CN204271040U - A kind of diode sealing cap mould - Google Patents
A kind of diode sealing cap mould Download PDFInfo
- Publication number
- CN204271040U CN204271040U CN201420849152.4U CN201420849152U CN204271040U CN 204271040 U CN204271040 U CN 204271040U CN 201420849152 U CN201420849152 U CN 201420849152U CN 204271040 U CN204271040 U CN 204271040U
- Authority
- CN
- China
- Prior art keywords
- mold
- bed die
- hole
- diameter
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 18
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000006835 compression Effects 0.000 abstract description 2
- 238000007906 compression Methods 0.000 abstract description 2
- 238000004513 sizing Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of diode sealing cap mould, comprise mold and bed die, the through hole one coordinated with fairlead is set on mold center line, the center line of bed die boss arranges the groove coordinated with stem, mold overlays and bed die is formed overall and is inserted in sleeve, the utility model is by upper, through hole one in bed die and groove, realize respectively being connected with the fairlead of upper cover and the stem of base and realize coordinating of mould and diode, then above-mentioned entirety is placed in sleeve, thus ensure that diode sizing in compression is accurate, the utility model theory structure is simple, easy to make, practical.
Description
Technical field
The utility model relates to a kind of diode sealing cap mould, belongs to electronic component processing and fabricating technical field.
Background technology
In the manufacturing process of present electron trade diode, the upper cover of diode and the connection of base whether firm in the quality of extreme influence diode, there is no the connection particular manufacturing craft of diode upper cover and base and the method for attachment of science in right existing technology.
Utility model content
The purpose of this utility model is: provide a kind of diode sealing cap mould, can realize the sealing cap of diode fast, to overcome the deficiencies in the prior art.
The technical solution of the utility model
A kind of diode sealing cap mould, comprise mold and bed die, on mold center line, arrange the through hole one coordinated with fairlead, the center line of bed die boss arranges the groove coordinated with stem, mold overlays and bed die is formed overall and is inserted in sleeve.
In aforesaid a kind of diode sealing cap mould, the vertical section of described mold is " convex " word structure, and the diameter of through hole one is that the fairlead external diameter of upper cover is consistent.
In aforesaid a kind of diode sealing cap mould, the vertical section of described bed die is " convex " word structure, and the diameter of groove is that the stem external diameter of base is consistent and depth of groove is greater than stem length.
In aforesaid a kind of diode sealing cap mould, described sleeve is cylindrical structure, the vertical section of the through hole two of this sleeve is " convex " word structure, wherein the top diameter of through hole two and the projection section diameter of mold consistent, the base diameter of through hole two is consistent with the base diameter of mold, bed die.
Owing to have employed technique scheme, compared with prior art, the utility model is by the through hole one in upper and lower mould and groove, realize respectively being connected with the fairlead of upper cover and the stem of base and realize coordinating of mould and diode, then above-mentioned entirety be placed in sleeve, thus ensure that diode sizing in compression is accurate, the utility model theory structure is simple, easy to make, practical.
Accompanying drawing explanation
Accompanying drawing 1 is the structural representation of the utility model middle sleeve;
Accompanying drawing 2 is the structural representation of mold in the utility model;
Accompanying drawing 3 is the structural representation of bed die in the utility model;
Accompanying drawing 4 is the structural representation of diode to be processed in the utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described in detail, but not as to any restriction of the present utility model.
Embodiment of the present utility model: a kind of diode sealing cap method; the method adopts to be inserted in the through hole one of mold and the groove of bed die by the stem of the fairlead of the upper cover of diode and base respectively; the upper cover of diode and base are fixed with mold and bed die respectively; then mold is overlayed and bed die is also formed overall and is inserted in sleeve pipe; adopt molding press synchronously to extrude upper and lower mould, after compressing, the principle of employing electric resistance welding completes the sealing cap to diode.
Wherein the vertical section of this mold is " convex " word structure, center line along mold is provided with through hole one, the diameter of through hole one is that the fairlead external diameter of upper cover is consistent, the vertical section of mould is " convex " word structure, the center line of bed die boss arranges groove, the diameter of groove is that the stem external diameter of base is consistent and depth of groove is greater than stem length, the cylindrical structure that this sleeve is made of plastics, the vertical section of the through hole two of this sleeve is " convex " word structure, wherein the top diameter of through hole two and the projection section diameter of mold consistent, the base diameter of through hole two and upper, the base diameter of bed die is consistent.
A kind of diode sealing cap mould needed for said method, as shown in drawings, comprise mold 1 and bed die 2, the through hole 1 coordinated with fairlead 7 is set on mold 1 center line, the vertical section of this mold 1 is " convex " word structure, the diameter a of through hole 1 is that the fairlead 7 external diameter e of upper cover 9 is consistent, the center line of bed die 2 boss arranges the groove 4 coordinated with stem 8, the vertical section of this bed die 2 is " convex " word structure, the diameter b of groove 4 is that the stem 8 external diameter f of base 10 is consistent and groove 4 degree of depth is greater than stem 8 length, mold 1 overlays and bed die 2 is formed overall and is inserted in sleeve 5, this sleeve 5 is cylindrical structure, the vertical section of the through hole 26 of this sleeve 5 is " convex " word structure, wherein the top diameter g of through hole 26 and the projection section diameter of mold 1 consistent, the base diameter d of through hole 26 and mold, the base diameter c of bed die is consistent.
During use; fairlead and stem branch are inserted in through hole one and groove; realize coordinating of diode and mould; then mold is overlayed and bed die is formed overall and is inserted in sleeve; then adopt molding press synchronously to extrude upper and lower mould, after compressing, the principle of employing electric resistance welding completes the sealing cap to diode.
Claims (4)
1. a diode sealing cap mould, comprise mold (1) and bed die (2), it is characterized in that: the through hole one (3) coordinated with fairlead (7) is set on mold (1) center line, the center line of bed die (2) boss arranges the groove (4) coordinated with stem (8), and mold (1) overlays the upper formation entirety of bed die (2) and is inserted in sleeve (5).
2. a kind of diode sealing cap mould according to claim 1, is characterized in that: the vertical section of described mold (1) is " convex " word structure, and fairlead (7) external diameter (e) that the diameter (a) of through hole one (3) is upper cover (9) is consistent.
3. a kind of diode sealing cap mould according to claim 1, it is characterized in that: the vertical section of described bed die (2) is " convex " word structure, stem (8) external diameter (f) that the diameter (b) of groove (4) is base (10) is consistent and groove (4) degree of depth is greater than stem (8) length.
4. a kind of diode sealing cap mould according to claim 1, it is characterized in that: described sleeve (5) is cylindrical structure, the vertical section of the through hole two (6) of this sleeve (5) is " convex " word structure, wherein the top diameter (g) of through hole two (6) is consistent with the projection section diameter of mold (1), and the base diameter (d) of through hole two (6) is consistent with the base diameter (c) of mold, bed die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420849152.4U CN204271040U (en) | 2014-12-29 | 2014-12-29 | A kind of diode sealing cap mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420849152.4U CN204271040U (en) | 2014-12-29 | 2014-12-29 | A kind of diode sealing cap mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204271040U true CN204271040U (en) | 2015-04-15 |
Family
ID=52805892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420849152.4U Expired - Fee Related CN204271040U (en) | 2014-12-29 | 2014-12-29 | A kind of diode sealing cap mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204271040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505348A (en) * | 2014-12-29 | 2015-04-08 | 贵州雅光电子科技股份有限公司 | Diode sealing method and die unit |
-
2014
- 2014-12-29 CN CN201420849152.4U patent/CN204271040U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505348A (en) * | 2014-12-29 | 2015-04-08 | 贵州雅光电子科技股份有限公司 | Diode sealing method and die unit |
| CN104505348B (en) * | 2014-12-29 | 2017-06-27 | 贵州雅光电子科技股份有限公司 | A kind of diode sealing cap method and sealing cap mould |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 |