CN105131870A - Preparation technology for solvent-type high-viscosity pressure-sensitive adhesive - Google Patents
Preparation technology for solvent-type high-viscosity pressure-sensitive adhesive Download PDFInfo
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- CN105131870A CN105131870A CN201510544910.0A CN201510544910A CN105131870A CN 105131870 A CN105131870 A CN 105131870A CN 201510544910 A CN201510544910 A CN 201510544910A CN 105131870 A CN105131870 A CN 105131870A
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- sensitive adhesive
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Abstract
The invention discloses a preparation technology for a solvent-type high-viscosity pressure-sensitive adhesive. The preparation technology comprises the following steps that micron-grade SiO2 powder, micron-grade Al2O3 powder and a silane coupling agent are added in first solvent, and ultrasonic treatment is performed on the mixture to obtain pre-dispersing liquid; nano-grade SiO2 powder, nano-grade Al2O3 powder and isocyanate are added in the pre-dispersing liquid, and ultrasonic treatment is performed on the mixture to obtain modulated pre-dispersing liquid; methyl methacrylate, ethyl acrylate and dimethyldiethoxysilane are added in second solvent, and mechanical stirring is performed on the mixture to obtain a polymer solution; the modulated pre-dispersing liquid and the polymer solution are mixed, then rosin resin, terpene resin, azoic compounds and N-nitroso compounds are sequentially added, mechanical high-speed stirring and ultrasonic stirring are performed on the mixture, and then the solvent-type high-viscosity pressure-sensitive adhesive is obtained through the preparation technology. According to the preparation technology, the high temperature resisting property and the viscosity stability under temperature difference changes are improved.
Description
Technical field
The present invention relates to a kind of high sticky pressure sensitive adhesive, particularly a kind of preparation technology for the sticky pressure sensitive adhesive of solvent-borne type height.
Background technology
Vinylformic acid sizing agent is for sticking in another kind of object by certain object.People pay attention to more for the visual requirement such as style, color of various furniture or electronic product, and therefore the outward appearance of electronic product seems particularly important, and this is also more and more higher to the requirement of adhesive tape, usually need clinging power strong and thickness at thinner adhesive tape.For electronic product or other products, once use adhesive tape, then need this adhesive tape can maintain viscosity when difference variation is large always, and can easily sizing agent be peeled off from film, secondly, prior art is being taken into account under other performances such as homogeneity, improves cloudy surface roughness and there is bottleneck.
Summary of the invention
The invention provides a kind of preparation technology for the sticky pressure sensitive adhesive of solvent-borne type height, this preparation technology being used for the sticky pressure sensitive adhesive of solvent-borne type height improves vinylformic acid sizing agent roughness when not increasing particle diameter, avoid cluster, it also avoid SiO
2powder, Al
2o
3the sedimentation of powder in system, improves and base material bonding force.
For achieving the above object, the technical solution used in the present invention is: a kind of solvent-based adhesive of high bonding force, comprises the following steps:
Step 1. is by 0.2 part of micron order SiO
2powder, 0.4 part of micron order Al
2o
3powder and 1.2 parts of silane coupling agents add in the first solvent and carry out ultrasonication and obtain pre-dispersed liquid, and this coupling agent chemical formula is: CH
2=CH-Si(OC
2h
5)
3;
Step 2. is by 2.8 parts of nano level SiO
2powder, 1.2 parts of nano level Al
2o
3powder and isocyanic ester 0.8 part add in pre-dispersed liquid carry out ultrasonication obtain modulation after pre-dispersed liquid;
Methyl methacrylate 70 parts, ethyl propenoate 26 parts and dimethyldiethoxysilane 15 parts add in the second solvent by step 3. carries out mechanical stirring acquisition polymers soln;
The mixing of the polymers soln of pre-dispersed liquid, step 3 after the modulation of step 2 is also added Gum Rosin 4.2 parts, note olefine resin 4.5 parts, azo-compound 1.5 parts, N-nitroso compound 4.6 parts by step 4. successively, carry out mechanical high-speed stirring and ultrasonic stirring, thus obtain the sticky pressure sensitive adhesive of solvent-borne type height.
The technical scheme improved further in technique scheme is as follows:
1. in such scheme, described nanometer Al
2o
3powder is on average 30nm so far.
2. in such scheme, described Nano-meter SiO_2
2powder mean diameter is 12nm.
3., in such scheme, described solvent is solvent is butanone, ethyl acetate or toluene.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1. the present invention is used for the preparation technology of the sticky pressure sensitive adhesive of solvent-borne type height, and it adopts nano level and micron order SiO
2powder, Al
2o
3powder and methyl methacrylate 72 parts, ethyl propenoate 32 parts, dimethyldiethoxysilane 16 parts and silane coupling agent, isocyanic ester acting in conjunction, relatively single use nano level or micron order SiO
2powder, Al
2o
3powder, improves vinylformic acid sizing agent roughness, is also conducive to SiO
2powder, Al
2o
3powder is uniformly distributed and dispersion in system, avoids cluster; Secondly, azo-compound 1 part, adding of N-nitroso compound 4 parts, it also avoid SiO
2powder, Al
2o
3the sedimentation of powder in system, improves and base material bonding force.
2. the present invention is used for the preparation technology of the sticky pressure sensitive adhesive of solvent-borne type height, and it comprises Gum Rosin 4.5 parts, and note olefine resin 5.8 parts and methyl methacrylate 72 parts, ethyl propenoate 32 parts, dimethyldiethoxysilane 16 parts of actings in conjunction, avoid by SiO
2powder, Al
2o
3powder adds the decline of the resistance to elevated temperatures caused, and improves resistance to elevated temperatures, and the stability of viscosity under difference variation, thus improves the reliability of product.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of preparation technology for the sticky pressure sensitive adhesive of solvent-borne type height, comprises the following steps:
Step 1. is by 0.2 part of micron order SiO
2powder, 0.4 part of micron order Al
2o
3powder and 1.2 parts of silane coupling agents add in the first solvent and carry out ultrasonication and obtain pre-dispersed liquid, and this coupling agent chemical formula is: CH
2=CH-Si(OC
2h
5)
3;
Step 2. is by 2.8 parts of nano level SiO
2powder, 1.2 parts of nano level Al
2o
3powder and isocyanic ester 0.8 part add in pre-dispersed liquid carry out ultrasonication obtain modulation after pre-dispersed liquid;
Methyl methacrylate 70 parts, ethyl propenoate 26 parts and dimethyldiethoxysilane 15 parts add in the second solvent by step 3. carries out mechanical stirring acquisition polymers soln;
The mixing of the polymers soln of pre-dispersed liquid, step 3 after the modulation of step 2 is also added Gum Rosin 4.2 parts, note olefine resin 4.5 parts, azo-compound 1.5 parts, N-nitroso compound 4.6 parts by step 4. successively, carry out mechanical high-speed stirring and ultrasonic stirring, thus obtain the sticky pressure sensitive adhesive of solvent-borne type height.
Above-mentioned Nano-meter SiO_2
2powder mean diameter is 12nm, described nanometer Al
2o
3powder mean diameter is 30nm.
Above-mentioned solvent is at least one in toluene, ethyl acetate and butanone.
When the height adopting above-mentioned manufacturing process to obtain glues pressure sensitive adhesive, its relatively single use nano level or micron order SiO
2powder, Al
2o
3powder, improves vinylformic acid sizing agent roughness, is also conducive to SiO
2powder, Al
2o
3powder is uniformly distributed and dispersion in system, avoids cluster; Next it also avoid SiO
2powder, Al
2o
3the sedimentation of powder in system, improves and base material bonding force; Again, avoid by SiO
2powder, Al
2o
3powder adds the decline of the resistance to elevated temperatures caused, and improves resistance to elevated temperatures, and the stability of viscosity under difference variation, thus improves the reliability of product.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to spirit of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (4)
1., for a preparation technology for the sticky pressure sensitive adhesive of solvent-borne type height, it is characterized in that: comprise the following steps:
Step 1. is by 0.2 part of micron order SiO
2powder, 0.4 part of micron order Al
2o
3powder and 1.2 parts of silane coupling agents add in the first solvent and carry out ultrasonication and obtain pre-dispersed liquid, and this coupling agent chemical formula is: CH
2=CH-Si(OC
2h
5)
3;
Step 2. is by 2.8 parts of nano level SiO
2powder, 1.2 parts of nano level Al
2o
3powder and isocyanic ester 0.8 part add in pre-dispersed liquid carry out ultrasonication obtain modulation after pre-dispersed liquid;
Methyl methacrylate 70 parts, ethyl propenoate 26 parts and dimethyldiethoxysilane 15 parts add in the second solvent by step 3. carries out mechanical stirring acquisition polymers soln;
The mixing of the polymers soln of pre-dispersed liquid, step 3 after the modulation of step 2 is also added Gum Rosin 4.2 parts, note olefine resin 4.5 parts, azo-compound 1.5 parts, N-nitroso compound 4.6 parts by step 4. successively, carry out mechanical high-speed stirring and ultrasonic stirring, thus obtain the sticky pressure sensitive adhesive of solvent-borne type height.
2. the preparation technology for the sticky pressure sensitive adhesive of solvent-borne type height according to claim 1, is characterized in that: described Nano-meter SiO_2
2powder mean diameter is 12nm.
3. the preparation technology for the sticky pressure sensitive adhesive of solvent-borne type height according to claim 1, is characterized in that: described nanometer Al
2o
3powder mean diameter is 30nm.
4. the preparation technology for the sticky pressure sensitive adhesive of solvent-borne type height according to claim 1, is characterized in that: described solvent is butanone, ethyl acetate or toluene.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410008520.7A CN103911099B (en) | 2014-01-09 | 2014-01-09 | Resistance matte acrylic acid adhesive |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410008520.7A Division CN103911099B (en) | 2014-01-09 | 2014-01-09 | Resistance matte acrylic acid adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105131870A true CN105131870A (en) | 2015-12-09 |
Family
ID=51037114
Family Applications (11)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510545255.0A Pending CN105086890A (en) | 2014-01-09 | 2014-01-09 | Process for making fogging surface acrylic adhesive |
| CN201510544910.0A Pending CN105131870A (en) | 2014-01-09 | 2014-01-09 | Preparation technology for solvent-type high-viscosity pressure-sensitive adhesive |
| CN201510628298.5A Pending CN105176418A (en) | 2014-01-09 | 2014-01-09 | Manufacturing method for temperature-difference-resistant adhesive |
| CN201510544958.1A Pending CN105131871A (en) | 2014-01-09 | 2014-01-09 | High-reliability adhesive with function of resisting temperature difference |
| CN201510625515.5A Pending CN105176416A (en) | 2014-01-09 | 2014-01-09 | Preparation method for high-temperature-resistant pressure-sensitive adhesive |
| CN201510625350.1A Pending CN105255404A (en) | 2014-01-09 | 2014-01-09 | Preparation technology for strong bonding solvent type adhesive |
| CN201510627922.XA Pending CN105176417A (en) | 2014-01-09 | 2014-01-09 | Solvent type strong-viscous-force pressure-sensitive adhesive |
| CN201510545024.XA Pending CN105086889A (en) | 2014-01-09 | 2014-01-09 | Solvent type adhesive with high bonding force |
| CN201510625419.0A Pending CN105153944A (en) | 2014-01-09 | 2014-01-09 | Matte pressure-sensitive adhesive for electronic product |
| CN201410008520.7A Active CN103911099B (en) | 2014-01-09 | 2014-01-09 | Resistance matte acrylic acid adhesive |
| CN201510545343.0A Pending CN105086844A (en) | 2014-01-09 | 2014-01-09 | High temperature resistant pressure sensitive adhesive |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510545255.0A Pending CN105086890A (en) | 2014-01-09 | 2014-01-09 | Process for making fogging surface acrylic adhesive |
Family Applications After (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510628298.5A Pending CN105176418A (en) | 2014-01-09 | 2014-01-09 | Manufacturing method for temperature-difference-resistant adhesive |
| CN201510544958.1A Pending CN105131871A (en) | 2014-01-09 | 2014-01-09 | High-reliability adhesive with function of resisting temperature difference |
| CN201510625515.5A Pending CN105176416A (en) | 2014-01-09 | 2014-01-09 | Preparation method for high-temperature-resistant pressure-sensitive adhesive |
| CN201510625350.1A Pending CN105255404A (en) | 2014-01-09 | 2014-01-09 | Preparation technology for strong bonding solvent type adhesive |
| CN201510627922.XA Pending CN105176417A (en) | 2014-01-09 | 2014-01-09 | Solvent type strong-viscous-force pressure-sensitive adhesive |
| CN201510545024.XA Pending CN105086889A (en) | 2014-01-09 | 2014-01-09 | Solvent type adhesive with high bonding force |
| CN201510625419.0A Pending CN105153944A (en) | 2014-01-09 | 2014-01-09 | Matte pressure-sensitive adhesive for electronic product |
| CN201410008520.7A Active CN103911099B (en) | 2014-01-09 | 2014-01-09 | Resistance matte acrylic acid adhesive |
| CN201510545343.0A Pending CN105086844A (en) | 2014-01-09 | 2014-01-09 | High temperature resistant pressure sensitive adhesive |
Country Status (1)
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|---|---|
| CN (11) | CN105086890A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109795207B (en) * | 2019-01-08 | 2021-02-02 | 信维通信（江苏）有限公司 | Electromagnetic shielding sheet and manufacturing method thereof |
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- 2014-01-09 CN CN201510545255.0A patent/CN105086890A/en active Pending
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- 2014-01-09 CN CN201510628298.5A patent/CN105176418A/en active Pending
- 2014-01-09 CN CN201510544958.1A patent/CN105131871A/en active Pending
- 2014-01-09 CN CN201510625515.5A patent/CN105176416A/en active Pending
- 2014-01-09 CN CN201510625350.1A patent/CN105255404A/en active Pending
- 2014-01-09 CN CN201510627922.XA patent/CN105176417A/en active Pending
- 2014-01-09 CN CN201510545024.XA patent/CN105086889A/en active Pending
- 2014-01-09 CN CN201510625419.0A patent/CN105153944A/en active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105086844A (en) | 2015-11-25 |
| CN105086889A (en) | 2015-11-25 |
| CN105255404A (en) | 2016-01-20 |
| CN105176416A (en) | 2015-12-23 |
| CN105176418A (en) | 2015-12-23 |
| CN105153944A (en) | 2015-12-16 |
| CN103911099B (en) | 2015-09-23 |
| CN105131871A (en) | 2015-12-09 |
| CN105086890A (en) | 2015-11-25 |
| CN105176417A (en) | 2015-12-23 |
| CN103911099A (en) | 2014-07-09 |
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| CB02 | Change of applicant information |
Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Applicant after: Jiangsu Stick new materials Polytron Technologies Inc Address before: 215400 Taicang Economic Development Zone, Jiangsu, Qingdao West Road, No. 11, No. Applicant before: Suzhou Sidike New Material Science & Technology Co., Ltd. |
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Application publication date: 20151209 |
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| RJ01 | Rejection of invention patent application after publication |