CN105226001B - 带计数感应检测的双晶片焊接治具 - Google Patents
带计数感应检测的双晶片焊接治具 Download PDFInfo
- Publication number
- CN105226001B CN105226001B CN201510698055.9A CN201510698055A CN105226001B CN 105226001 B CN105226001 B CN 105226001B CN 201510698055 A CN201510698055 A CN 201510698055A CN 105226001 B CN105226001 B CN 105226001B
- Authority
- CN
- China
- Prior art keywords
- fixed seat
- welding
- twin lamella
- bumping post
- copper wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 title claims abstract description 74
- 241000446313 Lamella Species 0.000 title claims abstract description 35
- 238000001514 detection method Methods 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000005452 bending Methods 0.000 claims description 24
- 238000009434 installation Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Butt Welding And Welding Of Specific Article (AREA)
- Resistance Welding (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510698055.9A CN105226001B (zh) | 2015-10-22 | 2015-10-22 | 带计数感应检测的双晶片焊接治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510698055.9A CN105226001B (zh) | 2015-10-22 | 2015-10-22 | 带计数感应检测的双晶片焊接治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105226001A CN105226001A (zh) | 2016-01-06 |
CN105226001B true CN105226001B (zh) | 2018-05-01 |
Family
ID=54994865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510698055.9A Expired - Fee Related CN105226001B (zh) | 2015-10-22 | 2015-10-22 | 带计数感应检测的双晶片焊接治具 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105226001B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103000546A (zh) * | 2011-09-15 | 2013-03-27 | 台湾积体电路制造股份有限公司 | 测试探针板 |
CN104465595A (zh) * | 2014-12-02 | 2015-03-25 | 天水华天科技股份有限公司 | 基于定制引线框架的csp型mems封装件及生产方法 |
CN104985380A (zh) * | 2015-08-04 | 2015-10-21 | 王琼琦 | 带冷却结构的焊接治具 |
-
2015
- 2015-10-22 CN CN201510698055.9A patent/CN105226001B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103000546A (zh) * | 2011-09-15 | 2013-03-27 | 台湾积体电路制造股份有限公司 | 测试探针板 |
CN104465595A (zh) * | 2014-12-02 | 2015-03-25 | 天水华天科技股份有限公司 | 基于定制引线框架的csp型mems封装件及生产方法 |
CN104985380A (zh) * | 2015-08-04 | 2015-10-21 | 王琼琦 | 带冷却结构的焊接治具 |
Also Published As
Publication number | Publication date |
---|---|
CN105226001A (zh) | 2016-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Li Yi Inventor before: Yuan Yuanyuan |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20180403 Address after: No. two, No. 1149, Qianshan Mingzhu South Road, Qianshan, Zhuhai, Guangdong Applicant after: Zhuhai its Chang Pml Precision Mechanism Ltd. Address before: 214000 Wuxi Economic Development Zone, Xishan, private industrial park B District, No. 5, No. Applicant before: WUXI BOJIN PRECISION MACHINERY MANUFACTURING Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210113 Address after: 1st floor, 1149 Mingzhu South Road, Qianshan, Zhuhai, Guangdong 519000 Patentee after: Zhuhai Qichang Intelligent Manufacturing Technology Co.,Ltd. Address before: 2 / F, 1149 Mingzhu South Road, Qianshan, Zhuhai, Guangdong 519070 Patentee before: Zhuhai its Chang Pml Precision Mechanism Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180501 Termination date: 20211022 |