CN105273683A - Organic high-temperature binder and method for improving organic high temperature adhesive property of ceramic material - Google Patents

Organic high-temperature binder and method for improving organic high temperature adhesive property of ceramic material Download PDF

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Publication number
CN105273683A
CN105273683A CN201510724978.7A CN201510724978A CN105273683A CN 105273683 A CN105273683 A CN 105273683A CN 201510724978 A CN201510724978 A CN 201510724978A CN 105273683 A CN105273683 A CN 105273683A
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binding agent
organic high
bonded
high temperature
stupalith
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CN105273683B (en
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栾新刚
王建强
成来飞
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Northwestern Polytechnical University
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Northwestern Polytechnical University
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Abstract

The invention relates to a method for improving an organic high temperature adhesive property of a ceramic material. Polyborosilazane (PSNB) and PBSZ are used as binders, and epoxy resin and polysiloxane (PSO) are used as oxygen molecule-containing additives. The PSNB is uniformly mixed with the epoxy resin, or the PSNB is uniformly mixed with the PSO to obtain a mixture, the mixture is applied onto the surface of ceramics is coated with the mixture, and after being vacuumized, two pieces of ceramics are in lap joint with each other. The binder adopted in the method has high adhesive strength at 1250 DEG C, 1400 DEG C and 1500 DEG C, the application requirement of the binder at high temperature is met, an ideal effect can be realized for large-area adhesion, the binder on any part is oxidized, the compactness of an adhesive layer can be improved, and the organic high temperature adhesive property of the ceramic material can be effectively improved.

Description

The method of organic high-temperature agglomerant and the organic high temperature bond performance of raising stupalith
Technical field
The invention belongs to the process of preparing field of organic high-temperature agglomerant, be specifically related to a kind of method of organic high-temperature agglomerant and the organic high temperature bond performance of raising stupalith.
Background technology
Stupalith has excellent high-temperature oxidation resistance, high temperature mechanical strength, thermal shock resistance, low thermal coefficient of expansion, the excellent properties such as corrosion-resistant, is more and more applied to the high-temperature field such as engine, Aeronautics and Astronautics.But due to its natural fragility and low ductility, cause stupalith to be difficult to manufacture large size complex construction material.Adopt riveted joint or bolt to connect and all can cause stress concentration, and add the quality of component.Compared to mechanical joining methods, bonding connection not only can eliminate stress concentrated, the quality of the component simultaneously alleviated, and makes the overall carry load of bonding interface and implementation structure connects.Because organic high-temperature agglomerant has the excellent properties such as acid and alkali-resistance, good stability, bonding strength height, so it gets most of the attention at the applicating and exploitation in high-temperature agglomerant field.But as organic polymer material, its cracking in high-temperature heat treatment process is inevitable with reaction.
Macromolecular material is in high-temperature heat treatment process, and cracking can produce gas molecules, tack coat can crack and space simultaneously, causes cohesive strength too low, does not reach bonding requirement.In order to crack and the hole of healing, filler to be added in a binder, the small molecules produced by cracking in atmosphere with the reaction of filler, heal these defects, thus make tack coat compact and complete, improves cohesive strength.But this solution is only applicable to that bond area is little, air can enter tack coat inside, makes tack coat complete oxidation.But when bond area is large, because tack coat is near air portion branch preferential oxidation, and air enough in finite time cannot enter the most middle position of tack coat, the blocking layer of densification is formed after causing outer oxide, air cannot continue to enter, and tack coat middle position can not be fully oxidized, makes tack coat outside fine and close, inner defectiveness, cohesive strength can not meet the demands.
Summary of the invention
The technical problem solved
In order to avoid the deficiencies in the prior art part, the present invention proposes a kind of organic high-temperature agglomerant and improves the method for the organic high temperature bond performance of stupalith, improves tack coat densification by introducing in a binder containing oxygen polymer.Solve the tack coat central authorities existed in big area binding agent bonding can not be oxidized, cause stress distribution uneven, the problem that bonding strength is low.
Technical scheme
Improve a binding agent for the organic high temperature bond performance of stupalith, it is characterized in that containing: poly-silicon boron azane PSNB or PVDF hollow fiber membrane PBSZ is binding agent, with epoxy resin or polysiloxane PSO for oxygenated additive; The massfraction of described additive is 5 ~ 20%; Binding agent and additive are mixed.
Improve a binding agent for the organic high temperature bond performance of stupalith, it is characterized in that containing: poly-silicon boron azane PSNB and PVDF hollow fiber membrane PBSZ is binding agent, with epoxy resin or polysiloxane PSO for oxygenated additive; The massfraction ratio of three components is 6 ~ 10: 1 ~ 4: 0.05 ~ 2; Binding agent and additive are mixed.
Utilize described binding agent to improve a method for the organic high temperature bond performance of stupalith, it is characterized in that step is as follows:
Step 1: needs are treated bonded ceramics ultrasonic cleaning, dry;
Step 2: bonding surface binding agent being coated onto pottery to be bonded, to be bonded dose be fully laid in the bonding surface of pottery to be bonded after, pottery to be bonded is put in vacuum environment and vacuumizes 20 ~ 40 minutes;
Step 3: then mutually overlapped by the bonding surface of pottery to be bonded, applies pressure 1 ~ 10KPa in bonded part, is put in baking oven 100 ~ 200 DEG C of solidifications 2 ~ 5 hours;
Step 4: be put in van-type stove again, when binding agent is two kinds of components, temperature rise rate was 1-8 DEG C/min, in 1250 ~ 1500 DEG C of high-temperature heat treatment 2 ~ 5 hours; When binding agent is three kinds of components, temperature rise rate is 1-8 DEG C/min, 1250 ~ 1500 DEG C of thermal treatments after 2 ~ 5 hours, then 600 ~ 800 DEG C of thermal treatments 2 ~ 5 hours.
Describedly treat that bonded ceramics is alumina-ceramic.
Beneficial effect
The method of a kind of organic high-temperature agglomerant that the present invention proposes and the organic high temperature bond performance of raising stupalith, using poly-silicon boron azane (PSNB) and poly-roc silazane (PBSZ) as binding agent, using epoxy resin and polysiloxane (PSO) as oxygen-containing molecules additive.PSNB is mixed with epoxy resin or PSNB and PSO, is coated onto ceramic surface, after being pumped through vacuum, two pieces of potteries are overlapped.
The binding agent that the present invention adopts is 1250,1400,1500 DEG C all have high cohesive strength, reach the service requirements of binding agent under high temperature, ideal effect can be reached for big area bonding, the binding agent of any part is oxidized, improves the compactness of tack coat, effectively can improve the organic high temperature bond performance of stupalith.
Embodiment
Now the invention will be further described in conjunction with the embodiments:
Embodiment one
Step one: after the ultrasonic cleaning of alumina-ceramic sample use water, dry.Poly-silicon boron azane (PSNB) resin and epoxy resin are mixed in varing proportions, epoxy resin mass ratio: 5%-15% simultaneously.Be coated onto ceramic material surfaces after mixed with resin is even, after mixed with resin binding agent is laid in bonding surface, vacuumize, discharge bubble in resin, two pieces of stupaliths overlap joints.
Step 2: load overlap joint sample being applied to 1-10KPa, is put in baking oven and solidifies 2h.
Step 3: the sample that is cured is put in van-type stove, is heated to 1400 DEG C of thermal treatment 2-5 hour with 1-8 DEG C/min speed.After 1400 DEG C of thermal treatments, cohesive strength is 3-12Mpa.
Embodiment two
Step one: after the ultrasonic cleaning of alumina-ceramic sample use water, dry.Poly-silicon boron azane (PSNB) resin and epoxy resin are mixed in varing proportions, epoxy resin mass ratio: 5%-20% simultaneously.Be coated onto ceramic material surfaces after mixed with resin is even, after mixed with resin binding agent is laid in bonding surface, vacuumize, discharge bubble in resin, two pieces of stupaliths overlap joints.
Step 2: the load sample of solidification being applied to 1-10Kpa, is put in baking oven and solidifies 3h.
Step 3: be put in overlapped sample in van-type stove, with 1-8 DEG C/min speed 1500 DEG C of thermal treatment 2-5 hour.After 1500 DEG C of thermal treatments, cohesive strength is 5-15Mpa.
Embodiment three
Step one: after the ultrasonic cleaning of alumina-ceramic sample use water, dry.PVDF hollow fiber membrane (PBSZ) resin and epoxy resin are mixed with certain proportion simultaneously.Epoxy resin mass ratio: 5%-20%.Be coated onto ceramic material surfaces after mixed with resin is even, after mixed with resin binding agent is laid in bonding surface, vacuumize, discharge bubble in resin, two pieces of stupaliths overlap joints.
Step 2: load overlap joint sample being applied to 1-10Kpa, is put in baking oven and solidifies 3h.
Step 3: the sample be cured is put in van-type stove, is heated to 1250 DEG C of thermal treatment 2-5 hour with 2-8 DEG C/min speed.Cohesive strength is 2-10Mpa.
Embodiment four
Step one: after the ultrasonic cleaning of alumina-ceramic sample use water, dry.PVDF hollow fiber membrane (PBSZ) resin and polysiloxane are mixed in varing proportions, epoxy resin mass ratio: 5%-10% simultaneously.Be coated onto ceramic material surfaces after mixed with resin is even, after mixed with resin binding agent is laid in bonding surface, vacuumize, discharge bubble in resin, two pieces of stupaliths overlap joints.
Step 2: load overlap joint sample being applied to 1-8Kpa, is put in baking oven and solidifies 2h.
Step 3: the sample be cured is put in van-type stove, with 1-8 DEG C/min speed 1500 DEG C of thermal treatment 2-5 hour.After 1500 DEG C of thermal treatments, cohesive strength is 8-12Mpa.
Embodiment five
Step one: after the ultrasonic cleaning of alumina-ceramic sample use water, dry.Poly-silicon boron azane (PSNB) resin, PVDF hollow fiber membrane (PSNB) resin and polysiloxane are mixed in varing proportions, proportions is 7:3:1 simultaneously.Be coated onto ceramic material surfaces after mixed with resin is even, after mixed with resin binding agent is laid in bonding surface, vacuumize, discharge bubble in resin, two pieces of stupaliths overlap joints.
Step 2: load overlap joint sample being applied to 1-10Kpa, is put in baking oven and solidifies 3.5h.
Step 3: the sample be cured is put in van-type stove, with 1-8 DEG C/min speed in 1250 DEG C of thermal treatment 2-5 hour, then at 600 DEG C of thermal treatment 3h.After 1250 DEG C of thermal treatments, cohesive strength is 10-20Mpa.

Claims (4)

1. improve a binding agent for the organic high temperature bond performance of stupalith, it is characterized in that containing: poly-silicon boron azane PSNB or PVDF hollow fiber membrane PBSZ is binding agent, with epoxy resin or polysiloxane PSO for oxygenated additive; The massfraction of described additive is 5 ~ 20%; Binding agent and additive are mixed.
2. improve a binding agent for the organic high temperature bond performance of stupalith, it is characterized in that containing: poly-silicon boron azane PSNB and PVDF hollow fiber membrane PBSZ is binding agent, with epoxy resin or polysiloxane PSO for oxygenated additive; The massfraction ratio of three components is 6 ~ 10: 1 ~ 4: 0.05 ~ 2; Binding agent and additive are mixed.
3. utilize binding agent described in claim 1 or 2 to improve a method for the organic high temperature bond performance of stupalith, it is characterized in that step is as follows:
Step 1: needs are treated bonded ceramics ultrasonic cleaning, dry;
Step 2: bonding surface binding agent being coated onto pottery to be bonded, to be bonded dose be fully laid in the bonding surface of pottery to be bonded after, pottery to be bonded is put in vacuum environment and vacuumizes 20 ~ 40 minutes;
Step 3: then mutually overlapped by the bonding surface of pottery to be bonded, applies pressure 1 ~ 10KPa in bonded part, is put in baking oven 100 ~ 200 DEG C of solidifications 2 ~ 5 hours;
Step 4: be put in van-type stove again, when binding agent is two kinds of components, temperature rise rate was 1-8 DEG C/min, in 1250 ~ 1500 DEG C of high-temperature heat treatment 2 ~ 5 hours; When binding agent is three kinds of components, temperature rise rate is 1-8 DEG C/min, 1250 ~ 1500 DEG C of thermal treatments after 2 ~ 5 hours, then 600 ~ 800 DEG C of thermal treatments 2 ~ 5 hours.
4. improve the method for stupalith organic high temperature bond performance according to claim 3, it is characterized in that: described in treat that bonded ceramics is alumina-ceramic.
CN201510724978.7A 2015-10-30 2015-10-30 Organic high-temperature agglomerant and the method for improving the organic high temperature bond performance of ceramic material Active CN105273683B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113666755A (en) * 2021-07-14 2021-11-19 山东格瑞兰德添加剂有限公司 Organic ceramic firing binder and preparation method thereof
CN115160004A (en) * 2022-05-30 2022-10-11 中国人民解放军陆军装甲兵学院 Preparation method of self-toughening fiber structure ceramic

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119062A (en) * 1989-09-30 1991-05-21 Tonen Corp Binder comdsition
CN104829257A (en) * 2015-05-08 2015-08-12 西北工业大学 Bonding method for aluminum oxide ceramics

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119062A (en) * 1989-09-30 1991-05-21 Tonen Corp Binder comdsition
CN104829257A (en) * 2015-05-08 2015-08-12 西北工业大学 Bonding method for aluminum oxide ceramics

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
刘洪丽等: "《不同陶瓷先驱体的裂解过程及粘接性能》", 《材料科学与工程学报》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113666755A (en) * 2021-07-14 2021-11-19 山东格瑞兰德添加剂有限公司 Organic ceramic firing binder and preparation method thereof
CN115160004A (en) * 2022-05-30 2022-10-11 中国人民解放军陆军装甲兵学院 Preparation method of self-toughening fiber structure ceramic

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