CN105149287A - Cleaning method for FPC heat dissipation substrate - Google Patents
Cleaning method for FPC heat dissipation substrate Download PDFInfo
- Publication number
- CN105149287A CN105149287A CN201510644111.0A CN201510644111A CN105149287A CN 105149287 A CN105149287 A CN 105149287A CN 201510644111 A CN201510644111 A CN 201510644111A CN 105149287 A CN105149287 A CN 105149287A
- Authority
- CN
- China
- Prior art keywords
- radiating substrate
- fpc
- cleaning method
- fpc heat
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
Abstract
The invention relates to the field of FPC manufacturing, in particular to a cleaning method for an FPC heat dissipation substrate. The cleaning method mainly comprises the following steps that oil removing, washing, acid pickling, washing, drying and cooling are sequentially carried out on the formed FPC heat dissipation substrate; ultrasonic cleaning is carried out on the FPC heat dissipation substrate through a low-temperature solvent, and the operation temperature is controlled at 10 DEG C. Compared with the prior art, the cleaning method has the following beneficial effects that the low-temperature solvent is free of toxicity and low in ODP value and cannot pollute the environment; the cleaning effect of ultrasonic cleaning can obviously meet the requirement for cleanliness; and the FPC heat dissipation substrate is processed through the low-temperature solvent ultrasonic cleaning method, the bonding force between an FPC and the heat dissipation substrate can be improved, and the requirement for the cleanliness in the quality aspect can be met.
Description
Technical field
The present invention relates to FPC and manufacture field, particularly relate to a kind of cleaning method of FPC heat-radiating substrate.
Background technology
FPC is resistance to around folding, light, the good extensive use of assembling capacity because of it, and for heat radiation base and this specific combination of FPC, due to the difference of material, for process between the two, have on the basis of the adhesion of dividing equally between the two in guarantee, ensure properties of product again, adopt traditional cleaning way, not only can not meet the requirement of cleanliness factor, and can environmental pollution be caused, meanwhile, the adhesion between FPC and heat radiation base needs specially treated, and traditional handicraft does not reach corresponding quality and performance test requirement.
Low-temperature solvent has low, nontoxic, the low ODP value of boiling point, good chemical stability.Ultrasonic cleaning technology refers to and utilizes hyperacoustic cavitation to clash into the dirt on body surface, peels off to reach the object of cleaning, and it has the features such as cleaning degree is high, cleaning speed is fast.Adopt this physical cleaning method of ultrasonic cleaning, the consumption of Chemical cleaning solvent can be reduced, greatly reduce the pollution to environment.Therefore, low-temperature solvent and ultrasonic cleaning can be considered to be applied in the cleaning of FPC heat-radiating substrate.
Summary of the invention
For the deficiency that prior art exists, the object of the present invention is to provide one to meet cleanliness factor, reach the FPC heat-radiating substrate cleaning method of corresponding quality and performance requirement simultaneously.
For achieving the above object, the present invention can be achieved by the following technical programs:
A cleaning method for FPC heat-radiating substrate, is characterized in that, comprises the following steps:
(1) successively oil removing, washing, pickling, washing, oven dry, cooling are carried out to the FPC heat-radiating substrate after shaping;
(2) adopt low-temperature solvent to carry out ultrasonic cleaning to FPC heat-radiating substrate, operating temperature controls at 10 DEG C;
Further, two slot type gas phase cleaning machines are adopted to carry out ultrasonic cleaning to FPC heat-radiating substrate in step (2).
Further, slightly wash FPC heat-radiating substrate in first groove of two slot type gas phase cleaning machines, operating temperature controls at 10 DEG C; In second groove of two slot type gas phase cleaning machines, FPC heat-radiating substrate is cleaned again until clean up.
Further, two slot type gas phase cleaning machines configure corresponding stainless steel cryovial and guarantee that operating temperature is at 10 DEG C.
Further, described in step (2), low-temperature solvent is 141B.
Further, the washing in step (1) after oil removing before pickling is for first to adopt hot water wash, and rear employing overflow is washed.
Further, the washing in step (1) after pickling adopts overflow washing.
Further, the hot water temperature of described hot water wash is 48 ~ 52 DEG C.
Further, the pressure of described overflow washing is 1.0kg/cm
2, flow is 4L/min.
Further, the pickling in step (1) adopts the solution containing 3% citric acid.
The present invention compared with prior art, has following beneficial effect: nontoxic, the low ODP value of low-temperature solvent, can not cause environmental pollution; The cleaning performance of ultrasonic cleaning obviously can ensure the requirement of cleanliness factor; Adopt the method process FPC heat radiation base of low-temperature solvent ultrasonic cleaning, not only can improve the adhesion between FPC and heat radiation base, the purity requirements of quality aspect can also be met.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the present invention is further illustrated:
The cleaning method of FPC heat-radiating substrate of the present invention, is characterized in that, comprise the following steps:
(1) successively oil removing, washing, pickling, washing, oven dry, cooling are carried out to the FPC heat-radiating substrate after shaping.
Wherein, the washing after oil removing before pickling is for first to adopt hot water wash, and rear employing overflow is washed.Washing after pickling adopts overflow washing.The temperature range of hot water is 48 ~ 52 DEG C.The pressure of overflow washing is 1.0kg/cm
2, flow is 4L/min.Pickling adopts the solution containing 3% citric acid.
(2) adopt low-temperature solvent to carry out ultrasonic cleaning to FPC heat-radiating substrate, operating temperature controls at 10 DEG C.This step is mainly deeply cleaned silicone oil and is polluted plate and oxidation plate.
Concrete, adopt two slot type gas phase cleaning machines to carry out ultrasonic cleaning to FPC heat-radiating substrate.In first groove of two slot type gas phase cleaning machines, FPC heat-radiating substrate is slightly washed, by most of oil removal of plate.Due to the strong volatility of low-temperature solvent, configure corresponding stainless steel cryovial and guarantee that operating temperature is at 10 DEG C.In second groove of two slot type gas phase cleaning machines, FPC heat-radiating substrate is cleaned again, to ensure that the greasy dirt on plate is all removed totally.Preferably, low-temperature solvent is 141B.
For a person skilled in the art, according to above technical scheme and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection domain of the claims in the present invention.
Claims (10)
1. a cleaning method for FPC heat-radiating substrate, is characterized in that, comprises the following steps:
(1) successively oil removing, washing, pickling, washing, oven dry, cooling are carried out to the FPC heat-radiating substrate after shaping;
(2) adopt low-temperature solvent to carry out ultrasonic cleaning to FPC heat-radiating substrate, operating temperature controls at 10 DEG C.
2. the cleaning method of FPC heat-radiating substrate according to claim 1, is characterized in that: adopt two slot type gas phase cleaning machines to carry out ultrasonic cleaning to FPC heat-radiating substrate in step (2).
3. the cleaning method of FPC heat-radiating substrate according to claim 2, is characterized in that: slightly wash FPC heat-radiating substrate in first groove of two slot type gas phase cleaning machines, operating temperature controls at 10 DEG C; In second groove of two slot type gas phase cleaning machines, FPC heat-radiating substrate is cleaned again until clean up.
4. the cleaning method of FPC heat-radiating substrate according to claim 3, is characterized in that: two slot type gas phase cleaning machines configure corresponding stainless steel cryovial and guarantee that operating temperature is at 10 DEG C.
5. the cleaning method of FPC heat-radiating substrate according to claim 1, is characterized in that: described in step (2), low-temperature solvent is 141B.
6. the cleaning method of FPC heat-radiating substrate according to claim 1, is characterized in that: the washing in step (1) after oil removing before pickling is for first to adopt hot water wash, and rear employing overflow is washed.
7. the cleaning method of the FPC heat-radiating substrate according to claim 1 or 6, is characterized in that: the washing in step (1) after pickling adopts overflow washing.
8. the cleaning method of FPC heat-radiating substrate according to claim 6, is characterized in that: the hot water temperature of described hot water wash is 48 ~ 52 DEG C.
9. the cleaning method of FPC heat-radiating substrate according to claim 7, is characterized in that: the pressure of described overflow washing is 1.0kg/cm
2, flow is 4L/min.
10. the cleaning method of FPC heat-radiating substrate according to claim 1, is characterized in that: the pickling in step (1) adopts the solution containing 3% citric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510644111.0A CN105149287A (en) | 2015-09-30 | 2015-09-30 | Cleaning method for FPC heat dissipation substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510644111.0A CN105149287A (en) | 2015-09-30 | 2015-09-30 | Cleaning method for FPC heat dissipation substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105149287A true CN105149287A (en) | 2015-12-16 |
Family
ID=54790491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510644111.0A Pending CN105149287A (en) | 2015-09-30 | 2015-09-30 | Cleaning method for FPC heat dissipation substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105149287A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114168006A (en) * | 2021-11-03 | 2022-03-11 | 深圳市佳明科电子有限公司 | Binding process of FPC (flexible printed circuit) of mobile phone touch screen |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004041860A (en) * | 2002-07-09 | 2004-02-12 | Sansha Electric Mfg Co Ltd | Washing/drying interlocking system |
| JP2008264722A (en) * | 2007-04-24 | 2008-11-06 | Mitsubishi Heavy Ind Ltd | Aqueous cleaning method and aqueous cleaning apparatus |
| CN101754594A (en) * | 2008-12-19 | 2010-06-23 | 北大方正集团有限公司 | Method for reducing inter-inner layer short circuit in PCB production |
| CN102294331A (en) * | 2011-08-19 | 2011-12-28 | 江西旭阳雷迪高科技股份有限公司 | Method for washing raw material of monocrystal silicon |
| CN102548066A (en) * | 2012-02-08 | 2012-07-04 | 惠州中京电子科技股份有限公司 | PCB (Printed Circuit Board) surface treatment technology |
| CN203886860U (en) * | 2014-06-19 | 2014-10-22 | 深圳市科特通光电有限公司 | Ultrasonic wave FPC washing machine |
| CN203886857U (en) * | 2014-06-19 | 2014-10-22 | 深圳市科特通光电有限公司 | FPC cleaning machine |
-
2015
- 2015-09-30 CN CN201510644111.0A patent/CN105149287A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004041860A (en) * | 2002-07-09 | 2004-02-12 | Sansha Electric Mfg Co Ltd | Washing/drying interlocking system |
| JP2008264722A (en) * | 2007-04-24 | 2008-11-06 | Mitsubishi Heavy Ind Ltd | Aqueous cleaning method and aqueous cleaning apparatus |
| CN101754594A (en) * | 2008-12-19 | 2010-06-23 | 北大方正集团有限公司 | Method for reducing inter-inner layer short circuit in PCB production |
| CN102294331A (en) * | 2011-08-19 | 2011-12-28 | 江西旭阳雷迪高科技股份有限公司 | Method for washing raw material of monocrystal silicon |
| CN102548066A (en) * | 2012-02-08 | 2012-07-04 | 惠州中京电子科技股份有限公司 | PCB (Printed Circuit Board) surface treatment technology |
| CN203886860U (en) * | 2014-06-19 | 2014-10-22 | 深圳市科特通光电有限公司 | Ultrasonic wave FPC washing machine |
| CN203886857U (en) * | 2014-06-19 | 2014-10-22 | 深圳市科特通光电有限公司 | FPC cleaning machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114168006A (en) * | 2021-11-03 | 2022-03-11 | 深圳市佳明科电子有限公司 | Binding process of FPC (flexible printed circuit) of mobile phone touch screen |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102811561B (en) | Treatment process before printing of printed circuit board | |
| CN105543860A (en) | High-gloss fine-cleaning combined cleaning technology | |
| CN104324922A (en) | Method for removing adhesive residue of touch screen | |
| CN103422092A (en) | Polishing solution and polishing method thereof | |
| CN103551343A (en) | Gear cleaning process | |
| CN105149287A (en) | Cleaning method for FPC heat dissipation substrate | |
| CN104726853A (en) | Optical copper surface delustring blackening treatment method | |
| CN106011866A (en) | Chemical polishing surface treatment method of copper tube workpiece | |
| CN104630806A (en) | Surface treatment technology of aluminium material | |
| CN105390376A (en) | Cleaning process of diode after pickling | |
| CN105088235A (en) | Application method of novel 5-series aluminum alloy (Al-Mg) etchant solution | |
| CN105013752B (en) | A kind of cleaning of PC eyeglass crude product | |
| CN105344779A (en) | Forming method for artificial ageing aluminum alloy thin plate | |
| CN107522408A (en) | A kind of spraying coating process of bottle for cosmetics | |
| CN101447416A (en) | Method for cleaning semiconductor silicon wafer | |
| CN103712515A (en) | Method for cleaning aluminum plate-fin heat exchanger | |
| CN104646354A (en) | Method for removing oil dirt on metal surface | |
| CN204369571U (en) | A kind of Graphene washing unit | |
| CN114453365A (en) | Portable large-diameter silicon wafer box cleaning process | |
| CN105215121A (en) | A kind of manufacturing process of artificial aging state aluminium alloy sheet | |
| CN107552481A (en) | A kind of silicon wafer cleaning process | |
| CN104454997A (en) | Cleaning process for bearing | |
| CN112706241A (en) | Bending process for producing office furniture | |
| CN103721965A (en) | Treatment process of aluminium alloy after brazing | |
| CN105040019A (en) | Copper piece oil removal method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151216 |
|
| RJ01 | Rejection of invention patent application after publication |