CN105290637A - Silver-added soldering tin - Google Patents
Silver-added soldering tin Download PDFInfo
- Publication number
- CN105290637A CN105290637A CN201510850355.4A CN201510850355A CN105290637A CN 105290637 A CN105290637 A CN 105290637A CN 201510850355 A CN201510850355 A CN 201510850355A CN 105290637 A CN105290637 A CN 105290637A
- Authority
- CN
- China
- Prior art keywords
- content
- silver
- tin
- soldering tin
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
The invention discloses silver-added soldering tin which comprises the following elements by weight percent: 3-4.55% of nickel, 0.25-0.8% of copper, 4.5-6.8% of silver and the balance of tin. Through the manner, the silver-added soldering tin is higher and more stable in electrical conductivity, better in using effect and lower in cost.
Description
Technical field
The present invention relates to scolding tin field, particularly relate to one and add silver soldering tin bar.
Background technology
Silver is that in all metal simple-substances, electric conductivity is best, in order to strengthen the electric conductivity of scolding tin, adding silver-colored soldering and arising at the historic moment, and present stage, when welding power amplification sound box, loudspeaker and frequency divider, will use the scolding tin of argentiferous in order to pursue tonequality.
Summary of the invention
The technical problem that the present invention mainly solves is to provide that a kind of electric conductivity is stronger, electric conductivity is more stable, result of use better adds silver soldering tin bar.
For solving the problems of the technologies described above, the invention provides one and add silver soldering tin bar, comprise except containing except tin, copper, nickel element, also containing silver element, described nickel content is 3-4.55%, and described copper content is 0.25-0.8%, and described silver content is 4.5-6.8%, all the other are tin, and described content is weight percentage.
In a preferred embodiment of the present invention, described nickel content is 3%, and described copper content is 0.25%, and described silver content is 4.5%, and all the other are tin, and described content is weight percentage.
In a preferred embodiment of the present invention, described nickel content is 4.55%, and described copper content is 0.8%, and described silver content is 6.8%, and all the other are tin, and described content is weight percentage.
In a preferred embodiment of the present invention, described nickel content is 4%, and described copper content is 0.6%, and described silver content is 6%, and all the other are tin, and described content is weight percentage.
The invention has the beneficial effects as follows: the present invention adds that silver soldering tin bar electric conductivity is stronger, electric conductivity is more stable, result of use is better, cost is lower.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
One adds silver soldering tin bar, comprises except containing except tin, copper, nickel element, and also containing silver element, described nickel content is 3%, and described copper content is 0.25%, and described silver content is 4.5%, and all the other are tin, and described content is weight percentage.
In the present embodiment 1 add that silver soldering tin bar cost is lower, electric conductivity is stronger, electric conductivity is more stable, result of use is better.
Embodiment 2
One adds silver soldering tin bar, comprises except containing except tin, copper, nickel element, and also containing silver element, described nickel content is 4.55%, and described copper content is 0.8%, and described silver content is 6.8%, and all the other are tin, and described content is weight percentage.
Add that silver soldering tin bar electric conductivity is stronger, electric conductivity is more stable, cost is lower, result of use is better in the present embodiment 2.
Embodiment 3
One adds silver soldering tin bar, comprises except containing except tin, copper, nickel element, and also containing silver element, described nickel content is 4%, and described copper content is 0.6%, and described silver content is 6%, and all the other are tin, and described content is weight percentage.
Be different from prior art, the present invention adds that silver soldering tin bar electric conductivity is stronger, electric conductivity is more stable, result of use is better, cost is lower.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. add a silver soldering tin bar, it is characterized in that, comprise tin, copper, nickel element, also containing silver element, described nickel content is 3-4.55%, and described copper content is 0.25-0.8%, and described silver content is 4.5-6.8%, and all the other are tin, and described content is weight percentage.
2. according to claim 1ly add silver soldering tin bar, it is characterized in that, described nickel content is 3%, and described copper content is 0.25%, and described silver content is 4.5%, and all the other are tin, and described content is weight percentage.
3. according to claim 1ly add silver soldering tin bar, it is characterized in that, described nickel content is 4.55%, and described copper content is 0.8%, and described silver content is 6.8%, and all the other are tin, and described content is weight percentage.
4. according to claim 1ly add silver soldering tin bar, it is characterized in that, described nickel content is 4%, and described copper content is 0.6%, and described silver content is 6%, and all the other are tin, and described content is weight percentage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510850355.4A CN105290637A (en) | 2015-11-30 | 2015-11-30 | Silver-added soldering tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510850355.4A CN105290637A (en) | 2015-11-30 | 2015-11-30 | Silver-added soldering tin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105290637A true CN105290637A (en) | 2016-02-03 |
Family
ID=55188819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510850355.4A Pending CN105290637A (en) | 2015-11-30 | 2015-11-30 | Silver-added soldering tin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105290637A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1151927A (en) * | 1995-12-12 | 1997-06-18 | 福田金属箔粉工业株式会社 | Sn base low-melting solder |
| JPH10193172A (en) * | 1996-12-16 | 1998-07-28 | Ford Motor Co | Brazing filler composition containing no lead |
| CN1262159A (en) * | 1999-01-28 | 2000-08-09 | 株式会社村田制作所 | Leadless solder and welding product |
| JP2001096394A (en) * | 1999-09-29 | 2001-04-10 | Nec Toyama Ltd | Solder and method for surface treatment for printed wiring board using the solder and method for mounting electronic components on the board using the solder |
| CN1570166A (en) * | 2004-05-09 | 2005-01-26 | 邓和升 | Lead free solder alloy and its preparation method |
| CN101024262A (en) * | 2006-02-17 | 2007-08-29 | 河南科技大学 | High-strength high-toughness nickel-contained SnAgCuRE lead-free brazing filler metal and its making method |
| CN101028673A (en) * | 2006-03-03 | 2007-09-05 | 天津市宏远电子有限公司 | Lead-free solder alloy |
| WO2007102588A1 (en) * | 2006-03-09 | 2007-09-13 | Nippon Steel Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| CN101049657A (en) * | 2006-04-06 | 2007-10-10 | 亚通电子有限公司 | Soft soldering flux without lead |
| CN103476541A (en) * | 2011-04-15 | 2013-12-25 | 日本斯倍利亚社股份有限公司 | Lead-free solder alloy |
| CN104526190A (en) * | 2014-12-23 | 2015-04-22 | 苏州龙腾万里化工科技有限公司 | Novel tin bar manufacturing method |
-
2015
- 2015-11-30 CN CN201510850355.4A patent/CN105290637A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1151927A (en) * | 1995-12-12 | 1997-06-18 | 福田金属箔粉工业株式会社 | Sn base low-melting solder |
| JPH10193172A (en) * | 1996-12-16 | 1998-07-28 | Ford Motor Co | Brazing filler composition containing no lead |
| CN1262159A (en) * | 1999-01-28 | 2000-08-09 | 株式会社村田制作所 | Leadless solder and welding product |
| JP2001096394A (en) * | 1999-09-29 | 2001-04-10 | Nec Toyama Ltd | Solder and method for surface treatment for printed wiring board using the solder and method for mounting electronic components on the board using the solder |
| CN1570166A (en) * | 2004-05-09 | 2005-01-26 | 邓和升 | Lead free solder alloy and its preparation method |
| CN101024262A (en) * | 2006-02-17 | 2007-08-29 | 河南科技大学 | High-strength high-toughness nickel-contained SnAgCuRE lead-free brazing filler metal and its making method |
| CN101028673A (en) * | 2006-03-03 | 2007-09-05 | 天津市宏远电子有限公司 | Lead-free solder alloy |
| WO2007102588A1 (en) * | 2006-03-09 | 2007-09-13 | Nippon Steel Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| CN101049657A (en) * | 2006-04-06 | 2007-10-10 | 亚通电子有限公司 | Soft soldering flux without lead |
| CN103476541A (en) * | 2011-04-15 | 2013-12-25 | 日本斯倍利亚社股份有限公司 | Lead-free solder alloy |
| CN104526190A (en) * | 2014-12-23 | 2015-04-22 | 苏州龙腾万里化工科技有限公司 | Novel tin bar manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160203 |