CN105220189A - A kind of samarium-tin-copper alloy electroplating liquid and electro-plating method thereof - Google Patents
A kind of samarium-tin-copper alloy electroplating liquid and electro-plating method thereof Download PDFInfo
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- CN105220189A CN105220189A CN201510727829.6A CN201510727829A CN105220189A CN 105220189 A CN105220189 A CN 105220189A CN 201510727829 A CN201510727829 A CN 201510727829A CN 105220189 A CN105220189 A CN 105220189A
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Abstract
The invention provides a kind of samarium-tin-copper alloy electroplating liquid and electro-plating method thereof.This samarium-tin-copper alloy electroplating liquid comprises following component: copper sulfate 30 ~ 50g/L, tin sulphate 20 ~ 30g/L, Samarium trioxide 0.1 ~ 0.5g/L, vinyl sulfonic acid potassium 2 ~ 5g/L, trisodium phosphate 10 ~ 30g/L, citric acid 6 ~ 15g/L, disodium ethylene diamine tetraacetate 10 ~ 20g/L, asccharin 0.5 ~ 2g/L and sodium acetate 10 ~ 16g/L.Samarium-tin-copper alloy electroplating liquid of the present invention has satisfactory stability and dispersive ability, and current efficiency is high, and obtained alloy layer does not have crackle, and erosion resistance is strong, and is combined well with matrix.
Description
Technical field
The present invention relates to electroplate liquid technical field, particularly relate to a kind of samarium-tin-copper alloy electroplating liquid and electro-plating method thereof.
Background technology
Along with the development of science and technology, more and more stricter to the requirement of product, the coating of single-element is difficult to the demand meeting plated item, and researcher turns one's attention to alloy plating gradually.
Nickel plating technology is widely used in all respects of electroplating industry, for metal device carry out anticorrosion, decoration for the purpose of surface treatment.But because nickel resources belongs to non-renewable nature, along with the continuous increase of nickel consumption, supply wretched insufficiency, cause substantial appreciation of prices, each electroplating enterprise nickel plating cost remains high.Electroplating enterprise is sought to save nickel, novel process for nickel one after another.From the character of coating, the alloys such as copper nickel should become first-selected plating.But prior art cupronickel electroplate liquid stability is bad, electroplating efficiency is low, be difficult to obtain stable coating, and the skin that metallic nickel directly contacts people can cause nickel condition susceptible, and wear resistance and the erosion resistance of plating gained coating are all poor.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of samarium-tin-copper alloy electroplating liquid, and this samarium-tin-copper alloy electroplating liquid has satisfactory stability and dispersive ability, and current efficiency is high.
The present invention realizes by the following technical solutions.
A kind of samarium-tin-copper alloy electroplating liquid comprises following component: copper sulfate 30 ~ 50g/L, tin sulphate 20 ~ 30g/L, Samarium trioxide 0.1 ~ 0.5g/L, vinyl sulfonic acid potassium 2 ~ 5g/L, trisodium phosphate 10 ~ 30g/L, citric acid 6 ~ 15g/L, disodium ethylene diamine tetraacetate 10 ~ 20g/L, asccharin 0.5 ~ 2g/L and sodium acetate 10 ~ 16g/L.
Wherein, following component is comprised: the deionized water of copper sulfate 36 ~ 42g/L, tin sulphate 22 ~ 26g/L, Samarium trioxide 0.1 ~ 0.3g/L, vinyl sulfonic acid potassium 2 ~ 4g/L, trisodium phosphate 12 ~ 18g/L, citric acid 8 ~ 12g/L, disodium ethylene diamine tetraacetate 14 ~ 18g/L, asccharin 0.8 ~ 1.2g/L, sodium acetate 12 ~ 14g/L and surplus.
Wherein, following component is comprised: the deionized water of copper sulfate 38g/L, tin sulphate 25g/L, Samarium trioxide 0.2g/L, vinyl sulfonic acid potassium 3g/L, trisodium phosphate 14g/L, citric acid 10g/L, disodium ethylene diamine tetraacetate 14g/L, asccharin 1.2g/L, sodium acetate 12g/L and surplus.
Wherein, described samarium-tin-copper alloy electroplating liquid PH is 5 ~ 6.
The present invention provides a kind of electro-plating method of above-mentioned samarium-tin-copper alloy electroplating liquid on the other hand, and adopting this electro-plating method to electroplate obtained alloy layer does not have crackle, and erosion resistance is strong, and is combined well with matrix.
A kind of electro-plating method of above-mentioned samarium-tin-copper alloy electroplating liquid comprises the following steps:
(1) samarium-tin-copper alloy electroplating liquid is configured: citric acid, vinyl sulfonic acid potassium and trisodium phosphate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and Samarium trioxide is added in described solution, stirring and dissolving makes mixed solution, asccharin, sodium acetate and disodium ethylene diamine tetraacetate is added to dissolving, obtained samarium-tin-copper alloy electroplating liquid in described mixed solution;
Wherein, copper sulfate 30 ~ 50g/L, tin sulphate 20 ~ 30g/L, Samarium trioxide 0.1 ~ 0.5g/L, vinyl sulfonic acid potassium 2 ~ 5g/L, trisodium phosphate 10 ~ 30g/L, citric acid 6 ~ 15g/L, disodium ethylene diamine tetraacetate 10 ~ 20g/L, asccharin 0.5 ~ 2g/L and sodium acetate 10 ~ 16g/L in described samarium-tin-copper alloy electroplating liquid;
(2) take metal base as negative electrode, graphite is that anode is electroplated, obtained alloy layer.
Wherein, in described step (2), the temperature of plating is 30 ~ 40 DEG C.
Wherein, in described step (2), the current density of plating is 30 ~ 50mA/cm
2, electroplating time is 5 ~ 9min.
Wherein, in described step (2), the distance of negative electrode and positive electrode is 8 ~ 15cm.
Compared with prior art, beneficial effect of the present invention: samarium-tin-copper alloy electroplating liquid of the present invention has satisfactory stability and dispersive ability, and current efficiency is high, obtained alloy layer does not have crackle, and erosion resistance is strong, and is combined well with matrix.
Embodiment
Further illustrate technical scheme of the present invention respectively below in conjunction with the embodiments.
Raw material involved in following examples is commercially available.
Embodiment 1: the samarium-tin-copper alloy electroplating liquid of the present embodiment comprises following component:
Use above-mentioned samarium-tin-copper alloy electroplating liquid electro-plating method as follows:
Configuration samarium-tin-copper alloy electroplating liquid: citric acid, vinyl sulfonic acid potassium and trisodium phosphate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and Samarium trioxide is added in described solution, stirring and dissolving makes mixed solution, asccharin, sodium acetate and disodium ethylene diamine tetraacetate is added to dissolving, obtained samarium-tin-copper alloy electroplating liquid in described mixed solution; Wherein, in described samarium-tin-copper alloy electroplating liquid, copper sulfate 30g/L, tin sulphate 20g/L, Samarium trioxide 0.1g/L, vinyl sulfonic acid potassium 2g/L, trisodium phosphate 10g/L, citric acid 6g/L, disodium ethylene diamine tetraacetate 10g/L, asccharin 0.5g/L and sodium acetate 10g/L, PH are 5;
Take metal base as negative electrode, graphite is anode, and the distance of negative electrode and positive electrode is 8cm, and described samarium-tin-copper alloy electroplating liquid is 35 DEG C and current density in temperature is 35mA/cm
2electroplate 6min under condition, obtain alloy layer.
Embodiment 2: the samarium-tin-copper alloy electroplating liquid of the present embodiment comprises following component:
Use above-mentioned samarium-tin-copper alloy electroplating liquid electro-plating method as follows:
Configuration samarium-tin-copper alloy electroplating liquid: citric acid, vinyl sulfonic acid potassium and trisodium phosphate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and Samarium trioxide is added in described solution, stirring and dissolving makes mixed solution, asccharin, sodium acetate and disodium ethylene diamine tetraacetate is added to dissolving, obtained samarium-tin-copper alloy electroplating liquid in described mixed solution; Wherein, in described samarium-tin-copper alloy electroplating liquid, copper sulfate 36g/L, tin sulphate 22g/L, Samarium trioxide 0.1g/L, vinyl sulfonic acid potassium 2g/L, trisodium phosphate 12g/L, citric acid 8g/L, disodium ethylene diamine tetraacetate 14g/L, asccharin 0.8g/L and sodium acetate 12g/L, PH are 6;
Take metal base as negative electrode, graphite is anode, and the distance of negative electrode and positive electrode is 10cm, and described samarium-tin-copper alloy electroplating liquid is 40 DEG C and current density in temperature is 45mA/cm
2electroplate 9min under condition, obtain alloy layer.
Embodiment 3: the samarium-tin-copper alloy electroplating liquid of the present embodiment comprises following component:
Use above-mentioned samarium-tin-copper alloy electroplating liquid electro-plating method as follows:
Configuration samarium-tin-copper alloy electroplating liquid: citric acid, vinyl sulfonic acid potassium and trisodium phosphate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and Samarium trioxide is added in described solution, stirring and dissolving makes mixed solution, asccharin, sodium acetate and disodium ethylene diamine tetraacetate is added to dissolving, obtained samarium-tin-copper alloy electroplating liquid in described mixed solution; Wherein, in described samarium-tin-copper alloy electroplating liquid, copper sulfate 38g/L, tin sulphate 25g/L, Samarium trioxide 0.2g/L, vinyl sulfonic acid potassium 3g/L, trisodium phosphate 14g/L, citric acid 10g/L, disodium ethylene diamine tetraacetate 14g/L, asccharin 1.2g/L and sodium acetate 12g/L, PH are 6;
Take metal base as negative electrode, graphite is anode, and the distance of negative electrode and positive electrode is 12cm, and described samarium-tin-copper alloy electroplating liquid is 40 DEG C and current density in temperature is 50mA/cm
2electroplate 9min under condition, obtain alloy layer.
Samarium-tin-copper alloy electroplating liquid of the present invention has satisfactory stability and dispersive ability, and current efficiency is high, and obtained alloy layer does not have crackle, and erosion resistance is strong, and is combined well with matrix.
It should be noted that and understand, when not departing from the spirit and scope of accompanying claim the present invention for required protection, various amendment and improvement can be made to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not by the restriction of given any specific exemplary teachings.
Applicant states, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, namely do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (8)
1. samarium-tin-copper alloy electroplating liquid, it is characterized in that, comprise following component: copper sulfate 30 ~ 50g/L, tin sulphate 20 ~ 30g/L, Samarium trioxide 0.1 ~ 0.5g/L, vinyl sulfonic acid potassium 2 ~ 5g/L, trisodium phosphate 10 ~ 30g/L, citric acid 6 ~ 15g/L, disodium ethylene diamine tetraacetate 10 ~ 20g/L, asccharin 0.5 ~ 2g/L and sodium acetate 10 ~ 16g/L.
2. samarium-tin-copper alloy electroplating liquid according to claim 1, it is characterized in that, comprise following component: the deionized water of copper sulfate 36 ~ 42g/L, tin sulphate 22 ~ 26g/L, Samarium trioxide 0.1 ~ 0.3g/L, vinyl sulfonic acid potassium 2 ~ 4g/L, trisodium phosphate 12 ~ 18g/L, citric acid 8 ~ 12g/L, disodium ethylene diamine tetraacetate 14 ~ 18g/L, asccharin 0.8 ~ 1.2g/L, sodium acetate 12 ~ 14g/L and surplus.
3. samarium-tin-copper alloy electroplating liquid according to claim 1, it is characterized in that, comprise following component: the deionized water of copper sulfate 38g/L, tin sulphate 25g/L, Samarium trioxide 0.2g/L, vinyl sulfonic acid potassium 3g/L, trisodium phosphate 14g/L, citric acid 10g/L, disodium ethylene diamine tetraacetate 14g/L, asccharin 1.2g/L, sodium acetate 12g/L and surplus.
4. samarium-tin-copper alloy electroplating liquid according to claim 1, is characterized in that, described samarium-tin-copper alloy electroplating liquid PH is 5 ~ 6.
5. an electro-plating method for samarium-tin-copper alloy electroplating liquid according to claim 1, is characterized in that, comprise the following steps:
(1) samarium-tin-copper alloy electroplating liquid is configured: citric acid, vinyl sulfonic acid potassium and trisodium phosphate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and Samarium trioxide is added in described solution, stirring and dissolving makes mixed solution, asccharin, sodium acetate and disodium ethylene diamine tetraacetate is added to dissolving, obtained samarium-tin-copper alloy electroplating liquid in described mixed solution;
Wherein, copper sulfate 30 ~ 50g/L, tin sulphate 20 ~ 30g/L, Samarium trioxide 0.1 ~ 0.5g/L, vinyl sulfonic acid potassium 2 ~ 5g/L, trisodium phosphate 10 ~ 30g/L, citric acid 6 ~ 15g/L, disodium ethylene diamine tetraacetate 10 ~ 20g/L, asccharin 0.5 ~ 2g/L and sodium acetate 10 ~ 16g/L in described samarium-tin-copper alloy electroplating liquid;
(2) take metal base as negative electrode, graphite is that anode is electroplated, obtained alloy layer.
6. electro-plating method according to claim 5, is characterized in that, in described step (2), the temperature of plating is 30 ~ 40 DEG C.
7. electro-plating method according to claim 5, is characterized in that, in described step (2), the current density of plating is 30 ~ 50mA/cm
2, electroplating time is 5 ~ 9min.
8. electro-plating method according to claim 5, is characterized in that, in described step (2), the distance of negative electrode and positive electrode is 8 ~ 15cm.
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| RU2029799C1 (en) * | 1992-07-13 | 1995-02-27 | Государственный научно-исследовательский, проектный и конструкторский институт сплавов и обработки цветных металлов "Гипроцветметобработка" | Electrolyte for precipitation of coating made of alloy copper-tin |
| CN102433577A (en) * | 2011-12-26 | 2012-05-02 | 无锡海普斯新材料科技有限公司 | Rare earth-nickel-cobalt-boron multi-element alloy anticorrosion and wear-resistant plating, electroplating liquid and preparation method of electroplating liquid |
| CN102925936A (en) * | 2012-10-30 | 2013-02-13 | 南通博远合金铸件有限公司 | Copper-tin alloy solution |
| CN103069054A (en) * | 2010-08-17 | 2013-04-24 | 尤米科尔电镀技术有限公司 | Electrolyte and process for the deposition of copper-tin alloy layers |
| CN103668359A (en) * | 2012-09-06 | 2014-03-26 | 上海造币有限公司 | Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof |
| CN103789803A (en) * | 2014-01-13 | 2014-05-14 | 孙松华 | Cyanide-free copper-tin alloy electroplate liquid and preparation method thereof |
| CN103806036A (en) * | 2012-11-12 | 2014-05-21 | 无锡三洲冷轧硅钢有限公司 | Wide-current density cyanide-free copper-tin alloy electroplating process |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2029799C1 (en) * | 1992-07-13 | 1995-02-27 | Государственный научно-исследовательский, проектный и конструкторский институт сплавов и обработки цветных металлов "Гипроцветметобработка" | Electrolyte for precipitation of coating made of alloy copper-tin |
| CN103069054A (en) * | 2010-08-17 | 2013-04-24 | 尤米科尔电镀技术有限公司 | Electrolyte and process for the deposition of copper-tin alloy layers |
| CN102433577A (en) * | 2011-12-26 | 2012-05-02 | 无锡海普斯新材料科技有限公司 | Rare earth-nickel-cobalt-boron multi-element alloy anticorrosion and wear-resistant plating, electroplating liquid and preparation method of electroplating liquid |
| CN103668359A (en) * | 2012-09-06 | 2014-03-26 | 上海造币有限公司 | Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof |
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| CN103806036A (en) * | 2012-11-12 | 2014-05-21 | 无锡三洲冷轧硅钢有限公司 | Wide-current density cyanide-free copper-tin alloy electroplating process |
| CN103789803A (en) * | 2014-01-13 | 2014-05-14 | 孙松华 | Cyanide-free copper-tin alloy electroplate liquid and preparation method thereof |
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