CN105252401A - Miniaturized chip edge rolling process and roller - Google Patents
Miniaturized chip edge rolling process and roller Download PDFInfo
- Publication number
- CN105252401A CN105252401A CN201510664212.4A CN201510664212A CN105252401A CN 105252401 A CN105252401 A CN 105252401A CN 201510664212 A CN201510664212 A CN 201510664212A CN 105252401 A CN105252401 A CN 105252401A
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- CN
- China
- Prior art keywords
- wafer
- cylinder
- sand
- roller
- miniaturized
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/02—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
- B24B31/14—Abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a miniaturized chip edge rolling process and a roller. The miniaturized chip edge rolling process sequentially comprises the steps that A, material preparation is carried out at first, sand is placed in a first oven at the temperature of 150 DEG C to be baked for four hours and then is placed in a second oven at the temperature of 60 DEG C to be subjected to heat preservation for one hour so as to obtain the prepared sand in the sand preparation process, and chips are weighed according to preset weight and placed in a chip bag to obtain the prepared chips in the chip preparation process; B, charging is carried out, the roller is taken out, and the sand and the chips are poured into the roller in sequence; C, the roller is placed in a roller machine and fixedly mounted; and D, the roller machine is started, the rotating speed of the roller machine is adjusted to 195 turns per minute, and the roller machine rolls for 600 minutes. A plurality of annular grooves are formed in the inner side wall of a roller body of the roller. The miniaturized chip edge rolling process and the roller can be used for carrying out edge rolling on miniaturized chips, so that the edge effect is relieved, resonant resistance is reduced, the spurious frequency is restrained, and the boundary dimensions of the chips are modified.
Description
Technical field
The present invention relates to miniaturized wafer edge knurling process and cylinder.
Background technology
The wafer used in crystal resonator, in order to better reduce the resonant resistance of crystal resonator, wafer needs to carry out periphery grinding in processing procedure process, is called for short rolling, its objective is the edge thickness wear down of wafer, plays the effect reducing resistance value.Wafer is divided into different models according to the large I of surface area, each performance parameter that large-sized wafer rolling uses existing barrel dliameter Φ 90mm to process can meet the requirements of the customers, but existing barrel dliameter is used for processing miniaturized SMD-2016 wafer, because wafer size is less, cylinder inner area is larger, comparatively large by the run up dispersion that processes wafer of edge-falled machine, each performance parameter that finished product test confirms is overall bigger than normal and disposable bad, and client cannot use.
Existing quartz wafer SMD roll processes is that quartz wafer is put into diameter of phi 90mm, and barrel dliameter length is in the straight tube of 285mm, and put into GC1000# sand and built by cover and put into high speed rotary-drum machine and fix, speed setting 160 revs/min is processed.The main purpose of wafer bevelling is to improve edge effect, reduces resonant resistance, suppresses undesire frequency, quartz plate is carried out to the correction of appearance and size.
Summary of the invention
Technical problem to be solved by this invention overcomes the deficiencies in the prior art, miniaturized wafer edge knurling process and cylinder are provided, rolling can be carried out to miniaturized wafer, result of use is good, improves edge effect, reduces resonant resistance, inhibit undesire frequency, have modified wafer profile size, there is structure simple, the advantage that cost is low simultaneously.
The technical solution adopted in the present invention is:
Miniaturized wafer edge knurling process, it comprises the following steps:
A, first to get the raw materials ready, be respectively sand and get the raw materials ready and wafer is got the raw materials ready; Wherein, the process that sand is got the raw materials ready is: the first baking oven sand being put into 150 DEG C toasts 4 hours, and then the baking second case of roasted sand being put into 60 DEG C carries out insulation 1 hour, the sand after insulation is loaded sandbag, obtains sand and get the raw materials ready; The process that wafer is got the raw materials ready is: wafer is put into electronic scale and weighs, and the wafer weighing up preset weight is put into wafer bag and obtains wafer and get the raw materials ready;
B, secondly charging, take out cylinder, first poured in cylinder by all sand in a sandbag, and then pour in cylinder by all wafers in a wafer bag, the cover of cylinder is covered;
C, cylinder is put into roller machine fixedly mount;
D, startup roller machine, by roller machine rotational speed regulation to 195 rev/min, and wait for that roller machine rolls 600 minutes.
Sand weight range in each sandbag in steps A is between 4 grams to 6 grams; Number of wafers scope in each wafer bag in steps A is between 2800 to 3200.
Sand weight in each sandbag in steps A is 5 grams; Number of wafers in each wafer bag in steps A is 3000.
In cylinder environment for use condition in steps A, humidity range is between 35%-55%, and temperature range is between 22 DEG C-28 DEG C.
In cylinder environment for use condition in steps A, temperature is 25 DEG C.
After step D completes, further comprising the steps of:
E, closed drum machine, take out cylinder, pour out the wafer in cylinder;
F, be placed into and wafer prober carry out detections by being poured out the wafer come and screen, the wafer screened is divided into two classes, is respectively qualified wafer and underproof wafer;
The cylinder of G, taking-up sky, taking-up does not have used sandbag, and pours the sand in sandbag into drums inside, then pours underproof wafer into drums inside, build the cover of cylinder, underproof wafer place cylinder finally will be housed and put into roller machine and again roll.
Cylinder, it is used in described miniaturized wafer edge knurling process, described cylinder comprises cylindrical shell and cover, described cylindrical shell is fixedly connected with by screwed tooth structure with between cover, at the bottom of described cylindrical shell is provided with tin and stack shell, described stack shell inwall is provided with several annular grooves of arranging successively toward the other end from stack shell one end.
Described stack shell madial wall is provided with the annular groove of 9 strip array distributions; The cross section of every bar annular groove is all curved, and the cross sectional radius of every bar annular groove is 10mm.
Described stack shell one end is provided with and coordinates the hard-wired annular breach position of cover; Described screwed tooth structure comprises the internal thread being located at annular breach position and the external screw thread be located on cover.
The diameter of cylindrical shell is 92mm, and the height size of cylindrical shell is 142mm, and the diameter of annular breach position is 80mm, and the height size of annular breach position is 9mm, and described lid thickness size is 17mm.
The invention has the beneficial effects as follows: can carry out rolling to miniaturized wafer, result of use is good, improves edge effect, reduces resonant resistance, inhibits undesire frequency, have modified wafer profile size to there is structure simultaneously simple, the advantage that cost is low.
Accompanying drawing explanation
Fig. 1 is the present invention's miniaturized wafer edge knurling process schematic flow sheet;
Fig. 2 is the structural representation of cylinder of the present invention.
Detailed description of the invention
As depicted in figs. 1 and 2, the miniaturized wafer edge knurling process of the present invention, it comprises the following steps:
A, first to get the raw materials ready, be respectively sand and get the raw materials ready and wafer is got the raw materials ready; Wherein, the process that sand is got the raw materials ready is: the first baking oven sand being put into 150 DEG C toasts 4 hours, and then the baking second case of roasted sand being put into 60 DEG C carries out insulation 1 hour, the sand after insulation is loaded sandbag, obtains sand and get the raw materials ready; The process that wafer is got the raw materials ready is: wafer is put into electronic scale and weighs, and the wafer weighing up preset weight is put into wafer bag and obtains wafer and get the raw materials ready;
B, secondly charging, take out cylinder, first poured in cylinder by all sand in a sandbag, and then pour in cylinder by all wafers in a wafer bag, the cover of cylinder is covered;
C, cylinder is put into roller machine fixedly mount;
D, startup roller machine, by roller machine rotational speed regulation to 195 rev/min, and wait for that roller machine rolls 600 minutes.
Sand weight range in each sandbag in steps A is between 4 grams to 6 grams; Number of wafers scope in each wafer bag in steps A is between 2800 to 3200.
Sand weight in each sandbag in steps A is 5 grams; Number of wafers in each wafer bag in steps A is 3000.
In cylinder environment for use condition in steps A, humidity range is between 35%-55%, and temperature range is between 22 DEG C-28 DEG C.
In cylinder environment for use condition in steps A, temperature is 25 DEG C.
After step D completes, further comprising the steps of:
E, closed drum machine, take out cylinder, pour out the wafer in cylinder;
F, be placed into and wafer prober carry out detections by being poured out the wafer come and screen, the wafer screened is divided into two classes, is respectively qualified wafer and underproof wafer;
The cylinder of G, taking-up sky, taking-up does not have used sandbag, and pours the sand in sandbag into drums inside, then pours underproof wafer into drums inside, build the cover of cylinder, underproof wafer place cylinder finally will be housed and put into roller machine and again roll.
Cylinder, it is used in described miniaturized wafer edge knurling process, described cylinder comprises cylindrical shell 1 and cover 2, described cylindrical shell 1 is fixedly connected with by screwed tooth structure with between cover 2, at the bottom of described cylindrical shell 1 is provided with tin 11 and stack shell 12, described stack shell 12 inwall is provided with several annular grooves 121 of arranging successively toward the other end from stack shell 12 one end.
Described stack shell 12 madial wall is provided with the annular groove 121 of 9 strip array distributions; The cross section of every bar annular groove 121 is all curved, and the cross sectional radius of every bar annular groove 121 is 10mm.
Described stack shell 12 one end is provided with and coordinates the hard-wired annular breach position 122 of cover 2; Described screwed tooth structure comprises the internal thread 123 being located at annular breach position 122 and the external screw thread 21 be located on cover 2.
The diameter of cylindrical shell 1 is 92mm, and the height size of cylindrical shell 1 is 142mm, and the diameter of annular breach position 122 is 80mm, and the height size of annular breach position 122 is 9mm, and described lid 2 thickness size is 17mm.
The invention has the beneficial effects as follows: can carry out rolling to miniaturized wafer, result of use is good, improves edge effect, reduces resonant resistance, inhibits undesire frequency, have modified wafer profile size to there is structure simultaneously simple, the advantage that cost is low.
Claims (10)
1. miniaturized wafer edge knurling process, is characterized in that comprising the following steps:
A, first to get the raw materials ready, be respectively sand and get the raw materials ready and wafer is got the raw materials ready; Wherein, the process that sand is got the raw materials ready is: the first baking oven sand being put into 150 DEG C toasts 4 hours, and then the baking second case of roasted sand being put into 60 DEG C carries out insulation 1 hour, the sand after insulation is loaded sandbag, obtains sand and get the raw materials ready; The process that wafer is got the raw materials ready is: wafer is put into electronic scale and weighs, and the wafer weighing up preset weight is put into wafer bag and obtains wafer and get the raw materials ready;
B, secondly charging, take out cylinder, first poured in cylinder by all sand in a sandbag, and then pour in cylinder by all wafers in a wafer bag, the cover of cylinder is covered;
C, cylinder is put into roller machine fixedly mount;
D, startup roller machine, by roller machine rotational speed regulation to 195 rev/min, and wait for that roller machine rolls 600 minutes.
2. miniaturized wafer edge knurling process according to claim 1, is characterized in that: the sand weight range in each sandbag in steps A is between 4 grams to 6 grams; Number of wafers scope in each wafer bag in steps A is between 2800 to 3200.
3. miniaturized wafer edge knurling process according to claim 2, is characterized in that: the sand weight in each sandbag in steps A is 5 grams; Number of wafers in each wafer bag in steps A is 3000.
4. miniaturized wafer edge knurling process according to claim 1, is characterized in that: in the cylinder environment for use condition in steps A, humidity range is between 35%-55%, and temperature range is between 22 DEG C-28 DEG C.
5. miniaturized wafer edge knurling process according to claim 4, is characterized in that: in the cylinder environment for use condition in steps A, temperature is 25 DEG C.
6. miniaturized wafer edge knurling process according to claim 1, is characterized in that, after step D completes, further comprising the steps of:
E, closed drum machine, take out cylinder, pour out the wafer in cylinder;
F, be placed into and wafer prober carry out detections by being poured out the wafer come and screen, the wafer screened is divided into two classes, is respectively qualified wafer and underproof wafer;
The cylinder of G, taking-up sky, taking-up does not have used sandbag, and pours the sand in sandbag into drums inside, then pours underproof wafer into drums inside, build the cover of cylinder, underproof wafer place cylinder finally will be housed and put into roller machine and again roll.
7. as the cylinder in the miniaturized wafer edge knurling process in claim 1 to 6 as described in any one, it is characterized in that: described cylinder comprises cylindrical shell (1) and cover (2), be fixedly connected with by screwed tooth structure between described cylindrical shell (1) with cover (2), (11) and a stack shell (12) at the bottom of described cylindrical shell (1) is provided with tin, described stack shell (12) inwall is provided with several annular grooves (121) of arranging successively toward the other end from stack shell (12) one end.
8. cylinder according to claim 7, is characterized in that: described stack shell (12) madial wall is provided with the annular groove (121) of 9 strip array distributions; The cross section of every bar annular groove (121) is all curved, and the cross sectional radius of every bar annular groove (121) is 10mm.
9. cylinder according to claim 7, is characterized in that: described stack shell (12) one end is provided with and coordinates cover (2) hard-wired annular breach position (122); Described screwed tooth structure comprises the internal thread (123) being located at annular breach position (122) and the external screw thread (21) be located on cover (2).
10. cylinder according to claim 9, it is characterized in that: the diameter of cylindrical shell (1) is 92mm, the height size of cylindrical shell (12) is 142mm, the diameter of annular breach position (122) is 80mm, the height size of annular breach position (122) is 9mm, and described lid (2) thickness size is 17mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510664212.4A CN105252401A (en) | 2015-10-15 | 2015-10-15 | Miniaturized chip edge rolling process and roller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510664212.4A CN105252401A (en) | 2015-10-15 | 2015-10-15 | Miniaturized chip edge rolling process and roller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105252401A true CN105252401A (en) | 2016-01-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510664212.4A Pending CN105252401A (en) | 2015-10-15 | 2015-10-15 | Miniaturized chip edge rolling process and roller |
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| CN (1) | CN105252401A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124928A (en) * | 1992-10-13 | 1994-05-06 | Rohm Co Ltd | Manufacture of semiconductor device |
| JPH07171749A (en) * | 1993-12-20 | 1995-07-11 | Shin Etsu Handotai Co Ltd | Device for grinding outer circumferential part of wafer |
| JP2000254543A (en) * | 1999-03-12 | 2000-09-19 | Mikura Bussan Kk | Method for regeneration treatment of silicon carbide abrasive and abrasive |
| JP2006021295A (en) * | 2004-07-09 | 2006-01-26 | Yuzo Mori | Method and device for processing ultraprecise mirror surface |
| JP2009014126A (en) * | 2007-07-06 | 2009-01-22 | Nsk Ltd | Roller bearing |
| CN201493744U (en) * | 2009-09-11 | 2010-06-02 | 镇江市港南电子有限公司 | Straight drum roller |
| CN203665295U (en) * | 2014-01-26 | 2014-06-25 | 台州市永安机械有限公司 | High-speed beveled wavy barrel |
-
2015
- 2015-10-15 CN CN201510664212.4A patent/CN105252401A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124928A (en) * | 1992-10-13 | 1994-05-06 | Rohm Co Ltd | Manufacture of semiconductor device |
| JPH07171749A (en) * | 1993-12-20 | 1995-07-11 | Shin Etsu Handotai Co Ltd | Device for grinding outer circumferential part of wafer |
| JP2000254543A (en) * | 1999-03-12 | 2000-09-19 | Mikura Bussan Kk | Method for regeneration treatment of silicon carbide abrasive and abrasive |
| JP2006021295A (en) * | 2004-07-09 | 2006-01-26 | Yuzo Mori | Method and device for processing ultraprecise mirror surface |
| JP2009014126A (en) * | 2007-07-06 | 2009-01-22 | Nsk Ltd | Roller bearing |
| CN201493744U (en) * | 2009-09-11 | 2010-06-02 | 镇江市港南电子有限公司 | Straight drum roller |
| CN203665295U (en) * | 2014-01-26 | 2014-06-25 | 台州市永安机械有限公司 | High-speed beveled wavy barrel |
Non-Patent Citations (1)
| Title |
|---|
| 宫桂英: "《人造石英晶体制造》", 30 April 1995, 电子工业出版社 * |
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Application publication date: 20160120 |