CN105278648A - Laptop heat dissipation apparatus - Google Patents
Laptop heat dissipation apparatus Download PDFInfo
- Publication number
- CN105278648A CN105278648A CN201510711783.9A CN201510711783A CN105278648A CN 105278648 A CN105278648 A CN 105278648A CN 201510711783 A CN201510711783 A CN 201510711783A CN 105278648 A CN105278648 A CN 105278648A
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- fin
- group
- heat
- heat pipe
- radiator
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The present invention discloses a laptop heat dissipation apparatus. The apparatus comprises a fin, a hot pipe, a heat collector and a multi-exit synthetic jet radiator. Heat dissipation chips of a laptop, such as a CPU and a GPU, are located on the heat collector; the hot pipe transfers heat on the heat collector to the fin and inputs a control signal into the multi-exit synthetic jet radiator; and synthetic jets can be formed in two directions and heat the fin. The laptop heat dissipation apparatus disclosed by the present invention solves the problem of existing low heat dissipation efficiency, adopts the multi-exit synthetic jet radiator and has a simple and compact structure, so that an occupied volume is reduced, power is decreased, heat dissipation is strengthened, a service life of the laptop is extended and standby time is increased.
Description
Technical field
The invention belongs to the field of radiating of pocket computer, relate to a kind of heat radiator for notebook computer.
Background technology
Along with developing rapidly of information industry, microelectronic component trends towards high integrated, high-performance, miniaturization, adds the heat radiation pressure of microelectronic component simultaneously, makes heat radiation become the bottleneck of integrated circuit technique development.The height of temperature is related to stability and the serviceable life of whole electronic apparatus system, and as when CPU long-term work is more than 80 DEG C, not only CPU may damage, and mainboard also can be aging rapidly.
Computer has been the indispensable part of people's Working Life, especially notebook computer easy to use receives the welcome of most of personage, simultaneously as the representative products of high integrated electronic equipment, its radiating efficiency becomes the bottleneck of its property development, more and more receives the concern of people.
The radiating mode that current notebook computer generally uses heat pipe, fin adds fan, this mode still also exists the not high shortcoming of radiating efficiency; There is again the notebook computer of two heat radiation in recent years, but occupy unnecessary space; Also have extra-thin notebook computer, but configuration is mostly lower, sacrifices performance and has brought the minimizing of heat.
Summary of the invention
In view of this, in order to solve some problems of above-mentioned existence, proposing a kind of heat radiator for notebook computer, synthesizing jet-flow technology being applied in laptop radiating and going, utilize Field Characteristics and entrainment to reach the effect of enhance heat.
For achieving the above object, a kind of heat radiator for notebook computer of the present invention comprises: first group of fin, second group of fin, heat pipe, heat collector and multiple exit synthesizing jet-flow heating radiator; Described first group of fin and second group of fin, heat collector are all arranged on described heat pipe, and the outlet of described first group of fin and second group of fin is angled, described multiple exit synthesizing jet-flow heating radiator has two spouts, corresponding with the outlet of first group of fin, second group of fin respectively.
Further, the structure of described heat pipe in " U " type, described first group of fin is arranged on the base of described heat pipe, described second group of fin is arranged on a side of described heat pipe, described heat collector is arranged on another side of described heat pipe, and two angles between side and base of described heat pipe are 90 ° of bent angles; Described multiple exit synthesizing jet-flow heating radiator is between two sides of described heat pipe.
Further, described multiple exit synthesizing jet-flow heating radiator comprises several vibrating reeds, housing, middle layer, upper cover body, lower cover; Described upper cover body, housing and lower cover set gradually from top to bottom and form vibrating reed container cavity, described vibrating reed is arranged in described container cavity, middle layer is provided with between every two vibrating reeds, two adjacent vibrating reeds and the middle layer be arranged between the two form the air flow chamber of a side opening, and the spout direction of described adjacent two air flow chamber is not identical.
Further, described upper cover body and lower cover are " L " type structure, and described housing is the hollow housing of " L " type.
Further, the angle in the spout direction of described adjacent two air flow chamber is 90 °.
Described upper cover body and described lower cover arrange fixed orifice, described housing is provided with fixed orifice, on described housing, the position of fixed orifice is corresponding with the fixed orifice position in described upper cover body and described lower cover.
Beneficial effect: heat radiator for notebook computer of the present invention, power is low, volume is little, structure is simple, control is convenient, only needs the AC signal of a certain frequency and voltage just can control accurately; Two groups of fins share a multiple exit synthesizing jet-flow heating radiator, decrease usage space; The middle layer height of multiple exit synthesizing jet-flow heating radiator and housing depth, outlet height are identical, make it on vibrating reed direction of vibration, have less physical dimension, reduce integrated installation area, make full use of space.
Accompanying drawing explanation
Fig. 1 is the axis side view such as grade of heat radiator for notebook computer of the present invention;
Fig. 2 is the axis side view such as grade of multiple exit synthesizing jet-flow heating radiator of the present invention;
Fig. 3 is the partial enlarged view at C place in Fig. 2;
Fig. 4 is the exploded view of multiple exit synthesizing jet-flow heating radiator of the present invention;
Fig. 5 is the vertical view of multiple exit synthesizing jet-flow heating radiator of the present invention;
Fig. 6 is the working state schematic representation of multiple exit synthesizing jet-flow heating radiator of the present invention;
In figure, 1 is first group of fin; 2 is second group of fin; 3 is heat pipes; 4 is heat collectors; 5 is multiple exit synthesizing jet-flow heating radiators; 51 is vibrating reeds; 52 is housings; 53 is middle layers; 54 is upper cover body; 55 is lower covers; 6 is first air flow chamber; 7 is second air flow chamber.
Embodiment
Below in conjunction with embodiment, the present invention is further described.
Heat radiator for notebook computer in Fig. 1 comprises: first group of fin, 1, second group of fin 2, heat pipe 3, heat collector 4 and multiple exit synthesizing jet-flow heating radiator 5; Heat pipe 3 is in the structure of approximate " U " type, first group of fin 1 is arranged on the base of heat pipe 3, second group of fin 2 is arranged on a side of heat pipe 3, heat collector 4 is arranged on another side of heat pipe 3, between the dual-side of heat pipe 3 and the base of " U " type, angle is 90 ° of bent angles, thus makes the Way out of first group of fin 1 and second group of fin 2 be 90 °; Multiple exit synthesizing jet-flow heating radiator 5 is between the dual-side of heat pipe 3, and multiple exit synthesizing jet-flow heating radiator 5 is square structure and has two spouts, and two spouts are corresponding with the outlet of first group of fin 1 and second group of fin 2 respectively.As shown in Figures 2 to 4, multiple exit synthesizing jet-flow heating radiator 5 comprises several vibrating reeds 51, housing 52, middle layer 53, upper cover body 54, lower cover 55 and wire (not shown), upper cover body 54 and lower cover 55 are " L " type structure, upper cover body 54 with lower cover 55 is provided with the corresponding fixed orifice in position, housing 52 is the hollow housing of " L " type, housing is provided with fixed orifice, the position of fixed orifice is corresponding with the fixed orifice position in upper cover body 54 and lower cover 55, upper cover body 54, housing 52 and lower cover 55 three set gradually, form the vibrating reed container cavity of " L " type, vibrating reed 51 is arranged in container cavity, middle layer 53 is provided with between every two vibrating reeds 51, middle layer 53 is the square structure of a side opening, adjacent two vibrating reeds 51 and the middle layer 53 be arranged between the two form the air flow chamber of a side opening, air flow chamber is rectangular structure, as shown in Figure 5, the opening of air flow chamber is the spout of air-flow, the spout direction of adjacent two air flow chamber is inconsistent, angle is 90 °, the spout direction of air flow chamber is corresponding with the position of two groups of fins, such as: if adjacent two air flow chamber, the spout of one of them air flow chamber aims at first group of fin 1, then the opening of another air flow chamber aims at second group of fin 2, the number of vibrating reed 51 can be set as required, thus determine the number of air flow chamber, number formed air-flow spout also more more, radiating effect is better.
Concrete, multiple exit synthesizing jet-flow heating radiator 5 has ultra-thin characteristic, minimumly can be about 2.5mm, and the whirlpool of synthesizing jet-flow is to being formed on center line both sides, jet overall width is greater than the thickness of jet heating radiator, so the height of fin preferably 0-4mm slightly larger than jet heating radiator 4.
The main type of drive of vibrating reed 51 of multiple exit synthesizing jet-flow heating radiator 5 is piezoelectric type, comprise piece of metal sheet and the piezoelectric ceramic piece being arranged on sheet metal center, housing 52, middle layer 53, lid 54 etc. adopt non electrically conductive material to make, the plastics such as such as PP, PVC.
The sheet metal of vibrating reed 51 and piezoelectric ceramic piece are connected to an electrode cable respectively, are connected, for the input of AC signal with excitation control device (not shown).The drive signal waveform that excitation control device exports is mainly sine wave, but is not limited to specific waveform, also can be other satisfactory waveforms such as square wave, triangular wave, trapezoidal wave.
The outlet of multiple exit synthesizing jet-flow heating radiator 5 is not limited only to two outlets, five films four also can be made to export, seven film six outlets, meets different operating mode needs.When outlet is more than two, make the outlet of odd number order towards same direction, the outlet of even number order is towards same direction.
When utilizing this heat radiator for notebook computer to dispel the heat, heat collector 4 and CPU, the euthermic chip electrical connections such as GPU, the first fin 1 and the second fin 2 is conducted heat to by heat pipe 3, excitation control device inputs the sinusoidal drive voltage signal of same frequency and amplitude to vibrating reed 51, vibrating reed produces elastic deformation under sinusoidal signal drives, as shown in Figure 6, for two neighboring gas flow cavitys that three vibrating reeds 51 are formed, first air flow chamber 6 outlet exports mutually vertical with the second air flow chamber 7, excitation control device drives multiple vibrating reed 51 to produce satisfactory deformation, the first air flow chamber 6 and the second air flow chamber 7 is made to be in contraction respectively, expansion two states, when the first air flow chamber 6 expands (left-half of corresponding diagram 6), suction gas, and the second air flow chamber 7 is contraction state ejection gas, otherwise when the first air flow chamber 6 is shunk (right half part of corresponding diagram 6), ejection gas, and the second air flow chamber 7 is swelling state, from spout suction gas.The spout of two air flow chamber has certain angle, creates two strands of synthesizing jet-flows, as shown in Figure 5.The synthesizing jet-flow 5 in two bursts of outs of phase and direction carries out strengthening convection current to two groups of fins 1, reaches the object of heat radiation.
More than describe the preferred embodiment of the present invention in detail; but the present invention is not limited to the detail in above-mentioned embodiment, within the scope of technical conceive of the present invention; can carry out multiple equivalents to technical scheme of the present invention, these equivalents all belong to protection scope of the present invention.
Claims (6)
1. a heat radiator for notebook computer, is characterized in that, comprising: first group of fin (1), second group of fin (2), heat pipe (3), heat collector (4) and multiple exit synthesizing jet-flow heating radiator (5); Described first group of fin (1) and second group of fin (2), heat collector (4) are all arranged on described heat pipe (3), and the outlet of described first group of fin (1) and second group of fin (2) is angled, described multiple exit synthesizing jet-flow heating radiator (5) has two spouts, corresponding with the outlet of first group of fin (1), second group of fin (2) respectively.
2. heat radiator for notebook computer according to claim 1, it is characterized in that, the structure of described heat pipe (3) in " U " type, described first group of fin (1) is arranged on the base of described heat pipe (3), described second group of fin (2) is arranged on a side of described heat pipe (3), described heat collector (4) is arranged on another side of described heat pipe (3), and two angles between side and base of described heat pipe (3) are 90 ° of bent angles; Described multiple exit synthesizing jet-flow heating radiator (5) is positioned between two sides of described heat pipe (3).
3. heat radiator for notebook computer according to claim 1, is characterized in that, described multiple exit synthesizing jet-flow heating radiator (5) comprises several vibrating reeds (51), housing (52), middle layer (53), upper cover body (54), lower cover (55); Described upper cover body (54), housing (52) and lower cover (55) set gradually from top to bottom and form vibrating reed container cavity, described vibrating reed (51) is arranged in described container cavity, middle layer (53) is provided with between every two vibrating reeds (51), two adjacent vibrating reeds (51) and the middle layer (53) be arranged between the two form the air flow chamber of a side opening, and the spout direction of described adjacent two air flow chamber is not identical.
4. heat radiator for notebook computer according to claim 3, is characterized in that, described upper cover body (54) and lower cover (55) are " L " type structure, and described housing (52) is the hollow housing of " L " type.
5. heat radiator for notebook computer according to claim 3, is characterized in that, the angle in the spout direction of described adjacent two air flow chamber is 90 °.
6. heat radiator for notebook computer according to claim 3, it is characterized in that, described upper cover body (54) and described lower cover (55) arrange fixed orifice, (52) are provided with fixed orifice to described housing, and the position of the upper fixed orifice of described housing (52) is corresponding with the fixed orifice position on described lower cover (55) with described upper cover body (54).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510711783.9A CN105278648B (en) | 2015-10-28 | 2015-10-28 | Heat radiator for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510711783.9A CN105278648B (en) | 2015-10-28 | 2015-10-28 | Heat radiator for notebook computer |
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| Publication Number | Publication Date |
|---|---|
| CN105278648A true CN105278648A (en) | 2016-01-27 |
| CN105278648B CN105278648B (en) | 2018-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510711783.9A Active CN105278648B (en) | 2015-10-28 | 2015-10-28 | Heat radiator for notebook computer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597193A (en) * | 2020-04-30 | 2021-11-02 | 维沃移动通信有限公司 | Airflow generating device, heat radiating device and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050231914A1 (en) * | 2002-08-16 | 2005-10-20 | Kazuyuki Mikubo | Cooling device for electronic apparatus |
| CN103175417A (en) * | 2011-12-20 | 2013-06-26 | 西安大昱光电科技有限公司 | Synthetic jet radiator |
| US20130343110A1 (en) * | 2011-10-18 | 2013-12-26 | Huawei Technologies Co., Ltd. | Inverter, Sealing Air Duct and Heat Dissipation System |
| CN203656862U (en) * | 2013-10-23 | 2014-06-18 | 浙江工业大学之江学院工业研究院 | Heat pipe radiator for assembled integrated high-power LED street lamp |
| CN104656859A (en) * | 2013-11-21 | 2015-05-27 | 西安嘉乐世纪机电科技有限公司 | Novel synthesis jet radiator for radiating heat of computer |
-
2015
- 2015-10-28 CN CN201510711783.9A patent/CN105278648B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050231914A1 (en) * | 2002-08-16 | 2005-10-20 | Kazuyuki Mikubo | Cooling device for electronic apparatus |
| US20130343110A1 (en) * | 2011-10-18 | 2013-12-26 | Huawei Technologies Co., Ltd. | Inverter, Sealing Air Duct and Heat Dissipation System |
| CN103175417A (en) * | 2011-12-20 | 2013-06-26 | 西安大昱光电科技有限公司 | Synthetic jet radiator |
| CN203656862U (en) * | 2013-10-23 | 2014-06-18 | 浙江工业大学之江学院工业研究院 | Heat pipe radiator for assembled integrated high-power LED street lamp |
| CN104656859A (en) * | 2013-11-21 | 2015-05-27 | 西安嘉乐世纪机电科技有限公司 | Novel synthesis jet radiator for radiating heat of computer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597193A (en) * | 2020-04-30 | 2021-11-02 | 维沃移动通信有限公司 | Airflow generating device, heat radiating device and electronic equipment |
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| CN105278648B (en) | 2018-08-21 |
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