CN105249991A - Super-wide linear array probe and ultrasonic imaging apparatus - Google Patents
Super-wide linear array probe and ultrasonic imaging apparatus Download PDFInfo
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- CN105249991A CN105249991A CN201510641180.6A CN201510641180A CN105249991A CN 105249991 A CN105249991 A CN 105249991A CN 201510641180 A CN201510641180 A CN 201510641180A CN 105249991 A CN105249991 A CN 105249991A
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Abstract
The invention discloses a super-wide linear array probe and ultrasonic imaging apparatus. The super-wide linear array probe and ultrasonic imaging apparatus comprises a super-wide linear array probe and an ultrasonic host connected therewith. The super-wide linear array probe has the advantages of super-wide structure and quite a lot of arrays. A piezoelectric unit of the super-wide linear array probe is formed by splicing linear array piezoelectric assemblies with a relatively small amount of arrays. Each linear array piezoelectric assembly is connected with a socket of an ultrasonic imaging apparatus through more than two cables. A controller of the ultrasonic imaging apparatus realizes an imaging function of the super-wide linear array probe through controlling a high-voltage switch, an emission unit, a wave beam synthesis unit, a signal processing module and the like. According to the invention, image defects caused by splicing of linear array piezoelectric units are also reduced through special processing of the wave beam synthesis unit. The imaging apparatus is mainly applied to the field of medical diagnosis, especially diagnosis of such positions as mammary glands, arms and legs and the like.
Description
Technical field
Ultra-wide linear array probe of the present invention and supersonic imaging device are mainly used in medical imaging field, particularly the diagnosis at the position such as mammary gland, extremity and thyroid.
Background technology
Ultrasonic image-forming system is one of current most widely used medical imaging device, and it, by human-body emitting ultrasound wave, receives human body echo-signal, rebuilds organization of human body information, thus is applied to the diagnosis of clinical human's internal imaging.
Ultrasonic wire array probe is widely used in medical diagnosis, but due to technology and cost restriction, the width of linear array is generally less than 8cm, and array number is generally less than 256 array elements.In mammary gland scanning or the clinical scanning of extremity, often need the two-dimensional imaging cross section that width is larger.Doctor generally uses linear array probe back and forth to carry out scanning, so scanning efficiency comparison is low.
In order to ensure concordance, existing probe generally uses independent one block of piezoquartz to process, so be not easy to make the probe being greater than 8cm width.If the linear array probe that working width is larger, often need advanced techniques and sky high cost.
Linear array is under same width, and higher array number has meticulousr picture quality.Under prior art conditions, when making is greater than 128 array element linear array probe, too much unlikely in order to ensure cable coaxial core number, high-voltage switch gear is often needed to concentrate in probe, so easy generation is to the interference of echo-signal, because heat radiation and sonde configuration limit, also more difficultly make the probe being greater than 256 array elements.
Also have technology to use wide scape technology to carry out scanning, this checking method doctor is not easy to grasp, and the concordance of each scanning is difficult to ensure, software image stitching algorithm is complicated, and image effect is not good yet.
Therefore, a kind of width is needed to be greater than 8cm ultra-wide linear array probe and supersonic imaging device, to solve the above-mentioned problems in the prior art.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the invention provides a kind of ultra-wide linear array probe and supersonic imaging device, described imaging system comprises:
Ultra-wide linear array probe, comprising lens, matching layer, piezoquartz, damping layer, Wiring circuit board, cable, plug composition, wherein piezoquartz is spliced successively by straight line by the piezoelectric crystal component that polylith array element number is identical, and each piece of piezoelectric crystal component connects different cables by Wiring circuit board.
Supersonic imaging device system, it comprises probe socket, high-voltage switch gear, controller, transmitter unit, AFE (analog front end) AFE, Beam synthesis, signal processing, image procossing, DSC, display section composition; Under the control of the controller, design a kind of high-voltage switch gear combination of special construction, be used for supporting that multiple socket and launch and accept passage switch as a whole in real time.
Beam synthesis unit increases configurable gain coefficient, for compensating the difference of the reception echo-signal amplitude of two piezoelectricity array elements adjacent between piezoelectric crystal component and other piezoelectricity array elements.
Preferably, described each cable uses specification identical, ensures the concordance of signal.
Preferably, described probe plug includes circuit unit or the storage chip of have any different probe and plug order.
Ultra-wide linear array probe of the present invention not only can have overlength width, also can make the probe of super many (being generally greater than 256) array element.If supersonic imaging device has the socket that 4 are supported 128 array element probes, so its ultra-wide linear array probe supported can reach 4 times of single probe array number, i.e. 512 array elements.And because probe uses the connecting method of piezoelectric crystal component, standard piezoelectric wafer and cable can be used to make, make probe than being easier to and controlling cost.The supersonic imaging device corresponding with probe, because high-voltage switch gear is all in ultrasonic main frame, so decrease probe internal heat to a great extent, and eliminates other implementation high-voltage switch signal cables to the interference of ultrasonic signal.
At the Beam synthesis unit of supersonic imaging device system, increase the gain-adjusted process of configurable gain coefficient, for compensating the difference of the reception echo signal amplitude of two piezoelectricity array elements adjacent between piezoelectric crystal component and other piezoelectricity array elements, improve the concordance of ultra sonic imaging.
Describe concrete structure and the feature of system in this patent content part, this will further describe in detailed description of the invention part.This patent content part does not also mean that the key feature and essential features that will attempt to limit technical scheme required for protection, does not more mean that the protection domain attempting to determine technical scheme required for protection.
Below in conjunction with accompanying drawing, describe advantage and the feature of this patent in detail.
Accompanying drawing explanation
The following accompanying drawing of this patent in this as a part for this patent, for understanding this patent.Shown in the drawings of embodiment and the description thereof of this patent, be used for explaining the principle of this patent.In the accompanying drawings,
Fig. 1 is the schematic block diagram of a kind of ultra-wide linear array probe according to this patent and supersonic imaging device;
Fig. 2 is the diagrammatic plan view of the ultra-wide linear array probe structure according to a this patent embodiment;
Fig. 3 is the high-voltage switch gear control circuit schematic diagram according to a this patent embodiment;
Fig. 4 is the Beam synthesis gain control circuit schematic diagram according to a this patent embodiment;
Detailed description of the invention
In the following description, give a large amount of concrete details to provide to understand more thoroughly this patent.But, it will be apparent to one skilled in the art that this patent can be implemented without the need to these details one or more.In other example, in order to avoid obscuring with this patent, technical characteristics more well known in the art are not described.
In order to thoroughly understand this patent, by following description, detailed structure is proposed.Obviously, the enforcement of this patent is not limited to the specific details that those skilled in the art has the knack of.The preferred embodiment of this patent is described in detail as follows, but except these are described in detail, this patent can also have other embodiments.
This patent provides a kind of ultra-wide linear array probe and supersonic imaging device.Fig. 1 is the schematic block diagram of ultra-wide linear array probe according to a this patent embodiment and supersonic imaging device.
As shown in Figure 1, ultra-wide linear array probe and supersonic imaging device mainly comprise two subsystems: pop one's head in subsystem 100 and supersonic imaging device 200.Wherein ultrasonic probe comprises probe head 140, probe cable 150 and plug portion 160.Supersonic imaging device 200 comprises socket 210, high-voltage switch gear 220, transmitter unit 230, controller 250, AFE (analog front end) AFE240, Beam synthesis 260, signal processing 270, image procossing 280, digital scan conversion DSC290, display unit 295.Two subsystems are linked together by plug 160 and socket 210.
Probe subsystem 100 comprises probe head 140, probe cable 150 and plug portion 160.Probe head 140 comprises the transducer of one of ultra sonic imaging critical component, is described in detail in following use diagram 2.Probe cable 150 is made up of many cables, and every root cable is again containing many coaxial lines.Coaxial line is mainly used in launching high electric field pulse, receiving echo-signal, because the two is not carry out simultaneously, so transmitting and receiving can use same coaxial line.In addition, some coaxial line is also used as ground wire, to form power circuit.If the array number of ultra-wide linear array probe is 512 array elements, every root cable comprises transmission 128 for launching and connect signal line, and so whole system at least needs 4 cables.The quantity of plug portion 160 and cable as many, are plugged on supersonic imaging device.Each plug portion 160 contains different wiring codes or memory circuit, for distinguishing different plugs.Supersonic imaging device by reading the data of wiring code or memory circuit in plug, can judge that whether the position of plug is correct.
Fig. 2 shows the more detailed structure of head 140 of probe subsystem 100.Fig. 2 shows the example of ultra-wide probe, and ultra-wide probe has 4 pieces of ultrasonic wafer assemblies 141 to be spliced.Ultrasonic wafer assemblies 141 is processed into multiple array element by cut-in groove.If the array number of ultra-wide linear array probe is 512 array elements, the ultrasonic wafer of every block should contain 128 array elements.Ultrasonic wafer assemblies 141 is backing 142 below, and backing 142 unified as a whole perfusion in whole ultrasonic probe forms.Ultrasonic wafer assemblies 141, containing conductor, is connected with circuit board 144 by flexible PCB 143.Circuit board 144 is by being welded to connect the coaxial line in probe cable 150.
The ultrasonic head of ultrasound probe transducer 140 forms by multiple wafer assemblies 141 is bonding, and the processing method mid portion of single wafer assembly is the same with ordinary ultrasonic probe, uses cut-in groove to realize.Two edge array elements between two wafer assemblies need special handling, Fig. 2 shows the specific process of a kind of this patent cut-in groove when wafer splices, each groove is uniformly distributed on ultrasonic wafer, but without cut-in groove between the edge array element of two pieces of adjacent chip assemblies, this ensure that the connection precision of wafer assemblies and be processed into power.
Being matching layer 148 before the ultrasonic wafer assemblies 141 of ultrasound probe transducer, is lens jacket 149 before matching layer.Matching layer 148 adopts four pieces of forms of splicing in the present embodiment, and lens jacket 149 is whole probes is one.But matching layer 148 can use whole unitary form in other embodiments.
Show the embodiment of supersonic imaging device host machine part high-voltage switch gear 220 in figure 3.High-voltage switch gear 220 is divided into four groups in the present embodiment, and often organize 8 pieces of high-voltage switch gear chips, every block high-voltage switch gear chip connects 8 ultrasonic signal lines.Fig. 3 shows the annexation of high-voltage switch gear chip 220 and socket 210, AFE (analog front end) AFE240, transmitter unit 230, controller 250.In an embodiment, when the work of ultra-wide probe, controller 250 needs to switch each group of high-voltage switch gear to carry out entirety control, often organizes high-voltage switch gear and all wants real time operation.Wherein be responsible for switching probe array element 1-128 for first group, be responsible for for second group switching array element 129-256, be responsible for for the 3rd group switching array element 257-384, last group is responsible for switching array element 385-512.And often organize high-voltage switch gear control the size and launch and accept port number meet certain corresponding relation.
In Fig. 3, socket 210 hypothesis has 4 sockets, and it is 512 that these four sockets contain holding wire quantity en altogether, and this en signal line needs through high-voltage switch gear, connects transmitting and receiving passage.Each socket connects one group of high-voltage switch gear, often organizes the holding wire that high-voltage switch gear contains the individual probe array element of sen (128).Transmit and receive number of channels in the embodiment of this patent identical, suppose that quantity is cn, cn is 64 in the present embodiment.While ensureing that ultrasonic main frame uses ultra-wide probe 100, can the ordinary ultrasonic probe of other socket compatible, transmitting and receiving number of channels cn and often group are popped one's head in the following relation of array number sen demand fulfillment:
mod(sen，cn)＝0。Be mod (128,64)=0 in this example.First channel C H1 of each transmitting and receiving passage of such guarantee, all connect often organize high-voltage switch gear be numbered 1 chip, thus when reaching compatible ordinary ultrasonic probe, optimal high-voltage switch gear resource object.
In an embodiment, due to two piezoelectricity array elements between arrangement adj acent piezoelectric crystal assembly, owing to not having groove, half groove wider than other array elements in shape, causes the hyperacoustic characteristic of the transmitting and receiving of adjacent two array elements between piezoelectric crystal component different.In order to revise this difference, in the embodiment of the Beam synthesis of Fig. 4, Beam synthesis unit increases the processing links 264 of configurable gain coefficient, for compensating the difference of the reception echo-signal amplitude of two piezoelectricity array elements adjacent between piezoelectric crystal component and other piezoelectricity array elements.Because in Beam synthesis processing procedure, the signal demand weighted sum of each passage, in the present embodiment, before the summation of each passage, add the gain compensation link of piezoelectricity array element adjacent between crystal assembly especially, sending signal by controller 250, judging that current channel is the need of carrying out gain compensation.
This patent is illustrated by above-described embodiment, but should be understood that, above-described embodiment just for the object of illustrating and illustrate, and is not intended to this patent to be limited in described scope of embodiments.In addition it will be appreciated by persons skilled in the art that this patent is not limited to above-described embodiment, according to the explanation of this patent, more kinds of variants and modifications can also be made, within these variants and modifications all drop on this patent scope required for protection.The protection domain of this patent defined by the appended claims and equivalent scope thereof.
Claims (6)
1. ultra-wide linear array probe and a supersonic imaging device system, is characterized in that, described system comprises:
Ultra-wide linear array probe, it comprises lens, matching layer, piezoquartz, damping layer, Wiring circuit board, cable, plug composition, wherein piezoquartz is spliced successively by straight line by the piezoelectric crystal component that polylith array element number is identical, and each piece of piezoelectric crystal component connects different cables by Wiring circuit board;
Supersonic imaging device system, it comprises probe socket, and high-voltage switch gear, controller, transmitter unit, AFE (analog front end) AFE, Beam synthesis, signal processing, image procossing, DSC, display unit form; High-voltage switch gear is supported and the multiple socket and the real-time switching of transmitting and receiving passage that are connected of popping one's head in, and while support ultra-wide linear array probe, also can support common linear array probe.
2. according to the piezoelectric crystal component of ultra-wide linear array probe according to claim 1, it is characterized in that, array element number contained by two piezoelectric crystal components is identical, the spacing of piezoelectricity array element adjacent between piezoelectric crystal component is identical with array element distance in each assembly, and two piezoelectricity array elements adjacent between piezoelectric crystal component do not have cutting groove.
3. according to the cable of ultra-wide linear array probe according to claim 1, it is characterized in that, described cable uses many, and each cable uses specification identical.
4. according to the plug of ultra-wide linear array probe according to claim 1, it is characterized in that, plug includes circuit or the memory element of have any different probe and plug.
5. according to the high-voltage switch gear of supersonic imaging device system according to claim 1, it is characterized in that, with other supersonic imaging devices unlike, during the work of ultra-wide linear array probe, the each group high-voltage switch gear corresponding with socket all participates in switching, and often group high-voltage switch gear switching channel number sen and transmitting and receiving number of channels cn meets following relation:
mod(sen，cn)＝0。
6. according to the Beam synthesis unit of supersonic imaging device system according to claim 1, it is characterized in that, increase configurable gain coefficient, under the control of the controller, for compensating the difference of the reception echo signal amplitude of two piezoelectricity array elements adjacent between piezoelectric crystal component and other piezoelectricity array elements.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107280704A (en) * | 2017-04-10 | 2017-10-24 | 深圳深超换能器有限公司 | Two-dimensional ultrasound corrugated battle array probe and preparation method thereof |
| CN112206003A (en) * | 2019-07-11 | 2021-01-12 | 深圳市理邦精密仪器股份有限公司 | Multi-probe ultrasonic instrument and cascade structure of socket thereof |
| CN112532223A (en) * | 2020-12-24 | 2021-03-19 | 深圳市威尔德医疗电子有限公司 | Real-time synchronous imaging probe circuit and B-ultrasonic equipment |
| CN113509204A (en) * | 2021-03-26 | 2021-10-19 | 聚融医疗科技(杭州)有限公司 | Ultrasonic probe for improving mammary gland ultrasonic signal and working method thereof |
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| CN112532223A (en) * | 2020-12-24 | 2021-03-19 | 深圳市威尔德医疗电子有限公司 | Real-time synchronous imaging probe circuit and B-ultrasonic equipment |
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