CN105185750B - A kind of power module sealing device - Google Patents
A kind of power module sealing device Download PDFInfo
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- CN105185750B CN105185750B CN201510559090.2A CN201510559090A CN105185750B CN 105185750 B CN105185750 B CN 105185750B CN 201510559090 A CN201510559090 A CN 201510559090A CN 105185750 B CN105185750 B CN 105185750B
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- shell
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- power module
- sealing ring
- hook
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Abstract
The present invention provides a kind of power module sealing device, shell (1) and substrate (2) including supporting power module；The shell (1) is fixedly connected with the substrate (2)；The shell (1) and the substrate (2) contact position have sealing ring (3)；The shell (1) and the substrate (2) compress the sealing ring (3).By the way that sealing ring is arranged between shell and substrate, sealing ring is compressed using shell and substrate and forms the sealing structure for preventing liquid-state silicon gel from leaking.Relative to the seal form of conventionally employed shell glue, the processing is simple for this sealing structure, not will receive the influence of subsequent operation process, and sealing effect is more preferable.
Description
Technical field
The present invention relates to high-power semiconductor module encapsulation technology field, in particular to a kind of power module sealing device.
Background technique
Insulated gate bipolar transistor (high-power height such as (Insulated Gate Bipolar Transistor, IGBT)
Die block is widely used in high voltage supply field.Since the larger module of its power needs to have good insulated enclosure characteristic.For
This, the silicone filler method that the prior art generally uses insulating properties excellent realizes the sealing of IGBT power module.It is specifically sealed
Process is as follows: shell and substrate form the seal cavity structure for accommodating silica gel, and IGBT is by being fixedly welded on above substrate, by outer
Shell provides filling silica gel in mechanical support shell and base plate seals cavity, provides insulation protection by silica gel.Due to liquid-state silicon gel
In the presence of the leakproofness demand of shell and substrate is very high.Existing shell is fixedly connected solid using point glue sticking and screw with substrate
Surely the mode combined in outer casing bottom even spread liquid shell glue and is pressed together on substrate, utilizes the screw hole on shell
It is fixed with substrate, it is finally heated so that shell adhesive curing forms sealing.By the way of the sealed connection of shell glue, there is many lack
Point: firstly, enclosure bottom and substrate surface are generally plane, it is pressed most liquid shell glue during shell glue and substrate
Outer side of shell can be spilt into, the remaining shell glue of contact surface is caused to reduce；Secondly, shell is the hygroscopic materials such as nylon, moisture absorption
Bonding shell glue reheats vapor evaporation afterwards can leave a large amount of cavities in shell glue；Again, to sealing after adhesive curing
Device also needs to start the cleaning processing the filling silica gel of ability, and under vacuum pressure effect, shell glue can be washed brokenly vacuum cleaned；With
The cavity of upper formation can make filling silica gel leak, and affect the appearance and product quality of power module.Meanwhile shell dispensing
Process itself is sufficiently complex, and reliability is lower, needs by dispensing, assembling and solidification three step greatly.Dispensing amount is more difficult to control, holds
Easily there is plastic emitting non-uniform phenomenon, glue may excessively influence the cleannes of substrate, and it is toxic that shell glue can volatilize methanol etc.
Gas, and shell adhesive curing process high temperature will lead to IMC layers of change in IGBT, influence the reliability of IGBT.
Summary of the invention
To substitute, the sealing that existing shell and base plate seals are had using sealant sealing is insecure, production technology is complicated
The problem of, the present invention provides a kind of new power module sealing devices.
The present invention provides a kind of power module sealing device, shell and substrate including supporting power module；The shell
It is fixedly connected with the substrate；The shell and the substrate contact position have sealing ring；The shell and the substrate compress
The sealing ring.
By the way that sealing ring is arranged between shell and substrate, compressing sealing ring formation using shell and substrate prevents liquid-state silicon gel
The sealing structure of leakage.Relative to the seal form of conventionally employed shell glue, the processing is simple for this sealing structure, not will receive after
The influence of continuous operational sequence, sealing effect are more preferable.
Optionally, the latch groove on the shell and/or the substrate also with sealing ring described in grafting.
It is arranged that sealing ring can be fixed on shell by latch groove and the junction of substrate squeezes sealing again, convenient for consolidating for sealing ring
It is fixed.
Optionally, the section of the sealing ring is cylindrical or T font.
Optionally, the free end of the shell and the substrate is respectively provided with mutually matched protrusion and groove；It is described convex
It rises and the groove is clamped.
Optionally, the groove is hook slot；The protrusion is hook protrusion；The hook end of the hook protrusion has bullet
Property component compresses the hook protrusion and is clamped the hook slot.
Optionally, the hook slot is T-slot.
Optionally, the elastomeric element of the hook protrusion is Elastic buckle.
Optionally, the elastomeric element is spring；The telescopic direction of the spring is perpendicular to the shell extending direction.
Hook slot and the elastic bumps with the cooperation of hook slot are set, are lockked using the elastic deformation characteristic of elastic bumps
Hook slot and elastic bumps fast implement the connection of shell and substrate, are not necessarily to operation bidirectional.
Optionally, the groove and the raised junction have shell glue.
Optionally, the shell is directly connected and fixed with the substrate by screw.
Detailed description of the invention
Fig. 1 is power module of embodiment of the present invention sealing device schematic cross-section.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, in the following with reference to the drawings and specific embodiments
The present invention is described in further detail.
If existing design structure is identical, power module sealing device provided in an embodiment of the present invention has substrate 2 and shell
1, substrate 2 and shell 1 are tightly connected the sealing structure for foring and accommodating power module insulating silica gel, and shell 1 connects power mould
Block plays support protective effect.
Fig. 1 is power module of embodiment of the present invention sealing device schematic cross-section, and wherein substrate 2 and shell 1 have engaged
Together.As seen from Figure 1, in order to avoid using shell glue bring to pollute and heating process problem, in the present embodiment
The inside of shell 1 and substrate 2 is provided with sealing ring 3, is formed and is sealed using sealing ring 3.After groove 21 and protrusion 11 cooperate, base
Plate 2 and shell 1 compress sealing ring 3 and form sealing structure.The common sealing material such as resin rubber can be used in sealing ring 3, can also adopt
With tetrafluoroethene sealing ring 3.
During the installation process, sealing ring 3 may be extruded the two junction due to the squeezing action of shell 1 and substrate 2.For
Better fixed seal ring 3, can be arranged 22 fixed seal ring 3 of latch groove of positioning on shell 1 or substrate 2.In the present embodiment
Latch groove 22 setting on a substrate 2, in other embodiments its may also be arranged on shell 1, or both be respectively provided with docking
Latch groove 22.
Because needing that sealing ring 3 is mounted in latch groove 22, it is T-type structure or L-type knot that section, which can be set, in sealing ring 3
Structure.Certainly, it can also be provided directly as traditional cylinder or square cross, as long as can fill in latch groove i.e.
It can.
To realize that shell 1 compresses sealing ring 3 with being fixedly connected for substrate 2, there is hook protrusion, on a substrate 2 on shell 1
With hook slot, hook protrusion and hook slot have cooperatively formed fixed connection structure and have sealed.Hook slot in the present embodiment is L
Type groove, hook protrusion are also L-type protrusion 11.
In order to enable hook protrusion is inserted into the opening to hook slot and is connected in hook slot, the hook of hook protrusion
End has elastomeric element, and hook protrusion can be compressed when making at the external opening in installation by hook slot.To realize that hook is convex
The compression property risen, in the free end of hook protrusion provided with spring in the present embodiment, the telescopic direction of spring is perpendicular to shell 1
The free end of hook protrusion is arranged in extending direction, that is, spring.Certainly, elastomeric element can also be other types, such as directly
Connect the Elastic buckle formed using the self-deformation of hook protrusion.It should be it is contemplated that hook slot formed above and hook be convex
Sealing can be formed to a certain extent by playing connection, be can be applied to filling silica gel and carried out the cured seal request of silica gel again.
Power module sealing device protrusions 11 in the present embodiment described above are arranged on shell 1, groove 21 is arranged
On a substrate 2；It is contemplated that, protrusion 11 may also set up on a substrate 2, groove 21 be arranged on shell 1.Described in another front
The namely hook slot of groove 21 is L-type, can also be set to T-type in other embodiments, as long as meeting its corresponding hook
Locking function, corresponding elastomeric element should also be arranged to bi-directional configuration.
Further, it is envisioned that shell glue is loaded in groove 21 and the sealant that is heating and curing can also form sealing structure,
The stability for guaranteeing connection, can more preferably realize the connection sealing effect of shell 1 and groove 21.Certainly, consider that shell glue has one
It volatilizees toxic gas in fixed toxicity, high temperature cure process and hot setting is the IMC layer of breakdown power module, can also be not provided with
Shell glue.
It should be noted that above-described groove 21, latch groove 22 should be ring structure, being fixedly connected for surrounding is formed
And sealing structure.In addition, a kind of above form for only realizing that sealing ring 3 is compressed using protrusion and the connection type of groove, also
Mode can be connected by screw to shell 1 is fixed on a substrate 2, compress sealing ring 3.
Simple explanation is done with regard to the sealing process of the power module sealing device in the embodiment of the present invention below, so as to
The apparent understanding embodiment of the present invention.Firstly, installing sealing ring 3 in the latch groove 22 of substrate 2 and being adjacent to sealing ring 3
On a substrate 2；Secondly, spring is through overcompression and restores shape by the hook slot of the hook protrusion insertion substrate 2 of 1 bottom of shell
So that shell 1 and substrate 2, which connect and compress sealing ring 3, forms sealing structure；Cleaning treatment then is continued to sealing structure；
Last encapsulating liquid-state silicon gel and installation power module.It is contemplated that not having during cleaning treatment to the sealing function of sealing ring 3
It is too many to influence；Even if liquid-state silicon gel is broken through sealing ring 3 and is flowed out, it is also desirable to by the groove 21 on substrate 2, such sealing structure
It can preferably guarantee the reliability of sealing.
The power module sealing device in the embodiment of the present invention is described in detail above.Specific is applied herein
Principle and implementation of the present invention are described for example, and it is of the invention that the above embodiments are only used to help understand
Core concept, without departing from the principles of the present invention, can also several improvements and modifications are made to the present invention, these improve and
Modification is also fallen within the scope of the present invention.
Claims (9)
1. a kind of power module sealing device, shell (1) and substrate (2) including supporting power module；The shell and described
Substrate is fixedly connected；It is characterized by: the shell and the substrate contact position have sealing ring (3)；The shell (1) and institute
It states substrate (2) and compresses the sealing ring (3)；
Latch groove (22) on the shell (1) and/or the substrate (2) also with sealing ring (3) described in grafting；
During the installation process, the shell (1) and the substrate (2) mutual extrusion, and the sealing ring (3) are squeezed out outside described
The junction of shell (1) and the substrate (2)；Preferably to fix the sealing ring (3), in the shell (1) or the substrate
(2) the fixed sealing ring (3) of latch groove (22) of positioning is set on.
2. power module sealing device according to claim 1, it is characterised in that: sealing ring (3) section is cylinder
Shape or T font.
3. -2 described in any item power module sealing devices according to claim 1, it is characterised in that: the shell (1) and institute
The free end for stating substrate (2) is respectively provided with mutually matched raised (11) and groove (21)；The protrusion (11) and the groove
(21) it is clamped.
4. power module sealing device according to claim 3, it is characterised in that: the groove (21) is hook slot；Institute
Stating raised (11) is hook protrusion；There is elastomeric element the hook protrusion to be made to be compressed and be blocked at the hook end of the hook protrusion
Connect the hook slot.
5. power module sealing device according to claim 4, it is characterised in that: the hook slot is T-slot.
6. power module sealing device according to claim 5, it is characterised in that: the elastomeric element of the hook protrusion is
Elastic buckle.
7. power module sealing device according to claim 5, it is characterised in that: the elastomeric element is spring；It is described
The telescopic direction of spring is perpendicular to the shell (1) extending direction.
8. power module sealing device according to claim 3, it is characterised in that: the groove (21) and the protrusion
(11) junction has shell glue.
9. -2 described in any item power module sealing devices according to claim 1, it is characterised in that: the shell (1) passes through
Screw is directly connected and fixed with the substrate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510559090.2A CN105185750B (en) | 2015-09-06 | 2015-09-06 | A kind of power module sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510559090.2A CN105185750B (en) | 2015-09-06 | 2015-09-06 | A kind of power module sealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105185750A CN105185750A (en) | 2015-12-23 |
| CN105185750B true CN105185750B (en) | 2019-01-25 |
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ID=54907742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510559090.2A Active CN105185750B (en) | 2015-09-06 | 2015-09-06 | A kind of power module sealing device |
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| Country | Link |
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| CN (1) | CN105185750B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816911A (en) * | 2003-07-04 | 2006-08-09 | 西门子公司 | Electronic power module comprising a rubber seal and corresponding production method |
| CN1819111A (en) * | 2000-02-15 | 2006-08-16 | 株式会社日立制作所 | Semiconductor device fabrication method and semiconductor device fabrication device |
| DE102005036105B3 (en) * | 2005-08-01 | 2006-11-16 | Semikron Elektronik Gmbh & Co. Kg | Electrical component e.g. insulated gate bipolar transistor module, has knob projecting from base surface of bus bar, and fastening unit provided for fixed connection contacting of external bus bar unit to contact surface of knob |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK176137B1 (en) * | 2003-10-27 | 2006-09-25 | Danfoss Silicon Power Gmbh | Flow distribution unit and cooling unit with bypass flow |
| US20100091477A1 (en) * | 2008-10-14 | 2010-04-15 | Kabushiki Kaisha Toshiba | Package, and fabrication method for the package |
-
2015
- 2015-09-06 CN CN201510559090.2A patent/CN105185750B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1819111A (en) * | 2000-02-15 | 2006-08-16 | 株式会社日立制作所 | Semiconductor device fabrication method and semiconductor device fabrication device |
| CN1816911A (en) * | 2003-07-04 | 2006-08-09 | 西门子公司 | Electronic power module comprising a rubber seal and corresponding production method |
| DE102005036105B3 (en) * | 2005-08-01 | 2006-11-16 | Semikron Elektronik Gmbh & Co. Kg | Electrical component e.g. insulated gate bipolar transistor module, has knob projecting from base surface of bus bar, and fastening unit provided for fixed connection contacting of external bus bar unit to contact surface of knob |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105185750A (en) | 2015-12-23 |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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Effective date of registration: 20201010 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |