CN105101610B - Flexible circuit board and flexible LED lamp band with the flexible circuit board - Google Patents
Flexible circuit board and flexible LED lamp band with the flexible circuit board Download PDFInfo
- Publication number
- CN105101610B CN105101610B CN201410214673.7A CN201410214673A CN105101610B CN 105101610 B CN105101610 B CN 105101610B CN 201410214673 A CN201410214673 A CN 201410214673A CN 105101610 B CN105101610 B CN 105101610B
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- Prior art keywords
- circuit board
- conductive wire
- flexible circuit
- main traverse
- traverse line
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 55
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 27
- NOQGZXFMHARMLW-UHFFFAOYSA-N Daminozide Chemical group CN(C)NC(=O)CCC(O)=O NOQGZXFMHARMLW-UHFFFAOYSA-N 0.000 claims description 19
- 239000011324 bead Substances 0.000 claims description 7
- 230000015556 catabolic process Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 42
- 238000005538 encapsulation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of flexible circuit board and the flexible LED lamp band with the flexible circuit board, flexible circuit board include：Conductor layer, conductor layer include the first main traverse line being arranged side by side, the second main traverse line and the packaging conductive wire between the first main traverse line and the second main traverse line, and the fracture for potted element is provided on packaging conductive wire；Insulating layer, insulating layer are set on the surface of conductor layer side；Solder mask, solder mask are set on the surface of the conductor layer other side, and window corresponding with fracture is provided on solder mask；Further include：Isolating separator layer, isolating separator layer are set between packaging conductive wire and the first main traverse line and the second main traverse line, for insulating to packaging conductive wire and the first main traverse line, the second main traverse line.The flexible circuit board of the present invention, isolating separator layer main traverse line and packaging conductive wire will not be connected up because of conducting wire in slight shift or thermal breakdown cause short circuit, therefore functional, circuit reliability is high, long lifespan.
Description
Technical field
The present invention relates to circuit boards, more particularly to a kind of flexible circuit board and with the flexible LED lamp of the flexible circuit board
Band.
Background technology
LED has significant energy saving and service life advantage as a forth generation lighting source.With the development of society, daily
Lighting energy consumption problem in life becomes increasingly conspicuous, and therefore, the LED lamp with notable power savings advantages is increasingly by the blueness of people
It looks at.
Flexible LED lamp band flexible circuit board can arbitrarily be bent, fold, wind because FPC materials are soft, can be in three-dimensional
Space is arbitrarily mobile and flexible without fractureing.The place for being suitable for irregular place and narrow space uses, also because it can
To be arbitrarily bent and wind, it is suitable in ad decoration arbitrarily combining various patterns.Therefore, LED flexible circuit boards are in feelings
Using more and more extensive in scape illumination and emotional-appeal illumination.
Conducting wire between the conductor layer of existing flexible circuit board is juxtaposed flat conductor, the main traverse line on both sides and centre
The direct gap of conducting wire is generally 0.6mm, due to the slight shift of flat conductor in the wiring of juxtaposition conducting wire, just easily causes
Two main traverse lines and central conductor are in direct contact short circuit and scrap；Meanwhile the main traverse line and central conductor on both sides do not carry out
Dielectric separation, during soft light bar use, the especially soft light bar of high pressure, heat dissipation is bad to cause thermal breakdown to cause two main traverse lines
With central conductor being in direct contact short circuit and scrap.
Invention content
Present situation for the above-mentioned prior art, technical problem to be solved by the present invention lies in provide a kind of flexible circuit board
And the flexible LED lamp band with the flexible circuit board, it is avoided that main traverse line with central conductor because of the small shifting in conducting wire wiring
Position or thermal breakdown cause short circuit.
In order to solve the above-mentioned technical problem, a kind of flexible circuit board provided by the present invention, including：
Conductor layer, the conductor layer include the first main traverse line being arranged side by side, the second main traverse line and are led positioned at described first
Packaging conductive wire between conducting wire and second main traverse line is provided with the fracture for potted element on the packaging conductive wire；
Insulating layer, the insulating layer are set on the surface of the conductor layer side；
Solder mask, the solder mask is set on the surface of the conductor layer other side, and is arranged on the solder mask
There is window corresponding with the fracture；Further include：
Isolating separator layer, the isolating separator layer are set to the packaging conductive wire and first main traverse line and described second
Between main traverse line, for insulating to the packaging conductive wire and first main traverse line, second main traverse line.
The isolating separator layer includes in one of the embodiments,：
First lattice, first lattice are set between the packaging conductive wire and first main traverse line；
Second lattice, second lattice be set between the packaging conductive wire and second main traverse line and
Interconnecting piece, the interconnecting piece are connected between first lattice and second lattice.
The isolating separator layer further includes in one of the embodiments,：
Interconnecting piece, the interconnecting piece are set between the conductor layer and the insulating layer, and the both ends of the interconnecting piece
It is connect respectively close to one end of the insulating layer side with first lattice and second lattice, the interconnecting piece, institute
It states and forms groove between the first lattice and second lattice, the packaging conductive wire is placed in the groove.
The isolating separator layer further includes in one of the embodiments,：
First alar part, first alar part from first lattice close to the solder mask side one end to the groove
Outer extension, and cover first main traverse line；
Second alar part, second alar part from second lattice close to the solder mask side one end to the groove
Outer extension, and cover second main traverse line.
The solder mask only covers the surface of the packaging conductive wire in one of the embodiments,.
The solder mask covers the packaging conductive wire, first alar part and described second in one of the embodiments,
The surface of alar part.
The packaging conductive wire is two or more in one of the embodiments, and two or more the packaging conductive wires are mutual
In parallel or series.
Mutually insulated separates between each packaging conductive wire in one of the embodiments,.
In one of the embodiments, the fracture is provided on each packaging conductive wire；Or described in adjacent two
The fracture is formed between packaging conductive wire.
A kind of flexible LED lamp band provided by the present invention, including flexible circuit board and multiple LED lamp beads, the flexible circuit
Plate is above-mentioned flexible circuit board, and multiple LED lamp beads are encapsulated in the incision position.
Compared with prior art, flexible circuit board of the invention and the flexible LED lamp band with the flexible circuit board, by exhausted
The main traverse line on the both sides of conductor layer and intermediate packaging conductive wire are carried out insulation processing by fate interlayer so that main traverse line is led with encapsulation
Line will not be connected up because of conducting wire in slight shift or thermal breakdown cause short circuit, therefore functional, circuit reliability is high, the service life
It is long.
Advantageous effect possessed by additional technical feature of the present invention will be said in this specification specific embodiment part
It is bright.
Description of the drawings
Fig. 1 is the structural schematic diagram of the conductor layer and isolating separator layer of the flexible circuit board in inventive embodiments one；
Fig. 2 is the close-up schematic view at I in Fig. 1；
Fig. 3 is the cross section structure schematic diagram of the flexible circuit board in inventive embodiments one；
Fig. 4 is the cross section structure schematic diagram of the flexible circuit board in inventive embodiments two.
The above each figure, 1, isolating separator layer；11, interconnecting piece；12, the first lattice；13, the second lattice；14, first wing
Portion；15, the second alar part；16, groove；2, insulating layer；3, conductor layer；31, the first main traverse line；32, packaging conductive wire；321, fracture；
33, the second main traverse line；4, solder mask；5, component encapsulation layer.
Specific implementation mode
Below with reference to the accompanying drawings and in conjunction with the embodiments the present invention is described in detail.It should be noted that not conflicting
In the case of, the feature in following embodiment and embodiment can be combined with each other.
As shown in Figures 1 to 3, the flexible circuit board in the embodiment of the present invention one includes conductor layer 3, insulating layer 2, solder mask 4
With isolating separator layer 1, wherein conductor layer 3 includes the first main traverse line 31 being arranged side by side, the second main traverse line 33 and positioned at described the
Packaging conductive wire 32 between one main traverse line 31 and second main traverse line 33 needs to be arranged on the packaging conductive wire 32 according to circuit
Be useful for the fracture 321 of potted element, on the position of the fracture 321, required circuit connection LED lamp bead and/or
The potted elements such as resistance carry out electric current connection and form circuit-line.
The isolating separator layer 1 is set to the packaging conductive wire 32 and first main traverse line 31 and second main traverse line
Between 33, for insulating to the packaging conductive wire 32 and first main traverse line 31, second main traverse line 33.In this way,
In the juxtaposition wiring process of conductor layer 3, the first main traverse line 31, second would not be caused leading because of the slight shift of conducting wire
Line 33 is with being in direct contact for packaging conductive wire 32 and short circuit is scrapped；It is also possible to prevent due to the use of the undesirable thermal shock that in the process, radiates
Wear etc. reasons cause the first main traverse line 31, the second main traverse line 33 and 32 short circuit of packaging conductive wire and cause flexible circuit board to be scrapped.
The isolating separator layer 1 includes the first lattice 12, the second lattice 13 and interconnecting piece 11, first lattice
12 are set between the packaging conductive wire 32 and first main traverse line 31；Second lattice 13 is set to the encapsulation and leads
Between line 32 and second main traverse line 33；The interconnecting piece 11 is set between the conductor layer 3 and the insulating layer 2, and
The both ends of the interconnecting piece 11 are respectively with first lattice 12 and second lattice 13 close to 2 side of the insulating layer
One end connects, and groove 16, the envelope are formed between the interconnecting piece 11, first lattice 12 and second lattice 13
Dress conducting wire 32 is placed in the groove 16.Further, the isolating separator layer 1 further includes the first alar part 14 and the second alar part
15, first alar part 14 extends close to one end of 4 side of the solder mask to outside the groove 16 from first lattice 12,
And cover first main traverse line 31；Second alar part 15 is from second lattice 13 close to the one of 4 side of the solder mask
It holds and extends outside the groove 16, and cover second main traverse line 33.
The insulating layer 2 is set on the surface of 3 side of the conductor layer.The solder mask 4 is set to the conductor layer 3
On the surface of the other side, and window (not shown) corresponding with the fracture 321 is provided on the solder mask 4.
Preferably, solder mask 4 is only covered on the packaging conductive wire 32, it is preferable that the covering resistance in advance of packaging conductive wire 32 may be used
Layer 4, and reserved window, then by cover solder mask 4 after packaging conductive wire 32 be mounted on the first main traverse line 31 and second
On the isolating separator layer 1 of 33 dielectric separation of main traverse line, is then mounted together with insulating layer 2 and form flexible circuit board.
Two sections of encapsulation for being not covered with solder mask 4 are reserved on the reserved potted element fracture 321 of flexible circuit board packaging conductive wire 32
Conducting wire 32, to form the component encapsulation layer 5 needed for flexible circuit board.
Fig. 4 is the structural schematic diagram of the flexible circuit board of the embodiment of the present invention two.Remaining is identical as embodiment one, different
It is that the solder mask 4 covers the surface of the packaging conductive wire 32, first alar part 14 and second alar part 15.
It should be noted that for the sake of simplicity and as an example, the packaging conductive wire 32 is one, but not indicating that encapsulation is led
Line 32 is only only one.It as deformation or improves, packaging conductive wire 32 can be 2 or more, the circuit between packaging conductive wire 32
The flexible ways such as in parallel and/or series connection may be used in connection, for example packaging conductive wire 32 is two and equally carries out dielectric separation processing
Conducting wire, each packaging conductive wire 32 can have oneself string with fracture 321 shown in above-described embodiment, each packaging conductive wire 32
Circuit is connected and/or be connected in parallel to the electric current of connection with another packaging conductive wire 32；Can also each encapsulation lead
Line 32 does not have to reserved fracture 321, by forming the fracture 321 between two adjacent packaging conductive wires 32.
To sum up, due to having used dielectric separation to handle between the main traverse line of conductor layer 3 and packaging conductive wire 32, thus can
It avoids, because the slight shift in 3 wiring process of conductor layer leads to short circuit, capable of also preventing because because radiating not during use
Short-circuit caused by good thermal breakdown, the reliability of such flexible circuit board improves, and service life is long.
The present invention also provides a kind of flexible LED lamp band, including flexible circuit board and multiple LED lamp beads, the flexible circuits
Plate is the flexible circuit board of above-described embodiment, and multiple LED lamp beads are encapsulated in the incision position.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.
Claims (8)
1. a kind of flexible circuit board, including：
Conductor layer, the conductor layer include the first main traverse line being arranged side by side, the second main traverse line and be located at first main traverse line
With the packaging conductive wire between second main traverse line, the fracture for potted element is provided on the packaging conductive wire；
Insulating layer, the insulating layer are set on the surface of the conductor layer side；
Solder mask, the solder mask are set on the surface of the conductor layer other side, and be provided on the solder mask with
The corresponding window of fracture；
It is characterized in that, further including：
Isolating separator layer, the isolating separator layer are set to the packaging conductive wire and are dominated with first main traverse line and described second
Between line, the isolating separator layer includes：First lattice, first lattice are set to the packaging conductive wire and described the
Between one main traverse line；Second lattice, second lattice are set between the packaging conductive wire and second main traverse line
And interconnecting piece, the interconnecting piece are connected between first lattice and second lattice, the interconnecting piece setting
Between the conductor layer and the insulating layer, and the both ends of the interconnecting piece respectively with first lattice and described second
Lattice close to the insulating layer side one end connect, the interconnecting piece, first lattice and second lattice it
Between form groove, the packaging conductive wire is placed in the groove.
2. flexible circuit board according to claim 1, which is characterized in that the isolating separator layer further includes：
First alar part, first alar part from first lattice close to the solder mask side one end to the groove extension
It stretches, and covers first main traverse line；
Second alar part, second alar part from second lattice close to the solder mask side one end to the groove extension
It stretches, and covers second main traverse line.
3. flexible circuit board according to claim 2, which is characterized in that the solder mask only covers the packaging conductive wire
Surface.
4. flexible circuit board according to claim 2, which is characterized in that the solder mask covers the packaging conductive wire, institute
State the surface of the first alar part and second alar part.
5. flexible circuit board as claimed in any of claims 1 to 4, which is characterized in that the packaging conductive wire is two
More than root, two or more the packaging conductive wires are parallel with one another or connect.
6. flexible circuit board according to claim 5, which is characterized in that mutually insulated point between each packaging conductive wire
Every.
7. flexible circuit board according to claim 5, which is characterized in that be provided on each packaging conductive wire described disconnected
Mouthful；Or form the fracture between two adjacent packaging conductive wires.
8. a kind of flexible LED lamp band, including flexible circuit board and multiple LED lamp beads, which is characterized in that the flexible circuit board is such as
Flexible circuit board described in any one of claim 1 to 7, multiple LED lamp beads are encapsulated in the incision position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410214673.7A CN105101610B (en) | 2014-05-20 | 2014-05-20 | Flexible circuit board and flexible LED lamp band with the flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410214673.7A CN105101610B (en) | 2014-05-20 | 2014-05-20 | Flexible circuit board and flexible LED lamp band with the flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105101610A CN105101610A (en) | 2015-11-25 |
| CN105101610B true CN105101610B (en) | 2018-08-24 |
Family
ID=54580822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410214673.7A Active CN105101610B (en) | 2014-05-20 | 2014-05-20 | Flexible circuit board and flexible LED lamp band with the flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101610B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0818652A2 (en) * | 1996-07-11 | 1998-01-14 | HAPPICH Fahrzeug- und Industrieteile GmbH | Lighting strip an method of manufacturing |
| CN201910973U (en) * | 2010-09-01 | 2011-07-27 | 王定锋 | Full-series LED (Light-Emitting Diode) circuit board made of flat leads |
| CN201928521U (en) * | 2010-08-24 | 2011-08-10 | 张�林 | Double-sided circuit board manufactured by adhering double-sided glued insulation layer to flat wires |
| CN203661401U (en) * | 2013-11-01 | 2014-06-18 | 鹤山市银雨照明有限公司 | LED lamp circuit board comprising multilayer flat wire |
| CN203912316U (en) * | 2014-05-20 | 2014-10-29 | 广东德豪润达电气股份有限公司 | A flexible circuit board and an LED flexible lamp strip with the flexible circuit board |
-
2014
- 2014-05-20 CN CN201410214673.7A patent/CN105101610B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0818652A2 (en) * | 1996-07-11 | 1998-01-14 | HAPPICH Fahrzeug- und Industrieteile GmbH | Lighting strip an method of manufacturing |
| CN201928521U (en) * | 2010-08-24 | 2011-08-10 | 张�林 | Double-sided circuit board manufactured by adhering double-sided glued insulation layer to flat wires |
| CN201910973U (en) * | 2010-09-01 | 2011-07-27 | 王定锋 | Full-series LED (Light-Emitting Diode) circuit board made of flat leads |
| CN203661401U (en) * | 2013-11-01 | 2014-06-18 | 鹤山市银雨照明有限公司 | LED lamp circuit board comprising multilayer flat wire |
| CN203912316U (en) * | 2014-05-20 | 2014-10-29 | 广东德豪润达电气股份有限公司 | A flexible circuit board and an LED flexible lamp strip with the flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105101610A (en) | 2015-11-25 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190912 Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: ELEC-TECH INTERNATIONAL CO.,LTD. Address before: 4 building, No. six, No. 18, Harbour Road, Tang Town, Xiangzhou District, Zhuhai, Guangdong, 519000 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: Zhuhai Leishi Lighting Co.,Ltd. Address before: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200511 Address after: No. 1308, Yannan Road, Bengbu City, Anhui Province (No. 1 in the Institute of Bengbu Dehao Photoelectric Technology Co., Ltd.) Patentee after: BENGBU NVC LIGHTING TECHNOLOGY Co.,Ltd. Address before: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee before: Zhuhai Leishi Lighting Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220117 Address after: 516021 Leishi Industrial Park, Ruhu Town, Huizhou City, Guangdong Province Patentee after: NVC Lighting Technology Co.,Ltd. Patentee after: CHONGQING NVC LIGHTING Co.,Ltd. Address before: No. 1308, Yannan Road, Bengbu City, Anhui Province (No. 1 in the Institute of Bengbu Dehao Photoelectric Technology Co., Ltd.) Patentee before: BENGBU NVC LIGHTING TECHNOLOGY Co.,Ltd. |