CN105199296A - Preparation method of resin gel for producing copper-clad plate - Google Patents
Preparation method of resin gel for producing copper-clad plate Download PDFInfo
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- CN105199296A CN105199296A CN201510553927.2A CN201510553927A CN105199296A CN 105199296 A CN105199296 A CN 105199296A CN 201510553927 A CN201510553927 A CN 201510553927A CN 105199296 A CN105199296 A CN 105199296A
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- resin
- clad plate
- preparation
- copper
- polyphenylene oxide
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Abstract
The invention discloses a preparation method of resin gel for producing a copper-clad plate. The method is characterized in that resin gel is prepared from methylbenzene, allyl bisphenol A, polyphenyl ether, benzoyl peroxide, trially cyanate ester, dicumyl peroxide and decabrominated dipheny ethane according to the weight ratio of 300-320 to 1.5 to 90-95 to 2.32 to 17.42-17.5 to 49.9-51 to 15.6-15.8. Polyphenyl ether resin is thermoplastic resin and has quite high glass conversion temperature (260 DEG C), the thermal resistance of polyphenyl ether resin is equivalent to that of polyimide resin, and therefore it is ensured that polyphenyl ether resin can be applied in the severe environment with quite high thermal resistance requirement.
Description
Technical field
The present invention relates to a kind of preparation method of the resin adhesive liquid for the production of copper-clad plate, particularly relate to the copper-clad plate of specific inductivity 3.4 high frequency microwave.
Background technology
The copper-clad plate of specific inductivity 3.4 high frequency microwave is high information quantity transmission, the base mateiral of communication, be also one of necessary material, it is by the matrix material of the woven fiber glass prepreg of dipping low-k resin polyphenylene oxide, high-performance that Copper Foil is composited through high pressure-temperature, high technology content.
The resin system that can be used in high frequency communications field has polytetrafluoroethylene (PTFE), polyphenylene oxide, cyanate ester resin, and domestic and international currently available products is mainly based on PTFE and polyphenylene oxide resin system.High-frequency copper-clad plate now on sale is both at home and abroad mainly based on teflon resin matrix, but PTFE resin matrix has very large defect to be namely that wiring board makes metallization process complexity in hole when, qualification rate is low, critical defect be metallic copper and hole wall poor adhesive force, easily come off, thus in causing hole circuit disconnect.
Summary of the invention
The object of this invention is to provide a kind of preparation method of the resin adhesive liquid for the production of copper-clad plate.
The technical solution used in the present invention is: for the production of the preparation method of the resin adhesive liquid of copper-clad plate, comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE, described each component ratio is by weight:
300-320：1.5：90-95：2.32：17.42-17.5：49.9-51：15.6-15.8；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; After solution temperature being warming up to 100 DEG C, insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 100 DEG C, continues reaction 1 hour; After completing the reaction times, immediately resin temperature is cooled to less than 70 DEG C; Finally add composite flame-retardant agent TDE, stir, this resin adhesive liquid namely made.
Optimize, toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE, described each component ratio is by weight:
310：1.5：92：2.32：17.45：50.2：15.7。
The invention has the beneficial effects as follows: polyphenylene oxide resin is thermoplastic resin, but there is very high glass transition temp (260 DEG C), thermotolerance is suitable with polyimide resin, thus ensure that it can be applied in the very high severe environment of heat resistant requirements, this advantage is unique in Dielectric Materials at Radio Frequencies, compared with this tetrafluoroethylene high frequency material more with application (Tg value 25 DEG C), advantages.
Embodiment
Embodiment 1:
For the production of the preparation method of the resin adhesive liquid of copper-clad plate, comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE, described each component ratio is by weight:
300：1.5：90：2.32：17.42：49.9：15.6；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; After solution temperature being warming up to 100 DEG C, insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 100 DEG C, continues reaction 1 hour; After completing the reaction times, immediately resin temperature is cooled to less than 70 DEG C; Finally add composite flame-retardant agent TDE, stir, this resin adhesive liquid namely made.
Pitch control index: gelation time: 125 ± 15 seconds
Viscosity: 21 ± 4 seconds
Solids content: 51 ± 3%.
Embodiment 2:
For the production of the preparation method of the resin adhesive liquid of copper-clad plate, comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE, described each component ratio is by weight:
320：1.5：95：2.32：17.5：51：15.8；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; After solution temperature being warming up to 100 DEG C, insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 100 DEG C, continues reaction 1 hour; After completing the reaction times, immediately resin temperature is cooled to less than 70 DEG C; Finally add composite flame-retardant agent TDE, stir, this resin adhesive liquid namely made.
Pitch control index: gelation time: 125 ± 15 seconds
Viscosity: 21 ± 4 seconds
Solids content: 51 ± 3%.
Embodiment 3:
For the production of the preparation method of the resin adhesive liquid of copper-clad plate, comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE, described each component ratio is by weight:
310：1.5：92：2.32：17.46：50：15.65；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; After solution temperature being warming up to 100 DEG C, insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 100 DEG C, continues reaction 1 hour; After completing the reaction times, immediately resin temperature is cooled to less than 70 DEG C; Finally add composite flame-retardant agent TDE, stir, this resin adhesive liquid namely made.
Pitch control index: gelation time: 125 ± 15 seconds
Viscosity: 21 ± 4 seconds
Solids content: 51 ± 3%.
Above embodiments of the present invention are described, but the invention is not restricted to above-mentioned embodiment, in the ken that art those of ordinary skill possesses, can also make a variety of changes under the prerequisite not departing from present inventive concept.
Claims (2)
1. for the production of the preparation method of the resin adhesive liquid of copper-clad plate, it is characterized in that: comprise toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE, described each component ratio is by weight:
300-320：1.5：90-95：2.32：17.42-17.5：49.9-51：15.6-15.8；
First dissolve polyphenylene oxide and benzoyl peroxide with toluene, after mixing, add allyl group dihydroxyphenyl propane; After solution temperature being warming up to 100 DEG C, insulation reaction one hour; Then add dicumyl peroxide and triallyl cyanate, temperature remains on 100 DEG C, continues reaction 1 hour; After completing the reaction times, immediately resin temperature is cooled to less than 70 DEG C; Finally add composite flame-retardant agent TDE, stir, this resin adhesive liquid namely made.
2. the preparation method of the resin adhesive liquid for the production of copper-clad plate according to claim 1, is characterized in that:
Toluene, allyl group dihydroxyphenyl propane, polyphenylene oxide, benzoyl peroxide, triallyl cyanate, dicumyl peroxide, TDE, described each component ratio is by weight:
310：1.5：92：2.32：17.45：50.2：15.7。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510553927.2A CN105199296A (en) | 2015-09-02 | 2015-09-02 | Preparation method of resin gel for producing copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510553927.2A CN105199296A (en) | 2015-09-02 | 2015-09-02 | Preparation method of resin gel for producing copper-clad plate |
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| CN105199296A true CN105199296A (en) | 2015-12-30 |
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| CN201510553927.2A Pending CN105199296A (en) | 2015-09-02 | 2015-09-02 | Preparation method of resin gel for producing copper-clad plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023181838A1 (en) * | 2022-03-24 | 2023-09-28 | 本州化学工業株式会社 | Composition for resin starting material, organic solvent solution, curable resin composition, varnish, prepreg, and cured product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0382312B1 (en) * | 1989-02-08 | 1995-07-12 | Asahi Kasei Kogyo Kabushiki Kaisha | A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| CN103102484A (en) * | 2013-01-22 | 2013-05-15 | 广东生益科技股份有限公司 | Crosslinkable polyphenyl ether resin, preparation method and use thereof |
| CN103834155A (en) * | 2014-03-18 | 2014-06-04 | 铜陵浩荣电子科技有限公司 | Preparation method of resin glue liquid for producing high-frequency copper-clad plate |
| CN103865221A (en) * | 2014-03-18 | 2014-06-18 | 铜陵浩荣电子科技有限公司 | Method for preparing high-temperature-resistant high-frequency copper-clad plate resin adhesive liquid |
-
2015
- 2015-09-02 CN CN201510553927.2A patent/CN105199296A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0382312B1 (en) * | 1989-02-08 | 1995-07-12 | Asahi Kasei Kogyo Kabushiki Kaisha | A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| CN103102484A (en) * | 2013-01-22 | 2013-05-15 | 广东生益科技股份有限公司 | Crosslinkable polyphenyl ether resin, preparation method and use thereof |
| CN103834155A (en) * | 2014-03-18 | 2014-06-04 | 铜陵浩荣电子科技有限公司 | Preparation method of resin glue liquid for producing high-frequency copper-clad plate |
| CN103865221A (en) * | 2014-03-18 | 2014-06-18 | 铜陵浩荣电子科技有限公司 | Method for preparing high-temperature-resistant high-frequency copper-clad plate resin adhesive liquid |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023181838A1 (en) * | 2022-03-24 | 2023-09-28 | 本州化学工業株式会社 | Composition for resin starting material, organic solvent solution, curable resin composition, varnish, prepreg, and cured product |
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Application publication date: 20151230 |