CN105206764A - Sealing technology of OLED display device - Google Patents
Sealing technology of OLED display device Download PDFInfo
- Publication number
- CN105206764A CN105206764A CN201510514483.1A CN201510514483A CN105206764A CN 105206764 A CN105206764 A CN 105206764A CN 201510514483 A CN201510514483 A CN 201510514483A CN 105206764 A CN105206764 A CN 105206764A
- Authority
- CN
- China
- Prior art keywords
- oled display
- display device
- sealing technology
- vapor deposition
- chemical vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Abstract
The invention belongs to the field of OLED processing, and especially relates to a sealing technology of an OLED display device. According to the technology, first of all, plasma enhanced chemical vapor deposition is carried out on the OLED display device, and then organic high polymer packaging is performed. The problem of incapability of meeting the packaging requirement of OLED display through single packaging in the prior art is well solved; the plasma enhanced chemical vapor deposition enables a chemical reaction to be carried out at a quite low temperature; a completely conformal polymer film is grown at the surface of a base material so that the defect of holes formed due to the plasma enhanced chemical vapor deposition can be made up for and the device is further separated from air; the OLED display device is packaged so that penetration of a water oxygen atmosphere is isolated, each function layer and the cathode of an OLED can be effectively prevented from reacting with such components in air as water, oxygen and the like, and at the same time, an OLED display layer is protected; and the life of a product is prolonged. Therefore, the sealing technology provided by the invention has quite large market prospect and a very high economic value.
Description
Technical field
The invention belongs to OLED manufacture field, be specifically related to a kind of sealing technology of OLED display device.
Background technology
Organic electroluminescent LED (OrganicLight-EmittingDiodes, be called for short OLED) all solid state, active illuminating, high brightness, high-contrast, ultra-thin and ultra-light, the low cost that have, low-power consumption, without characteristics such as angle limitations, operating temperature range are wide, and can be produced on flexibility, light, durable plastic base, can realize Flexible Displays truly, be can meet people to future device requirement technology.
Useful life of OLED is the bottleneck of restriction OLED industry development, and the factor affecting OLED useful life is a lot, has physical factor, as device architecture, and drives mode etc.; Also chemical factor is had, as the oxidation of metallic cathode, the crystallization etc. of organic material.Although the failure mechanism of people to OLED also imperfectly understands, the existence having many results of study to indicate OLED internal steam is the life-span principal element affecting OLED.Therefore, provide a kind of and improve highly dense property, have produced film protection, can extend the technique in the life-span of OLED display device, be the current instant thing in this field.
Summary of the invention
For this reason, technical problem to be solved by this invention is that the single encapsulation overcome in conventional package technique can not meet the technical bottleneck of the seal request of OLED display, thus proposes a kind of sealing technology improving the OLED display device in useful life.
For solving the problems of the technologies described above, the sealing technology disclosing a kind of OLED display device of the present invention, described technique comprises the steps: first to carry out plasma enhanced chemical vapor deposition to OLED display device, and then the encapsulation of row organic polymer.
The sealing technology of described OLED display device, wherein, described plasma enhanced chemical vapor deposition step is:
A, import OLED display device into plasma enhanced chemical vapor deposition reaction chamber under vacuum;
B, plasma enhancing chemical vapour deposition (CVD) is carried out vacuum and is taken out in advance;
The OLED display device that C, plasma strengthen in chemical vapour deposition reaction chamber carries out prerinse;
The OLED display device that D, plasma strengthen in chemical vapour deposition reaction chamber carries out plasma enhanced chemical vapor deposition reaction;
The sealing technology of described OLED display device, wherein, also comprises plasma and strengthens chemical vapour deposition (CVD) and carry out vacuum and take out after described step D.
The sealing technology of described OLED display device, wherein, it is 5 minutes that described vacuum is found time again, vacuum to pressure lower than 2*10
-3pa.
The sealing technology of described OLED display device, wherein, described plasma enhanced chemical vapor deposition reaction is: SiHx+N
2o+NH
3→ SiON
x+ H
2+ N
2.
The sealing technology of the OLED display device described in any one, wherein, the vacuum condition in described steps A is 4*10
-2pa.
The sealing technology of the OLED display device described in any one, wherein, the vacuum in described step B is evacuated to pressure in advance lower than 2*10
-3pa.
The sealing technology of the OLED display device described in any one, wherein, the prerinse condition in described step C is: with the N of 700sccm
2o, at 1Torr, 40Watts, carries out prerinse 1 minute under the temperature conditions of 180 DEG C.
The sealing technology of the OLED display device described in any one, wherein, the plasma enhanced chemical vapor deposition reaction condition in described step D is: use 50sccmSiH
4, 156sccmN
2o, 2000sccmN
2, 2Torr, 80Watts, 180 DEG C of temperature.
The sealing technology of the OLED display device described in any one, wherein, described organic polymer encapsulation step is: in material boat, add paraxylene, then the vaporization chamber of reaction chamber is put into, enter cracking room cracking through evaporation control and generate stable activated monomer, flow through shunt again and enter settling chamber, at room temperature deposit, form parylene film layer in adsorption polymerization.
Technique scheme of the present invention has the following advantages compared to existing technology, and what technique of the present invention the was good single encapsulation solved in existing technique can not meet the encapsulation requirement of OLED display; Plasma enhanced chemical vapor deposition (PECVD) in the present invention, the activity that make use of plasma promotes reaction, and chemical reaction can be carried out at a lower temperature; Organic polymer (CVD) in the present invention is then the thin polymer film (i.e. the complementary rete of silicon oxynitride film) being gone out to apply completely shape by active small molecular at substrate surface " growth ", the porosity defects that plasma enhanced chemical vapor deposition (PECVD) encapsulation is formed can be made up, thus further device and air are separated, OLED display device is encapsulated, thus the infiltration of exclusion of water oxygen atmosphere, can effectively prevent the composition such as water, oxygen in each functional layer of OLED and negative electrode and air from reacting, simultaneously for OLED display layer provides protection; Improve the life-span of product.Therefore there is great market prospects and economic worth.
Embodiment
Embodiment 1 present embodiment discloses a kind of technique, and described technique concrete steps are as follows:
1, plasma enhanced chemical vapor deposition (PECVD) is carried out to OLED display device:
A, by the OLED display device for preparing at vacuum condition (4*10
-2pa) plasma enhanced chemical vapor deposition (PECVD) reaction chamber is imported under into,
B, then carry out vacuum and take out 5 minutes in advance, guarantee that low vacuum is in 2*10
-3pa;
C, the plasma device strengthened in chemical vapour deposition (CVD) (PECVD) reaction chamber uses the N of 700sccm
2o, at 1Torr, 40Watts, carries out prerinse one minute under 180 DEG C of conditions.
The device that D, plasma strengthen in chemical vapour deposition (CVD) (PECVD) reaction chamber uses 50sccmSiH
4, 156sccmN
2o, 2000sccmN
2, at 2Torr, 80Watts, carry out plasma enhanced chemical vapor deposition (PECVD) reaction under 180 DEG C of conditions, produce and react as follows: SiH
4+ N
2o+NH
3→ SiON
x(+H
2+ N
2);
E, plasma enhancing chemical vapour deposition (CVD) (PECVD) carry out vacuum and take out 5 minutes again, guarantee that low vacuum is in 2*10
-3pa;
2, organic polymer (CVD) encapsulation is carried out to the OLED display device of having carried out plasma enhanced chemical vapor deposition (PECVD):
In material boat, place paraxylene raw material put into vaporization chamber by door, enter cracking room cracking through evaporation control and generate stable activated monomer, flow through shunt again and enter settling chamber, at room temperature deposit, be adsorbed on the product surface be placed in product shelves instantaneously and be polymerized to parylene film layer, be i.e. organic polymer (CVD) film.
Described material boat is used for holding paraxylene, and time it plays evaporation, the effect of container, can remove material boat together with heels after technique completes, and can feed in raw material after the cleaning of material boat again; Material boat material can adopt stainless steel or titanium; Material boat placement location is positioned at the setting stationary temperature of vaporization chamber.
MULTILAYER COMPOSITE packaging technology of the present invention wherein, combines two kinds of OLED encapsulating structures, and by mutual complementation, good solves single encapsulating structure indeterminable OLED sealing effectiveness problem.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (10)
1. a sealing technology for OLED display device, is characterized in that, described technique comprises the steps:
First plasma enhanced chemical vapor deposition is carried out to OLED display device, and then the encapsulation of row organic polymer.
2. the sealing technology of OLED display device as claimed in claim 1, it is characterized in that, described plasma enhanced chemical vapor deposition step is:
A, import OLED display device into plasma enhanced chemical vapor deposition reaction chamber under vacuum;
B, plasma enhancing chemical vapour deposition (CVD) is carried out vacuum and is taken out in advance;
The OLED display device that C, plasma strengthen in chemical vapour deposition reaction chamber carries out prerinse;
The OLED display device that D, plasma strengthen in chemical vapour deposition reaction chamber carries out plasma enhanced chemical vapor deposition reaction.
3. the sealing technology of OLED display device as claimed in claim 2, is characterized in that, also comprises plasma and strengthen chemical vapour deposition (CVD) and carry out vacuum and take out after described step D.
4. the sealing technology of OLED display device as claimed in claim 3, it is characterized in that, it is 5 minutes that described vacuum is found time again, vacuum to pressure lower than 2*10
-3pa.
5. as right wants the sealing technology of the OLED display device as described in 4, it is characterized in that, in described step D, plasma enhancing chemical vapour deposition reaction is: SiHx+N
2o+NH
3→ SiON
x+ H
2+ N
2.
6. the sealing technology of the OLED display device as described in any one of claim 2-5, is characterized in that, the vacuum condition in described steps A is 4*10
-2pa.
7. the sealing technology of the OLED display device as described in any one of claim 2-5, is characterized in that, the vacuum in described step B is evacuated to pressure in advance lower than 2*10
-3pa.
8. the sealing technology of the OLED display device as described in any one of claim 2-5, is characterized in that, the prerinse condition in described step C is: with the N of 700sccm
2o, at 1Torr, 40Watts, carries out prerinse 1 minute under the temperature conditions of 180 DEG C.
9. the sealing technology of the OLED display device as described in any one of claim 2-5, is characterized in that, the plasma enhanced chemical vapor deposition reaction condition in described step D is: use 50sccmSiH
4, 156sccmN
2o, 2000sccmN
2, 2Torr, 80Watts, 180 DEG C of temperature.
10. the sealing technology of the OLED display device as described in any one of claim 1-5, it is characterized in that, described organic polymer encapsulation step is: in material boat, add paraxylene, then the vaporization chamber of reaction chamber is put into, enter cracking room cracking through evaporation control and generate stable activated monomer, flow through shunt again and enter settling chamber, at room temperature deposit, form parylene film layer in adsorption polymerization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510514483.1A CN105206764A (en) | 2015-08-20 | 2015-08-20 | Sealing technology of OLED display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510514483.1A CN105206764A (en) | 2015-08-20 | 2015-08-20 | Sealing technology of OLED display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105206764A true CN105206764A (en) | 2015-12-30 |
Family
ID=54954311
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510514483.1A Pending CN105206764A (en) | 2015-08-20 | 2015-08-20 | Sealing technology of OLED display device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347265A (en) * | 2001-06-14 | 2002-05-01 | 中国科学院上海冶金研究所 | Protecting film of organic luminescent device and its packaging method |
| CN103022256A (en) * | 2012-12-27 | 2013-04-03 | 中利腾晖光伏科技有限公司 | Solar crystalline silicon cell film coating method |
| CN103155203A (en) * | 2010-10-12 | 2013-06-12 | 皇家飞利浦电子股份有限公司 | Organic electronic device with encapsulation |
| CN203165953U (en) * | 2013-04-19 | 2013-08-28 | 云南北方奥雷德光电科技股份有限公司 | Sealed structure of OLED device |
| CN104659150A (en) * | 2015-02-09 | 2015-05-27 | 浙江晶科能源有限公司 | Preparation method of crystalline silicon solar battery multi-layer antireflection film |
-
2015
- 2015-08-20 CN CN201510514483.1A patent/CN105206764A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347265A (en) * | 2001-06-14 | 2002-05-01 | 中国科学院上海冶金研究所 | Protecting film of organic luminescent device and its packaging method |
| CN103155203A (en) * | 2010-10-12 | 2013-06-12 | 皇家飞利浦电子股份有限公司 | Organic electronic device with encapsulation |
| CN103022256A (en) * | 2012-12-27 | 2013-04-03 | 中利腾晖光伏科技有限公司 | Solar crystalline silicon cell film coating method |
| CN203165953U (en) * | 2013-04-19 | 2013-08-28 | 云南北方奥雷德光电科技股份有限公司 | Sealed structure of OLED device |
| CN104659150A (en) * | 2015-02-09 | 2015-05-27 | 浙江晶科能源有限公司 | Preparation method of crystalline silicon solar battery multi-layer antireflection film |
Non-Patent Citations (1)
| Title |
|---|
| 何爵爷3: "PECVD原理与工艺", 《百度文库》 * |
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Effective date of registration: 20160913 Address after: 518131 Guangdong Province, Shenzhen city Longhua District streets Minzhi Avenue Tao technology exhibition building block A room 1703 Applicant after: Shenzhen Zhonghe Technology Co., Ltd. Address before: 518000, Shenzhen Yantian District, Guangdong Province, Sha Tau Kok Street Industrial Street East, Yantian International Creative port 2 5E Applicant before: SHENZHEN XINGHUO HUIHUANG SYSTEM ENGINEERING CO., LTD. |
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