CN105120591A - High thermal conductivity metal base circuit board and preparing method thereof - Google Patents
High thermal conductivity metal base circuit board and preparing method thereof Download PDFInfo
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- CN105120591A CN105120591A CN201510601252.4A CN201510601252A CN105120591A CN 105120591 A CN105120591 A CN 105120591A CN 201510601252 A CN201510601252 A CN 201510601252A CN 105120591 A CN105120591 A CN 105120591A
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- circuit board
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- boron nitride
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a high thermal conductivity metal base circuit board and a preparing method thereof. The circuit board comprises a metal base plate, a thermal conducting insulation layer arranged on the surface of the metal base plate, and a circuit formed on the thermal conducting insulation layer. The material of the thermal conducting insulation layer includes paint with following components by mass percentage: 40-60% by mass of a mixture of polyethylene glycol terephthalate and polybutylene terephthalate; 30-40% by mass of a mixture of aluminum oxide, aluminium nitride and boron nitride powder; 5-10% by mass of cosolvent; 3-10% by mass of diluent; and 0.5-1% by mass of curing agent. The above mentioned components account for 100% of the total mass percentage content. The heat conduction coefficient of the metal base circuit board ranges from 5W/k.M to 15W/k.M, enabling the metal base circuit board to achieve effective heat conduction, and therefore, the stability and service lifetime of an electronic component can be improved. It is also possible to make a circuit, including an abnormal-shaped circuit on a metal carrier, providing a new method to attain circuit boards of different purposes. The invention also provides a preparing method for such high thermal conductivity metal base circuit board.
Description
Technical field
The present invention relates to field of circuit boards, particularly relate to a kind of high heat conduction metal-based circuit board and preparation method thereof.
Background technology
In existing circuit board, the metal substrate used and ceramic substrate all have open defect, wherein, ceramic substrate, due to the frangible characteristic of pottery, does not possess good machining property, need laser cutting or directly high temperature sintering is shaping, processing cost is high, and also needs high temperature sintering in circuit production process, and therefore energy consumption is very high, not environmentally, cause cannot using in enormous quantities in circuit-board industry; And metal substrate (as aluminium base, stainless steel substrate) then poor heat conduction, insulating properties is bad, (as the conductive coefficient 0.5-2W/k.m of aluminium base, the voltage breakdown of resistance to 2000V-5000V), and complex manufacturing technology, not environmentally, energy consumption is high, makes it apply greatly limited; The structure of traditional metal substrate is: by metallic carrier, insulating cement, Copper Foil, by pressing formation energetically, due to the defect of insulating cement, cause the thermal conductivity of product very low, in the process of follow-up making circuit, relate to etched circuit, the heavy-polluted techniques such as plating, complex process, not environmentally, and special-shaped circuit cannot be formed, and as 3D face, curved surface etc.
Summary of the invention
Given this, embodiment of the present invention first aspect provides a kind of high heat conduction metal-based circuit board, to solve the problem that existing metal-based circuit board heat dispersion is poor, complicated process of preparation, process contamination are large, and solution prior art cannot realize the difficult problem making special-shaped circuit on metallic substrates.
First aspect, embodiments provide a kind of high heat conduction metal-based circuit board, the circuit comprising metal substrate, be arranged on the thermally conductive insulating layer of described metallic substrate surfaces and be formed in described thermally conductive insulating layer, the material of described thermally conductive insulating layer comprises coating, and described coating comprises the raw material components of following mass percentage:
The mixture 40-60% of PETG and polybutylene terephthalate;
Aluminium oxide, aluminium nitride and boron nitride powder mixture 30-40%;
Cosolvent: 5-10%;
Diluent: 3-10%;
Curing agent: 0.5-1%;
The gross mass percentage composition of above-mentioned each raw material components is 100%.
In the present invention the coating of thermally conductive insulating layer with the mixture of PETG and polybutylene terephthalate for carrier, and add aluminium oxide, aluminium nitride and boron nitride powder heat filling, due to mixture and the aluminium oxide of comprehensive PETG and polybutylene terephthalate, the excellent properties of the raw material such as aluminium nitride and boron nitride powder, by the synergy of the various raw materials of above-mentioned quality proportioning, thermally conductive insulating layer is made to have high heat conduction (conductive coefficient 5-20W/k.m) and high insulating property (voltage breakdown of 5-10KV can be carried) concurrently, different metal bases all can adhere to completely, resistance to 300 DEG C of high temperature, possesses good resistance to acids and bases simultaneously, salt spray resistance, ageing resistance, cold-and-heat resistent circulation and cold-and-heat resistent impact property.
High heat conduction metal-based circuit board of the present invention, owing to being provided with thermally conductive insulating layer, its conductive coefficient can reach 5-15W/k.m, energy effective, the temperature at electronic product center is effectively derived, again by the heat radiation of outside heat dissipation channel, thus the stability of electronic devices and components, useful life and result of use can be improved; Simultaneously, owing to being provided with thermally conductive insulating layer, well solve the problem of heat conduction and insulation, balance point is reached between two kinds of performances, thus achieve well and on metallic carrier, make circuit (comprising special-shaped circuit), for the circuit board obtaining various different purposes provides new method.
In the present invention, metal substrate can be aluminium base, stainless steel substrate etc.
Preferably, the thickness of described thermally conductive insulating layer is 20-60 micron.
Preferably, in the mixture of described PETG and polybutylene terephthalate, the mass ratio of PETG and polybutylene terephthalate is 2:2-6.More preferably, the mass ratio of PETG and polybutylene terephthalate is 2:3-4.
The present invention adopts the mixture of PETG and polybutylene terephthalate as coating carrier, by the performance synthesis of two kinds of resins, coating can be made finally to produce good adhesive force and adhesion with the carrier of unlike material, coating can be made when being applied in circuit board simultaneously, can the coefficient of expansion of match circuit part, improve the stability of circuit board.
Preferably, the mass percentage of the mixture of described PETG and polybutylene terephthalate is 45-55%.
Aluminium oxide, aluminium nitride and boron nitride powder have good heat conductivility, and good stability, be added in coating, coating thermal resistance can be reduced, improve the overall thermal conductivity energy of coating.Preferably, the mass percentage of described aluminium oxide, aluminium nitride and boron nitride powder mixture is 30-35%.
Preferably, in described aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:1-3:3-5, the grain diameter of described aluminium oxide is 0.1-2 micron, the grain diameter of described aluminium nitride is 0.1-1.5 micron, and the grain diameter of described boron nitride is 0.1-1 micron.The present invention combines by adopting the aluminium oxide of above-mentioned quality proportioning and particle size range, aluminium nitride and boron nitride, can make to form good heat conductive approach in coating, make whole paint coatings form heat conduction network chain, improve the overall heat conduction effect of coating, improve the mechanical property of coating simultaneously.More preferably, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:2:4.More preferably, the grain diameter of described aluminium oxide is 1-2 micron, the grain diameter of described aluminium nitride is 0.5-1.5 micron, and the grain diameter of described boron nitride is 0.1-0.5 micron.
Preferably, the mass percentage of described cosolvent is 6-8%; The mass percentage of described diluent is 5-8%; The mass percentage of described curing agent is 0.6-0.8%.
Preferably, described cosolvent can be acetamide, alcohols or alcohol ether organic solvent.Can be specifically isopropyl alcohol, isobutanol, n-butanol, propylene glycol monomethyl ether, ethylene glycol ethyl ether, butyl etc.
Preferably, described diluent can be n-butanol, styrene, ethyl acetate, butyl acetate, toluene, dimethylbenzene, butanone, acetone, phenmethylol, cyclohexanone, ether alcohol.
Preferably, the main component of described curing agent is dibutyl phthalate.Certainly, other curing agent that can realize paint solidification of the present invention is also suitable for the present invention.
In the present invention, circuit can be arbitrary form, comprises special-shaped circuit, as 3D face, and curved surface etc.
A kind of high heat conduction metal-based circuit board that embodiment of the present invention first aspect provides, by arranging thermally conductive insulating layer, its conductive coefficient can reach 5-15W/k.m, energy effective, the temperature at electronic product center is effectively derived, again by the heat radiation of outside heat dissipation channel, thus the stability of electronic devices and components, useful life and result of use can be improved; Simultaneously, owing to being provided with thermally conductive insulating layer, well solve the problem of heat conduction and insulation, balance point is reached between two kinds of performances, thus achieve well and on metallic carrier, make circuit (comprising special-shaped circuit), for the circuit board obtaining various different purposes provides new method.Due to the excellent machinability of metal base, plasticity, durability, is thus the development of whole circuit-board industry, provides new direction.
Second aspect, embodiments provides a kind of preparation method of high heat conduction metal-based circuit board, comprises the following steps:
(1) mixed in proportion with cosolvent by the mixture of PETG and polybutylene terephthalate, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder; after being fully ground; obtain aluminium oxide, aluminium nitride and boron nitride powder mixture; at atmosphere protection, at 60-80 DEG C of temperature, described aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture; add diluent, curing agent again; dispersed with stirring is even, obtains coating, and above-mentioned each raw material is by following mass percentage mixing:
The mixture 40-60% of PETG and polybutylene terephthalate;
Aluminium oxide, aluminium nitride and boron nitride powder mixture 30-40%;
Cosolvent: 5-10%;
Diluent: 3-10%;
Curing agent: 0.5-1%;
The gross mass percentage composition of above-mentioned each raw material components is 100%;
(2) get metal substrate, by above-mentioned gained paint or be printed on described metal substrate, solidify at 140-170 DEG C of temperature, form thermally conductive insulating layer;
(3) mixture of PETG and polybutylene terephthalate is separately got, mix with conducting powder, making obtains electrocondution slurry, utilizes described electrocondution slurry to be directly printed as circuit in described thermally conductive insulating layer, obtains high heat conduction metal-based circuit board.
Preferably, in the mixture of described PETG and polybutylene terephthalate, the mass ratio of PETG and polybutylene terephthalate is 2:2-6.More preferably, the mass ratio of PETG and polybutylene terephthalate is 2:3-4.
The coating of thermally conductive insulating layer of the present invention adopts the mixture of PETG and polybutylene terephthalate as carrier, by the performance synthesis of two kinds of resins, coating can be made finally to produce good adhesive force and adhesion with the carrier of unlike material, the coefficient of expansion of coating match circuit part can be made simultaneously, improve the stability of circuit board.
Preferably, the mass percentage of the mixture of described PETG and polybutylene terephthalate is 45-55%.
Aluminium oxide, aluminium nitride and boron nitride powder have good heat conductivility, and good stability, be added in coating, coating thermal resistance can be reduced, improve the overall thermal conductivity energy of coating.Preferably, the mass percentage of described aluminium oxide, aluminium nitride and boron nitride powder mixture is 30-35%.
Preferably, in described aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:1-3:3-5, the grain diameter of described aluminium oxide is 0.1-2 micron, the grain diameter of described aluminium nitride is 0.1-1.5 micron, and the grain diameter of described boron nitride is 0.1-1 micron.The present invention combines by adopting the aluminium oxide of above-mentioned quality proportioning and particle size range, aluminium nitride and boron nitride, can make to form good heat conductive approach in coating, make whole paint coatings form heat conduction network chain, improve the overall heat conduction effect of coating, improve the mechanical property of coating simultaneously.More preferably, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:2:4.More preferably, the grain diameter of described aluminium oxide is 1-2 micron, the grain diameter of described aluminium nitride is 0.5-1.5 micron, and the grain diameter of described boron nitride is 0.1-0.5 micron.
Preferably, the mass percentage of described cosolvent is 6-8%; The mass percentage of described diluent is 5-8%; The mass percentage of described curing agent is 0.6-0.8%.
Preferably, described cosolvent can be acetamide, alcohols or alcohol ether organic solvent.Can be specifically isopropyl alcohol, isobutanol, n-butanol, propylene glycol monomethyl ether, ethylene glycol ethyl ether, butyl etc.
Preferably, described diluent can be n-butanol, styrene, ethyl acetate, butyl acetate, toluene, dimethylbenzene, butanone, acetone, phenmethylol, cyclohexanone, ether alcohol.
Preferably, the main component of described curing agent is dibutyl phthalate.Certainly, other curing agent that can realize paint solidification of the present invention is also suitable for the present invention.
Preferably, described atmosphere can be nitrogen, argon gas or helium.
Preferably, the speed of described stirring is 200-500r/min, and described dispersed with stirring process can complete in three-roller.
In the present invention, metal substrate can be aluminium base, stainless steel substrate etc.Before thermally conductive insulating layer is set, remove grease and the impurity of metallic substrate surfaces.
Preferably, the thickness of described thermally conductive insulating layer is 20-60 micron.
In the present invention, the mode of described coating comprises spraying.
In the present invention, the time of described solidification can be 30 ~ 50 minutes.Particularly, can determine according to the heat conductive insulating layer thickness of pre-making curing time.Thermally conductive insulating layer obtains by coating or printing multilayer.
In the present invention, conducting powder can be copper powder, silver powder etc.In described electrocondution slurry, the mixture of PETG and polybutylene terephthalate and the mass ratio of conducting powder are 100:(40-75).
In the present invention, circuit can be arbitrary form, comprises special-shaped circuit, as 3D face, and curved surface etc.
The preparation method that embodiment of the present invention second aspect provides, technique is simple, by arranging thermally conductive insulating layer on metallic substrates, make the high heat conduction metal-based circuit board prepared, its conductive coefficient reaches 5-15W/k.m, energy effective, the temperature at electronic product center is effectively derived, again by the heat radiation of outside heat dissipation channel, thus the stability of electronic devices and components can be improved, useful life and result of use, simultaneously, achieve well and make circuit (comprising special-shaped circuit) on metallic carrier, for the circuit board obtaining various different purposes provides new method.
The third aspect, embodiments provides a kind of preparation method of high heat conduction metal-based circuit board, comprises the following steps:
(1) mixed in proportion with cosolvent by the mixture of PETG and polybutylene terephthalate, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder; after being fully ground; obtain aluminium oxide, aluminium nitride and boron nitride powder mixture; at atmosphere protection, at 60-80 DEG C of temperature, described aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture; add diluent, curing agent again; dispersed with stirring is even, obtains coating, and above-mentioned each raw material is by following mass percentage mixing:
The mixture 40-60% of PETG and polybutylene terephthalate;
Aluminium oxide, aluminium nitride and boron nitride powder mixture 30-40%;
Cosolvent: 5-10%;
Diluent: 3-10%;
Curing agent: 0.5-1%;
The gross mass percentage composition of above-mentioned each raw material components is 100%;
(2) get metal substrate, above-mentioned gained coating mixed rear coating with laser active powder or be printed on described metal substrate, solidifying at 140-170 DEG C of temperature, described metal substrate forms thermally conductive insulating layer;
(3) utilize laser active powder described in laser active, at described thermally conductive insulating layer circuit forming surface pattern, then form circuit by the mode of chemical plating, obtain high heat conduction metal-based circuit board.
Preferably, in the mixture of described PETG and polybutylene terephthalate, the mass ratio of PETG and polybutylene terephthalate is 2:2-6.More preferably, the mass ratio of PETG and polybutylene terephthalate is 2:3-4.
The coating of thermally conductive insulating layer of the present invention adopts the mixture of PETG and polybutylene terephthalate as carrier, by the performance synthesis of two kinds of resins, coating can be made finally to produce good adhesive force and adhesion with the carrier of unlike material, the coefficient of expansion of coating match circuit part can be made simultaneously, improve the stability of circuit board.
Preferably, the mass percentage of the mixture of described PETG and polybutylene terephthalate is 45-55%.
Aluminium oxide, aluminium nitride and boron nitride powder have good heat conductivility, and good stability, be added in coating, coating thermal resistance can be reduced, improve the overall thermal conductivity energy of coating.Preferably, the mass percentage of described aluminium oxide, aluminium nitride and boron nitride powder mixture is 30-35%.
Preferably, in described aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:1-3:3-5, the grain diameter of described aluminium oxide is 0.1-2 micron, the grain diameter of described aluminium nitride is 0.1-1.5 micron, and the grain diameter of described boron nitride is 0.1-1 micron.The present invention combines by adopting the aluminium oxide of above-mentioned quality proportioning and particle size range, aluminium nitride and boron nitride, can make to form good heat conductive approach in coating, make whole paint coatings form heat conduction network chain, improve the overall heat conduction effect of coating, improve the mechanical property of coating simultaneously.More preferably, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:2:4.More preferably, the grain diameter of described aluminium oxide is 1-2 micron, the grain diameter of described aluminium nitride is 0.5-1.5 micron, and the grain diameter of described boron nitride is 0.1-0.5 micron.
Preferably, the mass percentage of described cosolvent is 6-8%; The mass percentage of described diluent is 5-8%; The mass percentage of described curing agent is 0.6-0.8%.
Preferably, described cosolvent can be acetamide, alcohols or alcohol ether organic solvent.Can be specifically isopropyl alcohol, isobutanol, n-butanol, propylene glycol monomethyl ether, ethylene glycol ethyl ether, butyl etc.
Preferably, described diluent can be n-butanol, styrene, ethyl acetate, butyl acetate, toluene, dimethylbenzene, butanone, acetone, phenmethylol, cyclohexanone, ether alcohol.
Preferably, the main component of described curing agent is dibutyl phthalate.Certainly, other curing agent that can realize paint solidification of the present invention is also suitable for the present invention.
Preferably, described atmosphere can be nitrogen, argon gas or helium.
Preferably, the speed of described stirring is 200-500r/min, and described dispersed with stirring process can complete in three-roller.
In the present invention, metal substrate can be aluminium base, stainless steel substrate etc.Before thermally conductive insulating layer is set, remove grease and the impurity of metallic substrate surfaces.
Preferably, the thickness of described thermally conductive insulating layer is 20-60 micron.
In the present invention, the mode of described coating comprises spraying.
In the present invention, the time of described solidification can be 30 ~ 50 minutes.Particularly, can determine according to the heat conductive insulating layer thickness of pre-making curing time.Thermally conductive insulating layer obtains by coating or printing multilayer.
In the present invention, the mass ratio of described coating and laser active powder is 100:2-6.
In the present invention, circuit can be arbitrary form, comprises special-shaped circuit, as 3D face, and curved surface etc.
The preparation method that the embodiment of the present invention third aspect provides, technique is simple, by arranging thermally conductive insulating layer on metallic substrates, make the high heat conduction metal-based circuit board prepared, its conductive coefficient reaches 5-15W/k.m, energy effective, the temperature at electronic product center is effectively derived, again by the heat radiation of outside heat dissipation channel, thus the stability of electronic devices and components can be improved, useful life and result of use, simultaneously, achieve well and make circuit (comprising special-shaped circuit) on metallic carrier, for the circuit board obtaining various different purposes provides new method.
The advantage of the embodiment of the present invention will partly be illustrated in the following description, and a part is apparent according to specification, or can be known by the enforcement of the embodiment of the present invention.
Embodiment
The following stated is the preferred implementation of the embodiment of the present invention; should be understood that; for those skilled in the art; under the prerequisite not departing from embodiment of the present invention principle; can also make some improvements and modifications, these improvements and modifications are also considered as the protection range of the embodiment of the present invention.
Multiple embodiment is divided to be further detailed the embodiment of the present invention below.Wherein, the embodiment of the present invention is not limited to following specific embodiment.In the scope of constant principal right, carrying out that can be suitable is changed and implements.
Embodiment one
A preparation method for high heat conduction metal-based circuit board, comprises the following steps:
(1) be that the PETG of 2:3 and the mixture of polybutylene terephthalate mix in proportion with cosolvent isopropyl alcohol by mass ratio, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder, after being fully ground, obtain aluminium oxide, aluminium nitride and boron nitride powder mixture, protect at nitrogen atmosphere, at 80 DEG C of temperature, aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture, add diluent acetone, curing agent again, 220r/min dispersed with stirring is even, namely obtain high heat conduction height coatings, above-mentioned each raw material is by following mass percentage proportioning mixing: the mixture 50% of PETG and polybutylene terephthalate; Aluminium oxide, aluminium nitride and boron nitride powder mixture 40%; Cosolvent: 5%; Diluent: 4%; Curing agent: 1%.
In the present embodiment, in aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:2:4, and the grain diameter of described aluminium oxide is 1 micron, the grain diameter of described aluminium nitride is 0.5 micron, and the grain diameter of described boron nitride is 0.1 micron.
(2) get aluminium base, after removing surperficial grease and impurity, above-mentioned gained coating is printed on described aluminium base, solidify 30 minutes at 150 DEG C of temperature, form the thermally conductive insulating layer that thickness is 40 microns;
(3) mixture of PETG and polybutylene terephthalate is separately got, with conducting powder copper powder in mass ratio 100:60 mix, making obtains electrocondution slurry, utilize gained electrocondution slurry to be directly printed as circuit in described thermally conductive insulating layer, obtain high heat conduction metal-based circuit board.
Embodiment two
A preparation method for high heat conduction metal-based circuit board, comprises the following steps:
(1) be that the PETG of 2:3 and the mixture of polybutylene terephthalate mix in proportion with cosolvent n-butanol by mass ratio, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder, after being fully ground, obtain aluminium oxide, aluminium nitride and boron nitride powder mixture, protect at nitrogen atmosphere, at 80 DEG C of temperature, aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture, add diluent n-butanol, curing agent again, 220r/min dispersed with stirring is even, namely obtain high heat conduction height coatings, above-mentioned each raw material is by following mass percentage proportioning mixing: the mixture 50% of PETG and polybutylene terephthalate; Aluminium oxide, aluminium nitride and boron nitride powder mixture 35%; Cosolvent: 8%; Diluent: 6%; Curing agent: 1%.
In the present embodiment, in aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:3:5, and the grain diameter of described aluminium oxide is 1 micron, the grain diameter of described aluminium nitride is 0.5 micron, and the grain diameter of described boron nitride is 0.1 micron.
(2) get aluminium base, after removing surperficial grease and impurity, by above-mentioned gained spray painting on described aluminium base, solidify 50 minutes at 170 DEG C of temperature, form the thermally conductive insulating layer that thickness is 60 microns;
(3) mixture of PETG and polybutylene terephthalate is separately got, with conducting powder silver powder in mass ratio 100:75 mix, making obtains electrocondution slurry, utilize gained electrocondution slurry to be directly printed as circuit in described thermally conductive insulating layer, obtain high heat conduction metal-based circuit board.
Embodiment three
A preparation method for high heat conduction metal-based circuit board, comprises the following steps:
(1) be that the PETG of 2:5 and the mixture of polybutylene terephthalate mix in proportion with cosolvent ethylene glycol ethyl ether by mass ratio, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder, after being fully ground, obtain aluminium oxide, aluminium nitride and boron nitride powder mixture, protect at nitrogen atmosphere, at 80 DEG C of temperature, aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture, add diluent ethyl acetate, curing agent again, 220r/min dispersed with stirring is even, namely obtain high heat conduction height coatings, above-mentioned each raw material is by following mass percentage proportioning mixing: the mixture 60% of PETG and polybutylene terephthalate; Aluminium oxide, aluminium nitride and boron nitride powder mixture 30%; Cosolvent: 5%; Diluent: 4%; Curing agent: 1%.
In the present embodiment, in aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:1:3, and the grain diameter of described aluminium oxide is 2 microns, the grain diameter of described aluminium nitride is 1.5 microns, and the grain diameter of described boron nitride is 0.5 micron.
(2) get stainless steel substrate, after removing surperficial grease and impurity, above-mentioned gained coating is printed on described stainless steel substrate, solidify 40 minutes at 140 DEG C of temperature, form the thermally conductive insulating layer that thickness is 20 microns;
(3) mixture of PETG and polybutylene terephthalate is separately got, with conducting powder silver powder in mass ratio 100:40 mix, making obtains electrocondution slurry, utilize gained electrocondution slurry to be directly printed as circuit in described thermally conductive insulating layer, obtain high heat conduction metal-based circuit board.
Embodiment four
A preparation method for high heat conduction metal-based circuit board, comprises the following steps:
(1) be that the PETG of 2:6 and the mixture of polybutylene terephthalate mix in proportion with cosolvent isopropyl alcohol by mass ratio, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder, after being fully ground, obtain aluminium oxide, aluminium nitride and boron nitride powder mixture, protect at nitrogen atmosphere, at 80 DEG C of temperature, aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture, add diluent acetone, curing agent again, 220r/min dispersed with stirring is even, namely obtain high heat conduction height coatings, above-mentioned each raw material is by following mass percentage proportioning mixing: the mixture 42% of PETG and polybutylene terephthalate; Aluminium oxide, aluminium nitride and boron nitride powder mixture 40%; Cosolvent: 10%; Diluent: 7.5%; Curing agent: 0.5%.
In the present embodiment, in aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:2:4, and the grain diameter of described aluminium oxide is 0.1 micron, the grain diameter of described aluminium nitride is 1 micron, and the grain diameter of described boron nitride is 0.1 micron.
(2) aluminium base is got, after removing surperficial grease and impurity, by above-mentioned gained coating and laser active powder in mass ratio 100:4 be sprayed on after mixing on described aluminium base, solidify 50 minutes at 150 DEG C of temperature, described aluminium base formed the thermally conductive insulating layer that thickness is 50 microns;
(3) utilize laser active powder described in laser active, at described thermally conductive insulating layer circuit forming surface pattern, then form circuit by the mode of chemical plating, obtain high heat conduction metal-based circuit board.
Embodiment five
A preparation method for high heat conduction metal-based circuit board, comprises the following steps:
(1) be that the PETG of 2:3 and the mixture of polybutylene terephthalate mix in proportion with cosolvent isopropyl alcohol by mass ratio, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder, after being fully ground, obtain aluminium oxide, aluminium nitride and boron nitride powder mixture, protect at nitrogen atmosphere, at 80 DEG C of temperature, aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture, add diluent acetone, curing agent again, 220r/min dispersed with stirring is even, namely obtain high heat conduction height coatings, above-mentioned each raw material is by following mass percentage proportioning mixing: the mixture 50% of PETG and polybutylene terephthalate; Aluminium oxide, aluminium nitride and boron nitride powder mixture 35%; Cosolvent: 10%; Diluent: 4.5%; Curing agent: 0.5%.
In the present embodiment, in aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:2:4, and the grain diameter of described aluminium oxide is 1 micron, the grain diameter of described aluminium nitride is 0.5 micron, and the grain diameter of described boron nitride is 0.1 micron.
(2) stainless steel substrate is got, after removing surperficial grease and impurity, by above-mentioned gained coating and laser active powder in mass ratio 100:5 be printed on after mixing on described stainless steel substrate, solidify 30 minutes at 170 DEG C of temperature, stainless steel substrate is formed the thermally conductive insulating layer that thickness is 30 microns;
(3) utilize laser active powder described in laser active, at described thermally conductive insulating layer circuit forming surface pattern, then form circuit by the mode of chemical plating, obtain high heat conduction metal-based circuit board.
After testing, the conductive coefficient of the above embodiment of the present invention gained high heat conduction metal-based circuit board can reach 5-20W/k.m, the voltage breakdown of 5-10KV can be carried, resistance to 300 DEG C of high temperature, resistance to acids and bases, within resistance to 96 hours, salt spray test reaches 9 grade standards, cold-and-heat resistent circulation and cold-and-heat resistent impact property well, test (temperature 85 DEG C, humidity 85) by two 85, and by test in UV72 hour, embodiment of the present invention thermally conductive insulating layer adhesive force was on metallic substrates one-level.
Above disclosedly be only present pre-ferred embodiments, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (10)
1. a high heat conduction metal-based circuit board, it is characterized in that, the circuit comprising metal substrate, be arranged on the thermally conductive insulating layer of described metallic substrate surfaces and be formed in described thermally conductive insulating layer, the material of described thermally conductive insulating layer comprises coating, and described coating comprises the raw material components of following mass percentage:
The mixture 40-60% of PETG and polybutylene terephthalate;
Aluminium oxide, aluminium nitride and boron nitride powder mixture 30-40%;
Cosolvent: 5-10%;
Diluent: 3-10%;
Curing agent: 0.5-1%;
The gross mass percentage composition of above-mentioned each raw material components is 100%.
2. high heat conduction metal-based circuit board as claimed in claim 1, it is characterized in that, the thickness of described thermally conductive insulating layer is 20-60 micron.
3. high heat conduction metal-based circuit board as claimed in claim 1, it is characterized in that, in the mixture of described PETG and polybutylene terephthalate, the mass ratio of PETG and polybutylene terephthalate is 2:2-6.
4. high heat conduction metal-based circuit board as claimed in claim 1, it is characterized in that, the mass percentage of the mixture of described PETG and polybutylene terephthalate is 45-55%.
5. high heat conduction metal-based circuit board as claimed in claim 1, it is characterized in that, the mass percentage of described aluminium oxide, aluminium nitride and boron nitride powder mixture is 30-35%.
6. high heat conduction metal-based circuit board as claimed in claim 1, it is characterized in that, in described aluminium oxide, aluminium nitride and boron nitride powder mixture, the mass ratio of aluminium oxide, aluminium nitride and boron nitride is 1:1-3:3-5, the grain diameter of described aluminium oxide is 0.1-2 micron, the grain diameter of described aluminium nitride is 0.1-1.5 micron, and the grain diameter of described boron nitride is 0.1-1 micron.
7. high heat conduction metal-based circuit board as claimed in claim 1, it is characterized in that, described cosolvent is acetamide, alcohols or alcohol ether organic solvent, and described diluent is n-butanol, styrene, ethyl acetate, butyl acetate, toluene, dimethylbenzene, butanone, acetone, phenmethylol, cyclohexanone, ether alcohol.
8. high heat conduction metal-based circuit board as claimed in claim 1, it is characterized in that, the main component of described curing agent is dibutyl phthalate.
9. a preparation method for high heat conduction metal-based circuit board, is characterized in that, comprises the following steps:
(1) mixed in proportion with cosolvent by the mixture of PETG and polybutylene terephthalate, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder; after being fully ground; obtain aluminium oxide, aluminium nitride and boron nitride powder mixture; at atmosphere protection, at 60-80 DEG C of temperature, described aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture; add diluent, curing agent again; dispersed with stirring is even, obtains coating, and above-mentioned each raw material is by following mass percentage mixing:
The mixture 40-60% of PETG and polybutylene terephthalate;
Aluminium oxide, aluminium nitride and boron nitride powder mixture 30-40%;
Cosolvent: 5-10%;
Diluent: 3-10%;
Curing agent: 0.5-1%;
The gross mass percentage composition of above-mentioned each raw material components is 100%;
(2) get metal substrate, by above-mentioned gained paint or be printed on described metal substrate, solidify at 140-170 DEG C of temperature, form thermally conductive insulating layer;
(3) mixture of PETG and polybutylene terephthalate is separately got, mix with conducting powder, making obtains electrocondution slurry, utilizes described electrocondution slurry to be directly printed as circuit in described thermally conductive insulating layer, obtains high heat conduction metal-based circuit board.
10. a preparation method for high heat conduction metal-based circuit board, is characterized in that, comprises the following steps:
(1) mixed in proportion with cosolvent by the mixture of PETG and polybutylene terephthalate, abundant stirring reaction is complete, obtains slurry; Get aluminium oxide, aluminium nitride and boron nitride powder; after being fully ground; obtain aluminium oxide, aluminium nitride and boron nitride powder mixture; at atmosphere protection, at 60-80 DEG C of temperature, described aluminium oxide, aluminium nitride are mixed with above-mentioned gained slurry with boron nitride powder mixture; add diluent, curing agent again; dispersed with stirring is even, obtains coating, and above-mentioned each raw material is by following mass percentage mixing:
The mixture 40-60% of PETG and polybutylene terephthalate;
Aluminium oxide, aluminium nitride and boron nitride powder mixture 30-40%;
Cosolvent: 5-10%;
Diluent: 3-10%;
Curing agent: 0.5-1%;
The gross mass percentage composition of above-mentioned each raw material components is 100%;
(2) get metal substrate, above-mentioned gained coating mixed rear coating with laser active powder or be printed on described metal substrate, solidifying at 140-170 DEG C of temperature, described metal substrate forms thermally conductive insulating layer;
(3) utilize laser active powder described in laser active, at described thermally conductive insulating layer circuit forming surface pattern, then form circuit by the mode of chemical plating, obtain high heat conduction metal-based circuit board.
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| CN201510601252.4A CN105120591A (en) | 2015-09-18 | 2015-09-18 | High thermal conductivity metal base circuit board and preparing method thereof |
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| CN201510601252.4A CN105120591A (en) | 2015-09-18 | 2015-09-18 | High thermal conductivity metal base circuit board and preparing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109842988A (en) * | 2017-11-29 | 2019-06-04 | 东莞新科技术研究开发有限公司 | Printed circuit board |
| CN113442527A (en) * | 2021-07-07 | 2021-09-28 | 王氏港建移动科技有限公司 | Metal polymer interfaces useful in electronic circuits or components |
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| JP3412518B2 (en) * | 1998-06-16 | 2003-06-03 | 住友金属鉱山株式会社 | Thermal conductive resin paste |
| WO2010143800A1 (en) * | 2009-06-12 | 2010-12-16 | (주)솔라원 | Metal printed circuit board having thermal interface layer |
| CN102746769A (en) * | 2012-07-31 | 2012-10-24 | 江苏元京电子科技有限公司 | Thermosetting heat conduction and radiation coating and preparation method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3412518B2 (en) * | 1998-06-16 | 2003-06-03 | 住友金属鉱山株式会社 | Thermal conductive resin paste |
| WO2010143800A1 (en) * | 2009-06-12 | 2010-12-16 | (주)솔라원 | Metal printed circuit board having thermal interface layer |
| CN102746769A (en) * | 2012-07-31 | 2012-10-24 | 江苏元京电子科技有限公司 | Thermosetting heat conduction and radiation coating and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109842988A (en) * | 2017-11-29 | 2019-06-04 | 东莞新科技术研究开发有限公司 | Printed circuit board |
| CN113442527A (en) * | 2021-07-07 | 2021-09-28 | 王氏港建移动科技有限公司 | Metal polymer interfaces useful in electronic circuits or components |
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