CN105324500B - Disk aluminium alloy plate, disk aluminium alloy base substrate and disk aluminum alloy substrate - Google Patents
Disk aluminium alloy plate, disk aluminium alloy base substrate and disk aluminum alloy substrate Download PDFInfo
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- CN105324500B CN105324500B CN201580001061.2A CN201580001061A CN105324500B CN 105324500 B CN105324500 B CN 105324500B CN 201580001061 A CN201580001061 A CN 201580001061A CN 105324500 B CN105324500 B CN 105324500B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
- C22F1/047—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with magnesium as the next major constituent
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
- G11B5/73917—Metallic substrates, i.e. elemental metal or metal alloy substrates
- G11B5/73919—Aluminium or titanium elemental or alloy substrates
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/74—Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
- G11B5/82—Disk carriers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Magnetic Record Carriers (AREA)
- Chemically Coating (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
The disk aluminium alloy plate of the present invention is characterised by, containing Mg：3.5～5.5 mass %, Fe：It is limited in below 0.025 mass %, Si：It is limited in below 0.020 mass %, containing Cr：0.010～0.20 mass %, containing Cu：0.010～0.1 mass % and Zn：At least one among 0.05～0.4 mass %, additionally, Mn：It is limited in below 0.005 mass %, and Ni：It is limited in below 0.001 mass %, surplus is made up of Al and inevitable impurity, element in Al Fe Mn series intermetallic compounds constitutes ratio and is calculated as less than 0.50 with Mn/Fe ratios, and the absolute maximum length that the element in Al Fe Ni series intermetallic compounds is constituted than less than 0.20, Al Fe series intermetallic compounds are calculated as with Ni/Fe ratios is less than 10 μm.Even if the disk is processed with the acid etching that weak condition carries out treatment before plating with aluminium alloy plate, it is also difficult to which small plating defect occurs.
Description
Technical field
The present invention relates to disk aluminium alloy plate, disk aluminium alloy base substrate and disk aluminum alloy substrate.
Background technology
As computer etc. recording medium and using disk magnetic film formed on nonmagnetic substrate form.
Light weight is required generally, for the substrate and there is high rigidity, and require there is smooth surface, therefore use JIS H
4000：5086 alloys (Al-Mg systems alloy) of 2006 defineds.
For the substrate, it is fabricated to after sheet material using the alloy, for example, for the surface of the sheet material is entered in order
Row mirror finish, ungrease treatment, acid etching process, desmut process, first time zincic acid salt treatment, nitric acid lift-off processing, second
Secondary zincic acid salt treatment, electroless Ni-P plating process.Then, magnetic film etc. is formed on electroless Ni-P plating film, manufacture disk.
Aluminum (Al) alloy substrate for disk is for example as described in patent documentation 1,2.Specifically, in patent documentation 1
Description has a kind of disk aluminium alloy, it is characterised in that containing Cu：0.01 to 0.1 quality %, Mg：3.0 to 6.0 quality %,
Cr：0.02 to 0.1 quality %, Zn：0.04 to 0.7 quality %, Ni：0.001 to 0.02 quality %, surplus is by Al and impurity structure
Into, among the impurity, Fe and Si being limited to Fe：Below 0.02 mass %, Si：Below 0.02 mass %, others can not be kept away
The impurity exempted from is limited in below 0.01 mass % respectively, and makes Fe+Ni, below 0.03 mass %, to change between Al-Fe systems metal
The full-size of compound is less than 6 μm, and the full-size of Mg-Si series intermetallic compounds is less than 3 μm.
In addition, describe in patent documentation 2 having a kind of aluminium alloy base plate for magnetic disk, which contains Mg：It is more than 3.5 mass % and
Below 4.5 mass %, Si：More than 0.001 mass % and below 0.06 mass % and Fe：More than 0.001 mass % and 0.06 matter
Amount below %, containing Cu：More than 0.01 mass % and below 0.2 mass % and Zn：More than 0.001 mass % and 0.4 mass %
At least one of below, in addition as essential component, containing Cr：Higher than 0.10 mass % and below 0.3 mass % and Mn：It is high
At least one of in 0.10 mass % and below 0.3 mass %, surplus is made up of Al and inevitable impurity, greatest length
Intermetallic compound higher than 5 μm is 1/mm2Hereinafter, and average crystal grain diameter be less than 20 μm.
Prior art literature
Patent documentation
Patent documentation 1：No. 3794930 publication of Japan's patent
Patent documentation 2：No. 5199714 publication of Japan's patent
Invention problem to be solved
Aluminium alloy base plate for magnetic disk described in patent documentation 1, can guarantee and existing aluminium alloy base plate for magnetic disk
With the engineering propertiess of degree, desired smoothness is obtained, recirculation is excellent.In addition, the disk described in patent documentation 2 is used
The few surface defects such as aluminium alloy base plate, coating pit, and with fine grain structure, therefore, it is possible to reduce plating Ni-P surfaces
Microrelief.
But, in recent years, the high record density of disk is pushed further into, it is desirable to the higher plating clad can of flatness.In order to
The requirement is complied with, the condition for having acid etching when weakening treatment before plating to process suppresses the such meaning of etch damage of substrate surface
To.
If purpose as reflection, for the aluminium alloy base plate for magnetic disk described in patent documentation 1,2 carries out acid with weak condition
Etch processes, then can improve the flatness of the plate surface to form plated film.But on the other hand, wanted with acid etching all the time
A part for the Al-Fe series intermetallic compounds dissolved by process is not dissolved and remains.And, as reason, tuberosity
Occur with the small plating defect of gas pit etc..
Here, Fig. 1 (a)～(h) is the explanatory diagram for being described as follows content, i.e. illustrate for by aluminium alloy base plate for magnetic disk
The substrate for carrying out mirror finish and manufacturing (is described in FIG as " substrate ".The substrate also referred to as grinds substrate (GR substrates).)
Carried out after acid etching process with weak condition, it is micro- with the tuberosity and gas pit occurred when plating Ni-P and processing etc. to carry out zincic acid salt treatment
The explanatory diagram of little plating defect and its genesis mechanism.
Fig. 1 (a) represents the substrate for carrying out mirror finish to aluminium alloy base plate for magnetic disk and manufacturing.If the surface to the substrate
Ungrease treatment is carried out, is then processed with the acid etching of weak condition, then as described, the part nothing of Al-Fe series intermetallic compounds
Method is dissolved and remains (Fig. 1 (b)).This phenomenon is considered as due to reducing the condition that acid etching is processed, therefore Al-Fe systems
Intermetallic compound in electrochemistry becomes high potential and occurs.
Subsequently, if for the substrate of the state shown in Fig. 1 (b) carries out zincic acid salt treatment, such as Fig. 1 (c) is shown, not molten
The Al-Fe series intermetallic compounds taken off are (specifically between Al-Fe-Mn series intermetallic compounds and Al-Fe-Ni systems metal
Compound) on have zinc extremely to separate out.It is if carrying out electroless Ni-P plating process in this case, such as shown in Fig. 1 (d), different in zinc
The part Ni-P plated films for often separating out are separated out extremely, form dome projection (so-called tuberosity).Tuberosity can be after plating by mill
Light is removed, but hinders flatness, increases the polishing time.Therefore, productivity ratio is deteriorated.
In addition, shown in Fig. 1 (c), for the substrate that zinc is separated out extremely, in the matting carried out before plating,
The undissolved Al-Fe series intermetallic compounds are come off together with zinc, show out (Fig. 1 (e)) in Al.If entering in this case
The process of row electroless Ni-P plating, then as shown in Fig. 1 (f), the part not only showed out in Al cannot film forming Ni-P plated film, and plate
In liquid, contained hypophosphorous acid is reacted with Al, becomes H2The starting point that gas occurs, therefore form gas pit.
On the other hand, if for the substrate of the state shown in Fig. 1 (b) carries out zincic acid salt treatment, having the uneven precipitation of zinc
The situation (Fig. 1 (g)) that situation or zinc are not separated out.If carrying out electroless Ni-P plating process in this case, such as shown in Fig. 1 (h),
Undissolved Al-Fe series intermetallic compounds become negative electrode, make H2Gas continues generation.Therefore, in this section cannot film forming Ni-P
Plated film, and form gas pit.
The content of the invention
The present invention in view of the problem and formed, its problem is, there is provided though one kind treatment before plating is carried out with weak condition
Acid etching process when, it is also difficult to there is disk aluminium alloy plate, disk aluminium alloy base substrate and the disk of small plating defect
Use aluminum alloy substrate.
Means for solving the problems
The disk aluminium alloy plate of the present invention of the problem is solved, is consisted of, containing Mg：3.5～5.5 mass %,
Fe：It is limited in below 0.025 mass %, Si：It is limited in below 0.020 mass %, containing Cr：0.010～0.20 mass %, contains
There is Cu：0.010～0.1 mass % and Zn：At least one among 0.05～0.4 mass %, additionally, Mn：It is limited in 0.005 matter
Amount below %, and Ni：It is limited in below 0.001 mass %, surplus is made up of Al and inevitable impurity, Al-Fe-Mn systems
Element in intermetallic compound is constituted ratio and is calculated as in less than 0.50, and Al-Fe-Ni series intermetallic compounds with Mn/Fe ratios
Element constitute than with Ni/Fe ratios be calculated as less than 0.20, Al-Fe series intermetallic compounds absolute maximum length be 10 μm with
Under.
So, disk aluminium alloy plate of the invention is controlled between Al-Fe-Mn systems metal because specified chemical is constituted
Element in compound constitutes the element in ratio, Al-Fe-Ni series intermetallic compounds and constitutes ratio, and Al-Fe systems intermetallic
The absolute maximum length of thing, so intermetallic compound phase is difficult to become high potential in electrochemistry for etching solution.Therefore,
Even if the disk of the present invention is processed with the acid etching that weak condition carries out treatment before plating with aluminium alloy plate, it is also possible to be difficult to generation small
Plating defect.In addition, the disk aluminium alloy plate of the present invention is because of Fe, Si, Cr containing given amount respectively, it is possible to making to bend
The mechanical property for taking intensity etc. is improved.
The disk aluminium alloy base substrate of the present invention, is punched into discoid such structure using by the disk aluminium alloy plate
Into.
The present invention disk aluminium alloy base substrate because the disk aluminium alloy plate is punched into it is discoid, it is difficult
There is small plating defect.
Additionally, the composition that the disk aluminum alloy substrate of the present invention is adopted is, using disk aluminium alloy base substrate.
The disk aluminum alloy substrate of the present invention is difficult to generation small because using disk aluminium alloy base substrate
Plating defect.
Invention effect
The disk aluminium alloy plate of the present invention is controlled in Al-Fe-Mn series intermetallic compounds because specified chemical is constituted
Element constitute ratio, the element in Al-Fe-Ni series intermetallic compounds constitute ratio, and Al-Fe series intermetallic compounds definitely most
Long length, even if so when the acid etching for carrying out treatment before plating with weak condition is processed, it is also possible to be difficult to small plating defect.
In addition, disk aluminium alloy plate is because specified chemical composition, yield strength is excellent.
The present invention disk aluminium alloy base substrate because the disk aluminium alloy plate is punched into it is discoid, even if
When the acid etching that treatment before plating is carried out with weak condition is processed, it is also difficult to which small plating defect occurs.
The disk aluminum alloy substrate of the present invention because using disk aluminium alloy base substrate, even if with weak condition
When carrying out the acid etching process for the treatment of before plating, it is also difficult to which small plating defect occurs.
Description of the drawings
Fig. 1 (a)～(h) is to illustrate to carry out after acid etching process with weak condition for substrate, carries out zincic acid salt treatment and plating
The explanatory diagram of the small plating defect and its genesis mechanism of the tuberosity occurred during Ni-P process and gas pit etc..
Specific embodiment
Hereinafter, for the present invention disk aluminium alloy plate, disk with aluminium alloy base substrate and disk aluminum alloy substrate (with
Under, " Al alloy sheets ", " base substrate " and " substrate " are only called respectively.) an embodiment be illustrated in detail.
Here, in the description, the percentage rate (quality %) on the basis of quality is (heavy with the percentage rate on the basis of weight
Amount %) it is identical.
[Al alloy sheets]
The Al alloy sheets of present embodiment are used for disk.The Al alloy sheets of present embodiment contain Mg：3.5～5.5 matter
Amount %, Fe：It is limited in below 0.025 mass %, Si：It is limited in below 0.020 mass %, containing Cr：0.010～0.20 matter
Amount %, containing Cu：0.010～0.1 mass % and Zn：At least one among 0.05～0.4 mass %, additionally, Mn：It is limited in
Below 0.005 mass %, and Ni：It is limited in below 0.001 mass %, surplus is made up of Al and inevitable impurity.
Element structure in the Al alloy sheets of the present embodiment being made up of such chemical composition, in Al-Fe-Mn series intermetallic compounds
Into the element composition ratio than being calculated as with Mn/Fe ratios in less than 0.50, and Al-Fe-Ni series intermetallic compounds in terms of Ni/Fe ratios
For less than 0.20, the absolute maximum length for making Al-Fe series intermetallic compounds is less than 10 μm.
Further, so-called absolute maximum length, for example, refers to scanning electron microscope (Scanning Electron
Microscope；SEM the distance on the particle that COMPO pictures) etc. are confirmed when being observed, between 2 points of lie farthest away.
Mn and Ni in Al-Fe series intermetallic compounds cast operation crystallization, easily with Al-Fe systems intermetallic
Thing eutectoid.If Mn and Ni is contained in Al-Fe series intermetallic compounds in a large number, easily with respect to etching solution in electrochemistry
Upper formation high potential.Therefore, when the acid etching for carrying out treatment before plating with weak condition is processed, the one of Al-Fe series intermetallic compounds
Partly the part of Al-Fe-Mn series intermetallic compounds and Al-Fe-Ni series intermetallic compounds (specifically, be) cannot be by
Dissolve and remain.In the present invention, the element in Al-Fe series intermetallic compounds is constituted into ratio and Al-Fe systems intermetallic
The absolute maximum length of thing is controlled respectively in this way, even if carry out acid etching process with weak condition, also easily
Dissolving Al-Fe series intermetallic compounds.And, thus will suppress the generation of small plating defect, make the flat of Ni-P coated surfaces
Slip is improved.Hereinafter, for each key element of the Al alloy sheets for constituting present embodiment is illustrated.
Further, the acid etching of so-called weak condition is processed, and for example, can enumerate to utilize and former material is hardly corroded, and remove Al
The soft etchant of the oxide scale film on alloy sheets (substrate) surface is etched process.Here, so-called " the soft etching in this specification
Agent ", is referred to gentle condition for the surface of metallic plate is etched the solvent (etchant) of process.As such
Soft etchant, specifically, can use C. Uyemura ＆ Co Ltd AD-101F.With the process of the soft etchant, can be with
68 DEG C are carried out 2 minutes or are carried out 5 minutes etc. with 50 DEG C, but do not corrode substantially former material, and can remove the oxide scale film of aluminium surface
, it is not limited to this.So-called " gentle condition ", refer to observation by light microscope through etch processes metallic plate
Surface when, only there occurs the slight coarse of the degree that small concavo-convex generation can be recognized.As the acid of weak condition
The specific target of etch processes, for example, specifiable is that (also, the size of the substrate is external diameter to reduction 5～15mg/ substrates
The toroidal of 95mm, internal diameter 25mm, thickness of slab 1.0mm.) left and right process.
(Mg：3.5～5.5 mass %)
The effect that Mg undertakes is the machinery spy for making Al alloy sheets and specifying needed for possessing as base substrate described later, substrate
Property.As mechanical property, for example, can enumerate yield strength.Yield strength is for example preferably more than 90MPa.If yield strength is
More than 90MPa, then can have sufficient intensity as the Al alloy sheets of disk.If Mg amounts are in the numerical range,
Mechanical property (for example, yield strength etc.) can be excellent.
If Mg amounts are less than 3.5 mass %, used as the mechanical properties of Al alloy sheets, base substrate and substrate.
On the other hand, if Mg amounts are higher than 5.5 mass %, the crack sensitivity under high temperature is high, is susceptible to split in hot rolling
Stricture of vagina, therefore roll difficult.
Further, the lower limit of Mg amounts is preferably 3.6 mass %, more preferably 4.2 mass %.In addition, the upper limit of Mg amounts is preferred
For 5.4 mass %, more preferably 4.8 mass %.
(Fe：It is limited in below 0.025 mass %)
Fe is mixed in Al alloys usually as parent metal impurity, and Al-Fe systems intermetallic is made in casting process
Thing crystallization.
If Fe is measured below 0.025 mass %, grindability when manufacturing can substrate is improved.If in addition, Fe amounts are
Below 0.025 mass %, then can realize that intensity when making Al alloy sheets, base substrate and substrate is improved, in addition, contributing to tying again
Jingjing grain miniaturization, or the homogeneity of zincic acid salt treatment can also improved.
If, higher than 0.025 mass %, the absolute maximum length of Al-Fe series intermetallic compounds is long for Fe amounts.If Al-Fe
The absolute maximum length of series intermetallic compound is long, then when the acid etching for carrying out treatment before plating with weak condition is processed, Al-Fe systems
Intermetallic compound a part of undissolved and remain, be that reason causes the small plating defect such as tuberosity and gas pit to be sent out with which
It is raw.Therefore, if Fe amounts are higher than 0.025 mass %, the flatness of Ni-P coated surfaces is reduced.Therefore, Fe amounts are limited in
Below 0.025 mass %.
The lower limit of Fe amounts does not have a special provision, but it has been observed that due to being mixed in Al alloys as parent metal impurity, institute
If to specify lower limit, referred to higher than 0 mass % (i.e. not comprising 0 mass %).Further, if making Fe amounts be 0.005 mass %
More than, then can expect the raising effect of grindability and yield strength, make recrystal grain miniaturization and make zincic acid salt treatment
The effect that homogeneity is improved, it is stipulated that during the lower limit of Fe amounts, preferably 0.005 mass %.In addition, in order that Fe amounts are less than 0.005
Quality %, needs using highly purified parent metal, because cost is very high, unrealistic.Therefore, go out in terms of cost
Send out, it is also preferred that the lower limit of Fe amounts is 0.005 mass %.
The lower limit of Fe amounts is preferably 0.009 mass %, and the upper limit is preferably 0.021 mass %.
(Si：It is limited in below 0.020 mass %)
Si is mixed in Al alloys usually as parent metal impurity, among operation for casting Al alloy sheets etc., in Al
The surface of alloy sheets generates Mg-Si series intermetallic compounds.
If, higher than 0.020 mass %, the absolute maximum length of Mg-Si series intermetallic compounds is long for Si amounts.If Mg-Si
The absolute maximum length of series intermetallic compound is long, then during the mirror finish such as cutting and grinding when substrate is manufactured, Mg-Si
Series intermetallic compound comes off from the surface of Al alloy sheets, forms depression.If in addition, Mg-Si series intermetallic compounds is absolute
Greatest length is long, then Mg-Si series intermetallic compounds are processed via the acid etching for the treatment of before plating and are dissolved, and form depression.Cause
This, if Si amounts are higher than 0.020 mass %, the flatness of Ni-P coated surfaces is reduced.If in addition, Si amounts are higher than 0.020 matter
Amount %, then can also produce by the etch processes, only Mg dissolvings and where Si residuals.On the Si of residual, treatment before plating
The displacement reaction of Zn will not occur in zincic acid salt treatment, therefore plated film cannot grow in electroless Ni-P plating process, Ni-P platings
The adhesion of film is by deficiency.As a result, by heating during magnetic film film forming etc., being formed in Al alloy sheets (substrate)
Ni-P plated films are expanded.Therefore, Si amounts are limited in below 0.020 mass %.Further, Mg-Si series intermetallic compounds
Absolute maximum length is preferably less than 4 μm, more preferably less than 3 μm, more preferably less than 2 μm.The lower limit of Si amounts does not have
Special provision, but as described, due to being mixed in Al alloys as parent metal impurity, if so regulation lower limit, refers to
Higher than 0 mass % (that is, not including 0 mass %).Further, in order that Si amounts are needed using highly purified less than 0.005 mass %
Parent metal, due to cost it is very high, so unrealistic.Therefore, the lower limit of Si amounts is preferably 0.005 mass %, more preferably
0.008 mass %.Further, the upper limit of Si amounts is preferably 0.015 mass %.The absolute maximum of Mg-Si series intermetallic compounds is long
Degree, can be limited in the numerical range by Si to be measured (and preferably measuring together Mg) and be controlled.
(Cr：0.010～0.20 mass %)
By containing Cr, it is possible to increase the mechanical property (for example, yield strength etc.) of Al alloy sheets, base substrate and substrate.Machine
The raising effect of tool characteristic, is measured more than 0.010 mass % effectively to obtain by making Cr.If Cr amounts are less than 0.010
Quality %, it is likely that can not fully obtain the effect for improving mechanical property.
On the other hand, if Cr amounts are higher than 0.20 mass %, thick Al-Cr series intermetallic compounds are generated.If thick
Al-Cr series intermetallic compounds generate, then it is de- from surface during the mirror finish such as the cutting that carries out and grinding when substrate is manufactured
Fall, form depression.Therefore, if Cr amounts are higher than 0.20 mass %, the flatness of Ni-P coated surfaces is reduced.
(Cu：0.01～0.1 mass % and Zn：At least one among 0.05～0.4 mass %)
Cu equably solid solutions in Al alloy sheets, in the zincic acid salt treatment for the treatment of before plating, during zincic acid salt bath can be made
Zn uniform ions and the fine surface for precipitateing into Al alloy sheets (substrate).That is, by being contained within described numerical range
Cu is measured, and is formed uniformly can zincate epithelium, can be suppressed the generation of the tuberosity of Ni-P coated surfaces.That is, Cu is described
Scope contains, the effect of the flatness with the Ni-P coated surfaces for improving Al alloy sheets (substrate).
If Cu amounts are reduced less than 0.01 mass %, the uniformity of zincate epithelium, tuberosity occurs.Therefore, Ni-P plated films
The flatness on surface is reduced.
On the other hand, if Cu amounts are higher than 0.1 mass %, crystal boundary has Cu to separate out, therefore at the acid etching for the treatment of before plating
In reason, crystal boundary portion is subject to overetch, produces pit, and the generation of the tuberosity of Ni-P coated surfaces is very more.
The lower limit of Cu amounts is preferably 0.02 mass %, and the upper limit is preferably 0.05 mass %.
Zn is also same with Cu, and the equably solid solution in Al alloy sheets, in the zincic acid salt treatment for the treatment of before plating, can make zinc
Uniformly fine precipitation of the Zn ions in hydrochlorate bath to Al alloy sheets (substrate).In other words, by the numerical value model
Enclose and be contained within Zn amounts, be formed uniformly can zincate epithelium, the generation of the tuberosity of Ni-P coated surfaces can be suppressed.That is,
Zn contains in the scope, the effect that the flatness with the Ni-P coated surfaces for making Al alloy sheets (substrate) is improved.In addition, companion
Equably separate out in Al alloy sheets with the Zn of the increase of content, process in the acid etching of the treatment before plating carried out for substrate
In, become Zn elemental releases position when etching starting point and zincic acid salt treatment.Therefore, contain Zn in the scope, can have
Suppress the effect of the segment difference of grain formation.
If Zn amounts are reduced and tuberosity generation less than 0.05 mass %, the uniformity of zincate epithelium.Therefore, Ni-P plated films table
The flatness in face is reduced.
On the other hand, if Zn amounts are higher than 0.4 mass %, the precipitation core of Zn becomes big, it follows that because for the treatment of before plating
Etching and the depression that formed also becomes big.Therefore, if Zn amounts are higher than 0.4 mass %, the flatness of Ni-P coated surfaces is reduced.
Additionally, if Zn amounts are higher than 0.4 mass %, there are Al-Mg-Zn series intermetallic compounds to separate out in crystal boundary, therefore in treatment before plating
Etching in, crystal boundary portion is subject to overetch, and the generation of the tuberosity of Ni-P coated surfaces is very more.If in addition, Zn amounts are higher than 0.4 matter
% is measured, then Al-Mg-Zn series intermetallic compounds also dissolve and become depression (pit), which is still remaining after plating.
The lower limit of Zn amounts is preferably 0.1 mass %, and the upper limit is preferably 0.35 mass %.The lower limit of preferred Zn amounts is
0.15 mass %.
(Mn：It is limited in below 0.005 mass %)
(Ni：It is limited in below 0.001 mass %)
Mn and Ni is contained as inevitable impurity.As be described hereinafter, in JIS H4000：As inevitable in 2006
Impurity and the element that includes is respectively provided below 0.05 mass %, to add up to below 0.15 mass %, but in the present invention, make
The amount of Mn and Ni is lower than JIS specification.Specifically as it was previously stated, Mn：It is limited in below 0.005 mass %, and Ni：Limit
Below 0.001 mass %.By Mn：It is limited in below 0.005 mass % and Ni：It is limited in below 0.001 mass %, can
Element in Al-Fe series intermetallic compounds described later is constituted than being limited in specific scope.In addition, passing through Mn：It is limited in
Below 0.005 mass % and Ni：It is limited in below 0.001 mass %, can be by the exhausted of Al-Fe series intermetallic compounds described later
Less than 10 μm are limited in greatest length.
If Mn amounts are higher than 0.001 mass % higher than 0.005 mass % or Ni amounts, in Al-Fe series intermetallic compounds
Element is constituted and is unable to reach specific numerical range described later than (Mn/Fe ratios, Ni/Fe ratios).Therefore, for Al alloy sheets (bases
Bottom) with weak condition carry out treatment before plating acid etching process when, Al-Fe series intermetallic compounds it is a part of insoluble and residual
Stay.If Al-Fe series intermetallic compounds a part of undissolved and remain, the small plating defect such as tuberosity occurs, Ni-P platings
The flatness on film surface is reduced.
Further, Mn amounts are preferably below 0.001 mass %, and Ni amounts are preferably below 0.0005 mass %.
The restriction of the content of described Fe, Si, Mn, Ni, for example can be by using the matrix gold by three layers of electro deposition
Category removes them to carry out using segregation method.Further, the restriction of the content of Fe, Si, Mn, Ni is not limited to these handss
Section, can be suitable for known technology is carried out.
(surplus：Al and other inevitably impurity)
The basis of chemical composition of the Al alloy sheets of the present invention is constituted as described above, surplus composition is Al and others
Inevitable impurity.As other inevitably impurity, for example, can enumerate Ti, Zr, V, B etc..Described Fe, Si, Mn and
The inevitable impurity of others cited by inevitable impurity (parent metal impurity) as Ni and here, is molten
The impurity being inevitably mixed into during solution.Further, the inevitable impurity of described others, if respectively 0.005 matter
Amount below %, is aggregated in below 0.015 mass %, then will not hinder the effect of the present invention, as long as therefore meet the condition,
Element beyond the element illustrated during other inevitably impurity and this specification can energetically be contained is (in a word,
It is included in the technical scope of the present invention.).
(element in Al-Fe-Mn series intermetallic compounds constitutes ratio：Less than 0.50 is calculated as with Mn/Fe ratios)
(element in Al-Fe-Ni series intermetallic compounds constitutes ratio：Less than 0.20 is calculated as with Ni/Fe ratios)
(wherein, M is Mn or Ni to Al-Fe-M series intermetallic compounds.) in element constitute ratio, plated with weak condition
When the acid etching of pre-treatment is processed, impact is produced on the soluble degree of the intermetallic compound.
If the element in Al-Fe-Mn series intermetallic compounds constitutes ratio and is calculated as less than 0.50, and Al- with Mn/Fe ratios
Element in Fe-Ni series intermetallic compounds constitutes ratio and is calculated as less than 0.20 with Ni/Fe ratios, then these intermetallic compound phases pair
Electronegative potential is easily become in electrochemistry in acid-etching solution (soft etchant), even if as described above, by the acid under weak condition
Etch processes, it is also possible to fully dissolve.
If the element in Al-Fe-Mn series intermetallic compounds constitutes ratio in terms of Mn/Fe ratios higher than 0.50, or Al-Fe-Ni
Element in series intermetallic compound constitutes ratio in terms of Ni/Fe ratios higher than 0.20, then these intermetallic compound phases are for acid etching
Etching solution easily becomes high potential in electrochemistry, is processed by the acid etching under such weak condition and is difficult to dissolve.Cause
This, if Mn/Fe ratios are higher than the part that 0.50 or described Ni/Fe ratios are higher than 0.20, Al-Fe-M series intermetallic compounds
It is insoluble, it is that reason causes the small plating defect such as tuberosity and gas pit to occur with which, the flatness of Ni-P coated surfaces is reduced.
In order that the element in Al-Fe-Mn series intermetallic compounds constitutes ratio is calculated as less than 0.50 with Mn/Fe ratios, Al- is made
Element in Fe-Ni series intermetallic compounds constitutes ratio and is calculated as less than 0.20 with Ni/Fe ratios, and Fe amounts are limited in 0.025 matter
Amount below %, Mn amount is limited in below 0.005 mass %, and Ni amounts are limited in below 0.001 mass %, and with manufacturer described later
Condition manufacture Al alloy sheets described in method.More specifically and more effectively, with the bar described in the project of aftermentioned [embodiment]
Part manufactures Al alloy sheets.
(the absolute maximum length of Al-Fe series intermetallic compounds：Less than 10 μm)
In addition, the absolute maximum length of the Al-Fe series intermetallic compounds in the Al alloy sheets of present embodiment is 10 μm
Below.If the absolute maximum length of Al-Fe series intermetallic compounds is higher than 10 μm, its length is long, therefore manufactures in substrate
Before during the acid etching for the treatment of before plating that carries out processes, when carrying out the process with weak condition, one of Al-Fe series intermetallic compounds
Divide insoluble and remain.Therefore, thus result in the small plating defect such as tuberosity and gas pit as original to occur, Ni-P plated films
The flatness on surface is reduced.Therefore, the absolute maximum length for making Al-Fe series intermetallic compounds is less than 10 μm, can make Ni-
The flatness of P coated surfaces is improved.
Further, the absolute maximum length of the Al-Fe series intermetallic compounds in the Al alloy sheets of present embodiment is preferably 9
Below μm, more preferably less than 8 μm, more preferably less than 7 μm, be still more preferably less than 6 μm.
The absolute maximum length of Al-Fe series intermetallic compounds as described above, can by Fe is measured, Mn amounts and Ni amounts point
Be not limited in below the specific numerical value, casting temperature is made for more than 700 DEG C and be controlled.
Chemical composition is limited in specific scope by the Al alloy sheets of present embodiment described above, and with described
The element that mode is controlled in Al-Fe-Mn series intermetallic compounds is constituted than (Mn/Fe ratios), and Al-Fe-Ni systems intermetallic
The element of thing is constituted than (Ni/Fe ratios).Therefore, these intermetallic compound phases are easily become for etching solution in electrochemistry
Electronegative potential.In addition, the absolute maximum that the Al alloy sheets of present embodiment control Al-Fe series intermetallic compounds in this way is long
Degree, therefore, even if Al-Fe systems metal when the Al alloy sheets of present embodiment are processed with the acid etching that weak condition carries out treatment before plating
Between compound also easily dissolve, can suppress insoluble.That is, the acid etching for having carried out the weak condition can be made not molten after processing
Al-Fe series intermetallic compounds number be 20/mm2Below.As a result, the smooth of Ni-P coated surfaces can be improved
Property.Further, if through the number of the not molten Al-Fe series intermetallic compounds of such process be higher than 20/mm2, then Ni-P
The flatness of coated surface is reduced, therefore is not preferred.
Further, absolute maximum length is the number (individual number density) of more than 3 μm of Al-Fe series intermetallic compounds, for example
Preferably 50/mm2Below.The upper limit of the absolute maximum length of the Al-Fe series intermetallic compounds can be 10 μm.If definitely
It is 50/mm that greatest length is the number of more than 3 μm of Al-Fe series intermetallic compounds2Hereinafter, then Ni-P plated film tables can be made
The flatness in face is improved.
[base substrate and substrate]
The base substrate of present embodiment as needed the Al alloy sheets of the present embodiment are carried out it is quenched, by striking out
Shape is punched into the discoid of regulation and is manufactured.
In addition, the substrate of present embodiment carries out grinding by the base substrate for the present embodiment, and (minute surface adds
Work) and manufacture.
Further, with regard to present embodiment base substrate and substrate manufacture method in rear description.
The substrate of present embodiment, the acid etching of the weak condition (specifically, are exactly carried out with soft etchant after processing
After acid etching is processed) not molten Al-Fe series intermetallic compounds are 20/mm2Below.This is as already explained, in this reality
Apply in the Al alloy sheets of mode, ratio can be constituted in terms of Mn/Fe ratios by making element in Al-Fe-Mn series intermetallic compounds
For less than 0.50, make the element in Al-Fe-Ni series intermetallic compounds constitute ratio and less than 0.20 is calculated as with Ni/Fe ratios, make Al-
The absolute maximum length of Fe series intermetallic compounds is obtained for less than 10 μm.
As described above, after making the acid etching of weak condition and processing not molten Al-Fe series intermetallic compounds be 20/
mm2Hereinafter, the small plating defect such as tuberosity and gas pit can be made to be difficult to occur, it is possible to increase Ni-P coated surfaces it is smooth
Property.
In contrast, in the substrate of present embodiment, if between the acid etching of weak condition Al-Fe systems metal not molten after processing
Compound is higher than 20/mm2, then the small plating defect such as tuberosity and gas pit be susceptible to, Ni-P coated surfaces it is smooth
Property reduce.
[manufacture methods of Al alloy sheets]
The Al alloy sheets of present embodiment can be by the manufacture method of the usual conditions of the substrate of manufacture disk and equipment
Manufactured.For example, the Al alloys of chemical composition described in melting can be passed through, a series of work including following operation is supplied to
Sequence and manufactured, i.e.,：Casting is adjusted to the operation of the ingot bar of the chemical composition；For the ingot bar carries out the heat treatment that homogenizes
Operation；The operation of the hot rolled plate of the thickness of slab for specifying is obtained for the ingot bar of the heat treatment that carried out homogenizing implements hot rolling；It is right
Hot rolled plate carries out operation that is cold rolling and obtaining cold-reduced sheet.Also it is possible to as needed, before cold rolling process or cold rolling process
Way in carry out intermediate annealing.
Further, when the ingot bar of the Al alloys is manufactured, preferably when Al alloys are melted, spray feed argon (Ar) etc. in liquation
Inactive gas and carry out Dehydroepiandrosterone derivative.Additionally, it is preferred that with 30～80mm/ point of casting speed manufacture ingot bar.Casting temperature
More than 700 DEG C are preferably for example.If casting temperature is more than 700 DEG C, Al-Fe series intermetallic compounds can be more effectively made
Absolute maximum length be less than 10 μm, can make the intermetallic compound that absolute maximum length is more than 3 μm number be 50
Individual/mm2Below.If in addition, casting temperature is more than 700 DEG C, can more effectively make Al-Fe-Mn series intermetallic compounds
In element constitute ratio and be calculated as less than 0.50 with Mn/Fe ratios, the element composition in Al-Fe-Ni series intermetallic compounds can be made
Than being calculated as less than 0.20 with Ni/Fe ratios.
More preferably more than 710 DEG C of casting temperature.In addition, casting temperature is for example preferably less than 730 DEG C, more preferably
Less than 720 DEG C.
Homogenize heat treatment, carries out after building up by welding, for example, carrying out 2 with 500～570 DEG C preferably for the ingot bar of Al alloys
More than hour.If so, then the Mg-Si such as Mg2Si series intermetallic compound fully solid solutions can be made.Further, building up by welding
Amount considers that the degree of segregation suitably can be changed, but the preferably every one side of its amount is for example in the range of 3～20mm.
Hot rolling is for example preferably carried out with following condition：With the short time within 30 minutes in 490 DEG C to 400 DEG C of temperature model
Enclose end.So, until hot rolling terminates to make the intermetallic compounds such as MgSi systems will not coarsening or precipitation.
Further, if hot rolling end temp is reduced to 300 DEG C or so, in cold rolling process behind, there is luders band
Pattern (Luders Band Pattern).Luders band pattern is not left in the surface after being ground, therefore without compromising on as magnetic
The function of disc board, but damage the attractive in appearance of the Al alloy sheets (base substrate) before grinding.Therefore, in order to be prevented to which, preferred heat
End temp is rolled for more than 300 DEG C.
For cold rolling, such as, when hot rolling end temp is more than 250 DEG C, preferably entered with more than 70% cold rolling rate
OK, when hot rolling end temp is less than 250 DEG C, preferably carried out with more than 55% cold rolling rate.In such manner, it is possible to apply to make pack annealing
The strain energy required for crystal grain diameter miniaturization afterwards.
Here, when carrying out intermediate annealing before cold rolling or in cold rolling way, cold rolling rate is carried out preferably after intermediate annealing
More than 70% it is cold rolling.By carrying out ending in this operation, the Al alloy sheets of present embodiment can be manufactured.
[manufacture method of base substrate]
The base substrate of present embodiment for example can be by carrying out the operation of the operation and pack annealing that manufacture base substrate manufacturing.
The manufacture of base substrate can be carried out in the following way, i.e. quenched as needed to have carried out the cold rolling sheet material, lead to
Cross stamping that the sheet metal forming is discoid into what is specified.
Pack annealing, can by by discoid sheet material (discoid sheet material), be stacked on high flat degree distance piece it
Between, to all pressurizations while carrying out pack annealing (in general, through the referred to as base substrate of the pressurization annealing) to carry out.Should
Pack annealing is for example preferably heated with more than 30 DEG C/h of programming rate, keeps 1～5 in 300～360 DEG C of temperature ranges
After hour, less than 200 DEG C are cooled to more than 30 DEG C/h of rate of cooling.In such manner, it is possible to remove adding in discoid sheet material
Stevedore's damage residue stress and improve flatness.In addition, fine tissue can be obtained, the discoid sheet material before comparing can be with
Reduce the microrelief on the surface after plating.
Afterwards, for the inner peripheral and the end face of outer peripheral edge of discoid sheet material, implement the end face processing of regulation, can manufacture
The base substrate of present embodiment.
[manufacture method of substrate]
The substrate of present embodiment for example can be manufactured as follows.Carrier on twin grinder is defaulted in it is recessed
The base substrate is set in groove.Then, if carrying out grinding (mirror finish) and the thickness of slab of the target that arrives with grinding stone, can manufacture
(also, the substrate also referred to as grinds substrate (GR substrates) to the substrate of present embodiment.).
So chemical composition and metal structure of the substrate of the present embodiment of manufacture is same with the base substrate, but because enters
Row mirror finish, so possessing high flatness compared with base substrate.Therefore, even if the acid etching for the treatment of before plating is carried out with weak condition
During process, also it is difficult to small plating defect on the surface of substrate.
(disk)
Then, in described manner with weak condition for the surface of the substrate of such manufacture carries out acid etching process, form nothing
Electrolysis Ni-P plated films, grind its surface and (also, are formed with the substrate of electroless Ni-P plated films, also referred to as clad substate.).Connect
, on this substrate, formed for improving the substrate film of magnetic characteristic, the magnetic film comprising Co based alloys and using by sputtering etc.
Protecting film comprising C (carbon) in protection magnetic film etc. such that it is able to make disk.
Further, the electroless Ni-P plated films, substrate film, magnetic film, the formation of protecting film lead to during disk with being manufactured
The condition often implemented is carried out.
In addition, with regard to the manufacturing condition of Al alloy sheets, base substrate and substrate etc., for example, quoting entirely through reference here
No. 5199714 publication of No. 3471557 publication of Japan's patent and Japan's patent in have in detail description.Therefore, in system
When making Al alloy sheets, base substrate and substrate, it is also possible to reference to these documents.
(with regard to measuring method etc.)
Al-Fe-Mn series intermetallic compounds, Al-Fe-Ni systems metal for the Al alloy sheets, base substrate and/or substrate
Between element in compound constitute ratio；The absolute maximum length of Al-Fe series intermetallic compounds and and number density；And Mg-Si
One of the measuring method of the absolute maximum length of series intermetallic compound etc. illustrates.
Element in Al-Fe-Mn series intermetallic compounds is constituted than (Mn/Fe ratios) and Al-Fe-Ni series intermetallic compounds
In element constitute can obtain in the following way than (Ni/Fe ratios)：For the surface of the substrate through mirror finish, use
Energy dispersion type x-ray analysis equipment (Energy DispersiVe Spectroscopy are connected with SEM；EDS device)
(hereinafter referred to as " SEM-EDS ".) shot, it is intended that arbitrary scope is analyzed and calculates.These element compositions are such as
Can calculate as follows, i.e. for the surface of the substrate through mirror finish, irradiate electron ray 5 seconds using SEM-EDS
Left and right, shoots 20 visual field (0.2mm with arbitrary multiplying power (such as 1000 times)2) left and right, according to the half of resulting COMPO pictures
Number of quantitative analysis is calculated.Further, the base substrate of present embodiment and the difference of substrate are whether to carry out grinding (minute surface
Processing), the base substrate of present embodiment and the difference of Al alloy sheets be whether be punched into it is discoid.Therefore, for substrate is carried out
The element constitute the measurement result of ratio, absolute maximum length and individual number density etc. and be considered as script base substrate and Al alloys
The element of plate constitutes the measurement result of ratio, absolute maximum length and individual number density etc..
The mechanical property of yield strength etc. for example can be according to JIS Z 2241：2011, by Al alloy sheets (base substrate, substrate)
Test film is made, is tried to achieve by carrying out metal material stretching test.
The absolute maximum length of Al-Fe series intermetallic compounds, number and Mg-Si series intermetallic compounds definitely most
Long length, for example, can be measured as follows, i.e. for the surface of the substrate for carrying out mirror finish, with SEM-EDS appointing
The multiplying power (such as 1000 times) of meaning shoots 20 visual field (0.2mm2) left and right, by for resulting COMPO pictures (composition picture)
It is analyzed to measurement.Further, Al-Fe series intermetallic compounds and Mg-Si series intermetallic compounds can be in the COMPO of SEM
As in, it is identified according to the contrast with parent phase.Specifically, Al-Fe series intermetallic compounds seem white than parent phase, Mg-
Si series intermetallic compounds seem black than parent phase.Therefore, if they separately to be measured its length, which can be tried to achieve respectively exhausted
To greatest length.Further, as described above, the base substrate of present embodiment is whether to have carried out grinding with the difference of substrate
(mirror finish), the base substrate of present embodiment and the difference of Al alloy sheets be whether be punched into it is discoid, therefore for substrate
The measurement result of these intermetallic compounds for having carried out is considered as the measurement result of script base substrate and Al alloy sheets.
Carried out the weak condition acid etching process after not molten Al-Fe series intermetallic compounds number, can
Measure as follows.For example, can be measured by the following manner：Being cleaned with the alkaline cleaner not corroded has carried out mirror finish
Substrate matrix after, cleaned with pure water, then make former material hardly weather with remove surface oxide scale film soft etching
Agent is etched process, is cleaned with pure water.Then, 50 visuals field are shot with arbitrary multiplying power (such as 500 times) using SEM-EDS
(2mm2) left and right, resulting COMPO pictures (composition picture) are analyzed.
Embodiment
Next, with reference to the embodiment and the comparative example not played of the effect for playing the present invention, in the present invention
Appearance is specifically illustrated.
First, with 700 DEG C of fusing materials, adjusting component makes the chemical composition shown in No.1～24 of table 1, with table
Casting temperature cast billets shown in 1.Secondly, the surface cut of the segregation layer on removing ingot bar surface is carried out, and 8 is carried out with 540 DEG C
The heat treatment that homogenizes of hour.Thereafter, hot rolling is carried out immediately, makes the hot rolled plate of thickness of slab 3mm.Then the cold rolling hot rolled plate, makes
Make the cold-reduced sheet of thickness of slab 1.0mm.
The cold-reduced sheet (Al alloy sheets) is punched into into the toroidal of external diameter 95mm, internal diameter 25mm, is stacked per 20,
After with 320 DEG C of annealing 3 hours, pressurization annealing is carried out with 30 DEG C/h of rate of cooling.End face processing, manufacture 3.5 are carried out then
The base substrate of inch type.Then, for billet surface (two sides) is entered by PVA grinding stones (Japan is special to grind whetstone Co. Ltd. system 4000)
10 μm of grindings (mirror finish) of row one side, manufacture the substrate of No.1～24.Further, because hot rolling is split in No.11
Stricture of vagina, therefore Al alloy sheets, base substrate and substrate can not be manufactured.
For the substrate of No.1～22 for making, the element in Al-Fe-Mn series intermetallic compounds is evaluated as follows
Constitute and constitute than (Ni/Fe ratios), yield strength, Al-Fe than (Mn/Fe ratios) and the element in Al-Fe-Ni series intermetallic compounds
Series intermetallic compound (includes Al-Fe-Mn series intermetallic compounds and Al-Fe-Ni series intermetallic compounds.It is same as below.)
Absolute maximum length, the number (individual number density) of the Al-Fe series intermetallic compounds of more than 3 μm of absolute maximum length, Mg-Si
The absolute maximum length of series intermetallic compound, defat and acid etching Al-Fe series intermetallic compounds not molten after processing
Number (individual number density), the flatness of Ni-P coated surfaces.
(1) element in Al-Fe-Mn series intermetallic compounds is constituted and is changed and between Al-Fe-Ni systems metal than (Mn/Fe ratios)
Element in compound is constituted than (Ni/Fe ratios)
For the surface of the substrate of mirror-polishing, W/ is irradiated using SEM-EDS (Jeol Ltd. JSM-7001M)
The electron ray of ZrO 5 seconds or so, shoots 20 visual field (0.2mm according to the multiplying power with 1000 times2) obtained by COMPO as
Semi-quantitative analyses value is calculated.Mn/Fe ratios below 0.50 for qualified, it is unqualified higher than 0.50.Ni/Fe ratios are below 0.20
For qualified, higher than 0.20 for unqualified.
(2) yield strength
First, a part for the cold-reduced sheet of manufacture is cut, with the condition that the pressurization annealing is equal, i.e. carry out with 320 DEG C
The annealing of 3 hours.Then, by the cold-reduced sheet annealed according to JIS Z 2241：2011 make test film, by carrying out metal material
Tension test, tries to achieve yield strength.Yield strength is qualified for more than 90MPa, is unqualified less than 90MPa.
(3) absolute maximum length of Al-Fe series intermetallic compounds, number and Mg-Si series intermetallic compounds is absolute
Greatest length
For the surface of the substrate of mirror-polishing uses SEM-EDS (Jeol Ltd. JSM-7001M) with 1000
Multiplying power again shoots 20 visual field (0.2mm2) obtain COMPO pictures (composition picture).The part for seeming white than parent phase is considered as Al-Fe systems gold
Compound between category, the part for seeming black than parent phase are considered as Mg-Si series intermetallic compounds, measure respective absolute maximum length,
And measure the number (individual number density) of the Al-Fe series intermetallic compounds that absolute maximum length is more than 3 μm.Al-Fe systems gold
Between category the absolute maximum length of compound be less than 10 μm for qualified, be unqualified higher than 10 μm.Change between Mg-Si systems metal
The absolute maximum length of compound be less than 4 μm for qualified, be unqualified higher than 4 μm.In addition, absolute maximum length is 3 μm
The number of Al-Fe series intermetallic compounds above is 50/mm2Following is evaluated as preferably, higher than 50/mm2Be evaluated as
It is not preferred.
(4) number of defat and acid etching Al-Fe series intermetallic compounds not molten after processing
70 DEG C, 5 point are carried out with alkaline cleaner (C. Uyemura ＆ Co Ltd AD-68F) firstly, for the substrate of mirror-polishing
After the ungrease treatment of clock, cleaned with pure water.Secondly, with soft etchant (C. Uyemura ＆ Co Ltd AD-101F) carry out 68 DEG C,
After the acid etching of 2 minutes is processed, cleaned with pure water.Then, described in (2), measure Al-Fe systems intermetallic as described above like that
The number of thing.But, the measurement multiplying power of SEM is 500 times.The number of Al-Fe series intermetallic compounds is in 20/mm2Following
For qualified (zero), higher than 20/mm2For unqualified (×).
(5) flatness of Ni-P coated surfaces
Carry out after defat and acid etching process, carrying out desmut process with 30% nitric acid with the condition of above-mentioned (4), after this it
Carry out 20 DEG C, the zincic acid salt treatment of 30 seconds afterwards again with zincate treatment fluid (C. Uyemura ＆ Co Ltd AD-301F-3X).Its
Afterwards, after first dissolving Zn with 30% nitric acid, reusing the zincate treatment fluid carries out 20 DEG C, the zincic acid salt treatment of 15 seconds.
Then, using Ni-P plating solutions (C. Uyemura ＆ Co Ltd NIMUDEN (registered trade mark) HDX), with as 90 DEG C, 2 hours
Condition carries out electroless Ni-P plating process, forms the Ni-P plated films of 10 μm or so of thickness.
It is in the coating surface of the substrate for being formed with Ni-P plated films, (non-to connect using Bruker Nano societies ContourGT X3
Tactile three-dimensional optical interference-type surface configuration roughmeter) with object lens × 10, FOV × 1, VSI pattern measurement surfaces.Do not confirm
Wide more than 5 μm of pit for qualified (zero), confirm for unqualified (×).
Further, the substrate after Ni-P plated films being formed, using slurry (Co., Ltd. FUJIMI of colloidal silica silicon systems
INCORPORATED DISKLITE Z5601A etc.) and liner (kanebo Co., Ltd. (existing aion Co., Ltd.) make
N005872D etc.) it is ground (polish), even if evaluating its surface, the evaluation result after yet being formed with the Ni-P plated films is not had
Change.
The chemical composition (quality %) and casting temperature of the substrate (base substrate, Al alloy sheets) of No.1～24 are shown in table 1
(DEG C), and show with regard to the element composition in Al-Fe-Mn series intermetallic compounds than (being only expressed as " Mn/Fe in table 1
Than ".), the element in Al-Fe-Ni series intermetallic compounds constituted than (" Ni/Fe ratios " being only expressed as in table 1.), yield strength
(MPa), the absolute maximum length (μm) of Al-Fe series intermetallic compounds, the Al-Fe systems gold that absolute maximum length is more than 3 μm
Number (individual/the mm of compound between category2), the absolute maximum length (μm) of Mg-Si series intermetallic compounds, at defat and acid etching
Number (individual/the mm of Al-Fe series intermetallic compounds not molten after reason2), the evaluation result of the flatness of Ni-P coated surfaces.Also
Have, the "-" in table 1 represents and do not contain or less than detection marginal value that the numerical value with underscore represents the important document for being unsatisfactory for the present invention.
【Table 1】
As shown in table 1, because meeting the important document of the present invention, absolute maximum length is more than 3 μm to the substrate of No.1～9
The number of Al-Fe series intermetallic compounds, the absolute maximum length of Mg-Si series intermetallic compounds, yield strength it is excellent.And
And which confirms, the number of defat and acid etching Al-Fe series intermetallic compounds not molten after processing, Ni-P coated surfaces it is flat
Slip is excellent, even if the acid etching for carrying out treatment before plating with weak condition is processed, small plating defect does not almost occur yet.
Wherein, No.2～5, because Mg amounts are relatively more, yield strength is especially excellent for 7～9 substrate.
On the other hand, No.1,6 substrate are because Mg amounts, Si amounts, Fe measure fewer, Al-Fe systems intermetallic
The absolute maximum length of the absolute maximum length and Mg-Si series intermetallic compounds of thing diminishes, in addition, absolute maximum length is 3 μ
The number of the Al-Fe series intermetallic compounds of more than m is also few.In addition, its defat and acid etching Al-Fe systems gold not molten after processing
Between category, the number of compound is few.In a word, the flatness of Ni-P coated surfaces is more excellent.
In contrast, the substrate of No.10～24 is because be unsatisfactory for the important document of the present invention, as a result, absolute maximum
Length is the number of more than 3 μm of Al-Fe series intermetallic compounds, the absolute maximum length of Mg-Si series intermetallic compounds, bends
Take number, the flatness of Ni-P coated surfaces of Al-Fe series intermetallic compounds not molten after intensity, defat and acid etching are processed
Inequality.It is specifically as follows.
, because Mg amounts are very few, yield strength is low for the substrate of No.10.
Because Mg amounts are excessive, hot-rolled crackle the substrate of No.11 occurs.It is thus impossible to make plate, it is impossible to after carrying out
Evaluation.
Because Cu amounts are excessive, Cu is separated out the substrate of No.12 in crystal boundary.Therefore, the acid etching in treatment before plating is processed
In, crystal boundary portion is subject to overetch and pit occurs, and the flatness of Ni-P coated surfaces is reduced.
Because Zn amounts are excessive, the precipitation core of Zn becomes big to the substrate of No.13, and the thing followed is the etching for the treatment of before plating
Formed in depression also become big.As a result, the flatness of Ni-P coated surfaces is reduced.
Because Cu amounts and Zn amounts are very few, the uniformity of zincate epithelium reduces and tuberosity occurs the substrate of No.14.Its
As a result, the flatness of Ni-P coated surfaces is reduced.
Because Cu and Zn do not contain, the uniformity of zincate epithelium reduces and tuberosity occurs the substrate of No.15.Its
As a result, the flatness of Ni-P coated surfaces is reduced.
, because Fe amounts are excessive, the absolute maximum length of Al-Fe series intermetallic compounds is long for the substrate of No.16.Separately
Outward, absolute maximum length be more than 3 μm of Al-Fe series intermetallic compounds number it is also many.Additionally, defat and acid etching are processed
The number of Al-Fe series intermetallic compounds not molten afterwards is more.As a result, the small plating defect such as tuberosity occurs, Ni-P plated films
The flatness on surface is reduced.
Because Si amounts are excessive, the absolute maximum length of Mg-Si series intermetallic compounds became the substrate of No.17
It is long.As a result, the flatness of Ni-P coated surfaces is reduced.
Because Cr amounts are excessive, thick Al-Cr series intermetallic compounds are generated the substrate of No.18.Then, carrying out
Come off from surface during mirror finish, form depression.In addition, defat and acid etching Al-Fe systems intermetallic not molten after processing
The number of thing is more.As a result, the flatness of Ni-P coated surfaces is reduced.
Because Cr amounts are very few, yield strength is reduced the substrate of No.19.
The substrate of No.20 constitutes ratio with regard to the element in Al-Fe-Mn series intermetallic compounds because Mn amounts are excessive,
Mn/Fe ratios are uprised.As a result, the number of defat and acid etching Al-Fe series intermetallic compounds not molten after processing becomes many.Cause
This, the small plating defect such as tuberosity occurs, and the flatness of Ni-P coated surfaces is reduced.
The substrate of No.21 constitutes ratio with regard to the element in Al-Fe-Ni series intermetallic compounds because Ni amounts are excessive,
Ni/Fe ratios are uprised.As a result, the number of defat and acid etching Al-Fe series intermetallic compounds not molten after processing becomes many.Cause
This, the small plating defect such as tuberosity occurs and the flatness of Ni-P coated surfaces is reduced.
Although the substrate Ni amount of No.22 and Fe measure the important document for meeting the present invention, Ni amounts are relatively more, and Fe amounts are fewer,
And casting temperature is low, therefore ratio is constituted with regard to the element in Al-Fe-Mn series intermetallic compounds, Ni/Fe ratios are uprised.Its result
It is that the number of not molten Al-Fe series intermetallic compounds becomes many after defat and acid etching process.Therefore, the small plating such as tuberosity
Defect occurs and the flatness of Ni-P coated surfaces is reduced.
Although the substrate Mn amount of No.23 and Fe measure the important document for meeting the present invention, Mn amounts are relatively more, and Fe amounts are fewer,
And casting temperature is low, therefore ratio is constituted with regard to the element in Al-Fe-Mn series intermetallic compounds, Mn/Fe ratios are uprised.Its result
It is that the number of not molten Al-Fe series intermetallic compounds becomes many after defat and acid etching process.Therefore, the small plating such as tuberosity
Defect occurs and the flatness of Ni-P coated surfaces is reduced.
Although the substrate Mn amount of No.24, Ni amounts and Fe amounts meet the important document of the present invention, Mn amounts, Ni amounts and Fe amounts ratio
It is more, and casting temperature is low, therefore the absolute maximum length of Al-Fe series intermetallic compounds becomes long.In addition, absolute maximum
Length is that the number of more than 3 μm of Al-Fe series intermetallic compounds is also more.Additionally, defat and acid etching Al- not molten after processing
The number of Fe series intermetallic compounds is more.As a result, the small plating defect such as tuberosity occurs, the flatness of Ni-P coated surfaces
Reduce.
The present invention is described in detail by with reference to specific mode, but can carried out without departing from the spirit and scope of the present invention
Various changes and modifications, will be apparent that for a person skilled in the art.
Further, the application based on March 24th, 2014 application Japanese patent application (Japan Patent 2014-060694) and
Japanese patent application filed in 3 days December in 2014 (Japan Patent 2014-245338), entire contents are quoted by quoting.
Claims (3)
1. a kind of disk aluminium alloy plate, it is characterised in that
Containing Mg：3.5～5.5 mass %,
Fe：It is limited in below 0.025 mass %,
Si：It is limited in below 0.020 mass %,
Containing Cr：0.010～0.20 mass %,
Containing Cu：0.010～0.1 mass % and Zn：At least one among 0.05～0.4 mass %,
Also, Mn：It is limited in below 0.005 mass %, and Ni：It is limited in below 0.001 mass %,
Surplus is made up of Al and inevitable impurity,
Element in Al-Fe-Mn series intermetallic compounds is constituted than being calculated as less than 0.50 with Mn/Fe ratios, and,
Element in Al-Fe-Ni series intermetallic compounds constitutes ratio and is calculated as less than 0.20 with Ni/Fe ratios,
The absolute maximum length of Al-Fe series intermetallic compounds is less than 10 μm.
2. a kind of disk aluminium alloy base substrate, it is characterised in that disk according to claim 1 is punched with aluminium alloy plate
Into discoid.
3. a kind of disk aluminum alloy substrate, it is characterised in that usage right requires the disk aluminium alloy base substrate described in 2.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014060694 | 2014-03-24 | ||
| JP2014-060694 | 2014-03-24 | ||
| JP2014-245338 | 2014-12-03 | ||
| JP2014245338A JP5767384B1 (en) | 2014-03-24 | 2014-12-03 | Aluminum alloy plate for magnetic disk, aluminum alloy blank for magnetic disk and aluminum alloy substrate for magnetic disk |
| PCT/JP2015/058386 WO2015146812A1 (en) | 2014-03-24 | 2015-03-19 | Aluminum alloy plate for magnetic disk, aluminum alloy blank for magnetic disk, and aluminum alloy substrate for magnetic disk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105324500A CN105324500A (en) | 2016-02-10 |
| CN105324500B true CN105324500B (en) | 2017-03-29 |
Family
ID=53888052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580001061.2A Expired - Fee Related CN105324500B (en) | 2014-03-24 | 2015-03-19 | Disk aluminium alloy plate, disk aluminium alloy base substrate and disk aluminum alloy substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5767384B1 (en) |
| CN (1) | CN105324500B (en) |
| MY (1) | MY158381A (en) |
| WO (1) | WO2015146812A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105568084A (en) * | 2015-12-31 | 2016-05-11 | 新疆众和股份有限公司 | Aluminum base aluminum magnesium alloy substrate for hard disk and manufacturing process of aluminum base aluminum magnesium alloy substrate |
| CN108884520B (en) * | 2016-03-25 | 2020-07-17 | 株式会社神户制钢所 | Aluminum alloy blank for magnetic disk and aluminum alloy substrate for magnetic disk |
| JP6437583B2 (en) * | 2017-02-27 | 2018-12-12 | 株式会社Uacj | Aluminum alloy plate for magnetic disk substrate, manufacturing method thereof, and magnetic disk using the aluminum alloy plate for magnetic disk substrate |
| JP6402229B1 (en) * | 2017-09-28 | 2018-10-10 | 株式会社Uacj | Aluminum alloy substrate for magnetic disk, manufacturing method thereof, and magnetic disk using the aluminum alloy substrate for magnetic disk |
| CN108486435B (en) * | 2018-04-28 | 2019-11-12 | 中铝东南材料院（福建）科技有限公司 | A kind of high flat degree hard disk aluminium alloy base plate and preparation method thereof |
| JP6908741B2 (en) * | 2019-03-14 | 2021-07-28 | 株式会社神戸製鋼所 | Aluminum alloy blanks for magnetic disks and aluminum alloy substrates for magnetic disks |
| JP6826679B2 (en) * | 2019-03-14 | 2021-02-03 | 株式会社神戸製鋼所 | Aluminum alloy blanks for magnetic disks and aluminum alloy substrates for magnetic disks |
| JP7252395B2 (en) * | 2021-07-02 | 2023-04-04 | 株式会社神戸製鋼所 | Aluminum alloy plate for magnetic disk, aluminum alloy blank for magnetic disk and aluminum alloy substrate for magnetic disk |
| WO2023276572A1 (en) * | 2021-07-02 | 2023-01-05 | 株式会社神戸製鋼所 | Aluminum alloy plate for magnetic discs, aluminum alloy blank for magnetic discs, and aluminum alloy substrate for magnetic discs |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193537A (en) * | 1983-04-15 | 1984-11-02 | Mitsubishi Alum Co Ltd | Al alloy for substrate of magnetic disk |
| JP3794930B2 (en) * | 2001-03-15 | 2006-07-12 | 株式会社神戸製鋼所 | Aluminum alloy for magnetic disk and substrate for magnetic disk |
| JP5480599B2 (en) * | 2009-11-10 | 2014-04-23 | 株式会社神戸製鋼所 | Aluminum alloy plate for magnetic disk and manufacturing method thereof |
| JP2013112884A (en) * | 2011-11-30 | 2013-06-10 | Furukawa-Sky Aluminum Corp | Aluminum alloy substrate and method for producing the same |
| JP5973952B2 (en) * | 2013-04-19 | 2016-08-23 | 株式会社神戸製鋼所 | Aluminum alloy substrate for magnetic disk and manufacturing method thereof |
-
2014
- 2014-12-03 JP JP2014245338A patent/JP5767384B1/en not_active Expired - Fee Related
-
2015
- 2015-03-19 MY MYPI2015704618A patent/MY158381A/en unknown
- 2015-03-19 CN CN201580001061.2A patent/CN105324500B/en not_active Expired - Fee Related
- 2015-03-19 WO PCT/JP2015/058386 patent/WO2015146812A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015146812A1 (en) | 2015-10-01 |
| MY158381A (en) | 2016-09-26 |
| JP5767384B1 (en) | 2015-08-19 |
| CN105324500A (en) | 2016-02-10 |
| JP2015193901A (en) | 2015-11-05 |
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