CN105100979A - Microphone packaging structure with improved electromagnetic interference resistance - Google Patents
Microphone packaging structure with improved electromagnetic interference resistance Download PDFInfo
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- CN105100979A CN105100979A CN201410184956.1A CN201410184956A CN105100979A CN 105100979 A CN105100979 A CN 105100979A CN 201410184956 A CN201410184956 A CN 201410184956A CN 105100979 A CN105100979 A CN 105100979A
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Abstract
The invention relates to the field of electronic technology, in particular to a microphone packaging structure. The microphone packaging structure with improved electromagnetic interference resistance comprises a transducer, a signal processing circuit, a circuit board substrate and at least one electromagnetic interference suppression element, wherein the transducer is used for sensing sound signals and converting the sound signals into electric signals; the signal processing circuit comprises a signal input end and a signal output end, the signal input end is connected with the transducer, and the signal output end outputs signals to an external circuit; the circuit board substrate is used for setting the transducer and the signal processing circuit; the electromagnetic interference suppression elements are distributed on the circuit board substrate and/or connected between the transducer and the signal input end, and are used for suppressing electromagnetic interference signals. The microphone packaging structure can effectively improve the electromagnetic interference resistant characteristics by arranging the electromagnetic interference suppression element distributed on the circuit board substrate and/or connected between the transducer and the signal input end, and additionally arranging an extra compensation branch.
Description
Technical field
The present invention relates to electronic technology field, be specifically related to a kind of encapsulating structure of microphone.
Background technology
Along with the miniaturization of mobile terminal product, the variation of lightening and function, in the inner space that mobile terminal product is limited, each functional unit needs to arrange more compact, the electronic building brick that certainly will add in each functional unit suffers electromagnetic interference (ElectromagneticInterference, EMI) risk, especially, for the microphone assembly in audio system, the irradiation being subject to the radiofrequency signal that antenna module is launched can be easy to, affect the performance of microphone.
In order to eliminate radio frequency interference, the encapsulating structure of the MEMS condenser microphone of prior art usually with the circuit board of embedded high quality factor (Q) electric capacity for substrate, at substrate surface attachment transducer and dedicated IC chip, there is provided microphone products to RF (RadioFrequency by embedded capacitor, radio frequency) filter action of frequency band signals, but the shortcoming that this method exists is: loss is higher, anti-electrical impact ability, poor reliability, and can only process specific frequency.
Summary of the invention
The object of the invention is to, a kind of microphone packaging scheme with the electromagnetism interference of improvement is provided, solves above technical problem.
Technical problem solved by the invention can realize by the following technical solutions:
There is the microphone packaging scheme of the electromagnetism interference of improvement, wherein, comprise,
One transducer, is transformed to the signal of telecommunication for acoustic signals;
One signal processing circuit, is provided with signal input part and signal output part, and described signal input part connects described transducer, described signal output part externally circuit output signal;
One circuit board substrate, for arranging described transducer and described signal processing circuit;
Also comprise at least one electromagnetic interference suppression, be distributed on described circuit board substrate and/or be connected between described transducer and described signal input part, for suppressing electromagnetic interference signal.
Preferably, described electromagnetic interference suppression comprises magnetic bead, and described magnetic bead is connected between described transducer and described signal input part.
Preferably, described electromagnetic interference suppression comprises binding gold thread, and described transducer is electrically connected by described binding gold thread with described circuit board substrate with described signal processing circuit and described signal processing circuit.
Preferably, described electromagnetic interference suppression comprises the through hole running through described circuit board substrate, and described through hole is near described signal input part.
Preferably, described signal processing circuit comprises an amplifier unit, and described amplifier unit comprises a first input end and one second input, and described first input end connects described signal input part, and described second input connects one and compensates branch road.
Preferably, described compensation branch road comprises one first and compensates branch road, and described first compensates branch road adopts a feedback branch, and the input of described feedback branch connects described signal output part, and the output of described feedback branch connects described second input.
Preferably, described signal processing circuit comprises a bias voltage units, and described signal processing circuit is provided with bias voltage output, and described bias voltage output is connected with described transducer, to provide bias voltage to described transducer.
Preferably, described compensation branch road comprises one second and compensates branch road, and described bias voltage output is coupled to described second input and compensates branch road as described second.
Beneficial effect: owing to adopting above technical scheme, the present invention is by arranging electromagnetic interference suppression, be distributed on circuit board substrate and/or be connected between transducer and signal input part, and increasing extra compensation branch road so that the electromagnetism interference characteristic of microphone packaging scheme effectively can be improved.
Accompanying drawing explanation
Fig. 1 is the circuit connection diagram of a kind of embodiment of the present invention;
Fig. 2 is the circuit connection diagram of another kind of embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
It should be noted that, when not conflicting, the embodiment in the present invention and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
With reference to Fig. 1, Fig. 2, there is the microphone packaging scheme of the electromagnetism interference of improvement, wherein, comprise,
One transducer 1, is transformed to the signal of telecommunication for acoustic signals;
One signal processing circuit 2, is provided with signal input part Vin and signal output part Vout, and signal input part Vin connects transducer 1, signal output part Vout externally circuit output signal;
One circuit board substrate 3, for arranging transducer 1 and signal processing circuit 2;
Also comprise at least one electromagnetic interference suppression 23, be distributed on circuit board substrate 3 and/or be connected between transducer 1 and signal input part Vin, for suppressing electromagnetic interference signal.Electromagnetic interference suppression 23 also can between signal input part Vin and the internal functional elements of signal processing circuit 2.
The present invention, in microphone circuit, except transducer 1, signal processing circuit 2, arranges perceptual material as electromagnetic interference suppression 23, forms very high impedance, allow radiofrequency signal be not enough to enter body interior to suppress interference in high frequency points.
As a kind of preferred embodiment of the present invention, electromagnetic interference suppression 23 can be magnetic bead, and magnetic bead is connected between transducer 1 and signal input part Vin.During low frequency, impedance is low, and high-frequency resistance is high, suppresses extraneous high-frequency energy.
As a kind of preferred embodiment of the present invention, electromagnetic interference suppression 23 can be binding gold thread, and transducer 1 is electrically connected by binding gold thread with circuit board substrate 3 with signal processing circuit 2 and signal processing circuit 2.The characteristic utilizing binding gold thread to be easy to produce stray inductance in circuit realizes electromagnetic interference and suppresses.
As a kind of preferred embodiment of the present invention, electromagnetic interference suppression 23 can comprise the through hole running through circuit board substrate 3, and through hole is near signal input part Vin.Or the effect of containment high frequency can also be realized by printed circuit base board 3 cabling (trace).Printed circuit base board 3 cabling (trace) can carry out reasonable line arrangement on the basis of printed circuit board traces rule.
As a kind of preferred embodiment of the present invention, signal processing circuit 2 comprises an amplifier unit 21, and amplifier unit 21 comprises a first input end and one second input, first input end connection signal input Vin, and the second input connects one and compensates branch road.
As a kind of preferred embodiment of the present invention, compensation branch road comprises one first compensation branch road 24, first compensation branch road 24 and adopts a feedback branch, and the input connection signal output end vo ut of feedback branch, the output of feedback branch connects the second input.
The present invention is on the basis increasing electromagnetic interference suppression 23, increase extra compensation branch road, signal output part Vout is fed back to the input of amplifier unit, make irradiation can be exaggerated device loop to the unexpected energy on circuit board substrate and curb, improve radio frequency interference problem.
As a kind of preferred embodiment of the present invention, signal processing circuit 2 comprises a bias voltage units 22, and signal processing circuit 2 is provided with bias voltage output Vbias, and bias voltage output Vbias is connected with transducer 1, to provide bias voltage to transducer 1.
As a kind of preferred embodiment of the present invention, compensate branch road and comprise one second compensation branch road 25, bias voltage output Vbias is coupled to the second input and compensates branch road 25 as second.
It is inner that the part of signal usually along with radio frequency interference from the transmitting procedure of transducer 1 to signal processing circuit 2 may oppositely ooze back transducer 1 by the cabling of circuit board substrate 3, branch road is compensated as second by bias voltage output Vbias being coupled to the second input, if there is interference signal, identical interference can be produced to two inputs of amplifier unit 21, by the difference of the two, can realize offsetting completely or balancing out interference signal at least partly, effectively improve the electromagnetism interference characteristic of microphone packaging scheme.
The foregoing is only preferred embodiment of the present invention; not thereby embodiments of the present invention and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilizations specification of the present invention and diagramatic content and apparent change obtain in protection scope of the present invention.
Claims (8)
1. there is the microphone packaging scheme of the electromagnetism interference of improvement, it is characterized in that, comprise,
One transducer, is transformed to the signal of telecommunication for acoustic signals;
One signal processing circuit, is provided with signal input part and signal output part, and described signal input part connects described transducer, described signal output part externally circuit output signal;
One circuit board substrate, for arranging described transducer and described signal processing circuit;
Also comprise at least one electromagnetic interference suppression, be distributed on described circuit board substrate and/or be connected between described transducer and described signal input part, for suppressing electromagnetic interference signal.
2. the microphone packaging scheme with the electromagnetism interference of improvement according to claim 1, is characterized in that, described electromagnetic interference suppression comprises magnetic bead, and described magnetic bead is connected between described transducer and described signal input part.
3. the microphone packaging scheme with the electromagnetism interference of improvement according to claim 1, it is characterized in that, described electromagnetic interference suppression comprises binding gold thread, and described transducer is electrically connected by described binding gold thread with described circuit board substrate with described signal processing circuit and described signal processing circuit.
4. the microphone packaging scheme with the electromagnetism interference of improvement according to claim 1, is characterized in that, described electromagnetic interference suppression comprises the through hole running through described circuit board substrate, and described through hole is near described signal input part.
5. the microphone packaging scheme with the electromagnetism interference of improvement according to claim 1, it is characterized in that, described signal processing circuit comprises an amplifier unit, described amplifier unit comprises a first input end and one second input, described first input end connects described signal input part, and described second input connects one and compensates branch road.
6. the microphone packaging scheme with the electromagnetism interference of improvement according to claim 5, it is characterized in that, described compensation branch road comprises one first and compensates branch road, described first compensates branch road adopts a feedback branch, the input of described feedback branch connects described signal output part, and the output of described feedback branch connects described second input.
7. the microphone packaging scheme with the electromagnetism interference of improvement according to claim 5, it is characterized in that, described signal processing circuit comprises a bias voltage units, described signal processing circuit is provided with bias voltage output, described bias voltage output is connected with described transducer, to provide bias voltage to described transducer.
8. the microphone packaging scheme with the electromagnetism interference of improvement according to claim 7, it is characterized in that, described compensation branch road comprises one second and compensates branch road, and described bias voltage output is coupled to described second input and compensates branch road as described second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410184956.1A CN105100979A (en) | 2014-05-04 | 2014-05-04 | Microphone packaging structure with improved electromagnetic interference resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410184956.1A CN105100979A (en) | 2014-05-04 | 2014-05-04 | Microphone packaging structure with improved electromagnetic interference resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105100979A true CN105100979A (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410184956.1A Pending CN105100979A (en) | 2014-05-04 | 2014-05-04 | Microphone packaging structure with improved electromagnetic interference resistance |
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Citations (6)
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|---|---|---|---|---|
| CN201594811U (en) * | 2010-01-13 | 2010-09-29 | 歌尔声学股份有限公司 | MEMS microphone |
| CN101860778A (en) * | 2009-04-03 | 2010-10-13 | 三洋电机株式会社 | The amplifying circuit of Electret Condencer Microphone |
| CN102215448A (en) * | 2010-04-08 | 2011-10-12 | 北京卓锐微技术有限公司 | Silicon microphone packaging method capable of shielding electromagnetic interference, packaging body and electronic device |
| CN102413219A (en) * | 2010-08-06 | 2012-04-11 | 捷讯研究有限公司 | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
| US20130095897A1 (en) * | 2010-08-06 | 2013-04-18 | Research In Motion Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
| CN203942621U (en) * | 2014-05-04 | 2014-11-12 | 钰太芯微电子科技（上海）有限公司 | The microphone packaging scheme with improved anti-electromagnetic interference |
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2014
- 2014-05-04 CN CN201410184956.1A patent/CN105100979A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101860778A (en) * | 2009-04-03 | 2010-10-13 | 三洋电机株式会社 | The amplifying circuit of Electret Condencer Microphone |
| CN201594811U (en) * | 2010-01-13 | 2010-09-29 | 歌尔声学股份有限公司 | MEMS microphone |
| CN102215448A (en) * | 2010-04-08 | 2011-10-12 | 北京卓锐微技术有限公司 | Silicon microphone packaging method capable of shielding electromagnetic interference, packaging body and electronic device |
| CN102413219A (en) * | 2010-08-06 | 2012-04-11 | 捷讯研究有限公司 | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
| US20130095897A1 (en) * | 2010-08-06 | 2013-04-18 | Research In Motion Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
| CN203942621U (en) * | 2014-05-04 | 2014-11-12 | 钰太芯微电子科技（上海）有限公司 | The microphone packaging scheme with improved anti-electromagnetic interference |
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Application publication date: 20151125 |