CN105275179A - Heat-conducting wood composite floor - Google Patents
Heat-conducting wood composite floor Download PDFInfo
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- CN105275179A CN105275179A CN201410345264.0A CN201410345264A CN105275179A CN 105275179 A CN105275179 A CN 105275179A CN 201410345264 A CN201410345264 A CN 201410345264A CN 105275179 A CN105275179 A CN 105275179A
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- heat
- composite floor
- floor
- conducting
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Abstract
The invention relates to a heat-conducting wood composite floor. The heat-conducting wood composite floor is composed of a surface layer (1), a base layer (2) and a bottom layer (3), all of which are closely adhered to each other. The base layer (2) is a density board and made in such a manner that wood fibers (4) and heat-conducting material (5) are compounded. Accordingly, fine heat-conducting performance is obtained by the floor and strength of the floor is kept. The heat-conducting wood composite floor has following beneficial effects: the heat-conducting wood composite floor is simple in structure, easy in machining and production, fine in strength, high in heat conductivity, improved in energy utilization rate; as floor-heating equipment, the heat-conducting wood composite floor achieves fine heat transfer effect.
Description
Technical field
The present invention relates to floor heating wood flooring technical field, be specifically related to a kind of heat conduction wooden composite floor.
Background technology
At present, the heat conductivility research of composite wooden material is less, those skilled in the art Yang Gui extensively waits the thermal conductivity value by drawing them to the heat conductivility analysis of density board, composite floor board, solid wood board, veneer, four kinds of sheet material heat conducting coefficients are all very little, illustrate that normal wood lumber belongs to the non-conductor of heat, and their coefficient of thermal conductivity is followed successively by from big to small: density board, composite floor board, solid wood board, veneer.
There is a kind of heat conducting wood floor in prior art, by pasting honeycomb heat conductive intermediate layer between wood flooring upper and lower panel, honeycomb type heat conductive intermediate layer having multiple thermal hole, and insert Heat Conduction Material in thermal hole, makes floor obtain heat conductivility.Although this method can solve wood flooring Heat Conduction Problems, its honeycomb type interlayer structure reduces the intensity of heat conducting wood floor.Separately there is technology to pass through in wood flooring, arrange the Heat Conduction Problems that multiple thermal hole solves wood flooring, this also reduces the mechanical property of wood flooring, also destroy the natural characteristic of timber simultaneously.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention is exactly how to provide a kind of not premised on the intensity destroying floor, improves the novel floor of heat conductivility.
(2) technical scheme
In order to solve the problems of the technologies described above, the invention provides a kind of heat conduction wooden composite floor, be made up of surface layer, basic unit, bottom, closely be bonded together between each layer, combination process is adopted to make composite material, obtain basic unit by composite material, described basic unit is density board, and described composite material is composited by wood fiber and heat filling.
Preferably, described heat filling is micro-nano heat filling, when ensureing with Wood Fiber Composite, does not affect the stuctures and properties of composite wooden material, and when being used for making basic unit by the composite wooden material be made up of wood fiber and heat filling, do not affect presentation quality and the physical and mechanical property of basic unit.
Preferably, described micro-nano heat filling is carbon black, carbon fiber, CNT or nano aluminium oxide.
Preferably, described heat filling forms heat conduction network in the composite, thus the heat conductivility of laminated flooring.
Preferably, described wood fiber and heat filling make composite wooden material by artificial panel technology.
(3) beneficial effect
A kind of heat conduction wooden composite floor of the present invention, is made up of surface layer, basic unit and bottom, is closely bonded together between each layer.Wherein basic unit adopts the composite wooden material that wood fiber and Heat Conduction Material are composited, and makes floor obtain good heat conductivility, maintains the intensity on floor simultaneously.On this basis, Heat Conduction Material make wood flooring dispel the heat evenly, decrease the craze and transfiguration that wood flooring anisotropy causes.Heat conduction wooden composite floor structure of the present invention is simple, easily processing, intensity is good, thermal conductivity is high, improve capacity usage ratio, as ground warm device, can reach good heat-transfer effect.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1: the structural representation of a kind of heat conduction wooden composite floor provided by the invention.
In figure: 1, surface layer; 2, basic unit; 3, bottom; 4, wood fiber; 5, heat filling.
Detailed description of the invention
Below in conjunction with drawings and Examples, embodiments of the present invention are described in further detail.Following examples for illustration of the present invention, but can not be used for limiting the scope of the invention.
The present embodiment provides a kind of heat conduction wooden composite floor, as shown in Figure 1, is made up of surface layer 1, basic unit 2, bottom 3, closely be bonded together between each layer, described basic unit 2 is density board, and adopt composite material to make, described composite material is composited by wood fiber 4 and micro-nano heat filling 5.
In the present embodiment, micro-nano heat filling is carbon black, carbon fiber, CNT or nano aluminium oxide, is certainly also not limited to above-mentioned filler, as long as other micro-nano heat fillings meet structure and requirement attractive in appearance, also should be included in the middle of the present invention.
As can be seen from Figure 1 wood fiber 4 is interweaved cross-shaped, and micro-nano heat filling 5 is in graininess, be filled between wood fiber 4 structure, thus micro-nano heat filling 5 webbed heat transfer path of shape in basic unit 2, also be heat conduction network, thus the heat conductivility of consolidated floor.
The selection of heat filling is subject to the restriction of wood fiber 4 structure, micro-nano heat filling is adopted in the present embodiment, when ensureing with Wood Fiber Composite, do not affect the mechanism that wood fiber is original, and when being used for making basic unit by the composite wooden material be made up of wood fiber and heat filling, do not affect the attractive in appearance of basic unit, certainly other heat fillings, even if be not micro-nano heat filling, as long as meet structure and requirement attractive in appearance, also should be included in the middle of the present invention.
In the present embodiment, described wood fiber 4 and micro-nano heat filling 5 make composite wooden material by artificial panel technology.
Above embodiment is only for illustration of the present invention, but not limitation of the present invention.Although with reference to embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, various combination, amendment or equivalent replacement are carried out to technical scheme of the present invention, do not depart from the spirit and scope of technical solution of the present invention, all should be encompassed in the middle of right of the present invention.
Claims (5)
1. a heat conduction wooden composite floor, be made up of surface layer (1), basic unit (2), bottom (3), closely be bonded together between each layer, it is characterized in that, combination process is adopted to make composite material, obtain basic unit (2) by composite material, described basic unit (2) is density board, and described composite material is composited by wood fiber (4) and heat filling (5).
2. heat conduction wooden composite floor according to claim 1, is characterized in that, described heat filling (5) is micro-nano heat filling.
3. heat conduction wooden composite floor according to claim 2, is characterized in that, described micro-nano heat filling is carbon black, carbon fiber, CNT or nano aluminium oxide.
4. heat conduction wooden composite floor according to claim 1, is characterized in that, described heat filling (5) forms heat conduction network in the composite.
5. heat conduction wooden composite floor as claimed in any of claims 1 to 4, is characterized in that, described wood fiber (4) and heat filling (5) make composite wooden material by artificial panel technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410345264.0A CN105275179A (en) | 2014-07-18 | 2014-07-18 | Heat-conducting wood composite floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410345264.0A CN105275179A (en) | 2014-07-18 | 2014-07-18 | Heat-conducting wood composite floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105275179A true CN105275179A (en) | 2016-01-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410345264.0A Pending CN105275179A (en) | 2014-07-18 | 2014-07-18 | Heat-conducting wood composite floor |
Country Status (1)
| Country | Link |
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| CN (1) | CN105275179A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106903773A (en) * | 2017-03-31 | 2017-06-30 | 大亚人造板集团有限公司 | The manufacturing process and base material of a kind of ground-heating floor substrate |
| CN114589982A (en) * | 2022-01-24 | 2022-06-07 | 江阴延利新材料科技有限公司 | Heat-conducting fibrilia ground heating floor and manufacturing method thereof |
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| KR20070031071A (en) * | 2005-09-14 | 2007-03-19 | 주식회사 엘지화학 | upper finish and floor system |
| CN101061554A (en) * | 2004-11-03 | 2007-10-24 | 碳锥体公司 | Electricity and heat conductive composite |
| CN103233569A (en) * | 2013-04-19 | 2013-08-07 | 北华大学 | Wooden floor used in radiant floor heating |
| CN203403641U (en) * | 2013-06-03 | 2014-01-22 | 大亚(江苏)地板有限公司 | Four-layer solid-wood composite geothermal energy floor |
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2014
- 2014-07-18 CN CN201410345264.0A patent/CN105275179A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101061554A (en) * | 2004-11-03 | 2007-10-24 | 碳锥体公司 | Electricity and heat conductive composite |
| KR20070031071A (en) * | 2005-09-14 | 2007-03-19 | 주식회사 엘지화학 | upper finish and floor system |
| CN103233569A (en) * | 2013-04-19 | 2013-08-07 | 北华大学 | Wooden floor used in radiant floor heating |
| CN203403641U (en) * | 2013-06-03 | 2014-01-22 | 大亚(江苏)地板有限公司 | Four-layer solid-wood composite geothermal energy floor |
Non-Patent Citations (3)
| Title |
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| 余妙春: "基于分形理论的网状结构植物纤维材料导热系数研究", 《CNKI优秀硕士学位论文全文库》 * |
| 吕城龙: "木质纤维保温材料的性能研究", 《CNKI优秀硕士学位论文全文库》 * |
| 赖茂柏: "颗粒包覆及聚合物基复合材料", 《CNKI优秀硕士学位论文全文库》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106903773A (en) * | 2017-03-31 | 2017-06-30 | 大亚人造板集团有限公司 | The manufacturing process and base material of a kind of ground-heating floor substrate |
| WO2018176886A1 (en) * | 2017-03-31 | 2018-10-04 | 大亚人造板集团有限公司 | Process for fabricating geothermal floor substrate and substrate |
| CN114589982A (en) * | 2022-01-24 | 2022-06-07 | 江阴延利新材料科技有限公司 | Heat-conducting fibrilia ground heating floor and manufacturing method thereof |
| CN114589982B (en) * | 2022-01-24 | 2023-12-15 | 江阴延利新材料科技有限公司 | Heat-conducting fibrilia floor heating floor and manufacturing method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160127 |
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| RJ01 | Rejection of invention patent application after publication |