CN105172000A - Universal three-electrode conductance cell integrated forming die and using method - Google Patents
Universal three-electrode conductance cell integrated forming die and using method Download PDFInfo
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- CN105172000A CN105172000A CN201510494186.5A CN201510494186A CN105172000A CN 105172000 A CN105172000 A CN 105172000A CN 201510494186 A CN201510494186 A CN 201510494186A CN 105172000 A CN105172000 A CN 105172000A
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- slide block
- conductance cell
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- mould
- controlled slide
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Abstract
The invention provides a universal three-electrode conductance cell integrated forming die. The universal three-electrode conductance cell integrated forming die comprises a die body, a positioning and sealing plugs, glue filling grooves, positioning pin holes, connecting holes and controllable sliding blocks. The die body comprises two symmetrical die parts. The controllable sliding blocks are connected with the two die parts in a sliding mode respectively through bolts. Grooves are formed in the upper portions of the controllable sliding blocks. The positioning and sealing plugs are used for fixing a conductance cell tube. The positioning and sealing plug at one end is in the shape that the upper portion of the positioning and sealing plug is round and the lower portion of the positioning and sealing plug is square, is assembled at the groove formed in the corresponding controllable sliding block and is connected with the corresponding controllable sliding block in a matched mode. The positioning and sealing plug at the other end is cylindrical. The glue filling grooves are formed in the die body. The positioning pin holes are formed in the corresponding positions of the die parts. The connecting holes are formed in the two ends of each die part. An insertion groove is formed below the die parts. According to the universal three-electrode conductance cell integrated forming die, a conductance cell is integrally packaged, human factors are reduced, the packaging process is simplified, the packaging dimension is guaranteed, the manufacturing cycle is greatly shortened, and production efficiency is improved.
Description
Technical field
The invention belongs to conductance cell mould field, especially relate to a kind of universal three electrode conductance pond integrated mould and usings method.
Background technology
In each parameter measurement in ocean, sea water conductivity measures one of seawater salinity important parameter, plays an important role to marine environment investigation research.Seawater salinity is by temperature, electrical conductivity, pressure influence, and wherein conductivity measurement uncertain factor is a lot, very large by ectocine, and considers conductance cell watertight problem in the measurement of deep-sea place, requires relatively more to this conductance cell packaging technology.
Existing conductance cell packaging technology forms in two steps:
1. first by whole for die main body left and right two parts uniform application releasing agent, again conductance cell pipe is gone between through silica gel plug, then with the stifled fixing also elastic clamping conductance cell pipe of location sealing, ensure that conductance cell pipe does not break, assign in die main body the latter half groove, silica gel plug is put in die main body left-half wire hole, cover die main body right half part, tight a bolt, encapsulating notch is in top and places, fluid sealant is poured into afterwards by glue-filling slot, after glue is dry, take off bolt, breakdown die main body, make it shaping conductance cell to be separated with die main body, take off silica gel plug, location sealing blocks up, with alcohol washes conductance cell external release agent, pruning processing is carried out to this conductance cell, so far colloid dosing technology completes.
2. by conductance cell lead-in wire through silicagel pad and conductance cell supporting plate, and in supporting plate groove uniform application silicon rubber, the conductance cell pruned is bonded on conductance cell supporting plate, and fixed with band, after one week, silicon rubber solidifies completely, and prune and make it more attractive in appearance, after this this conductance cell finished product can use.
For existing three electrode conductance pond packaging technologies, the drawback of existence: overall craft flow process is divided into two steps is comparatively loaded down with trivial details, the exhaust that in technique, if the 1st step encapsulating can not be good, can bubble be formed at die inside two ends, so that cannot encapsulating, shaping conductance cell is imperfect; In technique, the 2nd step bonds the complete conductance cell of embedding, both conductance cell and supporting plate position relationship is estimated by experience completely, require higher to operator, the conductance cell of molding bonded can be caused, height differs, uneven, brings a series of inconvenience to follow-up work, and bonding process needs one week silicon rubber setting time, causes fabrication cycle longer; The conductance cell of existing encapsulation finished product can only be applicable to a kind of conductance cell supporting plate of dimensions, and the scope of application is less.
Summary of the invention
In view of this, the present invention is intended to propose a kind of universal three electrode conductance pond integrated moulds, is solved mold gases residue problem and is encapsulated different length conductance cell by designing controlled slide block, widen mold use scope by the position changing glue-filling slot.
For achieving the above object, technical scheme of the present invention is achieved in that
A kind of universal three electrode conductance pond integrated moulds, comprise that die main body, location sealing are stifled 1, glue-filling slot 2, dowel hole 3, connecting hole 4, controlled slide block 5; Described die main body comprises two mould splits; Described controlled slide block 5 is located at the below of mould split one end, is provided with fluting above controlled slide block 5; Described mould split both sides are provided with seal groove, are wherein provided with the slide block slot placing controlled slide block 5 below the seal groove of side; Described location sealing stifled 1 is assemblied in seal groove, and for fixing conductance cell pipe 8, wherein one end location sealing stifled 1 is assemblied in controlled slide block 5 fluting place, is connected with controlled slide block 5; Described die main body has 3 glue-filling slots 2; Described two mould split corresponding positions are provided with dowel hole 3; Described two mould split two ends place is provided with connecting hole 4; Slot 7 is provided with below described mould split.
Further, described dowel hole 3 comprises 2.
Further, described mould is also provided with locating piece 6 and installs the locating piece slot of locating piece, and described locating piece 6 is close to described controlled slide block 5.
Further, described location sealing stifled 1 comprises plug and stifled post two parts, and the stifled post shapes be connected with described controlled slide block 5 is circular upper part and square lower part, and it is cylindrical that the other end blocks up post.
Relative to prior art, the universal three electrode conductance pond integrated moulds of one of the present invention have following advantage:
(1) adopt integral forming process design, eliminate bonding process, avoiding by people is the defective workmanship caused, and position is more accurate, fixing in a mold to make conductance cell pipe, substantially reduces fabrication cycle;
(2) the effective encapsulated space of mould can be regulated according to different conductance cell pallet length, expand its scope of application;
The present invention, by carrying out integrative packaging to conductance cell, decreases human factor, simplifies encapsulation process, ensure that package dimension, significantly shortens fabrication cycle, improves production efficiency.
Another object of the present invention is to propose a kind of universal three electrode conductance pond integrated mould usings method, to realize carrying out integrative packaging to conductance cell.
For achieving the above object, technical scheme of the present invention is achieved in that
Utilize universal three electrode conductance pond integrated moulds to manufacture the method for conductance cell, comprise the steps:
(1) by uniform application releasing agent inside two mould splits;
(2) conductance cell conduit saddle plate 9 to be put into below one of them mould split in slot, regulate controlled slide block 5 to fix conductance cell conduit saddle plate 9, fix conductance cell pipe 8 with location sealing stifled 1;
(3) build another mould split, tighten all the other bolts;
(4) pour into fluid sealant by glue-filling slot 2, after glue is dry, unload that bolt, location sealing are stifled 1, controlled slide block 5, conductance cell packaging technology completes.
The Dominant Facies that described a kind of universal three electrode conductance pond integrated moulds and the above-mentioned method utilizing universal three electrode conductance pond integrated moulds to manufacture conductance cell have relative to prior art is same, does not repeat them here.
Accompanying drawing explanation
The accompanying drawing forming a part of the present invention is used to provide a further understanding of the present invention, and schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the mould Split type structure schematic diagram of a kind of universal three electrode conductance pond integrated moulds described in the embodiment of the present invention;
Fig. 2 is the conductance cell finished product structure schematic diagram described in the embodiment of the present invention;
Fig. 3 is the side view of a kind of universal three electrode conductance pond integrated moulds described in the embodiment of the present invention.
Description of reference numerals:
1-location sealing blocks up, 2-glue-filling slot, 3-dowel hole, 4-connecting hole, the controlled slide block of 5-, 6-locating piece, 7-slot, 8-conductance cell pipe, 9-conductance cell conduit saddle plate, 10-silicagel pad.
Detailed description of the invention
It should be noted that, when not conflicting, the embodiment in the present invention and the feature in embodiment can combine mutually.
Below with reference to the accompanying drawings and describe the present invention in detail in conjunction with the embodiments.
As shown in Figure 1, a kind of universal three electrode conductance pond integrated moulds, comprise that die main body, location sealing are stifled 1, glue-filling slot 2, dowel hole 3, connecting hole 4, controlled slide block 5; Described die main body comprises two mould splits; Described controlled slide block 5 is located at the below of mould split one end, is provided with fluting above controlled slide block 5; Described mould split both sides are provided with seal groove, are wherein provided with the slide block slot placing controlled slide block 5 below the seal groove of side; Described location sealing stifled 1 is assemblied in seal groove, and for fixing conductance cell pipe 8, wherein one end location sealing stifled 1 is assemblied in controlled slide block 5 fluting place, is connected with controlled slide block 5; Described die main body has 3 glue-filling slots 2; Described two mould split corresponding positions are provided with dowel hole 3; Described two mould split two ends place is provided with connecting hole 4; Slot 7 is provided with below described mould split.Dowel hole 3 comprises 2.Mould is also provided with locating piece 6 and installs the locating piece slot of locating piece, and described locating piece 6 is close to described controlled slide block 5.Location sealing stifled 1 comprises plug and stifled post two parts, and the stifled post shapes be connected with described controlled slide block 5 is circular upper part and square lower part, and it is cylindrical that the other end blocks up post.
Die main body is divided into symmetrical two parts, symmetric design, entire body structure, and the two ensures position relationship by 2 alignment pins, stainless steel, and inner polishing is completely so that the demoulding; Mould adopts 3 glue-filling slots 2 to design, and the glue-filling slot 2 at two ends, for being vented balance, avoids the formation of bubble, causes finished product imperfect; Adopt mutual-inserting type to combine with conductance cell conduit saddle plate 9 and utilize original four bolts hole of supporting plate to position, ensureing conductance cell pipe encapsulation center, without other direction frees degree; Employing integral forming process designs, and directly save bonding process of the prior art, avoiding by people is the defective workmanship caused, and position is more accurate, fixing in a mold to make conductance cell pipe, and has greatly shortened fabrication cycle.
Location sealing stifled 1 is polytetrafluoro material, has good plasticity and elasticity, is assemblied in die main body two ends, and play sealing and positioning action, via design can ensure that conductance cell inner and outer air pressure difference is 0, avoids casting glue to flow into conductance cell pipe 8 inner; Seal plug shape 1 circular upper part and square lower part be wherein connected with controlled slide block 5, consistent with mould inside groove cross sectional shape, coordinate with controlled slide block 5 and regulate the effective encapsulated space of mould, opposite side location sealing stifled 1 is cylindrical, plays main positioning action, combines closely with mould.
Controlled slide block 5 is polytetrafluoro material, rectangular structure, intension M3 through hole 2, there are good plasticity and elasticity, place this controlled slide block 5 at die main body internal notches, can, according to the different effective encapsulated spaces of conductance cell conduit saddle plate 9 length adjustment mould, make its scope of application expand.
Be illustrated in figure 2 conductance cell finished product structure, comprise conductance cell pipe 8, conductance cell conduit saddle plate 9, silicagel pad 10.
The detailed process utilizing these universal three electrode conductance pond integrated moulds to manufacture conductance cell is as follows:
When these universal three electrode conductance pond integrated moulds use, first by uniform application releasing agent whole inside two mould splits, again conductance cell finished product to be put into below mould split in slot, regulate controlled slide block 5 that supporting plate is fixed, tight a bolt, then conductance cell pipe 8 contact conductor is passed string holes bottom silicagel pad 10 and conductance cell conduit saddle plate 9, conductance cell pipe is fixed afterwards with location sealing stifled 1, relax firmly in the middle of two side direction, make conductance cell pipe 8 elastic clamping, and ensure that conductance cell pipe 8 does not break, locating piece 6 is inserted in locating piece slot, fix conductance cell pipe, build another mould split, tighten all the other bolts, encapsulating notch is in top and places, fluid sealant is poured into finally by glue-filling slot 2, after glue is dry, unload bolt, location sealing stifled 1, controlled slide block 5, this conductance cell packaging technology completes, form integral hermetic between conductance cell pipe 8 and conductance cell conduit saddle plate 9.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. universal three electrode conductance pond integrated moulds, is characterized in that: comprise die main body, location sealing stifled (1), glue-filling slot (2), dowel hole (3), connecting hole (4), controlled slide block (5); Described die main body comprises two mould splits; Described controlled slide block (5) is located at the below of mould split one end, and controlled slide block (5) top is provided with fluting; Described mould split both sides are provided with seal groove, are wherein provided with the slide block slot placing controlled slide block (5) below the seal groove of side; Described location sealing stifled (1) is assemblied in seal groove, for fixing conductance cell pipe (8), wherein one end location sealing stifled (1) is assemblied in controlled slide block (5) fluting place, is connected with controlled slide block (5); Described die main body has 3 glue-filling slots (2); Described two mould split corresponding positions are provided with dowel hole (3); Described two mould split two ends place is provided with connecting hole (4); Slot (7) is provided with below described mould split.
2. the universal three electrode conductance pond integrated moulds of one according to claim 1, is characterized in that: described dowel hole (3) comprises 2.
3. the universal three electrode conductance pond integrated moulds of one according to claim 1, it is characterized in that: described mould is also provided with locating piece (6) and installs the locating piece slot of locating piece, and described locating piece (6) and described controlled slide block (5) are close to.
4. the universal three electrode conductance pond integrated moulds of one according to claim 1, it is characterized in that: described location sealing stifled (1) comprises plug and stifled post two parts, the stifled post shapes be connected with described controlled slide block (5) is circular upper part and square lower part, and it is cylindrical that the other end blocks up post.
5. universal three electrode conductance pond integrated mould usings method, is characterized in that: comprise the steps:
(1) by uniform application releasing agent inside two mould splits;
(2) conductance cell conduit saddle plate (9) to be put into below one of them mould split in slot, regulate controlled slide block (5) to fix conductance cell conduit saddle plate (9), fix conductance cell pipe (8) with location sealing stifled (1);
(3) build another mould split, tighten all the other bolts;
(4) by glue-filling slot (2) perfusion fluid sealant, after glue is dry, unload bolt, location sealing stifled (1), controlled slide block (5), conductance cell packaging technology completes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510494186.5A CN105172000B (en) | 2015-08-11 | 2015-08-11 | A kind of universal three electrode conductances pond integrated mould and application method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510494186.5A CN105172000B (en) | 2015-08-11 | 2015-08-11 | A kind of universal three electrode conductances pond integrated mould and application method |
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| CN105172000A true CN105172000A (en) | 2015-12-23 |
| CN105172000B CN105172000B (en) | 2017-09-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106863675A (en) * | 2017-01-20 | 2017-06-20 | 昆山东美自动化设备科技有限公司 | A kind of manufacturing process for cleaning dust wheel |
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| CN101214710A (en) * | 2008-01-15 | 2008-07-09 | 张家港市福音防辐射技术开发有限公司 | Method for preparing interlayer organic lead glass |
| CN201179701Y (en) * | 2007-12-29 | 2009-01-14 | 中国石化集团胜利石油管理局钻井工艺研究院 | Encapsulating compound mould for down-hole instrument circuit board |
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| CN102825695A (en) * | 2012-09-03 | 2012-12-19 | 苏州金科信汇光电科技有限公司 | Injection mould with replaceable inserts |
| CN103434059A (en) * | 2013-06-27 | 2013-12-11 | 国家电网公司 | Production mould for insulation sleeve of high-voltage direct current (DC) power transmission equipment |
| CN204820100U (en) * | 2015-08-11 | 2015-12-02 | 国家海洋技术中心 | Three electrode conductance pond integrated into one piece moulds on general type |
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2015
- 2015-08-11 CN CN201510494186.5A patent/CN105172000B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007245552A (en) * | 2006-03-16 | 2007-09-27 | Sumitomo Chemical Co Ltd | Manufacturing method of thermoplastic resin-molded product |
| CN201179701Y (en) * | 2007-12-29 | 2009-01-14 | 中国石化集团胜利石油管理局钻井工艺研究院 | Encapsulating compound mould for down-hole instrument circuit board |
| CN101214710A (en) * | 2008-01-15 | 2008-07-09 | 张家港市福音防辐射技术开发有限公司 | Method for preparing interlayer organic lead glass |
| CN201477067U (en) * | 2009-08-31 | 2010-05-19 | 宇星科技发展(深圳)有限公司 | Electrolytic cell device used for COD on-line monitoring |
| CN102825695A (en) * | 2012-09-03 | 2012-12-19 | 苏州金科信汇光电科技有限公司 | Injection mould with replaceable inserts |
| CN103434059A (en) * | 2013-06-27 | 2013-12-11 | 国家电网公司 | Production mould for insulation sleeve of high-voltage direct current (DC) power transmission equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106863675A (en) * | 2017-01-20 | 2017-06-20 | 昆山东美自动化设备科技有限公司 | A kind of manufacturing process for cleaning dust wheel |
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| CN105172000B (en) | 2017-09-19 |
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