CN105152644A - NTC thermistor chip material, chip, resistor and sensor, and making methods thereof - Google Patents

NTC thermistor chip material, chip, resistor and sensor, and making methods thereof Download PDF

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Publication number
CN105152644A
CN105152644A CN201510409529.3A CN201510409529A CN105152644A CN 105152644 A CN105152644 A CN 105152644A CN 201510409529 A CN201510409529 A CN 201510409529A CN 105152644 A CN105152644 A CN 105152644A
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China
Prior art keywords
ntc thermistor
chip
thermistor chip
thin slice
roasting
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苑广军
苑广礼
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MINGGUANG XUSHENG TECHNOLOGY Co Ltd
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MINGGUANG XUSHENG TECHNOLOGY Co Ltd
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Abstract

The invention discloses an NTC thermistor chip material, a chip, a resistor and a sensor, and making methods thereof, and belongs to the field of thermistors. The material comprises, by weight, 1000-1200 parts of Mn3O4, 95-105 parts of Co2O3, 190-210 parts of NiO and 590-610 parts of Fe2O3. The NTC thermistor made by using the NTC thermistor chip material has the advantages of difficult breakdown by current, difficult resistance drift and long service life.

Description

A kind of NTC thermistor chip material, chip, resistance, sensor and preparation method
Technical field
The present invention relates to thermistor field, particularly a kind of NTC thermistor chip material, chip, resistance, sensor and preparation method.
Background technology
Thermistor is the thermally sensitive element of a class, posistor (PositiveTemperatureCoefficient is divided into according to temperature factor difference, PTC thermistor) and negative tempperature coefficient thermistor (NegativeTemperatureCoefficient, NTC thermistor).Particularly, the resistance value of PTC thermistor raises along with temperature and increases, and the resistance value of NTC thermistor raises along with temperature and reduces.Wherein, NTC thermistor due to have the fluctuation of highly sensitive, temperature profile little, to advantages such as temperature variation fast response times, be widely used in the fields such as refrigerator, air-conditioning, microwave oven, Medical Instruments, automobile thermometric, fire alarm.NTC thermistor generally comprises NTC thermistor chip, and the pair of electrodes affixed with this NTC thermistor chip.Wherein, the performance of NTC thermistor chip on NTC thermistor has important impact.
Prior art adopts the oxide compound of the metals such as two or more manganese, copper, silicon, cobalt, iron, nickel, zinc as NTC thermistor chip material usually, by it is fully mixed, shaping, sintering, prepare NTC thermistor chip.Then by the affixed pair of electrodes of this NTC thermistor chip, NTC thermistor is prepared.
Contriver finds that prior art at least exists following problem:
When iterating through electric current, the NTC thermistor chip that prior art provides easily is punctured by electric current or produces aging drift, thus its work-ing life reduces.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides that a kind of resistance to rush of current is effective, the NTC thermistor chip material of long service life, chip, resistance, sensor and preparation method.Concrete technical scheme is as follows:
First aspect, embodiments provides a kind of NTC thermistor chip material, comprises the component of following weight part: Mn 3o 41000-1200 part, Co 2o 395-105 part, NiO190-210 part, Fe 2o 3590-610 part, described component is the nano particle that particle diameter is less than or equal to 500nm, and the purity of described component is all more than or equal to 99%.
Particularly, as preferably, described NTC thermistor chip material comprises the component of following weight part: Mn 3o 41100 parts, Co 2o 3100 parts, NiO200 part, Fe 2o 3600 parts.
Second aspect, the embodiment of the present invention additionally provides a kind of NTC thermistor chip, is prepared by described NTC thermistor chip material.
The third aspect, the embodiment of the present invention additionally provides a kind of NTC thermistor, comprises described NTC thermistor chip.
Fourth aspect, the embodiment of the present invention additionally provides a kind of temperature sensor, comprises described NTC thermistor.
5th aspect, the embodiment of the present invention additionally provides a kind of method utilizing described NTC thermistor chip material to prepare NTC thermistor chip, comprising:
Step a, carry out roasting dehydration by after the mixing of above-mentioned NTC thermistor chip material, ball milling, obtain dry ball milling raw material;
Step b, the ball milling raw material of described drying to be mixed with tackiness agent, obtain chip slurry;
Step c, described chip slurry is pressed into thin slice, and roasting is carried out to described thin slice, then two sides polishing is carried out to the described thin slice after roasting, obtain blank;
Steps d, at the temperature of 1280-1300 DEG C, described blank to be sintered, obtain NTC thermistor chip.
Particularly, as preferably, in described step b, described tackiness agent is dibutyl phthalate and white glue with vinyl, and the weight of described dibutyl phthalate is 4% of the weight of the ball milling raw material of described drying, the weight of described white glue with vinyl is 1.5% of the weight of the ball milling raw material of described drying.
Particularly, as preferably, in described step c, by first time punching press, first time dry, second time punching press, second time are dried, third time punching press, roasting, the 4th punching press operation described chip slurry is pressed into the thin slice that thickness is 0.52mm.
Further, 6th aspect, embodiments provide a kind of method utilizing described NTC thermistor chip to prepare NTC thermistor, comprise: the silver slurry diluted in the coated on both sides of described NTC thermistor chip, drying, sintering, section, welding lead, obtain NTC thermistor.
Further, described method also comprises: adopt epoxy resin rubber powder to carry out epoxy encapsulation to described NTC thermistor.
The beneficial effect that the technical scheme that the embodiment of the present invention provides is brought is:
The NTC thermistor chip material that the embodiment of the present invention provides, comprises the component of following weight part: Mn 3o 41000-1200 part, Co 2o 395-105 part, NiO190-210 part, Fe 2o 3590-610 part, above each component is the nano particle that particle diameter is less than or equal to 500nm, and the purity of each component is all more than or equal to 99%.By the collaborative complex role of above-mentioned each component, the NTC thermistor chip that the NTC thermistor chip material utilizing the embodiment of the present invention to provide is made is thicker than the NTC thermistor chip with identical B value, thus be convenient to carry out two-sided polishing to it, guarantee its smoothness of the surface and consistence, preventing this NTC thermistor chip from performance variation occurring in long term operation process causes resistance to be drifted about, after making it use 5 years, resistance drift is no more than 1%, use after 10 years, resistance drift is no more than 3%.Meanwhile, because prepared NTC thermistor chip thickness increases, make this NTC thermistor chip can the electric current of resistance to 20mA, and not easily breakdown when iterating through electric current, effectively extend its work-ing life.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation being coated with the NTC thermistor chip of silver slurry that the embodiment of the present invention provides;
Fig. 2 is the structural representation of the NTC thermistor that further embodiment of this invention provides;
Fig. 3 is the structural representation of the NTC thermistor of the epoxy encapsulation that further embodiment of this invention provides.
Reference numeral:
1 is coated with the silver-colored NTC thermistor chip starched;
2 lead-in wires;
3 epoxy resin coating layers.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
The ratio of the resistivity of NTC thermistor, work-ing life and its component and each component, sintering atmosphere, sintering temperature and structural state etc. are relevant.Current many producers pursue the traditional performance such as precision, sensitivity, drift value of NTC thermistor simply, and have ignored its work-ing life.But work-ing life is a key property of NTC thermistor, there is dialectical relationship with other parameters such as precision, sensitivity.Only under the condition ensureing its work-ing life, the traditional performance such as precision, sensitivity, drift value of NTC thermistor could stablize performance.For the problems referred to above, embodiments provide a kind of NTC thermistor chip material.
First aspect, embodiments provides a kind of NTC thermistor chip material, comprises the component of following weight part: Mn 3o 41000-1200 part, Co 2o 395-105 part, NiO190-210 part, Fe 2o 3590-610 part, above each component is the nano particle that particle diameter is less than or equal to 500nm, and the purity of each component is all more than or equal to 99%, is preferably greater than or equal to 99.9%.
The NTC thermistor chip material that the embodiment of the present invention provides, by the collaborative complex role of above-mentioned each component, made NTC thermistor chip is thicker than the NTC thermistor chip with identical B value, thus be convenient to carry out two-sided polishing to it, guarantee its smoothness of the surface and consistence, prevent resistance from performance variation occurring in long term operation process and cause resistance to be drifted about, after it uses 5 years, resistance drift is no more than 1%, uses after 10 years, and resistance drift is no more than 3%.Meanwhile, because prepared NTC thermistor chip thickness increases, make this chip can the electric current of resistance to 20mA, and not easily breakdown when iterating through electric current, effectively extend its work-ing life.Visible, the NTC thermistor chip material that the embodiment of the present invention provides, made thermistor is not easily punctured by electric current or aging drift occurs, long service life.Wherein, above-mentioned B value is used to characterize thermistor to the constant of the sensitivity of temperature, and it represents with the change size of zero-power resistance to the time, and its expression formula is:
B = lnR 2 - lnR 1 1 / T 2 - 1 / T 1
Wherein, T 1and T 2for different arbitrary temp value (K), R 1for T 1time zero-power resistance (Ω), R 2for T 2time zero-power resistance (Ω).
As preferably, this NTC thermistor chip material comprises the component of following weight part: Mn 3o 41100 parts, Co 2o 3100 parts, NiO200 part, Fe 2o 3600 parts.The embodiment of the present invention is by being defined as above component and the proportioning thereof of NTC thermistor chip material, make the NTC thermistor that the performance such as drift value, work-ing life of the NTC thermistor utilizing this material to make is better than on market, the current value of its resistance to rush of current is 4 times of commercially available NTC thermistor, extends one times work-ing life.
Second aspect, the embodiment of the present invention additionally provides a kind of NTC thermistor chip, and the NTC thermistor material that it is provided by embodiment of the present invention first aspect prepares.
The third aspect, the embodiment of the present invention additionally provides a kind of NTC thermistor, and it comprises the NTC thermistor chip that embodiment of the present invention second aspect provides.
Fourth aspect, the embodiment of the present invention additionally provides a kind of temperature sensor, and it comprises the NTC thermistor that embodiment of the present invention fourth aspect provides.
It will be appreciated by persons skilled in the art that above-mentioned NTC thermistor chip, NTC thermistor and temperature sensor that the embodiment of the present invention provides all have the advantage not easily being punctured or occur aging drift, long service life by electric current.
5th aspect, the embodiment of the present invention additionally provides a kind of method that NTC thermistor chip material utilizing embodiment of the present invention first aspect to provide prepares NTC thermistor chip, and the method comprises the following steps:
Carry out roasting dehydration after step 101, NTC thermistor chip material mixing first aspect present invention provided, ball milling, obtain dry ball milling raw material.
Step 102, the ball milling raw material of drying step 101 obtained mix with tackiness agent, obtain chip slurry.
Step 103, chip slurry step 102 obtained are pressed into thin slice, and carry out roasting to thin slice, then carry out two sides polishing to the thin slice after roasting, obtain blank.
Step 104, at the temperature of 1280-1300 DEG C, the blank that step 103 obtains to be sintered, obtain NTC thermistor chip.
The embodiment of the present invention passes through as above method can prepare NTC thermistor chip, and the method is simple and easy to control, is convenient to mass-producing application.
Particularly, in step 101, pour in ball mill after being mixed by NTC thermistor chip material, add the water that weight is this material weight 1.25 times, carry out ball milling, Ball-milling Time is 30-50 hour, is preferably 40 hours.And then roasting dehydration is carried out to the material after ball milling, maturing temperature is 125 DEG C, and roasting time is 10-14 hour, is preferably 12 hours, thus obtained dry ball milling raw material.
Wherein, utilize ball mill to carry out ball milling for this area common technology, it is divided into dry grinding and wet-milling.For wet-milling, need to add a certain amount of water, the weight generally adding water is suitable with the weight of the material treating ball milling, if hypervolia, grindability can be caused to decline, and the water yield is very few, the athletic meeting of grinding in ball grinder body is hindered.And the material of NTC thermistor chip in the embodiment of the present invention is nano particle, it is because particle diameter is little, specific surface area large, and thus water regain is large, proves through overtesting, and adding weight is that the water of this material weight 1.25 times can reach good ball milling effect.And the length of Ball-milling Time directly affects granularity, the purity of product.In the ball milling starting stage, granularity declines fast along with the prolongation of time, and after ball milling certain hour, granularity reaches the state that weighs stably gradually, but the pollution that the long meeting of Ball-milling Time causes, thus affect the purity of product.Therefore, the time consuming of embodiment of the present invention preferred spheres is 40 hours.
Particularly, in step 102, tackiness agent is the mixture of dibutyl phthalate and white glue with vinyl, and the weight of dibutyl phthalate is 4% of the weight of dry ball milling raw material, and the weight of white glue with vinyl is 1.5% of the weight of dry ball milling raw material.Wherein, the main component of white glue with vinyl is polyvinyl acetate (PVA), and using water as dispersion agent, and the macromolecular compound that with the addition of polyvinyl alcohol and oxymethylene polymerization is as properties-correcting agent, improves water tolerance and the freeze-thaw resistance of white glue with vinyl.According to the tackiness agent of this proportioning have bounding force by force, not volatile, on the chemical property of raw material without impact, viscosity is moderate and be beneficial to the advantages such as Homogeneous phase mixing.
Particularly, in step 103, by first time punching press, first time dry, second time punching press, second time dry, third time punching press, roasting, the 4th punching press operation chip slurry is pressed into the thin slice that thickness is 0.52mm.Concrete operation step is as follows:
1), with tabletting machine, chip slurry is pressed into the thin slice that thickness is 0.6mm.
2), with large clip be that the thin slice of 0.6mm is fixed by thickness, hang 20min at ambient temperature and this thin slice is dried.
3) be, that the thin slice of 0.6mm is pressed into the thin slice that thickness is 0.55mm by thickness.
4) be, by thickness that the thin slice of 0.55mm is cut into the rectangular of wide about 44mm, rectangularly come on stainless (steel) wire by this, pros and cons respectively dries in the air 10min at ambient temperature.
5) be, that the rectangular of 0.55mm is pressed into the thin slice that thickness is 0.53mm by thickness.
6) be, by thickness that the thin slice of 0.53mm is cut into the square sheets that the length of side is 44mm, this square sheets come on stainless (steel) wire, puts into baking oven in 60 DEG C of roasting 10min.
7) be, by thickness that the square sheets of 0.53mm is pressed into the thin slice that thickness is 0.52mm, side by side on a glass.
Roasting is carried out to the thin slice that thickness is 0.52mm, at PID controller (ProportionIntegrationDifferentiation, proportional-integral derivative controller) control under in 60 DEG C of roastings 12 hours, re-baking is carried out after being cooled to normal temperature, utilize PID controller temperature control, respectively at the roasting roasting roasting roasting roasting roasting 6 hours at 1 hour, 126 DEG C at 1 hour, 110 DEG C at 1 hour, 100 DEG C at 1 hour, 90 DEG C at 1 hour, 80 DEG C at 1 hour, 70 DEG C of roasting at 60 DEG C.Carry out two sides polishing with sander to the thin slice after roasting, obtain ganoid blank, this blank thickness is 0.49-0.51mm, is preferably 0.5mm.
Wherein, PID controller carries out bias adjustment according to PID control principle to Controlling System, makes the process variables such as the temperature of production equipment, pressure, flow, hydraulic pressure maintain numerically certain, to meet the requirement of production technique.The embodiment of the present invention utilizes PID controller temperature control, effectively can be controlled by maturing temperature in the temperature range of setting, thus reach desirable roasting effect.
In addition, the thin slice after step 103 pair roasting carries out two sides polishing, makes blank smooth surface, can be subsequent coated silver slurry and prepares, make silver slurry can cover blank surface equably.
Particularly, in step 104, blank is arranged in fire-resistant box, and is positioned over PID controller and sinters, obtain NTC thermistor chip.Wherein, sintering temperature is 1280-1300 DEG C, is preferably 1290 DEG C.
The embodiment of the present invention changes blank into fine and close NTC thermistor chip by above-mentioned sintering process, makes its various aspects of performance more stable.
Further, 6th aspect, the method provided in employing the 5th prepares on the basis of NTC thermistor chip, a kind of method preparing NTC thermistor that the embodiment of the present invention also provides, comprise: the silver slurry diluted in the coated on both sides of NTC thermistor chip, drying, sintering, section, welding lead, obtain NTC thermistor.Wherein, the structure of the NTC thermistor chip 1 of silver slurry is coated with as shown in Figure 1.As shown in Figure 2, it comprises the NTC thermistor chip 1 and lead-in wire 2 that are coated with silver slurry to the structure of NTC thermistor.
Be understandable that, the method preparing NTC thermistor that the embodiment of the present invention the 6th aspect provides is the ordinary skill in the art, and the embodiment of the present invention does not do concrete restriction to it at this.But, in order to obtain the NTC thermistor of excellent property, preferably will be coated with the NTC thermistor arrangements of chips of silver slurry on stainless (steel) wire, roasting 10-15min at 125 DEG C is until load fire-resistant box after dry, put into sintering oven, utilize PID controller to sinter in 650 DEG C.By resistance requirement, this chip is cut into the fritter of 1.32mm × 1.44mm, and welding lead, form the NTC thermistor of resistance R25=10K Ω ± 2%, B value B25/85=3978K ± 1%.At wherein R25 represents 25 DEG C, the zero-power resistance of thermistor, B25/85 represents T 1be 25 DEG C, T 2when being 85 DEG C, the zero-power resistance of thermistor is to the change size of time.
Wherein, the silver slurry of above-mentioned dilution is starched thinner by silver slurry and silver and is formed, and wherein silver slurry and silver-colored weight ratio of starching thinner are preferably 100:5.And silver starches the thick slurry of a kind of mechanical mixture be made up of the particulate of the argent of high purity (purity is 99.9%), tackiness agent, solvent, auxiliary agent.The silver slurry adopted in the embodiment of the present invention is sintered type conductive silver paste, and its composition is constructed as follows: silver powder, bisphenol A type epoxy resin, acid anhydride type curing agent, butylacetate.The silver slurry thickness being coated with the NTC thermistor chip surface of silver slurry is about 6 μm.The solidification of silver slurry is made by sintering.
Welding lead is the technique means that this area is commonly used, be generally employing thermosonic bonding process, wire welding is connected on the weld pad of weld pad on chip and lead frame or substrate, make welding wire form good ohmic contact between chip electrode and lead wire bonding district, complete the connection work of the interior external circuit of chip.
In addition, according to different resistance requirements, chip can be cut into the fritter of different size, welding lead, thus form the NTC thermistor of different resistance.
Further, the method that the embodiment of the present invention provides also comprises: adopt epoxy resin rubber powder to carry out epoxy encapsulation to NTC thermistor, obtain the NTC thermistor of epoxy encapsulation.Wherein, as shown in Figure 3, it comprises the NTC thermistor chip 1, lead-in wire 2 and the epoxy resin coating layer 3 that are coated with silver slurry to the structure of the NTC thermistor of epoxy encapsulation.
Particularly, above-mentioned epoxy encapsulation can realize as follows: utilize powder infusion machine to flood upper epoxy resin rubber powder to the weld parcel of NTC thermistor chip and lead-in wire, baking-curing 2 hours at 150 DEG C, make it form the epoxy resin coating layer of solidification, thus make the NTC thermistor of epoxy encapsulation.Its concrete operation step is as follows:
Powder infusion machine there are respectively 3 powder grooves, the region that is heating and curing is provided with after each powder groove, travelling belt drives NTC thermistor running, make it in powder groove, be stained with epoxy powder, and it is regions curing through hot setting, realize epoxy resin impregnated, again successively through the second powder box and consolidation zone, 3rd powder box and consolidation zone dipping, after dipping, NTC thermistor is rolled onto on dish by powder infusion machine automatically, in baking box at 150 DEG C baking-curing 2 hours, it is made to form the epoxy resin coating layer of solidification, thus make the NTC thermistor of epoxy encapsulation.
The NTC thermistor of epoxy encapsulation is protected due to its chip, thus ensures the longer service life of this NTC thermistor.
Below further the present invention will be described by specific embodiment.
In following specific embodiment, the unreceipted condition person of involved operation, the condition of all conveniently condition or manufacturers's suggestion is carried out.Raw materials used unreceipted production firm and specification person are can by the conventional products of commercial acquisition.Part material information involved in following examples is as follows:
Silver slurry, ST-M-004-1 type, purchased from paddy field, Shanghai material Science and Technology Ltd.;
Silver slurry thinner, 3205 types, purchased from Pinghu, Longgang District of Shenzhen City Wan Feng chemical industry;
Epoxy resin rubber powder, zk-1600 type, purchased from Zhong Ke state prosperous (Beijing) Science and Technology Ltd..
In addition, tested by the performance of following performance test methods to NTC thermistor chip:
1), rush of current test: at 120 DEG C, direct current energizing test is carried out to the NTC thermistor chip (benchmark resistance is 0.388K Ω) that the embodiment of the present invention provides, the volts DS that NTC thermistor chip loads is raised gradually from 5V, the resistance detecting resistance in galvanization exports, and chooses resistance or B value respectively and changes the current point that the current point that exceedes original value 3% and chip puncture.
2), high/low temperature test: under 5V volts DS, resistance, in the environment of high temperature 100 DEG C ± 2 DEG C, toasts 1000 hours, the change of test resistance and B value.
3), stability test: under 5V volts DS, with thermal shock machine, impact experiment is carried out, 20min at-40 DEG C to the NTC thermistor chip that the embodiment of the present invention provides, 20min at 100 DEG C, buffering time 2min, carry out 5000 circulations.
Embodiment 1
Present embodiments provide a kind of NTC thermistor chip material, comprise the component of following weight part: Mn 3o 41100 parts, Co 2o 395 parts, NiO210 part, Fe 2o 3590 parts, the median size of each component remains between 300-400nm, and the purity of each component is all greater than 99.7%.
Embodiment 2
Present embodiments provide a kind of NTC thermistor chip material, comprise the component of following weight part: Mn 3o 41000 parts, Co 2o 3100 parts, NiO205 part, Fe 2o 3595 parts, the median size of each component remains between 200-300nm, and the purity of each component is all greater than 99.6%.
Embodiment 3
Present embodiments provide a kind of NTC thermistor chip material, comprise the component of following weight part: Mn 3o 41100 parts, Co 2o 3100 parts, NiO200 part, Fe 2o 3600 parts, the median size of each component remains between 400-500nm, and the purity of each component is all greater than 99.9%.
Embodiment 4
Present embodiments provide a kind of NTC thermistor chip material, comprise the component of following weight part: Mn 3o 41200 parts, Co 2o 3105 parts, NiO200 part, Fe 2o 3605 parts, the median size of each component remains between 300-400nm, and the purity of each component is all greater than 99.8%.
Embodiment 5
The NTC thermistor chip material that the present embodiment utilizes embodiment 1-embodiment 4 to provide prepares NTC thermistor, and concrete operation step is as follows:
1) NTC thermistor chip material is mixed, pours in ball mill, add the water that weight is this material weight 1.25 times, ball milling 40 hours, then roasting dehydration is carried out to the material after ball milling, maturing temperature is 125 DEG C, and roasting time is 12 hours, thus obtained dry ball milling raw material.
2) take the ball milling raw material of 600g drying, add 24g dibutyl phthalate and 9g white glue with vinyl, mix, obtain chip slurry.
3) by first time punching press, first time dry, second time punching press, second time dry, third time punching press, roasting, the 4th punching press operation chip slurry is pressed into the thin slice that thickness is 0.52mm, and roasting is carried out to thin slice, then two sides polishing is carried out to the thin slice after roasting, obtain blank.Concrete operation step is as follows:
A, with tabletting machine, chip slurry is pressed into the thin slice that thickness is 0.6mm.
B, with large clip be that the thin slice of 0.6mm is fixed by thickness, hang 20min at ambient temperature and this thin slice is dried.
C, be that the thin slice of 0.6mm is pressed into the thin slice that thickness is 0.55mm by thickness.
D, be that the thin slice of 0.55mm is cut into the rectangular of wide about 44mm by thickness, rectangularly come on stainless (steel) wire by this, pros and cons respectively dries in the air 10min at ambient temperature.
E, be that the rectangular of 0.55mm is pressed into the thin slice that thickness is 0.53mm by thickness.
F, be that the thin slice of 0.53mm is cut into the square sheets that the length of side is 44mm by thickness, this square sheets come on stainless (steel) wire, puts into baking oven in 60 DEG C of roasting 10min.
G, be that the square sheets of 0.53mm is pressed into the thin slice that thickness is 0.52mm by thickness, side by side on a glass.
H, be that the thin slice of 0.52mm carries out roasting to thickness, in 60 DEG C of roastings 12 hours under the control of PID controller, re-baking is carried out after being cooled to normal temperature, utilize PID controller temperature control, respectively at the roasting roasting roasting roasting roasting roasting 6 hours at 1 hour, 126 DEG C at 1 hour, 110 DEG C at 1 hour, 100 DEG C at 1 hour, 90 DEG C at 1 hour, 80 DEG C at 1 hour, 70 DEG C of roasting at 60 DEG C.
I, carry out two sides polishing with sander to the thin slice after roasting, obtain ganoid blank, this blank thickness is 0.5mm.
4) blank is arranged in fire-resistant box, sinters in PID controller, obtain NTC thermistor chip, sintering temperature is 1290 DEG C.
5) at the silver slurry that the coated on both sides of NTC thermistor chip is diluted, wherein, the weight ratio that silver slurry and silver starch thinner is 100:5.To be coated with the NTC thermistor arrangements of chips of silver slurry on stainless (steel) wire, roasting 10-15min at 125 DEG C, until load fire-resistant box after dry, puts into sintering oven, utilizes PID controller to sinter in 650 DEG C.By resistance requirement, this chip is cut into the fritter of 1.32mm × 1.44mm, obtains NTC thermistor chip, and welding lead, form the NTC thermistor of resistance R25=10K Ω ± 2%, B value B25/85=3978K ± 1%.
6) powder infusion machine there are respectively 3 powder grooves, the region that is heating and curing is provided with after each powder groove, travelling belt drives NTC thermistor running, make it in powder groove, be stained with epoxy powder, and it is regions curing through hot setting, realize epoxy resin impregnated, again successively through the second powder box and consolidation zone, 3rd powder box and consolidation zone dipping, after dipping, NTC thermistor is rolled onto on dish by powder infusion machine automatically, in baking box at 150 DEG C baking-curing 2 hours, it is made to form the epoxy resin coating layer of solidification, thus make the NTC thermistor of epoxy encapsulation.
Test the performance of the NTC thermistor prepared, result is as follows:
The rush of current of the resistance to 18mA of NTC thermistor that the NTC thermistor material utilizing embodiment 1 to provide prepares; Can bear 4900 high/low-temperature impacts, resistance deviation is less than 3%; After it uses 5 years, resistance drift is no more than 1%, uses after 10 years, and resistance drift is no more than 3%.
The rush of current of the resistance to 19mA of NTC thermistor that the NTC thermistor material utilizing embodiment 2 to provide prepares; Can bear 4900 high/low-temperature impacts, resistance deviation is less than 3%; After it uses 5 years, resistance drift is no more than 1%, uses after 10 years, and resistance drift is no more than 3%.
The rush of current of the resistance to 20mA of NTC thermistor that the NTC thermistor material utilizing embodiment 3 to provide prepares; Can bear 5000 high/low-temperature impacts, resistance deviation is less than 3%; After it uses 5 years, resistance drift is no more than 1%, uses after 10 years, and resistance drift is no more than 3%.
The rush of current of the resistance to 19mA of NTC thermistor that the NTC thermistor material utilizing embodiment 4 to provide prepares; Can bear 4950 high/low-temperature impacts, resistance deviation is less than 3%; After it uses 5 years, resistance drift is no more than 1%, uses after 10 years, and resistance drift is no more than 3%.
The foregoing is only preferred embodiment of the present invention, not in order to limit the scope of the invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. a NTC thermistor chip material, comprises the component of following weight part: Mn 3o 41000-1200 part, Co 2o 395-105 part, NiO190-210 part, Fe 2o 3590-610 part;
Described component is the nano particle that particle diameter is less than or equal to 500nm, and the purity of described component is all more than or equal to 99%.
2. NTC thermistor chip material according to claim 1, is characterized in that, described NTC thermistor chip material comprises the component of following weight part: Mn 3o 41100 parts, Co 2o 3100 parts, NiO200 part, Fe 2o 3600 parts.
3. a NTC thermistor chip, is prepared by the NTC thermistor chip material described in claim 1 or 2.
4. a NTC thermistor, comprises NTC thermistor chip according to claim 3.
5. a temperature sensor, comprises NTC thermistor according to claim 4.
6. utilize the NTC thermistor chip material described in claim 1 or 2 to prepare the method for NTC thermistor chip, comprising:
Step a, the NTC thermistor chip material mixing by described in claim 1 or 2, ball milling, roasting dehydration, obtain dry ball milling raw material;
Step b, the ball milling raw material of described drying to be mixed with tackiness agent, obtain chip slurry;
Step c, described chip slurry is pressed into thin slice, roasting is carried out to described thin slice, then two sides polishing is carried out to the described thin slice after calcination process, obtain blank;
Steps d, at the temperature of 1280-1300 DEG C, described blank to be sintered, obtain NTC thermistor chip.
7. method according to claim 6, is characterized in that, in described step b, described tackiness agent is the mixture of dibutyl phthalate and white glue with vinyl;
The weight of described dibutyl phthalate is 4% of the weight of the ball milling raw material of described drying, and the weight of described white glue with vinyl is 1.5% of the weight of the ball milling raw material of described drying.
8. method according to claim 6, it is characterized in that, in described step c, by first time punching press, first time dry, second time punching press, second time dry, third time punching press, roasting, the 4th punching press operation described chip slurry is pressed into the thin slice that thickness is 0.52mm.
9. utilize the NTC thermistor chip described in claim 3 to prepare the method for NTC thermistor, comprising:
At the silver slurry that the coated on both sides of NTC thermistor chip according to claim 3 is diluted, drying, sintering, section, welding lead, obtain NTC thermistor.
10. method according to claim 9, is characterized in that, described method also comprises: adopt epoxy resin rubber powder to carry out epoxy encapsulation to described NTC thermistor.
CN201510409529.3A 2015-07-10 2015-07-10 NTC thermistor chip material, chip, resistor and sensor, and making methods thereof Pending CN105152644A (en)

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Application publication date: 20151216