CN105322053A - Tool holder and groove processing device - Google Patents

Tool holder and groove processing device Download PDF

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Publication number
CN105322053A
CN105322053A CN201510178005.8A CN201510178005A CN105322053A CN 105322053 A CN105322053 A CN 105322053A CN 201510178005 A CN201510178005 A CN 201510178005A CN 105322053 A CN105322053 A CN 105322053A
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CN
China
Prior art keywords
instrument
overlay
tool
processing head
tool holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510178005.8A
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Chinese (zh)
Other versions
CN105322053B (en
Inventor
片桐直树
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN105322053A publication Critical patent/CN105322053A/en
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Publication of CN105322053B publication Critical patent/CN105322053B/en
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Photovoltaic Devices (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention relates to a tool holder and a groove processing device. The invention aims to make it possible to attach a tool while accurately positioning the tool in a tool holder and easily remove the tool. A cover plate (50) is fixed to a tool fitting part (42) of a base plate (40). The tool fitting part (42) has a first side wall part (46) and a second side wall part (47) which face each other. The inner side surface of the first side wall part (46) is an inclined surface (46a) and the inner side surface of the second side wall part (47) is also an inclined surface (47a) so as to form first and second V-shaped reference surfaces. The surface of the cover plate (50) is the third reference surface. The cover plate (50) is fastened through a screw (63). The cylindrical tool (60) is fixed through the three reference surfaces.

Description

Tool holder and grooving apparatus
Technical field
The present invention relates to and be a kind ofly installed on the tool holder and the grooving apparatus that add processing head man-hour film being carried out to slot machining in the manufacture of thin film solar cell.
Background technology
Such as, in the manufacturing step of the thin film solar cell of integrated-type, as described in Patent Document 1, there is lamination semiconductive thin film on substrate and also repeatedly carry out repeatedly the step of patterning.In this manufacturing step, brittle substrate forms metal lower electrode layer, and utilize as patterning P1 laser beam split by electrode layer and be divided into short strip shape.Form P type light absorbing zone and resilient coating thereon and make the semiconductive thin film of stack-up type.Thereafter, as patterning P2, by the line that offsets a little along the groove from patterning P1, a part of mechanical scratching of resilient coating and P type light absorbing zone is split and is divided into short strip shape.Next, the nesa coating comprising metal oxide is formed on the buffer layer.Then, as patterning P3, by the line offset a little along the groove from patterning P2, a part of mechanical scratching of nesa coating, resilient coating and P type light absorbing zone is divided into short strip shape.So can manufacture the solar cell of film.Therefore, need the line of patterning P2, P3 is offset a little relative to the line of patterning P1 respectively, and need to form hundred tens of parallel grooves relative to 1 plate base with the spacing of such as about 5mm.
The scoring device having solar cell is disclosed in patent documentation 2,3.Be provided with in patent documentation 2 in the substrate of engraving head, keep the tool holder of machining tool, the cylinder that tool holder is moved up and down and the spring etc. in order to the deadweight of eliminating tool holder, and by cylinder one side adjustment load one side, instrument is pressed into workpiece.In addition, in patent documentation 3, announcement has by multiple head is arranged on the slide mechanism on crossbeam and side by side carries out the scoring device of multiple delineation.
In addition, the installing mechanism having the instrument of the front end of the grooving apparatus of the slot machining being arranged on solar cell is proposed in patent documentation 4.
[background technology document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2005-191167 publication
[patent documentation 2] Japanese Patent Laid-Open 2011-155151 publication
[patent documentation 3] Japanese Patent Laid-Open 2010-245255 publication
[patent documentation 4] Japanese Patent Laid-Open 2011-142236 publication
Summary of the invention
[inventing the problem that will solve]
But the head shown in patent documentation 2 is due to the structure for being combined with multiple component, so the width of head is large to tens of about mm, and be difficult to head to be contracted to narrower than current.Therefore, as shown in such as patent documentation 3 side by side configuration multiple, there is the problem points that too cannot reduce the interval of head.Therefore, there are the following problems point: cannot carry out delineating with the narrow interval of such as 5mm in the manufacturing step etc. of solar cell and form many line abreast simultaneously.In addition, multiple head not configures by patent documentation 4 side by side, there are the following problems point: need to unload 2 screws when the instrument of replacing, thus not easily change.
The problem points that the present invention is conceived to this kind processing head in the past completes, object is to provide a kind of when configuring multiple tool holder side by side with narrow spacing, columned instrument correctly can be located respectively and be arranged on tool holder, and easily can change the tool holder of instrument and use its grooving apparatus.
[technological means of dealing with problems]
In order to solve this problem, tool holder of the present invention is arranged on processing head and keeps columned instrument and make it handling freely, and possesses: base plate, has the tool mounting-portion of erecting tools, and overlay, be fixed on the tool mounting-portion of described base plate, the tool mounting-portion of described base plate has first of the position being arranged on mutual subtend, second sidewall portion, described first, second sidewall portion is inwardly cut from the edge in outside and is formed as triangle column, and inclined plane is set to first respectively, second datum level, described overlay is formed with the surface with described tool mounting-portion subtend, and this surface is set to the 3rd datum level, be pressed into described instrument between described tool mounting-portion with described overlay and by described 3rd datum level of described overlay by described instrument is inserted into and aims at described first, second datum level is with fixing described instrument.
Herein, the drift angle that first, second sidewall portion that also can be the tool mounting-portion of described base plate is cut is angle equal each other.
In order to solve this problem, grooving apparatus of the present invention possesses: platform, for mounting substrate; Described processing head, is provided with the tool holder with the instrument carrying out slot machining; And travel mechanism, in order to make described platform and the relative movement in horizontal plane of described processing head; And grooving apparatus of the present invention makes described processing head move abreast at the upper surface of substrate and form groove on substrate.
[effect of invention]
According to the present invention with this kind of feature, the inner face in first, second sidewall portion of the base plate of tool holder is set to the inclined plane of V-shaped.These inclined planes are set to first, second datum level, the inner face of the groove of overlay is set to the second datum level and by utilize these datum levels clamp and setting tool to position.Therefore, obtain following effect: just can correctly position by means of only tightening a screw, thus can extremely easily fix or change columned instrument.
Accompanying drawing explanation
Fig. 1 is the stereogram of the grooving apparatus of embodiments of the present invention.
Fig. 2 is the front view of the processing head of the grooving apparatus of embodiments of the present invention.
Fig. 3 (a) and Fig. 3 (b) is front view and the end view of the tool holder of present embodiment.
Fig. 4 is the stereogram of the base plate of the tool holder representing present embodiment.
Fig. 5 is the stereogram of the overlay representing present embodiment.
Fig. 6 (a) and Fig. 6 (b) is upward view and the cutaway view of the state representing tool holder instrument being arranged on present embodiment.
Embodiment
Fig. 1 is the stereogram that the entirety of the grooving apparatus representing embodiments of the present invention is formed.In detail in this figure, grooving apparatus 10 possesses the platform 11 being placed with the thin film solar cell substrate W becoming processing object in xy plane.Platform 11 can move along the y direction of Fig. 1 in horizontal plane (xy plane), and can go to arbitrary angle in horizontal plane inward turning.
Above platform 11, be separately installed with video camera 13 at two pedestals 12.Each pedestal 12 can move along the guide rail 15 extended in the x-direction being arranged on support table 14.Two video cameras 13 can move up and down, and the image captured by each video camera 13 is presented at corresponding watch-dog 16.
Bridger 17 is provided with above platform 11.Bridger 17 has a pair supporting pillar 18a, 18b, across between these supporting pillars and the along the x-axis direction guide rod 19 arranged and drive the motor 21 being formed in the guide rail 20 of guide rod 19.Bridger 17 keeps processing head 30 can move in the x-direction in horizontal plane along guide rail 20 to make it.Herein, the travel mechanism that the guide rail 20 of bridger 17 and motor 21 form to make processing head 30 relative movement along the x-axis direction in horizontal plane is arranged on.
Next, the processing head 30 of Fig. 2 to embodiments of the present invention is used to be described.Processing head 30 adjacent the multiple head units 31 configured with fixed intervals are arranged on the framework 32 of frame-shaped.Herein, be such as set to and be configured with 10 head units 31 with the interval of 5mm.The top of framework 32 is provided with cylinder block 33.Be formed with 10 cylinders in cylinder block 33, and each cylinder is provided with the conduit in order to separately supply gas.And, by each cylinder supply gas, and make the piston in each cylinder along the z-axis direction mobile freely.And, be linked with head unit 31 respectively at each piston, and set up not shown spring between each head unit 31 and framework 32.The tool holder 34 moved up and down by not shown linear guides is freely separately installed with in the below of each head unit 31.
Next, the tool holder 34 being arranged on head unit 31 is described.Fig. 3 (a) and Fig. 3 (b) is front view and the end view of tool holder 34.Tool holder 34 has elongated rectangular-shaped form to be configured with narrow interval.Tool holder 34 has as a whole and is cuboid and its a part of base plate 40 be cut and the overlay 50 being arranged on this notch, and in lower end, instrument 60 is remained handling freely.
Fig. 4 is the stereogram of base plate 40.As shown in this figure, base plate 40 is roughly rectangular-shaped, and has the processing head installation portion 41 on the top being arranged on linear slide block and install in below and the tool mounting-portion 42 of setting tool.A pair through hole 43a, 43b is provided with up and down at processing head installation portion 41.
Tool mounting-portion 42 as shown in Figure 4 below is cut into thinner, has opening 44a, 44b of inserting for two foundation pilot pins at an upper portion thereof, has the flight 45 installing screw in below.In addition, in the below of flight 45, the sidewall portion 46 and 47 extended on the same face with sidewall is provided with in both sides.The centre in sidewall portion 46,47 becomes elongated groove 48.Sidewall portion 46 is cut in the mode becoming roughly triangle column towards the groove 48 of inner side from the front end at the edge of side as diagram, and inner side becomes inclined plane 46a.Similarly, sidewall portion 47 is cut in the mode becoming roughly triangle column towards the groove 48 of inner side from the edge of the side in outside, and inner side becomes inclined plane 47a.The drift angle of otch is equal, and be such as 45 ° ~ 60 °, the section of inclined plane 46a, 47a becomes V-shaped.Inclined plane 46a forms the first datum level, and inclined plane 47a forms the second datum level.
Next, the overlay 50 being arranged on this tool mounting-portion 42 is described.Overlay 50 is illustrated in figure 5 elongated rectangular-shaped component, and is cut into thinner than end difference 51 part on the lower.On the top of the end difference 51 of overlay 50, through hole 52a, 52b of inserting for two foundation pilot pins and the through hole 53 for screw insertion are arranged on a line.Have in the below of the end difference 51 of overlay 50 and slope inwardly and cut sidewall portion 54,55 from the sidewall of both sides, and the plane 56a on the surface of groove 56 inside it forms the 3rd datum level.This plane 56a forms the face parallel with the back side of overlay 50.
Next, the installation of instrument 60 to tool holder 34 is described.In Fig. 3 (a) and Fig. 3 (b), first, make through hole 52a, 52b of the through overlay of two foundation pilot pins 61,62 and be inserted into opening 44a, 44b of base plate 40.And then, make screw 63 from the through flight 45 to tool mounting-portion 42 of the through hole 53 of overlay 50 side, and tighten the screws 63.Thus, base plate 40 and overlay 50 become roughly rectangular-shaped tool holder 34 as a whole, and are formed with elongated groove in below.
Then, as Suo Shi Fig. 3 (a) and Fig. 3 (b) by the point of a knife of columned instrument 60 down and insert from groove.Fig. 6 (a) is the upward view representing the state of having installed columned instrument 60, and Fig. 6 (b) is the cutaway view of the A-A line along Fig. 3 (a).If instrument 60 is inserted into bosom, so the top of instrument 60 is kept by magnet 64.If tighten the screws 63 in this condition, so owing to using two foundation pilot pins 61,62, so overlay 50 is close relative to base plate 40 keeping parallelism.The sidewall of instrument 60 contacts with first, second inclined plane 46a, the 47a in the plane 56a of the groove 56 of overlay 50 and the sidewall portion 46,47 of base plate and is fixed on ad-hoc location.Now, plane 56a becomes the 3rd datum level and presses these faces and clamp instrument 60, and inclined plane 46a, the 47a in sidewall portion 46,47 become first, second datum level, thus correctly can locate and install columned instrument 63.So, under the state that instrument is arranged on tool holder, multiple tool holder 34 is arranged in processing head 30 as shown in Figure 2.Now, become in Fig. 3 (b) with the direction using instrument to carry out delineating and installed by the mode in the x-axis direction shown in arrow.In addition, the sidewall portion 54,55 of overlay does not contact with the instrument 60 of the state kept by first, second inclined plane 46a, 47a and plane 56a and is helpless to the maintenance of instrument, so also can omit the sidewall portion 54,55 of overlay.
In addition when using this processing head to carry out slot machining, as shown in Figure 1 thin film solar cell substrate W is configured on platform 11.Then, processing head 30 is moved to the one end in x-axis direction, and adjustment is supplied to the gas of the cylinder of the cylinder block of processing head to control the position in the z-axis direction of the instrument of each head unit.Thus, the load of each instrument separately can be set when manufacturing solar cell.Then, with the load of the best, film sun electric substrate W is delineated to make processing head 30 move along x-axis by CD-ROM drive motor 21, and form multiple groove simultaneously.In addition, when delineating, instrument 60 is applied relative to first, second datum level and the power of symmetry.Make when as above having formed groove in the direction of the x axis each head block increase a little, and again fall each head block after platform 11 is staggered to y-axis direction and repeatedly carry out slot machining.As long as like this, just patterning P1, P2, P3 can be performed with narrow interval., make the drift angle of the otch of formation inclined plane 46a, 47a equal herein, even if therefore the external diameter of instrument 60 exists slightly little error, error also can become the position skew in x-axis direction, and the situation of position skew in the y-axis direction disappears.
And, when changing in instrument deterioration, unscrew the screw 63 of tool holder 34 and the below of instrument 60 to Fig. 3 (a) and Fig. 3 (b) is extracted out.Then, by means of only new instrument being inserted from the groove of the below of tool holder 34 and utilizing screw 63 to tighten, just new instrument correctly can be fixed on ad-hoc location, thus the replacing operation of instrument can be carried out simply.Now, the sidewall portion 54,55 of overlay is the guide rail of the posture of the instrument 60 extracted out as restriction or insert and plays function, thus makes the replacing of instrument easy.
In addition, be illustrated for grooving apparatus solar cell substrate being carried out to slot machining in the present embodiment, but the present invention is not limited to solar cell substrate, a kind of grooving apparatus and the tool holder of various brittle substrate being implemented to slot machining can be provided.
[utilizability in industry]
About this processing head, owing to installing multiple instrument by installing multiple processing head side by side with narrow spacing, the grooving apparatus etc. of the solar cell simultaneously forming many grooves therefore preferably can be used in.
[explanation of symbol]
10 grooving apparatus
11 mounting tables
12 video cameras
13 pedestals
14 support table
15 guide rails
16 watch-dogs
17 bridgers
18a, 18b pillar
19 guide rods
20 guide rails
21 motors
30 processing heads
31 head units
32 frameworks
33 cylinder block
34 tool holders
40 base plates
41 processing head installation portions
42 tool mounting-portion
44a, 44b opening
45 flights
46,47 sidewall portions
46a, 47b inclined plane
48 grooves
50 overlays
51 end differences
52,53 through holes
54,55 sidewall portions
56 grooves
56a plane
60 instruments
61,62 reference pins
63 screws.

Claims (5)

1. a tool holder, is arranged on processing head and keeps columned instrument and make it handling freely, and possessing:
Base plate, has the tool mounting-portion of erecting tools; And
Overlay, is fixed on the tool mounting-portion of described base plate; And
The tool mounting-portion of described base plate has
Be arranged on first, second sidewall portion of the position of mutual subtend, and
First, second sidewall portion described is inwardly cut from the edge in outside and is formed as triangle column, and inclined plane is set to respectively first, second datum level,
Described overlay is formed with the surface with described tool mounting-portion subtend, and this surface is set to the 3rd datum level,
By described instrument is inserted between described tool mounting-portion and described overlay, and described 3rd datum level of described overlay is pressed into described instrument and aims at first, second datum level described with fixing described instrument.
2. tool holder according to claim 1, the drift angle that first, second sidewall portion of the tool mounting-portion of wherein said base plate is cut is angle equal each other.
3. tool holder according to claim 1 and 2, wherein said overlay to be formed with groove with the mode of described tool mounting-portion subtend, and is formed with pair of sidewalls portion outside it,
Described instrument is inserted in the groove formed by described tool mounting-portion and described overlay, and the surface of the described groove of described overlay is set to described 3rd datum level.
4. a grooving apparatus, possesses:
Platform, for mounting substrate;
Processing head, is provided with the tool holder according to claim 1 and 2 of the instrument having to carry out slot machining; And
Travel mechanism, in order to make described platform and the relative movement in horizontal plane of described processing head; And this grooving apparatus makes described processing head move abreast at the upper surface of substrate and form groove on substrate.
5. a grooving apparatus, possesses:
Platform, for mounting substrate;
Processing head, is provided with the tool holder according to claim 3 of the instrument having to carry out slot machining; And
Travel mechanism, in order to make described platform and the relative movement in horizontal plane of described processing head; And this grooving apparatus makes described processing head move abreast at the upper surface of substrate and form groove on substrate.
CN201510178005.8A 2014-05-29 2015-04-15 Tool holder and grooving apparatus Active CN105322053B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014110813 2014-05-29
JP2014-110813 2014-05-29
JP2014265597A JP6406005B2 (en) 2014-05-29 2014-12-26 Tool holder and groove processing device
JP2014-265597 2014-12-26

Publications (2)

Publication Number Publication Date
CN105322053A true CN105322053A (en) 2016-02-10
CN105322053B CN105322053B (en) 2017-11-14

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Application Number Title Priority Date Filing Date
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JP (1) JP6406005B2 (en)
CN (1) CN105322053B (en)
TW (1) TWI659541B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114670039B (en) * 2022-04-08 2023-05-26 北京市政建设集团有限责任公司 Positioning device for processing steel sheet piles for construction of thermodynamic tunnel

Citations (4)

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Publication number Priority date Publication date Assignee Title
CN102130216A (en) * 2010-01-08 2011-07-20 三星钻石工业股份有限公司 Groove machining tool for use with a thin-film solar cell and an angle regulation structure
CN102142485A (en) * 2010-01-27 2011-08-03 三星钻石工业股份有限公司 Scribing apparatus for thin film solar cells
JP2011216646A (en) * 2010-03-31 2011-10-27 Mitsuboshi Diamond Industrial Co Ltd Scribing device
KR101298024B1 (en) * 2010-09-17 2013-08-26 엘지디스플레이 주식회사 Method and interface of recognizing user's dynamic organ gesture, and electric-using apparatus using the interface

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US6103518A (en) * 1999-03-05 2000-08-15 Beecher Instruments Instrument for constructing tissue arrays
JP2005074477A (en) * 2003-09-01 2005-03-24 Matsushita Electric Ind Co Ltd Punch holding mechanism of punching press die, and method therefor
JP4452691B2 (en) * 2005-08-04 2010-04-21 リンテック株式会社 Sheet cutting device and cutting method
JP4842015B2 (en) * 2006-04-28 2011-12-21 英一 大林 Cutter wheel tip holder for brittle materials
CN201168796Y (en) * 2008-02-04 2008-12-24 映钒企业有限公司 Combined type lathe cutter structure
JP6331701B2 (en) * 2014-05-29 2018-05-30 三星ダイヤモンド工業株式会社 Tool holder and groove processing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102130216A (en) * 2010-01-08 2011-07-20 三星钻石工业股份有限公司 Groove machining tool for use with a thin-film solar cell and an angle regulation structure
CN102142485A (en) * 2010-01-27 2011-08-03 三星钻石工业股份有限公司 Scribing apparatus for thin film solar cells
JP2011216646A (en) * 2010-03-31 2011-10-27 Mitsuboshi Diamond Industrial Co Ltd Scribing device
KR101298024B1 (en) * 2010-09-17 2013-08-26 엘지디스플레이 주식회사 Method and interface of recognizing user's dynamic organ gesture, and electric-using apparatus using the interface

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Publication number Publication date
CN105322053B (en) 2017-11-14
JP6406005B2 (en) 2018-10-17
TWI659541B (en) 2019-05-11
JP2016006845A (en) 2016-01-14
TW201601335A (en) 2016-01-01

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