CN105273469A - Copper alloy surface treatment sealing agent and surface treatment method - Google Patents
Copper alloy surface treatment sealing agent and surface treatment method Download PDFInfo
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- CN105273469A CN105273469A CN201410311621.1A CN201410311621A CN105273469A CN 105273469 A CN105273469 A CN 105273469A CN 201410311621 A CN201410311621 A CN 201410311621A CN 105273469 A CN105273469 A CN 105273469A
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- copper alloy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
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- Preventing Corrosion Or Incrustation Of Metals (AREA)
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Abstract
The invention discloses a copper alloy surface treatment sealing agent and a copper alloy surface treatment method. The copper alloy surface treatment sealing agent is prepared by mixing the following components, by weight: 1-18% of straight-chain aliphatic alcohol, 0.1-5% of a nitrogen-containing heterocyclic compound, 0.3-10% of an aqueous organic anionic compound, 0.01-1% of a surfactant, 0.2-8% of an inorganic corrosion inhibitor, and balance of water. The copper alloy surface treatment method comprises the steps of finishing, ultrasonic degreasing, sealing agent solution heating, soaking, and heat treatment. The process is reasonably designed, and the method is energy-saving and environment-friendly. After treatment, a surface layer is consistent with the product in primary color, and is beautiful and natural. The cost is low. A passivation protection effect is good.
Description
Technical field
The present invention relates to a kind of metal conditioner and treatment process thereof, especially relevant with copper alloy surface process encapsulant and surface treatment method thereof.
Technical background
Copper alloy products surface is in various thermal treatment, mechanical workout, transport and management process, inevitably oxidized, produces the zone of oxidation of one deck became uneven.Meanwhile, the impurity of various pollution by oil and absorption some other is also easily subject to.Therefore surface treatment should be carried out as quickly as possible in the copper products surface after process.Existing copper alloy products surface treatment has plating, phosphatization, oxidation (blackout) etc. several usually, also exist complete processing complexity, big for environment pollution, process after upper layer and product primary colors Different Effects product attractive in appearance, high in cost of production is not enough.
Summary of the invention
The object of this invention is to provide a kind of technological design rationally, energy-conserving and environment-protective, the copper alloy surface process encapsulant that upper layer is consistent with the primary colors of product, elegant in appearance, cost is low, passivation protection is effective after process and surface treatment method thereof.
For achieving the above object, the present invention adopts following technical solution.Copper alloy surface process encapsulant is mixed by weight percentage by following component: straight-chain fatty alcohol 1%-18%, nitrogen-containing heterocycle compound 0.1%-5%, water-based organic anion compound 0.3%-10%, tensio-active agent 0.01%-1%, inorganic inhibitor 0.2%-8%, all the other are water.
As preferably, described straight-chain fatty alcohol is ethoxypropyl straight-chain fatty alcohol.
As preferably, described nitrogen-containing heterocycle compound is imidazoles.
As preferably, described water-based organic anion compound is silicate.
As preferably, described tensio-active agent is OP promoting agent.
As preferably, described inorganic inhibitor is water-soluble mercapto benzothiazole.
A kind ofly described copper alloy surface process encapsulant is adopted to the surface treatment method of copper alloy to be: the precision work of a. copper alloy products, b. carry out ultrasonic wave to deoil, c. capping agent solutions is heated to 40-80 DEG C, d. the copper alloy products after ultrasonic wave is deoiled to be dipped in the capping agent solutions after heating 1-5 minutes, thermal treatment 5-10 minutes in e. is placed on 40-60 baking oven after taking out product.
The present invention compares with prior art, there is following beneficial effect: (one) is compared with traditional physical containment method, have after process of the present invention and absolutely not increase thickness of workpiece and change the feature of color, the precision that improve product and added value, make more convenient operation; (2) carry out because process of the present invention belongs to state of anergy, reagent can add use repeatedly, and therefore the life-span is longer, cost is more economical; (3) fine and close, the stable performance of the present invention's oxygen molecule structure passive film, rete of impelling metallic surface to be formed, and in atmosphere there is self-healing effect simultaneously, therefore compared with the method for traditional painting slushing oil, the present invention formed passive film more stable, have more solidity to corrosion; (4) copper alloy surface process encapsulant used in the present invention belongs to environmentally friendly machine, can not pollute, meet the requirement of energy-conserving and environment-protective to environment; (5) performance of product in neutral salt spray test that the present invention processes can reach more than 72 hours.
Embodiment
Below embodiments of the present invention are described in detail.Should be appreciated that enforcement of the present invention is not limited to the following examples, any pro forma accommodation make the present invention and/or change all will fall into scope.
In the present invention, if not refer in particular to, all parts, per-cent are weight unit, and all equipment and raw material all can be buied from market or the industry is conventional.
Embodiment 1: cut-off chain fatty alcohol 3 kilograms, nitrogen-containing heterocycle compound 1 kilogram, water-based organic anion compound 0.2 kilogram, 0.02 kilogram, tensio-active agent, inorganic inhibitor 1.78 kilograms, water is 94 kilograms and is made into copper alloy surface process encapsulant, capping agent solutions is heated to 50 DEG C, copper alloy products after ultrasonic wave is deoiled to be dipped in the capping agent solutions after heating 3 minutes, then take out to be placed on 50 DEG C after product baking oven in thermal treatment 6 minutes, complete copper alloy surface passivation sealing treatment.
Embodiment 2: cut-off chain fatty alcohol 1.5 kilograms, nitrogen-containing heterocycle compound 0.3 kilogram, water-based organic anion compound 1.7 kilograms, 0.2 kilogram, tensio-active agent, inorganic inhibitor 0.3 kilogram, water is 96 kilograms and is made into copper alloy surface process encapsulant, capping agent solutions is heated to 45 DEG C, copper alloy products after ultrasonic wave is deoiled to be dipped in the capping agent solutions after heating 1 minute, then take out to be placed on 45 DEG C after product baking oven in thermal treatment 5 minutes, complete copper alloy surface passivation sealing treatment.
Embodiment 3: cut-off chain fatty alcohol 16 kilograms, nitrogen-containing heterocycle compound 4.5 kilograms, water-based organic anion compound 9 kilograms, 1 kilogram, tensio-active agent, inorganic inhibitor 7.5 kilograms, water is 62 kilograms and is made into copper alloy surface process encapsulant, capping agent solutions is heated to 80 DEG C, copper alloy products after ultrasonic wave is deoiled to be dipped in the capping agent solutions after heating 5 minutes, then take out to be placed on 60 DEG C after product baking oven in thermal treatment 10 minutes, complete copper alloy surface passivation sealing treatment.
Embodiment 4: cut-off chain fatty alcohol 10 kilograms, nitrogen-containing heterocycle compound 3 kilograms, water-based organic anion compound 5 kilograms, 0.2 kilogram, tensio-active agent, inorganic inhibitor 3.8 kilograms, water is 78 kilograms and is made into copper alloy surface process encapsulant, capping agent solutions is heated to 60 DEG C, copper alloy products after ultrasonic wave is deoiled to be dipped in the capping agent solutions after heating 3 minutes, then take out to be placed on 60 DEG C after product baking oven in thermal treatment 5 minutes, complete copper alloy surface passivation sealing treatment.
Embodiment 5: cut-off chain fatty alcohol 7 kilograms, nitrogen-containing heterocycle compound 1.5 kilograms, water-based organic anion compound 1.5 kilograms, 0.5 kilogram, tensio-active agent, inorganic inhibitor 3.5 kilograms, water is 86 kilograms and is made into copper alloy surface process encapsulant, capping agent solutions is heated to 55 DEG C, copper alloy products after ultrasonic wave is deoiled to be dipped in the capping agent solutions after heating 2.5 minutes, then take out to be placed on 50 DEG C after product baking oven in thermal treatment 8 minutes, complete copper alloy surface passivation sealing treatment.
Embodiment 6: described straight-chain fatty alcohol is ethoxypropyl straight-chain fatty alcohol, nitrogen-containing heterocycle compound is imidazoles, and water-based organic anion compound is silicate, and tensio-active agent is OP promoting agent, inorganic inhibitor is water-soluble mercapto benzothiazole, and all the other are with one of embodiment 1-5.
Above-described embodiment is one of the present invention preferably scheme, not does any pro forma restriction to the present invention, under the prerequisite not exceeding the technical scheme described in claim, also has other variant and remodeling.
Claims (7)
1. a copper alloy surface process encapsulant, it is characterized in that described copper alloy surface process encapsulant is mixed by weight percentage by following component: straight-chain fatty alcohol 1%-18%, nitrogen-containing heterocycle compound 0.1%-5%, water-based organic anion compound 0.3%-10%, tensio-active agent 0.01%-1%, inorganic inhibitor 0.2%-8%, all the other are water.
2. copper alloy surface process encapsulant according to claim 1, is characterized in that: described straight-chain fatty alcohol is ethoxypropyl straight-chain fatty alcohol.
3. copper alloy surface process encapsulant according to claim 1, is characterized in that: described nitrogen-containing heterocycle compound is imidazoles.
4. copper alloy surface process encapsulant according to claim 1, is characterized in that: described water-based organic anion compound is silicate.
5. copper alloy surface process encapsulant according to claim 1, is characterized in that: described tensio-active agent is OP promoting agent.
6. copper alloy surface process encapsulant according to claim 1, is characterized in that: described inorganic inhibitor is water-soluble mercapto benzothiazole.
7. one kind adopts copper alloy surface process encapsulant as described in one of claim 1-6 to the surface treatment method of copper alloy, it is characterized in that its treatment process is: the precision work of a. copper alloy products, b. carry out ultrasonic wave to deoil, c. capping agent solutions is heated to 40-80 DEG C, d. the copper alloy products after ultrasonic wave is deoiled to be dipped in the capping agent solutions after heating 1-5 minutes, thermal treatment 5-10 minutes in e. is placed on 40-60 baking oven after taking out product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410311621.1A CN105273469A (en) | 2014-07-02 | 2014-07-02 | Copper alloy surface treatment sealing agent and surface treatment method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410311621.1A CN105273469A (en) | 2014-07-02 | 2014-07-02 | Copper alloy surface treatment sealing agent and surface treatment method |
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| CN105273469A true CN105273469A (en) | 2016-01-27 |
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| CN201410311621.1A Pending CN105273469A (en) | 2014-07-02 | 2014-07-02 | Copper alloy surface treatment sealing agent and surface treatment method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107236978A (en) * | 2016-07-09 | 2017-10-10 | 平顶山市美伊金属制品有限公司 | The enclosure method of the packing material and pore of closing oxidation rear substrate surface pore |
| CN108588700A (en) * | 2018-07-26 | 2018-09-28 | 成都飞机工业（集团）有限责任公司 | A kind of plating copper piece chromium-free passivation liquid and its deactivating process for the treatment of |
-
2014
- 2014-07-02 CN CN201410311621.1A patent/CN105273469A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107236978A (en) * | 2016-07-09 | 2017-10-10 | 平顶山市美伊金属制品有限公司 | The enclosure method of the packing material and pore of closing oxidation rear substrate surface pore |
| CN108588700A (en) * | 2018-07-26 | 2018-09-28 | 成都飞机工业（集团）有限责任公司 | A kind of plating copper piece chromium-free passivation liquid and its deactivating process for the treatment of |
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Application publication date: 20160127 |
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| WD01 | Invention patent application deemed withdrawn after publication |