1, it is characterised in that the flexible PCB-holder group
It is interference fits between part and the through hole.
3. electronics vacuum feedthrough according to claim 1, it is characterised in that one end of the through hole forms injecting glue
Groove.
4. electronics vacuum feedthrough according to claim 3, it is characterised in that the injecting glue groove is described logical to be molded over
" V " type hole of hole one end.
5. electronics vacuum feedthrough according to claim 1, it is characterised in that the flexible PCB is RO4000 systems
Row frequency is not less than 500,000,000 HZ flexible PCB.
6. electronics vacuum feedthrough according to claim 1, it is characterised in that the material of described matrix be stainless steel or
Titanium.
7. the electronics vacuum feedthrough according to any one of claim 1-6, it is characterised in that the sealed colloid is
Epoxide-resin glue.
8. electronics vacuum feedthrough according to claim 7, it is characterised in that the epoxide-resin glue is bi-component ring
Oxygen resin glue.
9. electronics vacuum feedthrough according to claim 8, it is characterised in that the bi-component epoxide-resin glue is
2216Gray epoxide-resin glues, the B component and component A of the 2216Gray epoxide-resin glues are 5 according to mass ratio:7 are matched somebody with somebody
Than.
10. electronics vacuum feedthrough according to claim 8, it is characterised in that the bicomponent epoxy resin glue is
Torr seal epoxide-resin glues；The component A and B component of the Torr seal epoxide-resin glues, according to mass ratio 2:1 is matched somebody with somebody
Than.
11. a kind of method of the electronics vacuum feedthrough any one of manufacturing claims 1-10, it is characterised in that bag
Include
Feedthrough overall package step：
It will be inserted as the flexible PCB of the conductor material of feedthrough in the through hole of matrix；
It is packaged to form feedthrough entirety toward sealed colloid is injected between the inwall and the flexible PCB of the through hole；
Feedthrough is integrally solidified.
12. the method for manufacture electronics vacuum feedthrough according to claim 11, it is characterised in that
Also include flexible PCB encapsulation step before feedthrough overall package step：
Flexible PCB is clamped by holder, and incite somebody to action the two toward sealed colloid is injected between flexible PCB and the holder
Integrally formed flexible PCB-holder the component of encapsulation；
Flexible PCB-holder component is solidified；
Inserted the flexible PCB-holder component after solidification as the conductor material of feedthrough in the through hole of matrix.
13. the method for manufacture electronics vacuum feedthrough according to claim 12, it is characterised in that flexible PCB is sealed
Solidify again after applying uniform pressure to flexible PCB-holder component using fixture in dress step.
14. the method for the manufacture electronics vacuum feedthrough according to any one of claim 11-13, it is characterised in that
The sealed colloid is epoxide-resin glue.
15. the method for manufacture electronics vacuum feedthrough according to claim 14, it is characterised in that the epoxy resin
Glue is bi-component epoxide-resin glue.
16. the method for manufacture electronics vacuum feedthrough according to claim 15, it is characterised in that
The bi-component epoxide-resin glue is 2216Gray epoxide-resin glues, the B component and A of the 2216Gray epoxide-resin glues
Component, is 5 according to mass ratio:7 are matched；
The epoxy resin glue that proportioning is completed is placed in vacuum<Mixed in 100Pa vacuum environment, and be evenly stirred until fluid sealant
Body surface face does not have obvious bubble, then passes to pure nitrogen to 1 atmospheric pressure.
17. the method for manufacture electronics vacuum feedthrough according to claim 15, it is characterised in that
The bicomponent epoxy resin glue is Torr seal epoxide-resin glues；The component A of the Torr seal epoxide-resin glues
With B component, according to mass ratio 2:1 is matched；
The epoxy resin glue that proportioning is completed is placed in vacuum<Mixed in 100Pa vacuum environment, and be evenly stirred until fluid sealant
Body surface face does not have obvious bubble, then passes to pure nitrogen to 1 atmospheric pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510740626.0A CN105336564B (en) | 2015-11-04 | 2015-11-04 | Electronics vacuum feedthrough |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510740626.0A CN105336564B (en) | 2015-11-04 | 2015-11-04 | Electronics vacuum feedthrough |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105336564A CN105336564A (en) | 2016-02-17 |
| CN105336564B true CN105336564B (en) | 2017-08-11 |
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| CN201510740626.0A Active CN105336564B (en) | 2015-11-04 | 2015-11-04 | Electronics vacuum feedthrough |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10559408B2 (en) | 2016-12-27 | 2020-02-11 | Asml Netherlands B.V. | Feedthrough device and signal conductor path arrangement |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000260364A (en) * | 1999-03-10 | 2000-09-22 | Canon Inc | Feedthrough and image display device |
| US20050219140A1 (en) * | 2004-04-01 | 2005-10-06 | Stella Doradus Waterford Limited | Antenna construction |
| IT1390960B1 (en) * | 2008-07-09 | 2011-10-27 | Tvp Solar Sa | SOLAR VACUUM THERMAL PANEL |
| GB0901338D0 (en) * | 2009-01-28 | 2009-03-11 | Cxr Ltd | X-Ray tube electron sources |
| CN102936478B (en) * | 2012-12-05 | 2014-03-05 | 湖南神力铃胶粘剂制造有限公司 | Elastic bicomponent normal-temperature cured epoxy resin adhesive and preparation method thereof |
| CN204533835U (en) * | 2014-12-25 | 2015-08-05 | 江苏德佐电子科技有限公司 | A kind of vacuum feedthroughs |
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