CN105316664A - Method for treating metal surface and metal surface treating agent used thereof - Google Patents

Method for treating metal surface and metal surface treating agent used thereof Download PDF

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Publication number
CN105316664A
CN105316664A CN201510422991.7A CN201510422991A CN105316664A CN 105316664 A CN105316664 A CN 105316664A CN 201510422991 A CN201510422991 A CN 201510422991A CN 105316664 A CN105316664 A CN 105316664A
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quality
epithelium
alkali metal
metal salt
less
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CN201510422991.7A
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CN105316664B (en
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韩钟直
韩娜丽
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Grimm Chemical Industry Co Ltd
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Grimm Chemical Industry Co Ltd
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Abstract

The invention relates to a method for treating metal surface and a metal surface treatment thereof including; a step of flushing after removing the scale of metal materials; a step of forming a alkali metallic salt film on the surface of the metal materials after the flushing to improve a lubrication effect when the metal materials wire is drawn by a dice and to protect the surface of the metal materials; and a step of drying. The present invention is capable of providing rod drawability, corrosion resistance, and wear resistance on the surface of a wire without any environmental contamination.

Description

Metal surface treating method and metal conditioner
Technical field
The present invention relates to metal surface treating method and metal conditioner, more specifically, in order to improve oilness and there is extensibility and form epithelium in metallic surface when relating to plastic working, and comprise the metal surface treating method and metal conditioner that immerse (BatchSystem) and operate continuously (InlineSystem).
Background technology
In metal iron easily oxidized in atmosphere and be difficult to keeping.Therefore, in order to protect metallic surface to carry out gold-plated or chemical conversion treatment.In chemical conversion treatment, be generally used in order to the lubrication, electrical isolation etc. of the close property of coating, wear resistance, viscous deformation processing the phosphate coating process that metal material surface forms phosphate coating.
Phosphate coating handling principle is as follows.
3[Zn(H 2PO 4) 2)]→Zn 3(PO 4) 2+4H 3PO 4
In the surface treatment used in plastic working, its optimal quality show of the phosphate coating formed by phosphate coating process.
But, phosphate coating process have the phosphate coating agent containing heavy metal waste water handling problem, because of mud (Sludge) produce (Fe (PO 4)) problem such as the offal treatment that causes.
Mud produces (Fe (PO 4)) process be as follows.
Fe+2H 3PO 4→Fe(H 2PO 4) 2+H 2
Oxygenant (O) → H 2o
FePO 4(Sludge)+H 3PO 4+1/2H 2O
And, in order to the temperature treatment phosphate coating agent of more than 80 DEG C, also there is problems such as consuming thermal source.
Along with people increase to the cognition of environment protection, the trade waste produced in phosphate coating process and environment protection clash.
Summary of the invention
The object of the invention is to, the environmental problem improved waste water, mud because producing in existing phosphate coating process and cause is provided, especially, reducing thermal source and elementary cell by reducing operation, forming metal surface treating method and the metal conditioner with ductile pre-treatment (Precoating) epithelium in metallic surface.
For reaching object described above, the present invention includes: the step removing the dirt after washing of metallic substance; After washing, when described metallic substance carries out Wire Drawing by wortle, in order to improve lubricant effect and protect the surface of described metallic substance, form the step of an alkali metal salt epithelium on the surface of described metallic substance; And drying step.
At least one method that the dirt of described metallic substance is removed and is selected from chemical pickling operation, electrolytic pickling operation, physics derust in operation.
Described an alkali metal salt epithelium is immersed to by the metallic substance of described washing in the metal conditioner containing an alkali metal salt reactant and additive, thus be adhered to described metal material surface.
The quality of described metal conditioner an alkali metal salt reactant described in it and described additive is 10:90-90:10 than scope.
Described an alkali metal salt reactant comprises the Na of 10-90 quality % relative to described reactant total mass 2the B of O, 10-90 quality % 2o 3, pH scope is 5-10.
Described additive increases the bonding amount of described an alkali metal salt epithelium as tackiness agent, makes described an alkali metal salt epithelium have solidity to corrosion, and the one be selected from mineral compound and organic compound or its compound, wherein said mineral compound is selected from B 2o 3, Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO, BaO, SO 3, more than one in SrO, described organic compound is selected from CH 2o, C 6h 10o 5, CH 3oH, COOH, methoxyl group (Methoxy), oxyethyl group (ethoxy), propoxyl (hydroxyproxy), ester (Ester), semi-lactosi, glucose, C 6h 12o 6, CH 2more than one in OH, polyvalent alcohol (Polyol).
Described mineral compound comprises the B of 10-90 quality % relative to described additive total mass 2o 3, be greater than the Al that 0 is less than 30 quality % 2o 3, be greater than the ZrO that 0 is less than 30 quality % 2, be greater than the K that 0 is less than 30 quality % 2o, be greater than the SiO that 0 is less than 30 quality % 2, be greater than the Fe that 0 is less than 10 quality % 2o 3, be greater than the MgO that 0 is less than 10 quality %.
Described organic compound comprises the CH of 1-15 quality % relative to described additive total mass 2the C of O, 1-15 quality % 6h 10o 5, 1-15 quality % CH 3the propoxyl of the methoxyl group of COOH, 1-15 quality % of OH, 1-15 quality %, the oxyethyl group of 1-15 quality %, 1-15 quality %, the ester of 1-15 quality %, the semi-lactosi of 1-15 quality %, the glucose of 1-15 quality %, the C of 1-15 quality % 6h 12o 6, 1-15 quality % CH 2the polyvalent alcohol of OH, 1-15 quality %.
Described additive comprises the one be selected from the compound with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group further, comprises be greater than the scope that 0 is less than 10 quality % relative to described additive total mass.
Described metallic substance is wire rod, and described wire rod is selected from the one in iron and steel, stainless steel, aluminium, titanium, copper, magnesium and alloy thereof.
Metal conditioner is used for forming an alkali metal salt epithelium on the surface of metallic substance, and the mass ratio of its an alkali metal salt reactant and additive is 10:90-90:10.
Described an alkali metal salt reactant comprises the Na of 10-90 quality % relative to described reactant total mass 2the B of O, 10-90 quality % 2o 3, pH scope is 5-10.
Described additive is selected from one in mineral compound and organic compound or its compound, and wherein said mineral compound is selected from B 2o 3, Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO, BaO, SO 3, more than one in SrO, described organic compound is selected from CH 2o, C 6h 10o 5, CH 3oH, COOH, methoxyl group, oxyethyl group, propoxyl, ester, semi-lactosi, glucose, C 6h 12o 6, CH 2more than one in OH, polyvalent alcohol.
Described mineral compound comprises the B of 10-90 quality % relative to described additive total mass 2o 3, be greater than the Al that 0 is less than 30 quality % 2o 3, be greater than the ZrO that 0 is less than 30 quality % 2, be greater than the K that 0 is less than 30 quality % 2o, be greater than the SiO that 0 is less than 30 quality % 2, be greater than the Fe that 0 is less than 10 quality % 2o 3, be greater than the MgO that 0 is less than 10 quality %.
Described organic compound comprises the CH of 1-15 quality % relative to described additive total mass 2the C of O, 1-15 quality % 6h 10o 5, 1-15 quality % CH 3the propoxyl of the methoxyl group of COOH, 1-15 quality % of OH, 1-15 quality %, the oxyethyl group of 1-15 quality %, 1-15 quality %, the ester of 1-15 quality %, the semi-lactosi of 1-15 quality %, the glucose of 1-15 quality %, the C of 1-15 quality % 6h 12o 6, 1-15 quality % CH 2the polyvalent alcohol of OH, 1-15 quality %.
Described additive comprises the one be selected from the compound with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group further, has be greater than the scope that 0 is less than 10 quality % relative to described additive total mass.
Metal conditioner is used for forming an alkali metal salt epithelium on the surface of metallic substance, is not containing B 2o 3without boron (BoronFree) metal conditioner, the quality of additive and water is 5:95-50:50 than scope.
Additive is selected from one in mineral compound and organic compound or its compound, and wherein said mineral compound is selected from Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO, BaO, SO 3, more than one in SrO, S, Si, Ca, organic compound is selected from CH 2o, C 6h 10o 5, CH 3oH, COOH, methoxyl group, oxyethyl group, propoxyl, ester, semi-lactosi, glucose, C 6h 12o 6, CH 2more than one in OH, polyvalent alcohol.
Described metal conditioner is K 2o and SiO 2carry out reacting and form an alkali metal salt epithelium on the surface of described metallic substance.
Metal surface treating method of the present invention is reacted by an alkali metal salt and forms an alkali metal salt pre-treatment epithelium on the surface of wire rod, therefore, different from formation phosphate coating, can not environmental problem be caused, and have and make wire surface have extensibility, solidity to corrosion, the effect of wear resistance and the effect of carrying (carrier (pick-up)) various lubricant.
The present invention has the effect reducing thermal source and elementary cell because reducing operation, can be cost-saving when therefore carrying out metal finishing.
Accompanying drawing explanation
Fig. 1 is the procedure chart according to metal surface treating method of the present invention.
Fig. 2 and Fig. 3 is the mode chart of the epithelium formed by metal surface treating method of the present invention.
Fig. 4 is the mode chart without boron epithelium formed by the metal surface treating method of other embodiments of the present invention.
Embodiment
Below, the preferred embodiments of the present invention are described in detail.
As shown in Figure 1, metal surface treating method of the present invention, comprising: the step removing the dirt after washing of metallic substance; After washing, when described metallic substance carries out wire drawing by wortle, in order to improve lubricant effect, protecting the surface of described metallic substance and carry (carrier (pick-up)) various lubricant, form the step of an alkali metal salt pre-treatment epithelium (hereinafter referred to as " an alkali metal salt epithelium ") on the surface of described metallic substance; And drying step.
Wire rod selected by metallic substance.Wire rod refers to the wire rod (WireRod) being manufactured various line by Wire Drawing.Wire rod is fabricated to the diameter with 5.5mm-32mm, manufactured the drawing process of the fine rule of wanted shape and size by the hole pull-out through wortle and be manufactured to steel wire, iron wire, piano wire.
Wire rod can be formed hard dirt on surface by after hot rolling, in order to Wire Drawing needs to remove dirt.Wire rod is by after hot rolling, and need to heat-treat to obtain physical properties (hardness and toughness), the wire rod of heat-treating also forms dirt on surface, therefore in order to Wire Drawing also needs to remove dirt.Dirt is the oxide compound produced at wire surface, can affect Wire Drawing when not removing.
At least one method that dirt is removed can be selected from chemical pickling operation, electrolytic pickling operation, physics derust in operation.
Pickling process is wire rod is immersed to the operation that the specified time such as hydrochloric acid, sulfuric acid removes dirt, and physics derusts operation for carrying out de-scaling (scalebreaker) or spraying the operation that hard particles projectile and high pressure water remove the dirt of wire surface on the surface of wire rod.
The concentration that the dirt of pickling process removes the Acidwash solution by increasing hydrochloric acid, sulfuric acid, nitric acid etc. improves clearance.
Wash after removing the dirt of wire surface, and form an alkali metal salt epithelium on the surface of wire rod.Carry out drying after forming an alkali metal salt epithelium, then carry out Wire Drawing.
During Wire Drawing, most important condition is for guarantee wire-drawing workability by lubricant effect.Wire Drawing is generally High-speed machining, therefore, adds and easily causes man-hour temperature to rise, reduce oil body or cause the floating and rupture of oil film of powder lubricant.And Wire Drawing is attended by high temperature, therefore, because the friction of wortle and wire rod easily forms adhesion at wortle, and easily produce flaw on the surface of wire rod because of described adhesion or be difficult to carry out viscous deformation smoothly.
When Wire Drawing, the friction because of the High Temperature High Pressure produced between wortle and wire rod causes wire surface damaged, in order to prevent breakage and complete viscous deformation smoothly, forms epithelium at wire surface.
Epithelium is an alkali metal salt epithelium.An alkali metal salt epithelium is be immersed to by the wire rod of washing in the metal conditioner containing an alkali metal salt reactant and additive, thus is adhered to wire surface.
In addition, also have the gunite at wire surface metal injection surface treatment agent, the squeegee process with brush brushing, method etc. with roll brushing, wire rod is immersed to and is equipped with in the groove of metal conditioner by preferred employing, thus in the sedimentation of wire rod surface bonding metal conditioner.
An alkali metal salt epithelium improves oilness in Wire Drawing, thus can carry out viscous deformation smoothly.
The bonding amount (thickness) of an alkali metal salt epithelium is preferably 5-30g/ ㎡.
The bonding amount of an alkali metal salt epithelium is relevant with Wire Drawing, the solidity to corrosion of epithelium and wear resistance can not be guaranteed when bonding amount is less than 5g/ ㎡ and in Wire Drawing, be difficult to guarantee oilness, when being greater than 30g/ ㎡, because too much epithelium causes the close property of epithelium itself to reduce, reduce wire-drawing workability simultaneously.
The epithelium of optimum regime is formed when the bonding amount of an alkali metal salt epithelium is 10g/ ㎡.
The quality of its an alkali metal salt reactant of metal conditioner and additive is 10:90-90:10 than scope.Preferably, the quality of its an alkali metal salt reactant of metal conditioner and additive is 60:40-70:30 than scope.
An alkali metal salt reactant is used for forming epithelium at wire surface.
Additive works to improve the solidity to corrosion of epithelium and increases the bonding amount of epithelium or lubricant.Containing additive only with an alkali metal salt reactant when wire surface forms epithelium, can epithelium be formed but be difficult to adjust bonding amount and uneven, produce iron rust at wire rod and be difficult to guarantee solidity to corrosion.
When the mass ratio of an alkali metal salt reactant and additive is less than 60:40, although can epithelium be formed, but the quantity not sufficient of an alkali metal salt reactant and be difficult to be formed the epithelium of optimal morphology, when more than 70:30 quality than time, carry the scarce capacity of lubricant because additive is not enough and be difficult to be formed the epithelium of optimal morphology.
When the mass ratio of an alkali metal salt reactant and additive is less than 10:90, be difficult to guarantee the bonding amount of epithelium, when more than 90:10 quality than time, be difficult to the epithelium forming optimal morphology because additive is not enough, and be difficult to bonding epithelium equably.
An alkali metal salt reactant comprises the Na of 10-90 quality % relative to described reactant total mass 2the B of O, 10-90 quality % 2o 3, pH scope is 5-10.
Na 2o and B 2o 3reaction generates an alkali metal salt.Therefore, an alkali metal salt comprises Na 2b 4o 7.Described an alkali metal salt plays antacid effect, therefore different from formation phosphate coating, can not cause environmental problem when processing wire rod surperficial.
An alkali metal salt reactant pH be less than 5 or be greater than 10 time, viscosity reduce and be difficult to generate epithelium at the appointed time.Therefore, pH ranges preferably from 5-10.
Additive is selected from one in mineral compound and organic compound or its compound, and wherein said mineral compound is selected from B 2o 3, Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO, BaO, SO 3, more than one in SrO, organic compound is selected from CH 2o, C 6h 10o 5, CH 3oH, COOH, methoxyl group, oxyethyl group, propoxyl, ester, semi-lactosi, glucose, C 6h 12o 6, CH 2more than one in OH, polyvalent alcohol.
The basal component of additive is mineral compound.Mineral compound (inorganics) increases the bonding amount of described an alkali metal salt epithelium as tackiness agent, makes described an alkali metal salt epithelium have solidity to corrosion.
Organic compound (organism) is added and makes more mineral compound bonding in mineral compound, thus increases the bonding amount of epithelium or lubricant.When organic compound uses as additive together with mineral compound, more mineral compound can be attracted and increase the bonding amount of epithelium.
The mass ratio of mineral compound and organic compound can be 99:1-50:50.
Compared to mineral compound, when the content of organic compound is more, the bonding amount of epithelium increases effect and can be saturated.
Mineral compound can comprise B 2o 3, Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO is whole.Such as, mineral compound can comprise the B of 10-90 quality % relative to described additive total mass 2o 3, be greater than the Al that 0 is less than 30 quality % 2o 3, be greater than the ZrO that 0 is less than 30 quality % 2, be greater than the K that 0 is less than 30 quality % 2o, be greater than the SiO that 0 is less than 30 quality % 2, be greater than the Fe that 0 is less than 10 quality % 2o 3, be greater than the MgO that 0 is less than 10 quality %.
Mineral compound can comprise BaO, SO 3, SrO.Such as, mineral compound can comprise the SO of BaO, 1-90 quality % of 1-10 quality % relative to described additive total mass 3, 1-90 quality % SrO.
Organic compound can comprise CH 2o, C 6h 10o 5, CH 3oH, COOH, methoxyl group, oxyethyl group, propoxyl, ester, semi-lactosi, glucose, C 6h 12o 6, CH 2oH, polyvalent alcohol are whole.Such as, organic compound can comprise the CH of 1-15 quality % relative to described additive total mass 2the C of O, 1-15 quality % 6h 10o 5, 1-15 quality % CH 3the propoxyl of the methoxyl group of COOH, 1-15 quality % of OH, 1-15 quality %, the oxyethyl group of 1-15 quality %, 1-15 quality %, the ester of 1-15 quality %, the semi-lactosi of 1-15 quality %, the glucose of 1-15 quality %, the C of 1-15 quality % 6h 12o 6, 1-15 quality % CH 2the polyvalent alcohol of OH, 1-15 quality %.
CH in organic compound 2o, C 6h 10o 5, CH 3oH, COOH, methoxyl group, oxyethyl group, propoxyl, ester, semi-lactosi, glucose, C 6h 12o 6, CH 2oH, polyvalent alcohol refer to functional group.
Additive comprises the one be selected from the compound (having inorganic complex) with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group further, can have be greater than the scope that 0 is less than 10 quality % relative to additive total mass.
Additive has the effect evenly forming epithelium at wire rod.
Usual use wire rod is immersed to metal conditioner is housed groove in after pass through, thus in the method for wire rod surface bonding metal conditioner, now, wire rod is being immersed in the process passed through after in groove, the metal conditioner on wire rod top flows to bottom because of gravity, the metal conditioner flowing to bottom then concentrates on the bottom of wire rod, thus the epithelium on wire rod top is thin and the epithelium of bottom is thick, produces non-uniform phenomenon.
In order to prevent described phenomenon, comprise the one be selected from the compound with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group further.
Have lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group compound metal conditioner is evenly adhered on wire rod, thus evenly form epithelium on wire rod.
When to be selected from the compound with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group a kind of, relative to additive total mass comprise be greater than 10 quality % time, the composition of other additive components and mineral compound or organic compound reduces relatively, thus is difficult to guarantee the bonding amount of epithelium.
After forming epithelium, drying ranges preferably from 40-300 DEG C.When drying temperature is lower than 40 DEG C, dry insufficient and promising result after forming epithelium, can not be expected, when more than 300 DEG C, after drying, be not easy cooling, and because of the carbonization etc. of epithelium cause epithelium composition in conjunction with time deform, and can overall performance be reduced.
Fig. 2 and Fig. 3 is the schematic diagram of an alkali metal salt epithelium formed by metal surface treating method of the present invention.
As shown in Figure 2, an alkali metal salt epithelium is formed by an alkali metal salt reactant and mineral compound reaction, as shown in Figure 3, reacts formed by an alkali metal salt reactant and mineral compound, organic compound one.
When for Fig. 2 situation, the epithelium of thinner thickness is formed compared to Fig. 3, two kinds of situations all add the one be selected from the compound with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group as additive, thus evenly form epithelium in the upper and lower of wire rod.
Described metal surface treating method is by Na 2o and B 2o 3carry out reaction to form an alkali metal salt, therefore can not produce too much mud in epithelium treating processes, prevent heavy metal the like waste.
Therefore, different when metal surface treating method of the present invention and formation phosphate coating, can not environmental problem be caused when processing wire surface, and make wire surface have extensibility, solidity to corrosion, wear resistance etc.
Metallic substance is illustrated for wire rod, but is not limited to wire rod, needs the various material such as steel plate, steel of lubrication when can be plastic working.
Metallic substance can be selected from the one in iron and steel, stainless steel, aluminium, titanium, copper, magnesium and alloy thereof.
Metal conditioner of the present invention, except described integrant, can comprise defoamer, water etc. further in the scope not damaging main idea of the present invention or epithelium performance.
Metal conditioner of the present invention assigns to manufacture by the one-tenth as mentioned above that hybrid regulatory is quantitative, is not particularly limited to, applicable various known method for blending means.
The temperature of metal conditioner keeps 70-90 DEG C.When the temperature of metal conditioner is lower than 70 DEG C, adhesive effect is weak, and when more than 90 DEG C, volatile quantity is many and be difficult to keep total quality ratio.
Be formed with the wire rod of an alkali metal salt epithelium by as above process, be fabricated to the fine rule with desired shape and size by Wire Drawing.
Below, the present invention is described in detail with reference to following example and comparative example.
But following example and comparative example only for example the present invention, do not limit the present invention.
Whether etc. table 1 illustrates to utilize metal conditioner of the present invention to form the bonding amount after epithelium, extensibility, wear resistance, epithelium evenly at wire rod.
Table 1
(unit: quality %)
[bonding amount unit: g/ ㎡]
< extensibility >
Zero: outstanding, △: common, ×: poor
< solidity to corrosion and wear resistance >
Zero: outstanding, △: common, ×: poor
As a reference, mineral compound comprises the B of 10-90 quality % relative to additive total mass 2o 3, be greater than the Al that 0 is less than 30 quality % 2o 3, be greater than the ZrO that 0 is less than 30 quality % 2, be greater than the K that 0 is less than 30 quality % 2o, be greater than the SiO that 0 is less than 30 quality % 2, be greater than the Fe that 0 is less than 10 quality % 2o 3, be greater than the MgO that 0 is less than 10 quality %, organic compound comprises the CH of 1-15 quality % relative to additive total mass 2the C of O, 1-15 quality % 6h 10o 5, 1-15 quality % CH 3the propoxyl of the methoxyl group of COOH, 1-15 quality % of OH, 1-15 quality %, the oxyethyl group of 1-15 quality %, 1-15 quality %, the ester of 1-15 quality %, the semi-lactosi of 1-15 quality %, the glucose of 1-15 quality %, the C of 1-15 quality % 6h 12o 6, 1-15 quality % CH 2the polyvalent alcohol of OH, 1-15 quality %, other compounds employ the compound with lipid functional group.
Wire rod immerses 1-10 minute (BatchSystem) or passes through after 1 second to 5 minutes in the groove that metal conditioner is housed, and now the temperature of metal conditioner keeps 70-90 DEG C.
As shown in table 1, not low containing its bonding amount of comparative example 1 of additive and epithelium is also uneven, not uneven containing the comparative example 2 of other compounds, its epithelium of comparative example 3.
The mass ratio of an alkali metal salt reactant and additive do not meet 60:40-70:30 scope and not containing the bonding quantity not sufficient of its epithelium of comparative example 4 of additive, thus extensibility, solidity to corrosion, wear resistance is not enough.
The content of other compounds is even more than its epithelium of comparative example 5 of 10 quality % relative to additive total mass, but the content relative deficiency of mineral compound or organic compound and the bonding amount of epithelium is low.
Only comprise Na 2o and B 2o 3in a kind of composition comparative example 6 to comparative example 9 its do not generate metal-salt and can not epithelium be formed.
The bonding amount of its epithelium of example 1 to example 7 meeting scope of the present invention meets 5-30g/ ㎡, and epithelium is also even.Especially, in example 2, the bonding amount of epithelium is 10g/ ㎡, defines the epithelium of optimal morphology.
Can be confirmed by above experimental result, metal conditioner of the present invention does not cause environmental problem, forms epithelium simultaneously and have extensibility, solidity to corrosion, wear resistance at wire rod surface uniform.
As other embodiments, when metal conditioner needs without boron, comprise additive and water, the mass ratio of additive and water can be 5:95-50:50.
During without boron, do not use an alkali metal salt reactant in addition and be contained in additive.Without during boron at additive-package alkali metal containing reactant salt thing, the quality of the additive therefore contained in metal conditioner can be different from above embodiment.
Additive is selected from one in mineral compound and organic compound or its compound, and wherein said mineral compound is selected from Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO, BaO, SO 3, more than one in SrO, S, Si, Ca, described organic compound is selected from CH 2o, C 6h 10o 5, CH 3oH, COOH, methoxyl group, oxyethyl group, propoxyl, ester, semi-lactosi, glucose, C 6h 12o 6, CH 2more than one in OH, polyvalent alcohol.
Preferably, mineral compound comprises and is greater than the Al that 0 is less than 30 quality % 2o 3, be greater than the ZrO that 0 is less than 30 quality % 2, be greater than the K that 0 is less than 90 quality % 2o, be greater than the SiO that 0 is less than 90 quality % 2, be greater than the Fe that 0 is less than 10 quality % 2o 3, be greater than 0 MgO being less than 10 quality %, be greater than 0 S being less than 30 quality %, be greater than 0 Si being less than 30 quality %, be greater than the Ca that 0 is less than 30 quality %.
Organic compound comprises the CH of 1-15 quality % 2the C of O, 1-15 quality % 6h 10o 5, 1-15 quality % CH 3the propoxyl of the methoxyl group of COOH, 1-15 quality % of OH, 1-15 quality %, the oxyethyl group of 1-15 quality %, 1-15 quality %, the ester of 1-15 quality %, the semi-lactosi of 1-15 quality %, the glucose of 1-15 quality %, the C of 1-15 quality % 6h 12o 6, 1-15 quality % CH 2the polyvalent alcohol of OH, 1-15 quality %.
Additive comprises the one be selected from the compound with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group further.
Recorded the principle that organic compound and the Additive that contains further are formed in epithelium in embodiment, therefore at this, its detailed description is omitted.
B is not contained without in boron 2o 3, be K 2o and SiO 2reaction forms an alkali metal salt epithelium.That is, without the SiO comprising 10-90 quality % in boron 2, 10-90 quality % K 2o, not containing B 2o 3.
Experimental result, as shown in Figure 4, not containing B 2o 3the mass ratio without its additive of boron metal conditioner and water when being also 5:95-50:50, the K in additive 2o and SiO 2react, form an alkali metal salt epithelium on the surface of metallic substance.
And the bonding amount of its epithelium of an alkali metal salt epithelium being formed at metal material surface meets 5-30g/ ㎡, and epithelium is also even.
Interest field of the present invention is not limited to described embodiment, and according to right and determining, and should understand in interest field that those skilled in the art can record in right and carry out various distortion and change.

Claims (8)

1. a metal surface treating method, is characterized in that, comprising:
Remove the step of the dirt after washing of metallic substance;
After washing, when described metallic substance carries out Wire Drawing by wortle, in order to improve lubricant effect and protect the surface of described metallic substance, form the step of an alkali metal salt epithelium on the surface of described metallic substance; And
Drying step,
Described an alkali metal salt epithelium is immersed to by the metallic substance of described washing in the metal conditioner containing an alkali metal salt reactant and additive, thus be adhered to described metal material surface,
The quality of described metal conditioner an alkali metal salt reactant described in it and described additive is 10:90-90:10 than scope,
Described an alkali metal salt reactant comprises the Na of 10-90 quality % relative to described reactant total mass 2the B of O, 10-90 quality % 2o 3,
PH scope is 5-10,
Described additive increases the bonding amount of described an alkali metal salt epithelium as tackiness agent, makes described an alkali metal salt epithelium have solidity to corrosion,
To comprise and be selected from B 2o 3, Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO, BaO, SO 3, more than one mineral compound in SrO as basal component,
Add further to comprise at described mineral compound and be selected from CH 2o, C 6h 10o 5, CH 3more than one organic compound in OH, COOH, semi-lactosi, glucose,
Described an alkali metal salt epithelium has ductile pre-treatment epithelium for making described metallic surface, the effect of the lubricant used during Wire Drawing after having carrying drying,
The bonding amount of described pre-treatment epithelium is 5-30g/ ㎡,
Described mineral compound comprises the B of 10-90 quality % relative to described additive total mass 2o 3, be greater than the Al that 0 is less than 30 quality % 2o 3, be greater than the ZrO that 0 is less than 30 quality % 2, be greater than the K that 0 is less than 30 quality % 2o, be greater than the SiO that 0 is less than 30 quality % 2, be greater than the Fe that 0 is less than 10 quality % 2o 3, be greater than the MgO that 0 is less than 10 quality %,
Described organic compound comprises the CH of 1-15 quality % relative to described additive total mass 2the C of O, 1-15 quality % 6h 10o 5, 1-15 quality % CH 3the semi-lactosi of OH, 1-15 quality %, the glucose of 1-15 quality %.
2. metal surface treating method according to claim 1, is characterized in that, at least one method that the dirt of described metallic substance is removed and is selected from chemical pickling operation, electrolytic pickling operation, physics derust in operation.
3. metal surface treating method according to claim 1, is characterized in that,
Described additive comprises the one be selected from the compound with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group further,
Have relative to described additive total mass and be greater than the scope that 0 is less than 10 quality %.
4. metal surface treating method according to claim 1, is characterized in that,
Described metallic substance is wire rod,
Described wire rod is selected from the one in iron and steel, stainless steel, aluminium, titanium, copper, magnesium and alloy thereof.
5. a metal conditioner, is characterized in that,
Described metal conditioner is used for forming an alkali metal salt epithelium on the surface of metallic substance,
The mass ratio of its an alkali metal salt reactant of described metal conditioner and additive is 10:90-90:10,
Described an alkali metal salt reactant comprises the Na of 10-90 quality % 2the B of O, 10-90 quality % 2o 3,
PH scope is 5-10,
Described additive increases the bonding amount of described an alkali metal salt epithelium as tackiness agent, makes described an alkali metal salt epithelium have solidity to corrosion,
To comprise and be selected from B 2o 3, Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO, BaO, SO 3, more than one mineral compound in SrO as basal component,
Add further to comprise at described mineral compound and be selected from CH 2o, C 6h 10o 5, CH 3more than one organic compound in OH, semi-lactosi, glucose,
Described an alkali metal salt epithelium has ductile pre-treatment epithelium for making described metallic surface, the effect of the lubricant used during Wire Drawing after having carrying drying,
The bonding amount of described pre-treatment epithelium is 5-30g/ ㎡,
Described mineral compound comprises the B of 10-90 quality % relative to described additive total mass 2o 3, be greater than the Al that 0 is less than 30 quality % 2o 3, be greater than the ZrO that 0 is less than 30 quality % 2, be greater than the K that 0 is less than 30 quality % 2o, be greater than the SiO that 0 is less than 30 quality % 2, be greater than the Fe that 0 is less than 10 quality % 2o 3, be greater than the MgO that 0 is less than 10 quality %,
Described organic compound comprises the CH of 1-15 quality % relative to described additive total mass 2the C of O, 1-15 quality % 6h 10o 5, 1-15 quality % CH 3the semi-lactosi of OH, 1-15 quality %, the glucose of 1-15 quality %.
6. metal conditioner according to claim 5, is characterized in that,
Described additive comprises the one be selected from the compound with lipid, vinyl-based, epoxies, methacryloxy class, amino, sulfydryl class functional group further,
Have relative to described additive total mass and be greater than the scope that 0 is less than 10 quality %.
7. a metal conditioner, is characterized in that,
Described metal conditioner is used for forming an alkali metal salt epithelium on the surface of metallic substance, is not containing B 2o 3without boron metal conditioner, the quality of its additive of described metal conditioner and water is 5:95-50:50 than scope,
Additive increases the bonding amount of described an alkali metal salt epithelium as tackiness agent, makes described an alkali metal salt epithelium have solidity to corrosion,
To comprise and be selected from Al 2o 3, ZrO 2, K 2o, SiO 2, Fe 2o 3, MgO, BaO, SO 3, more than one mineral compound in SrO, S, Si, Ca as basal component,
Add further to comprise at described mineral compound and be selected from CH 2o, C 6h 10o 5, CH 3more than one organic compound in OH, semi-lactosi, glucose,
Described an alkali metal salt epithelium has ductile pre-treatment epithelium for making described metallic surface, the effect of the lubricant used during Wire Drawing after having carrying drying,
The bonding amount of described pre-treatment epithelium is 5-30g/ ㎡.
8. metal conditioner according to claim 7, is characterized in that, described metal conditioner is, K 2o and SiO 2react and form an alkali metal salt epithelium at described metal material surface.
CN201510422991.7A 2014-07-24 2015-07-17 Metal surface treating method and metal conditioner Expired - Fee Related CN105316664B (en)

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