CN105225997A - 一种静电夹盘及静电夹盘的制造方法 - Google Patents
一种静电夹盘及静电夹盘的制造方法 Download PDFInfo
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- CN105225997A CN105225997A CN201410261390.8A CN201410261390A CN105225997A CN 105225997 A CN105225997 A CN 105225997A CN 201410261390 A CN201410261390 A CN 201410261390A CN 105225997 A CN105225997 A CN 105225997A
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CN201410261390.8A CN105225997B (zh) | 2014-06-12 | 2014-06-12 | 一种静电夹盘及静电夹盘的制造方法 |
TW103145981A TWI545688B (zh) | 2014-06-12 | 2014-12-29 | A method for manufacturing electrostatic chuck and electrostatic chuck |
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CN201410261390.8A CN105225997B (zh) | 2014-06-12 | 2014-06-12 | 一种静电夹盘及静电夹盘的制造方法 |
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CN105225997A true CN105225997A (zh) | 2016-01-06 |
CN105225997B CN105225997B (zh) | 2018-01-23 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10186400B2 (en) | 2017-01-20 | 2019-01-22 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
US10443126B1 (en) | 2018-04-06 | 2019-10-15 | Applied Materials, Inc. | Zone-controlled rare-earth oxide ALD and CVD coatings |
CN110783251A (zh) * | 2018-07-30 | 2020-02-11 | Toto株式会社 | 静电吸盘 |
US10676819B2 (en) | 2016-06-23 | 2020-06-09 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
US10858741B2 (en) | 2019-03-11 | 2020-12-08 | Applied Materials, Inc. | Plasma resistant multi-layer architecture for high aspect ratio parts |
US11180847B2 (en) | 2018-12-06 | 2021-11-23 | Applied Materials, Inc. | Atomic layer deposition coatings for high temperature ceramic components |
US11198936B2 (en) | 2016-04-27 | 2021-12-14 | Applied Materials, Inc. | Atomic layer deposition of protective coatings for semiconductor process chamber components |
US11279656B2 (en) | 2017-10-27 | 2022-03-22 | Applied Materials, Inc. | Nanopowders, nanoceramic materials and methods of making and use thereof |
US11667575B2 (en) | 2018-07-18 | 2023-06-06 | Applied Materials, Inc. | Erosion resistant metal oxide coatings |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI765518B (zh) * | 2021-01-07 | 2022-05-21 | 財團法人工業技術研究院 | 靜電吸盤及其製備方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US5325261A (en) * | 1991-05-17 | 1994-06-28 | Unisearch Limited | Electrostatic chuck with improved release |
WO1997038481A1 (en) * | 1996-04-10 | 1997-10-16 | Virginia Tech Intellectual Properties, Inc. | Process for providing a glass-ceramic dielectric layer on an electrically conductive substrate and electrostatic chucks made by the process |
US20030169553A1 (en) * | 2002-03-08 | 2003-09-11 | Applied Materials, Inc. | High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications |
CN101677053A (zh) * | 2008-09-19 | 2010-03-24 | Ips株式会社 | 静电吸盘及其制备方法 |
US20110209985A1 (en) * | 2010-02-26 | 2011-09-01 | Youming Li | Physical Vapor Deposition With Heat Diffuser |
US20120227667A1 (en) * | 2011-03-10 | 2012-09-13 | Applied Materials, Inc. | Substrate carrier with multiple emissivity coefficients for thin film processing |
CN103370778A (zh) * | 2011-01-27 | 2013-10-23 | 应用材料公司 | 具有加热器与快速温度变化的基板支撑件 |
-
2014
- 2014-06-12 CN CN201410261390.8A patent/CN105225997B/zh active Active
- 2014-12-29 TW TW103145981A patent/TWI545688B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5325261A (en) * | 1991-05-17 | 1994-06-28 | Unisearch Limited | Electrostatic chuck with improved release |
WO1997038481A1 (en) * | 1996-04-10 | 1997-10-16 | Virginia Tech Intellectual Properties, Inc. | Process for providing a glass-ceramic dielectric layer on an electrically conductive substrate and electrostatic chucks made by the process |
US20030169553A1 (en) * | 2002-03-08 | 2003-09-11 | Applied Materials, Inc. | High temperature DC chucking and RF biasing cable with high voltage isolation for biasable electrostatic chuck applications |
CN101677053A (zh) * | 2008-09-19 | 2010-03-24 | Ips株式会社 | 静电吸盘及其制备方法 |
US20110209985A1 (en) * | 2010-02-26 | 2011-09-01 | Youming Li | Physical Vapor Deposition With Heat Diffuser |
CN103370778A (zh) * | 2011-01-27 | 2013-10-23 | 应用材料公司 | 具有加热器与快速温度变化的基板支撑件 |
US20120227667A1 (en) * | 2011-03-10 | 2012-09-13 | Applied Materials, Inc. | Substrate carrier with multiple emissivity coefficients for thin film processing |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11326253B2 (en) | 2016-04-27 | 2022-05-10 | Applied Materials, Inc. | Atomic layer deposition of protective coatings for semiconductor process chamber components |
US11198937B2 (en) | 2016-04-27 | 2021-12-14 | Applied Materials, Inc. | Atomic layer deposition of protective coatings for semiconductor process chamber components |
US11198936B2 (en) | 2016-04-27 | 2021-12-14 | Applied Materials, Inc. | Atomic layer deposition of protective coatings for semiconductor process chamber components |
US10676819B2 (en) | 2016-06-23 | 2020-06-09 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
US11251023B2 (en) | 2017-01-20 | 2022-02-15 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
US10573497B2 (en) | 2017-01-20 | 2020-02-25 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
US10186400B2 (en) | 2017-01-20 | 2019-01-22 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
US12002657B2 (en) | 2017-01-20 | 2024-06-04 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
US11279656B2 (en) | 2017-10-27 | 2022-03-22 | Applied Materials, Inc. | Nanopowders, nanoceramic materials and methods of making and use thereof |
US11667578B2 (en) | 2017-10-27 | 2023-06-06 | Applied Materials, Inc. | Methods of making nanopowders, nanoceramic materials and nanoceramic components |
US10443126B1 (en) | 2018-04-06 | 2019-10-15 | Applied Materials, Inc. | Zone-controlled rare-earth oxide ALD and CVD coatings |
US11667575B2 (en) | 2018-07-18 | 2023-06-06 | Applied Materials, Inc. | Erosion resistant metal oxide coatings |
CN110783251A (zh) * | 2018-07-30 | 2020-02-11 | Toto株式会社 | 静电吸盘 |
US11180847B2 (en) | 2018-12-06 | 2021-11-23 | Applied Materials, Inc. | Atomic layer deposition coatings for high temperature ceramic components |
US10858741B2 (en) | 2019-03-11 | 2020-12-08 | Applied Materials, Inc. | Plasma resistant multi-layer architecture for high aspect ratio parts |
Also Published As
Publication number | Publication date |
---|---|
CN105225997B (zh) | 2018-01-23 |
TW201546950A (zh) | 2015-12-16 |
TWI545688B (zh) | 2016-08-11 |
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Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |
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Effective date of registration: 20210122 Address after: No.188, Taihua Road, Jinqiao Export Processing Zone (South District), Pudong New Area, Shanghai, 201206 Patentee after: China micro semiconductor equipment (Shanghai) Co.,Ltd. Patentee after: Nanchang Medium and Micro Semiconductor Equipment Co.,Ltd. Address before: 201201 Shanghai City Jingqiao export processing zone of Pudong New Area (South) Taihua Road No. 188 Patentee before: China micro semiconductor equipment (Shanghai) Co.,Ltd. |
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