CN105254922A - Surface modification method of heat-conducting filler and application thereof - Google Patents
Surface modification method of heat-conducting filler and application thereof Download PDFInfo
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- CN105254922A CN105254922A CN201510703319.5A CN201510703319A CN105254922A CN 105254922 A CN105254922 A CN 105254922A CN 201510703319 A CN201510703319 A CN 201510703319A CN 105254922 A CN105254922 A CN 105254922A
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- 239000000945 filler Substances 0.000 title abstract description 14
- 238000002715 modification method Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000003822 epoxy resin Substances 0.000 claims abstract description 11
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 238000000967 suction filtration Methods 0.000 claims abstract description 7
- 238000001291 vacuum drying Methods 0.000 claims abstract description 7
- 230000004913 activation Effects 0.000 claims abstract description 6
- 238000000227 grinding Methods 0.000 claims abstract description 3
- 239000011231 conductive filler Substances 0.000 claims description 31
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 23
- 230000004048 modification Effects 0.000 claims description 23
- 238000012986 modification Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000007711 solidification Methods 0.000 claims description 8
- 230000008023 solidification Effects 0.000 claims description 8
- 230000003252 repetitive effect Effects 0.000 claims description 6
- 238000005201 scrubbing Methods 0.000 claims description 6
- 229910017083 AlN Inorganic materials 0.000 claims description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 5
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- OEOIWYCWCDBOPA-UHFFFAOYSA-N 6-methyl-heptanoic acid Chemical compound CC(C)CCCCC(O)=O OEOIWYCWCDBOPA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical group N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 238000003786 synthesis reaction Methods 0.000 claims description 2
- 239000004634 thermosetting polymer Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 125000003944 tolyl group Chemical group 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract description 20
- 239000003054 catalyst Substances 0.000 abstract description 5
- 239000004814 polyurethane Substances 0.000 abstract description 4
- 229920002635 polyurethane Polymers 0.000 abstract description 4
- 229920000642 polymer Polymers 0.000 abstract description 2
- 238000010992 reflux Methods 0.000 abstract 1
- 238000009210 therapy by ultrasound Methods 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000007822 coupling agent Substances 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000011068 loading method Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 238000003760 magnetic stirring Methods 0.000 description 4
- 239000004570 mortar (masonry) Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009775 high-speed stirring Methods 0.000 description 3
- -1 mphenylenediamine Chemical compound 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PZBFGYYEXUXCOF-UHFFFAOYSA-N TCEP Chemical compound OC(=O)CCP(CCC(O)=O)CCC(O)=O PZBFGYYEXUXCOF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
Abstract
The invention discloses a surface modification method of a heat-conducting filler and application thereof, which comprises the steps of sequentially adding 5-10 parts by mass of the heat-conducting filler subjected to high-temperature activation, 0.5-1 part by mass of NDI, 75-150 parts by mass of a solvent and a catalyst into a three-neck flask, carrying out ultrasonic treatment for not less than 20min, then carrying out reflux stirring at 60-85 ℃ for 2-6 h, cooling, carrying out suction filtration, repeatedly washing with the solvent to remove excessive NDI, carrying out vacuum drying at 40-60 ℃ for 6-8 h, and grinding to obtain the modified heat-conducting filler. The modified heat-conducting filler prepared by the method is suitable for epoxy resin or polyurethane matrix so as to improve the heat-conducting property of the polymer matrix.
Description
One, technical field
The present invention relates to a kind of surface modifying method and application thereof of heat conductive filler.
Two, background technology
Macromolecular material mostly is isolator, and chemical resistance and process industrial art performance excellent, but it mostly is the poor conductor of heat, after adopting heat conductive insulating inorganic powdered filler to fill, greatly can improve the heat conductivility of material.But the interface compatibility between mineral filler and matrix is generally poor, and filler grain is easily reunited in the base, be difficult to dispersed; In addition filler grain surface is more difficult is soaked by resin matrix, causes both to there is space in interface, adds the interface resistance of polymer composite.
Bibliographical information is in the past mostly adopt coupling agent to process filling surface, improves the absorption of filler, wetting and dispersing property, thus improves matrix material heat conductivility.Such as, Zhang Xiaohui coupling agent treatment Al
2o
3, and fill epoxy adhesive, find material than directly not filling Al through process
2o
3material conducts heat effect improve 10%.
Three, summary of the invention
The present invention aims to provide a kind of surface modifying method and application thereof of heat conductive filler, to adopt the isocyanic ester of naphthalene ring as surface treatment agent, conjugated structure on heat conductive filler surface grafting is made it reduce with polymeric matrix interface resistance, to improve the heat conductivility of polymkeric substance.
The present invention is with NDI (1,5-naphthalene diisocyanate, C
12h
6n
2o
2) as the surface-modifying agent of heat conductive filler, conjugated structure is introduced on heat conductive filler surface, be conducive to the electron motion in material, thus the interface resistance reduced between filler and macromolecule matrix, more be conducive to the formation of thermal conducting path, improve the heat conductivility of filled-type thermally conductive polymer composite further.
The surface modifying method of heat conductive filler of the present invention, comprises the steps:
5 ~ 10 mass parts heat conductive fillers after high-temperature activation, 0.5 ~ 1 mass parts NDI, the solvent of 75 ~ 150 mass parts and catalyzer (graft reaction of NDI and filling surface hydroxyl is accelerated in the catalysis of catalyzer energy) is added successively in there-necked flask, supersound process is no less than 20min, then in 60 ~ 85 DEG C of return stirring 2 ~ 6h, suction filtration after cooling, with solvent repetitive scrubbing to remove wherein excessive NDI, 40 ~ 60 DEG C of vacuum-drying 6 ~ 8h, namely obtain modification heat conductive filler after grinding.
Described heat conductive filler is boron nitride, silicon nitride, aluminium nitride or aluminum oxide, and the particle diameter of described heat conductive filler is 10nm ~ 100 μm.
Described catalyzer is that stannous octoate, dibutyl tin laurate or isocaprylic acid are plumbous.
Described solvent is the organic solvent that toluene or dimethylbenzene etc. do not participate in reacting.
The addition of described catalyzer is the 5-10% of NDI quality.
Described high-temperature activation is by heat conductive filler freeze-day with constant temperature 2h at 160 DEG C.
The modification heat conductive filler prepared in the process of the present invention, is applicable to epoxy resin or polyurethane matrix, to improve the heat conductivility of this polymeric matrix.
Add in thermosetting resin by modification heat conductive filler of the present invention, obtain the thermoset resin material with heat conductivility after solidification, the quality that modification heat conductive filler adds is the 5-100% of thermosetting resin quality.
Described thermosetting resin is epoxy resin or urethane.
Modification heat conductive filler adds with the form be distributed in the liquid raw material component of synthesis thermosetting resin or adds with the form be distributed in liquid thermosetting resin prepolymer.
Modification heat conductive filler prepared by the present invention can change according to the requirement of polymeric matrix thermal conductivity within the scope of 10wt%-100wt%.
The present invention is by carrying out surface treatment to heat conductive filler, the contact surface that can soak filler and polymeric matrix on the one hand reduces interface resistance, paracrystalline organizations is introduced on the other hand between polymeric matrix and heat conductive filler, along with the increase of heat conductive filler loading level, whole matrix material paracrystalline organizations also increases thereupon, and the lack of alignment in paracrystalline organizations region makes resins act be macroscopically isotropic; Paracrystalline organizations, by covalent linkage and inner amorphous state anatomical connectivity, makes their interface fuzzy, adds consistency; Because middle group is high orderly, is conducive to forming class crystal structure, thus suppresses phon scattering, improve thermal conductivity.The third aspect, by introducing conjugated structure, can produce Electro-Phonon Interaction, promotes phonon transmission, is conducive to improving heat conductivility.
The mode that the class crystal structure of conjugated type compound treatment increase material is introduced in current employing was also reported in Patents and document.
The polymeric matrix of the present invention's application mostly is epoxy resin and polyurethane matrix, by the untreated filler of contrast equal in quality mark, check the effect of process with the method process filler of published silane coupling agent, the thermal conductivity of matrix material is higher just illustrates that the effect for the treatment of method is better.
The present invention is to after heat conductive filler surface treatment, and filling epoxy resin and polyurethane matrix, prepare high-heat-conductive composite material, reduce the loading level of filler, saved the production cost preparing high-heat-conductive composite material, caking agent, and treatment scheme is simple, chemical levels is few, environmental pollution is little, make it to have possessed convenient for production, superior performance, cheap feature, improve it further at electronics, the application in the fields such as electric encapsulation.
Four, accompanying drawing explanation
Fig. 1 is the reaction schematic diagram of surface modifying method of the present invention.
Five, embodiment
Embodiment 1 (taking epoxy resin as matrix)
1, surface modification
The toluene of NDI and BN particle mass 15 times of the BN particle of 1 μm at 160 DEG C after freeze-day with constant temperature 2h, BN particle mass 5-10wt% is added successively in there-necked flask, supersound process is 20min at least, add appropriate stannous octoate catalyst, with be placed on be furnished with magnetic stirring apparatus oil bath pan in 60 DEG C reaction 4h, suction filtration after cooling, with toluene repetitive scrubbing to remove wherein excessive coupling agent, in 75 DEG C of vacuum-drying 6h, take out rear mortar grinder, obtain modification BN.
2, apply
By 5 mass parts thinners, (Virahol and acetone are prepared according to 1:3, v/v) join in 100 mass parts epoxy resin, 50 mass parts modification BN are added after stirring, add 10 mass parts aromatic amine curing agents subsequently successively (as m-xylene diamine, mphenylenediamine, diamino diphenyl sulfone etc.), 5 mass parts promotor, 3 mass parts defoamer DMP-30, high-speed stirring is rear supersound process 20min evenly, pour mould into after vacuum defoamation, after 120 DEG C of solidification 2h, be warmed up to 160 DEG C of solidification 2h.(loading level is 30wt%)
Embodiment 2 (taking epoxy resin as matrix)
1, surface modification
The AlN of 50nm is placed on dry 2h in 160 DEG C of loft drier, stand-by; The AlN particle after activation treatment, the coupling agent NDI of AlN particle mass 5-10wt% and the dimethylbenzene of BN particle mass 15 times is added successively in there-necked flask, supersound process is 20min at least, add appropriate stannous octoate catalyst, with be placed on be furnished with magnetic stirring apparatus oil bath pan in 70 DEG C reaction 4h, suction filtration after cooling, with dimethylbenzene repetitive scrubbing to remove wherein excessive coupling agent, in 60 DEG C of vacuum-drying 4h, take out rear mortar grinder, obtain Modification on Al N.
2, apply
By 5 mass parts thinners, (Virahol and acetone are prepared according to 1:3, v/v) join in 100 mass parts epoxy resin, 50 mass parts Modification on Al N are added after stirring, add 10 mass parts aromatic amine curing agents subsequently successively (as m-xylene diamine, mphenylenediamine, diamino diphenyl sulfone etc.), 5 mass parts altax P-30,3 mass parts silicone antifoam agents, high-speed stirring is rear supersound process 20min evenly, pour mould into after vacuum defoamation, after 120 DEG C of solidification 2h, be warmed up to 160 DEG C of solidification 2h.(loading level is 30wt%)
Embodiment 3 (taking urethane as matrix)
1, surface modification
The toluene of NDI and BN particle mass 15 times of the 20nmBN particle of freeze-day with constant temperature 2h at 160 DEG C, BN particle mass 5-10wt% is added successively in there-necked flask, supersound process is 20min at least, add appropriate stannous octoate catalyst, with be placed on be furnished with magnetic stirring apparatus oil bath pan in 85 DEG C reaction 4h, suction filtration after cooling, with toluene repetitive scrubbing to remove wherein excessive coupling agent, in 80 DEG C of vacuum-drying 6h, take out rear mortar grinder, obtain modification BN.
2, apply
Following component is example in mass ratio: get 5 mass parts modification BN, 1 mass parts polyether glycol N204,4 mass parts polyether glycol N303,10 mass parts polyisocyanates PAPI, 3 mass parts fire retardant thinner TCEP, ultrasonic 10min under ice-water bath after stirring, add octoate catalyst sub-tin 0.1-0.2 part and stir, pour mould into, self-vulcanizing 3-5 minute shaping.(loading level is 21wt%)
Comparative example---silane coupler modified
1, surface modification
Add 160 DEG C successively in there-necked flask at, the toluene of the BN particle of 1 μm after freeze-day with constant temperature 2h, the KH560 (γ-glycidyl ether oxygen propyl trimethoxy silicane) of BN particle mass 5-10wt% and BN particle mass 15 times, supersound process is 20min at least, with be placed on be furnished with magnetic stirring apparatus oil bath pan in 60 DEG C reaction 4h, suction filtration after cooling, with toluene repetitive scrubbing to remove wherein excessive coupling agent, in 75 DEG C of vacuum-drying 6h, take out rear mortar grinder, obtain modification BN.
2, apply
By 5 mass parts thinners, (Virahol and acetone are prepared according to 1:3, v/v) join in 100 mass parts epoxy resin, 50 mass parts modification BN are added after stirring, add 10 mass parts aromatic amine curing agents subsequently successively (as m-xylene diamine, mphenylenediamine, diamino diphenyl sulfone etc.), 5 mass parts altax P-30,3 mass parts silicone antifoam agents, high-speed stirring is rear supersound process 20min evenly, pour mould into after vacuum defoamation, after 120 DEG C of solidification 2h, be warmed up to 160 DEG C of solidification 2h.(loading level is 30wt%)
Claims (9)
1. a surface modifying method for heat conductive filler, is characterized in that comprising the steps:
5 ~ 10 mass parts heat conductive fillers after high-temperature activation, 0.5 ~ 1 mass parts NDI, the solvent of 75 ~ 150 mass parts and catalyzer is added successively in there-necked flask, supersound process is no less than 20min, then in 60 ~ 85 DEG C of return stirring 2 ~ 6h, suction filtration after cooling, with solvent repetitive scrubbing to remove wherein excessive NDI, 40 ~ 60 DEG C of vacuum-drying 6 ~ 8h, namely obtain modification heat conductive filler after grinding.
2. method according to claim 1, is characterized in that the proportioning of each component is:
3. method according to claim 1, is characterized in that:
Described high-temperature activation is by heat conductive filler freeze-day with constant temperature 2h at 160 DEG C.
4. method according to claim 1, is characterized in that:
Described heat conductive filler is boron nitride, silicon nitride, aluminium nitride or aluminum oxide, and the particle diameter of described heat conductive filler is 10nm ~ 100 μm.
5. method according to claim 1 and 2, is characterized in that:
Described catalyzer is that stannous octoate, dibutyl tin laurate or isocaprylic acid are plumbous.
6. method according to claim 1 and 2, is characterized in that:
Described solvent is toluene or dimethylbenzene.
7. an application for the modification heat conductive filler of claim 1 preparation, is characterized in that:
Add in thermosetting resin by modification heat conductive filler, obtain the thermoset resin material with heat conductivility after solidification, the quality that modification heat conductive filler adds is the 5-100% of thermosetting resin quality.
8. application according to claim 7, is characterized in that:
Described thermosetting resin is epoxy resin or urethane.
9. application according to claim 7, is characterized in that:
Modification heat conductive filler adds with the form be distributed in the liquid raw material component of synthesis thermosetting resin or adds with the form be distributed in liquid thermosetting resin prepolymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703319.5A CN105254922A (en) | 2015-10-26 | 2015-10-26 | Surface modification method of heat-conducting filler and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510703319.5A CN105254922A (en) | 2015-10-26 | 2015-10-26 | Surface modification method of heat-conducting filler and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105254922A true CN105254922A (en) | 2016-01-20 |
Family
ID=55094890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510703319.5A Pending CN105254922A (en) | 2015-10-26 | 2015-10-26 | Surface modification method of heat-conducting filler and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105254922A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1962799A (en) * | 2006-11-09 | 2007-05-16 | 上海大学 | Low-viscosity heat-conductive adhesive and process for preparing same |
| CN103819498A (en) * | 2014-01-27 | 2014-05-28 | 合肥工业大学 | Closed isocyanate coupling agent and application thereof |
-
2015
- 2015-10-26 CN CN201510703319.5A patent/CN105254922A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1962799A (en) * | 2006-11-09 | 2007-05-16 | 上海大学 | Low-viscosity heat-conductive adhesive and process for preparing same |
| CN103819498A (en) * | 2014-01-27 | 2014-05-28 | 合肥工业大学 | Closed isocyanate coupling agent and application thereof |
Non-Patent Citations (2)
| Title |
|---|
| 刘益军: "《聚氨酯原料及助剂手册（第二版）》", 31 January 2013, 化学工业出版社 * |
| 李绍雄 等: "《聚氨酯树脂及其应用》", 31 May 2002, 化学工业出版社 材料科学与工程出版中心 * |
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Application publication date: 20160120 |
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