CN105282981A - 3D printing method for circuit board with space three-dimensional circuit - Google Patents
3D printing method for circuit board with space three-dimensional circuit Download PDFInfo
- Publication number
- CN105282981A CN105282981A CN201510765460.8A CN201510765460A CN105282981A CN 105282981 A CN105282981 A CN 105282981A CN 201510765460 A CN201510765460 A CN 201510765460A CN 105282981 A CN105282981 A CN 105282981A
- Authority
- CN
- China
- Prior art keywords
- circuit
- circuit board
- printing
- layer
- shower nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a 3D printing method for a circuit board with a space three-dimensional circuit. The 3D printing method comprises the following steps that a circuit board structure model and a circuit line are designed by utilizing three-dimensional modeling software; the circuit board structure model is hierarchically sliced by utilizing slicing software, and structure and circuit line information in slicing layers is identified; identification information of each layer is inputted to FDM equipment equipped with double nozzles; deposition and formation are performed layer by layer by the double nozzles according to the structure information and the circuit line information of each layer, a formed piece is enabled to drop a height of preset layer thickness when deposition and formation of one slicing layer are completed in the formation process, the next slicing layer is deposited on the formed slicing layer by the double nozzles continuously, and circulating stacking is performed layer by layer until printing of the whole circuit board is completed; and post-processing is performed on the circuit board so that the required circuit board is obtained. According to the method, the conventional manufacturing process is greatly simplified, the manufacturing period is shortened, manufacturing cost is reduced and degree of freedom of electronic product appearance structure design can be substantially enhanced.
Description
Technical field
The invention belongs to 3D printing technique field, more specifically, relate to a kind of circuit board 3D Method of printing with space multistory circuit.
Background technology
Electronic product system is made up of part, components and parts etc., in its manufacture process, first part, components and parts are assembled into parts, again assembling parts is become complete machine, its core work components and parts is assembled into the circuit board component with certain function, therefore, the manufacture core of electronic product is the manufacture of printed circuit board (PCB) (PrintedCircuitBoard, PCB).Circuit board is the carrier of electronic devices and components electrical connection, almost often kind has the equipment of the electronic devices and components of integrated circuit, such as wrist-watch, calculator, computer, communication apparatus etc., all will use printed circuit board (PCB), thus the Design and manufacture quality of circuit board directly has influence on quality and the cost of whole electronic product.From the angle of use, circuit board is divided into single sided board, double sided board and multi-layer sheet three class, and when towards more complicated application demand, multiple-plate circuit can be designed to multilayer, builds each layer circuit of through hole circuit communication, can greatly increase wiring area at interlayer cloth.
The Making programme of usual circuit board is sawing sheet, boring, heavy copper, Graphic transitions, graphic plating, move back film, etching, green oil transfer, add character, shaping and test etc., complex procedures and high wiring complexity, high-precision circuit board fabrication cannot be met.At present, (3DPrinting) technology prepares high wiring complexity, high-precision multilayer circuit board becomes development trend to adopt 3D to print.3D prints based on digital model, by specific former, with materials such as liquefaction, Powdered, thread metal, macromolecule and potteries, prints 3D solid based on successively accumulation mode.
In prior art, have some schemes for 3D printed circuit board.Such as, CN104486910A proposes a kind of method adopting 3D printing technique to make multilayer circuit board, concrete use selective laser sintering (SelectiveLaserSintering, SLS) on substrate, carry out the printing of heat-resistant insulating layer, then direct metal laser sintering (DirectMetalLaserSintering is adopted, DMLS) carry out circuit printing on the insulating layer, print multilayer circuit board and so forth; CN104411122A proposes a kind of 3D Method of printing of multi-layer flexible circuit board, uses 3D spraying technique printing substrate, adopts laser-engineered nearly shaping (LaserEngineeredNetShaping, LENS) to print metallic member on substrate.But, the fabrication scheme of above-mentioned two kinds of circuit boards all have employed the custom circuit plate that two kinds of different 3D print the single slab construction of technique combined shaping, not only combination process cost is high, and the wire laying mode of forming circuit plate and volume all do not change, cause circuit board still to take the space of considerable part in the electronic device, and heat radiation is too concentrated; On the other hand, the form construction design of equipment is still restricted, and the advantage that 3D printing structure-oriented freely designs is subject to very big constraint.
Summary of the invention
For above defect or the Improvement requirement of prior art, the invention provides a kind of circuit board 3D Method of printing with space multistory circuit, wherein utilize the FDM (FusedDepositionModeling carrying two shower nozzles, fusion sediment is shaped) equipment, design a model according to computer CAD, utilize the three-dimensional circuit base board of a road nozzle printing design, another road shower nozzle print circuit circuit on substrate, shower nozzle work opportunity is controlled by control system, the print circuit while of in the process of printed circuit board three-dimensional structure, integral forming has the board structure of circuit of space multistory complicated circuit.Wherein, FDM is as the one of 3D printing technique, by thread hot melt macromolecular material in shower nozzle place heating and melting, three-dimensional shower nozzle is under control of the control system according to the cross section profile information of entity simultaneously, melted material is optionally deposited on the table, after cooling fast, forms corresponding individual layer cross section, after one deck has been shaped, decline layer height of machine operation platform continues the lower one deck that is shaped, until form whole entity.The method greatly simplify traditional manufacturing process, shortens the manufacturing cycle, reduces manufacturing cost, significantly can promote the degree of freedom of electronic product surface structure design.
For achieving the above object, the present invention proposes a kind of circuit board 3D Method of printing with space multistory circuit, it is characterized in that, comprise the steps:
1) 3 d modeling software is utilized to design board structure of circuit model to be printed, and with the circuit-line of board structure of circuit distribution of shapes;
2) utilize Slice Software to be cut into slices by described board structure of circuit model layers, identify structural information and the circuit-line information of circuit board in each slicing layer;
3) every layer of described structural information identified and circuit-line information are inputed in the FDM equipment being provided with two shower nozzle, described pair of shower nozzle comprises preposition shower nozzle and rearmounted shower nozzle, described preposition shower nozzle is for spraying macromolecule silk material, and described rearmounted shower nozzle is for spraying conductive rubber silk material;
4) the described pair of shower nozzle is according to the structural information of every layer and circuit-line information, successively carries out deposition formation.In forming process, often complete the deposition formation of a slicing layer, drip molding is declined one and sets the height of thickness, then two shower nozzle continues one deck slicing layer under the slicing layer deposition be shaped, and so successively circulates stacking, until complete the printing of whole circuit board; Described preposition shower nozzle is for printing the structure division of current layer, and described rearmounted shower nozzle is for printing the circuit-line part of current layer;
5) subsequent treatment is carried out to described circuit board, the circuit board product with space multistory circuit needed for acquisition.
As preferred further, when only comprising structure division in slicing layer, only has preposition shower nozzle work; When comprising structure division and circuit part in slicing layer simultaneously, during preposition nozzle printing structure division, rearmounted shower nozzle quits work, and during rearmounted nozzle printing circuit-line part, preposition shower nozzle quits work.
As preferred further, described macromolecule silk material is preferably acrylonitrile-butadiene-styrene (ABS) polymer filaments, lost foam casting wax silk, vistanex silk, nylon yarn or polyamide filament.
As preferred further, the diameter of described macromolecule silk material is preferably 1.2mm ~ 1.8mm.
As further preferred, described conductive rubber silk material using silicon rubber as shell, silver-colored copper facing, silver are aluminized, silver-colored nickel plating, a kind of as the filler in described shell in fine silver.
As preferred further, the maximum volume resistivity of described conductive rubber silk material is no more than 0.008 Ω/cm.
As preferred further, described pair of shower nozzle adopts built-in heating bar type brass nozzle, and described nozzle diameter is 0.2mm ~ 0.4mm.
As preferred further, the thickness of described setting is 0.1mm, and the speed of described printing is 50mm/s ~ 150mm/s.
As preferred further, need to insert chip and power supply place design interface in described board structure of circuit, directly access for chip and power supply.
In general, the above technical scheme conceived by the present invention compared with prior art, mainly possesses following technological merit:
1. the present invention adopts space multistory circuit to print technique, the print circuit while of in the process of printed circuit board three-dimensional structure, thus form the circuit structure of space multistory, directly can have the circuit board product of space multistory complicated circuit by integral forming, the very big range of application having expanded 3D print circuit, solve existing compound 3D and print technique only for the problem of the single slab construction circuit board that is shaped, compared to the manufacture method of existing lift-launch circuit board product, the present situation in product is assembled to after the present invention is directed to first design circuit plate, provide directly preparation and there is the 3D Method of printing of the circuit board product of space multistory circuit, the volume of electronic product can be reduced, optimize electronic product contour structures, greatly simplify traditional manufacturing process, shorten the manufacturing cycle, reduce manufacturing cost, forming speed is fast, precision is high, be expected to the development promoting electronic products manufacturing technology.
2. the present invention needs at circuit board product the local design interface inserting chip and power supply, directly access for chip and power supply, contribute to solving that the space availability ratio that the single slab construction of existing making circuit board brings is low, shortcoming that restriction electronic equipment contour structures, heat radiation are concentrated, and significantly can promote the degree of freedom of electronic product surface structure design.
Accompanying drawing explanation
Fig. 1 is rectangular-shaped product structure schematic diagram of the present invention;
Fig. 2 is semi-cylindrical product structure schematic diagram of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.In addition, if below in described each execution mode of the present invention involved technical characteristic do not form conflict each other and just can mutually combine.
The print circuit while that principle of the present invention being in the process printing electronic product three-dimensional structure, the method utilizes the FDM equipment of the two shower nozzles carrying difference in functionality material, design a model according to computer CAD, utilize the three-dimensional structure circuit board substrate of a road nozzle printing design, another road shower nozzle print circuit circuit on substrate, control shower nozzle work opportunity by control system, integral forming has the board structure of circuit of space multistory circuit.
Specifically, a kind of circuit board 3D Method of printing with space multistory circuit of the present invention, mainly comprises the steps:
1) 3 d modeling software is utilized to design board structure of circuit model to be printed, and with the circuit-line of board structure of circuit distribution of shapes;
2) utilize Slice Software to be cut into slices by board structure of circuit model layers, identify structural information and the circuit-line information of circuit board in each slicing layer;
3) every layer of structural information identified and circuit-line information are inputed in the FDM equipment being provided with two shower nozzle, two shower nozzle comprises preposition shower nozzle and rearmounted shower nozzle, and preposition shower nozzle is for spraying macromolecule silk material, and rearmounted shower nozzle is for spraying conductive rubber silk material;
4) two shower nozzle is according to the structural information of every layer and circuit-line information, successively carry out deposition formation, in forming process, often complete the deposition formation of a slicing layer, the drip molding be shaped is declined one and sets the height of thickness, the thickness set in the present invention is 0.1mm, and then two shower nozzle to continue on the slicing layer be shaped one deck slicing layer under deposition, so successively circulate stacking, until complete the printing of whole circuit board; Preposition shower nozzle is for printing the structure division of current layer, and rearmounted shower nozzle is for printing the circuit-line part of current layer;
5) subsequent treatment is carried out to circuit board, the circuit board product with space multistory circuit needed for acquisition.
Further, when only comprising structure division in slicing layer, only has preposition shower nozzle work; When comprising structure division and circuit part in slicing layer simultaneously, during preposition nozzle printing structure division, rearmounted shower nozzle quits work, and during rearmounted nozzle printing circuit-line part, preposition shower nozzle quits work.Described macromolecule silk material is the thermoplastics such as acrylonitrile-butadiene-styrene (ABS) polymer filaments (ABSP400), lost foam casting wax silk (ICW06wax), vistanex silk, nylon yarn, polyamide filament, and the diameter of macromolecule silk material is preferably 1.2mm ~ 1.8mm.Conductive rubber silk material using silicon rubber as shell, silver-colored copper facing, silver are aluminized, silver-colored nickel plating, a kind of as the filler in shell in fine silver, the maximum volume resistivity of conductive rubber silk material is no more than 0.008 Ω/cm.Two shower nozzle adopts built-in heating bar type brass nozzle, and nozzle diameter is 0.2mm ~ 0.4mm, and the speed of printing is 50mm/s ~ 150mm/s.Need to insert chip and power supply place design interface in board structure of circuit, directly access for chip and power supply.
Be below specific embodiments of the invention:
Embodiment 1
1) 3 d modeling software design rectangular-shaped part product (belonging to circuit board) structural model is as shown in Figure 1 utilized, and with the circuit-line that planform distributes, wherein 1 is product structure part, and 2 is circuit-line part, and 3 is the interface inserted for chip;
2) utilize Slice Software to be cut into slices by model layers, every layer thickness 0.1mm, in slice information, identify the product structure part 1 in each layer and circuit-line part 2 respectively;
3) every layer of structural information identified and circuit-line information are inputed to the FDM terminal of carrying two shower nozzles, two shower nozzle (built-in heating bar type brass nozzle, nozzle diameter scope 0.2mm-0.4mm) comprise preposition shower nozzle and rearmounted shower nozzle, work is controlled by control system, in preposition shower nozzle feed system, material is ABS silk material, and diameter is 1.8mm; Be copper silver-plated conductive rubber silk material in rearmounted shower nozzle feed system, diameter is 1.6mm;
4) print from the bottom of product structure 1, now only has preposition shower nozzle work, be shaped complete at one deck solid cross-section shaped deposition, the workbench of carrying drip molding is declined by computer control the height of a thickness, shower nozzle deposits the 2nd layer cross section on this shaped cross-section, and the 2nd layer cross section can bondingly be solidificated on the 1st layer cross section; When having after certain thickness bottom printed, start the sidewall of print circuit portions and the structure part 1, now preposition nozzle printing sidewall, rearmounted nozzle printing electrical wiring 2, until print complete along the circuit-line part in short transverse, rearmounted shower nozzle quits work, and preposition shower nozzle has continued the printing of structure division, until total completes;
5) carry out the part product with space multistory circuit needed for reprocessing acquisition to the rectangular-shaped part be shaped, reprocessing comprises the taking-up of model, the process such as stripping, surface treatment of support.
Embodiment 2
1) utilize 3 d modeling software design semi-cylindrical part product (belonging to circuit board) structural model as shown in Figure 2, and with the circuit-line that planform distributes, wherein 1 is the structure division of model, and 2 is circuit-line part;
2) utilize Slice Software to be cut into slices by model layers, every layer thickness 0.1mm, in slice information, identify the product structure part 1 in each layer and circuit-line part 2 respectively;
3) every layer of structural information identified and circuit-line information are inputed to the FDM terminal of carrying two shower nozzles, two shower nozzle (built-in heating bar type brass nozzle, nozzle diameter scope 0.2mm-0.4mm) be divided into preposition shower nozzle and rearmounted shower nozzle, work is controlled by control system, in preposition shower nozzle feed system, material is nylon yarn material, and diameter is 1.6mm; For silver is aluminized conductive rubber silk material in rearmounted shower nozzle feed system, diameter is 1.6mm;
4) print from the bottom of product structure 1, now only has preposition shower nozzle work, be shaped complete at one deck solid cross-section shaped deposition, the workbench of carrying drip molding is declined by computer control the height of a thickness, shower nozzle deposits the 2nd layer cross section on this shaped cross-section, and the 2nd layer cross section can bondingly be solidificated on the 1st layer cross section; When having after certain thickness bottom printed, start the sidewall of print circuit portions and the structure part, now preposition nozzle printing sidewall, rearmounted nozzle printing electrical wiring 2, until print complete along the circuit-line part in short transverse, rearmounted shower nozzle quits work, and preposition shower nozzle has continued the printing of 1, until total completes;
5) carry out the part product with space multistory circuit needed for reprocessing acquisition to the cylindric part be shaped, reprocessing comprises the taking-up of model, the process such as stripping, surface treatment of support.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. there is a circuit board 3D Method of printing for space multistory circuit, it is characterized in that, comprise the steps:
1) 3 d modeling software is utilized to design board structure of circuit model to be printed, and with the circuit-line of board structure of circuit distribution of shapes;
2) utilize Slice Software to be cut into slices by described board structure of circuit model layers, identify structural information and the circuit-line information of circuit board in each slicing layer;
3) every layer of described structural information identified and circuit-line information are inputed in the FDM equipment being provided with two shower nozzle, described pair of shower nozzle comprises preposition shower nozzle and rearmounted shower nozzle, described preposition shower nozzle is for spraying macromolecule silk material, and described rearmounted shower nozzle is for spraying conductive rubber silk material;
4) the described pair of shower nozzle is according to the structural information of every layer and circuit-line information, successively carry out deposition formation, in forming process, often complete the deposition formation of a slicing layer, drip molding is declined one and sets the height of thickness, then two shower nozzle to continue on the slicing layer be shaped one deck slicing layer under deposition, so successively circulates stacking, until complete the printing of whole circuit board; Described preposition shower nozzle is for printing the structure division of current layer, and described rearmounted shower nozzle is for printing the circuit-line part of current layer;
5) subsequent treatment is carried out to described circuit board, the circuit board product with space multistory circuit needed for acquisition.
2. there is the circuit board 3D Method of printing of space multistory circuit as claimed in claim 1, it is characterized in that, when only comprising structure division in slicing layer, only having preposition shower nozzle work; When comprising structure division and circuit part in slicing layer simultaneously, during preposition nozzle printing structure division, rearmounted shower nozzle quits work, and during rearmounted nozzle printing circuit-line part, preposition shower nozzle quits work.
3. there is the circuit board 3D Method of printing of space multistory circuit as claimed in claim 1 or 2, it is characterized in that, described macromolecule silk material is preferably acrylonitrile-butadiene-styrene (ABS) polymer filaments, lost foam casting wax silk, vistanex silk, nylon yarn or polyamide filament.
4. have the circuit board 3D Method of printing of space multistory circuit as claimed in claim 1 or 2, it is characterized in that, the diameter of described macromolecule silk material is preferably 1.2mm ~ 1.8mm.
5. there is the circuit board 3D Method of printing of space multistory circuit as claimed in claim 4, it is characterized in that, described conductive rubber silk material using silicon rubber as shell, silver-colored copper facing, silver are aluminized, silver-colored nickel plating, a kind of as the filler in described shell in fine silver.
6. have the circuit board 3D Method of printing of space multistory circuit as claimed in claim 5, it is characterized in that, the maximum volume resistivity of described conductive rubber silk material is no more than 0.008 Ω/cm.
7. have the circuit board 3D Method of printing of space multistory circuit as claimed in claim 6, it is characterized in that, described pair of shower nozzle adopts built-in heating bar type brass nozzle, and described nozzle diameter is 0.2mm ~ 0.4mm.
8. have the circuit board 3D Method of printing of space multistory circuit as claimed in claim 7, it is characterized in that, the thickness of described setting is 0.1mm, and the speed of described printing is 50mm/s ~ 150mm/s.
9. there is the circuit board 3D Method of printing of space multistory circuit as claimed in claim 8, it is characterized in that, need to insert chip and power supply place design interface in described board structure of circuit, directly access for chip and power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510765460.8A CN105282981B (en) | 2015-11-11 | 2015-11-11 | A kind of circuit board 3D printing method with space multistory circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510765460.8A CN105282981B (en) | 2015-11-11 | 2015-11-11 | A kind of circuit board 3D printing method with space multistory circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105282981A true CN105282981A (en) | 2016-01-27 |
| CN105282981B CN105282981B (en) | 2018-02-23 |
Family
ID=55151067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510765460.8A Active CN105282981B (en) | 2015-11-11 | 2015-11-11 | A kind of circuit board 3D printing method with space multistory circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105282981B (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106111981A (en) * | 2016-07-28 | 2016-11-16 | 西安交通大学 | The 3D of a kind of three dimensional structure electronic device prints manufacture method |
| CN106211622A (en) * | 2016-08-05 | 2016-12-07 | 华中科技大学 | A kind of embedded circuit board is combined 3D Method of printing |
| CN106493939A (en) * | 2016-12-22 | 2017-03-15 | 青岛理工大学 | The 3D printing method of embedded electronic product and 3D printer |
| CN106747476A (en) * | 2016-11-28 | 2017-05-31 | 贵州航天计量测试技术研究所 | A kind of many nozzle printing integrated manufacturing methods of LTCC wave filters |
| CN106817846A (en) * | 2015-11-30 | 2017-06-09 | 中国科学院理化技术研究所 | Liquid metal stereo circuit and its manufacture method based on 3D printing technique |
| CN106863770A (en) * | 2017-01-12 | 2017-06-20 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on fusion sediment forming technique |
| CN107139485A (en) * | 2017-05-15 | 2017-09-08 | 西安理工大学 | 3D printing system and its Method of printing for making printed circuit board (PCB) |
| CN107529274A (en) * | 2017-09-04 | 2017-12-29 | 电子科技大学 | A kind of medium based on 3D printing integrates suspended substrate stripline circuit structure |
| CN107570663A (en) * | 2017-09-15 | 2018-01-12 | 杭州喜马拉雅信息科技有限公司 | A kind of the sand mold printing equipment and method of the different aperture nozzle of double shower nozzles |
| CN108010711A (en) * | 2017-12-26 | 2018-05-08 | 电子科技大学 | A kind of process of 3D printing PCB plane transformer |
| CN108495446A (en) * | 2018-05-04 | 2018-09-04 | 北京梦之墨科技有限公司 | Tubular circuit |
| CN108566736A (en) * | 2018-06-22 | 2018-09-21 | 北京梦之墨科技有限公司 | A kind of preparation method of printing equipment and printed circuit |
| CN108770215A (en) * | 2018-07-27 | 2018-11-06 | 四川长虹智能制造技术有限公司 | A kind of 3D printing circuit board processing method and its nozzle |
| CN108901138A (en) * | 2018-08-30 | 2018-11-27 | 西安瑞特三维科技有限公司 | Integral preparation method based on 3D printing ceramics and metallic circuit |
| CN109451674A (en) * | 2018-11-02 | 2019-03-08 | 深圳市金洲精工科技股份有限公司 | The manufacturing method of printed circuit board |
| CN110191586A (en) * | 2019-06-11 | 2019-08-30 | 北京大华博科智能科技有限公司 | A kind of three-dimensional circuit board integral preparation method and three-dimensional circuit board |
| CN110901071A (en) * | 2019-11-28 | 2020-03-24 | 武汉科技大学 | Method and system for 3D printing of circuit board and 3D printer |
| CN113271837A (en) * | 2019-02-19 | 2021-08-17 | 奥林巴斯株式会社 | Endoscope distal end structure and endoscope |
| CN113847999A (en) * | 2021-09-08 | 2021-12-28 | 绍兴智新机电科技有限公司 | Method for detecting temperature of built-in bearing of equipment and driving device with bearing |
| CN114945249A (en) * | 2022-05-30 | 2022-08-26 | 华中科技大学 | Multilayer functional circuit structure based on electrowetting and electrofluid jet printing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103395207A (en) * | 2013-08-01 | 2013-11-20 | 甘春丽 | Three-dimensional (3D) printer and method for preparing three-dimensional products by use of 3D printer |
| US20140152383A1 (en) * | 2012-11-30 | 2014-06-05 | Dmitri E. Nikonov | Integrated circuits and systems and methods for producing the same |
| CN104385592A (en) * | 2014-10-14 | 2015-03-04 | 秦皇岛天秦三维数字化技术有限公司 | 3D printer electromechanical control system and method thereof |
| CN104708809A (en) * | 2013-12-12 | 2015-06-17 | 三纬国际立体列印科技股份有限公司 | Three-dimensional printing device |
-
2015
- 2015-11-11 CN CN201510765460.8A patent/CN105282981B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140152383A1 (en) * | 2012-11-30 | 2014-06-05 | Dmitri E. Nikonov | Integrated circuits and systems and methods for producing the same |
| CN103395207A (en) * | 2013-08-01 | 2013-11-20 | 甘春丽 | Three-dimensional (3D) printer and method for preparing three-dimensional products by use of 3D printer |
| CN104708809A (en) * | 2013-12-12 | 2015-06-17 | 三纬国际立体列印科技股份有限公司 | Three-dimensional printing device |
| CN104385592A (en) * | 2014-10-14 | 2015-03-04 | 秦皇岛天秦三维数字化技术有限公司 | 3D printer electromechanical control system and method thereof |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106817846A (en) * | 2015-11-30 | 2017-06-09 | 中国科学院理化技术研究所 | Liquid metal stereo circuit and its manufacture method based on 3D printing technique |
| CN106111981A (en) * | 2016-07-28 | 2016-11-16 | 西安交通大学 | The 3D of a kind of three dimensional structure electronic device prints manufacture method |
| CN106111981B (en) * | 2016-07-28 | 2018-03-16 | 西安交通大学 | A kind of 3D printing manufacture method of three-dimensional structure electronic device |
| CN106211622B (en) * | 2016-08-05 | 2018-08-03 | 华中科技大学 | A kind of compound 3D printing method of embedded circuit board |
| CN106211622A (en) * | 2016-08-05 | 2016-12-07 | 华中科技大学 | A kind of embedded circuit board is combined 3D Method of printing |
| CN106747476A (en) * | 2016-11-28 | 2017-05-31 | 贵州航天计量测试技术研究所 | A kind of many nozzle printing integrated manufacturing methods of LTCC wave filters |
| CN106493939A (en) * | 2016-12-22 | 2017-03-15 | 青岛理工大学 | The 3D printing method of embedded electronic product and 3D printer |
| CN106863770A (en) * | 2017-01-12 | 2017-06-20 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on fusion sediment forming technique |
| CN106863770B (en) * | 2017-01-12 | 2018-10-19 | 南京航空航天大学 | The production method of structural circuit unitary member based on fusion sediment forming technique |
| CN107139485A (en) * | 2017-05-15 | 2017-09-08 | 西安理工大学 | 3D printing system and its Method of printing for making printed circuit board (PCB) |
| CN107529274A (en) * | 2017-09-04 | 2017-12-29 | 电子科技大学 | A kind of medium based on 3D printing integrates suspended substrate stripline circuit structure |
| CN107529274B (en) * | 2017-09-04 | 2020-01-07 | 电子科技大学 | Integrated suspension line circuit structure of medium based on 3D prints |
| CN107570663A (en) * | 2017-09-15 | 2018-01-12 | 杭州喜马拉雅信息科技有限公司 | A kind of the sand mold printing equipment and method of the different aperture nozzle of double shower nozzles |
| CN108010711A (en) * | 2017-12-26 | 2018-05-08 | 电子科技大学 | A kind of process of 3D printing PCB plane transformer |
| CN108495446A (en) * | 2018-05-04 | 2018-09-04 | 北京梦之墨科技有限公司 | Tubular circuit |
| CN108566736A (en) * | 2018-06-22 | 2018-09-21 | 北京梦之墨科技有限公司 | A kind of preparation method of printing equipment and printed circuit |
| CN108566736B (en) * | 2018-06-22 | 2023-09-26 | 北京梦之墨科技有限公司 | Printing device and preparation method of printed circuit |
| CN108770215A (en) * | 2018-07-27 | 2018-11-06 | 四川长虹智能制造技术有限公司 | A kind of 3D printing circuit board processing method and its nozzle |
| CN108770215B (en) * | 2018-07-27 | 2023-06-02 | 四川长虹智能制造技术有限公司 | 3D printed circuit board processing method and spray head thereof |
| CN108901138B (en) * | 2018-08-30 | 2021-03-26 | 西安瑞特三维科技有限公司 | Integrated preparation method based on 3D printing ceramic and metal circuit |
| CN108901138A (en) * | 2018-08-30 | 2018-11-27 | 西安瑞特三维科技有限公司 | Integral preparation method based on 3D printing ceramics and metallic circuit |
| CN109451674A (en) * | 2018-11-02 | 2019-03-08 | 深圳市金洲精工科技股份有限公司 | The manufacturing method of printed circuit board |
| CN113271837A (en) * | 2019-02-19 | 2021-08-17 | 奥林巴斯株式会社 | Endoscope distal end structure and endoscope |
| US11957305B2 (en) | 2019-02-19 | 2024-04-16 | Olympus Corporation | Endoscope distal end structure and endoscope |
| CN110191586A (en) * | 2019-06-11 | 2019-08-30 | 北京大华博科智能科技有限公司 | A kind of three-dimensional circuit board integral preparation method and three-dimensional circuit board |
| CN110191586B (en) * | 2019-06-11 | 2020-12-18 | 北京大华博科智能科技有限公司 | Three-dimensional circuit board integrated preparation method and three-dimensional circuit board |
| CN110901071A (en) * | 2019-11-28 | 2020-03-24 | 武汉科技大学 | Method and system for 3D printing of circuit board and 3D printer |
| CN113847999A (en) * | 2021-09-08 | 2021-12-28 | 绍兴智新机电科技有限公司 | Method for detecting temperature of built-in bearing of equipment and driving device with bearing |
| CN114945249A (en) * | 2022-05-30 | 2022-08-26 | 华中科技大学 | Multilayer functional circuit structure based on electrowetting and electrofluid jet printing method thereof |
| CN114945249B (en) * | 2022-05-30 | 2024-05-14 | 华中科技大学 | Multi-layer functional circuit structure based on electrowetting and electrofluidic jet printing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105282981B (en) | 2018-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105282981A (en) | 3D printing method for circuit board with space three-dimensional circuit | |
| CN102523704B (en) | Production method of multi-stage HDI plate | |
| CN106863770B (en) | The production method of structural circuit unitary member based on fusion sediment forming technique | |
| CN106211622A (en) | A kind of embedded circuit board is combined 3D Method of printing | |
| CN101299911B (en) | Method for making a multilayered circuitized substrate | |
| CN102291947B (en) | Method for manufacturing through hole pad on step structure of printed circuit board (PCB) and PCB | |
| KR20170118837A (en) | Additional fabrication of single and multi-layer electronic circuits | |
| US20150245469A1 (en) | Flexible flat circuit | |
| JP2014514162A (en) | Metal product having internal space formed and method for manufacturing the same | |
| US10446412B2 (en) | Printing of multi-layer circuits | |
| CN103402331A (en) | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof | |
| CN104244588B (en) | The preparation method and modified laser sintered powder material of stereo circuit | |
| CN102917554A (en) | Manufacturing method of multilayer double-copper conductor plate | |
| CN107529274A (en) | A kind of medium based on 3D printing integrates suspended substrate stripline circuit structure | |
| CN104427773A (en) | Manufacturing method of printed circuit board and corresponding printed circuit board | |
| CN109862721A (en) | A kind of production method and the antenna integrated PCB of power amplifier of the antenna integrated PCB of power amplifier | |
| EP3286992B1 (en) | Method for fabricating high performance, ultra low loss, ultra lightweight, multi-layered rigid circuit boards | |
| CN102946691B (en) | Method for producing printed circuit board (PCB) with locally metalized stepped groove | |
| KR101539355B1 (en) | 3-dimension Rapid prototyping equipment for making printed circuit board and forming methods thereby | |
| CN102858098B (en) | The manufacture method of asymmetric PCB | |
| CN116614964A (en) | IC carrier plate and manufacturing method thereof | |
| CN109429429B (en) | Manufacturing method of vertical wiring in printed circuit board and printed circuit board | |
| CN102215628B (en) | Super-thick circuit board | |
| CN104244587A (en) | Three-dimensional circuit manufacturing method and thermosetting spraying solution | |
| Tsukada et al. | Functional inkjet 3D printing system for customized electronics |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |