CN105097620B - System for being detached from product substrate from bearing basement - Google Patents
System for being detached from product substrate from bearing basement Download PDFInfo
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- CN105097620B CN105097620B CN201510619239.1A CN201510619239A CN105097620B CN 105097620 B CN105097620 B CN 105097620B CN 201510619239 A CN201510619239 A CN 201510619239A CN 105097620 B CN105097620 B CN 105097620B
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- bearing basement
- product substrate
- bearing
- support
- basement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Abstract
The present invention relates to a kind of system for being detached from product substrate from bearing basement, wherein the product substrate is temporarily attached to the bearing basement by articulamentum to form stack portion, the system comprises: support the device of the stack portion；Discrete device initializes the product substrate and is detached from from the bearing basement, and the discrete device has the top from the articulamentum that the circumferential edge of the articulamentum is penetrated into the stack portion；First component has the surface extended in the plane of the plane on the surface for being basically parallel to the bearing basement；And the extension extended from the first component, wherein the extension includes the surface for being configured to contact the circumferential edge of the bearing basement, wherein the system applies force to the bearing basement so that the bearing basement to be bent far from the product substrate, so that the product substrate be made to be detached from from the bearing basement.
Description
The application is application number 201180070028.7, on 04 11st, 2011 applying date, entitled " flexible to hold
The divisional application of the application for a patent for invention of load bracket, device and method for being detached from bearing basement ".
Technical field
The present invention relates to a kind of system for being detached from product substrate from bearing basement and for make bearing basement from
The system that product substrate is detached from.
Background technique
Usually it is integrated to structured wafer or product chip in bearing wafer or bearing basement in the semiconductor industry,
In order to operating on it.It should be as simple as possible, quickly and cost advantages and cleanly after to product base treatment
It is removed from bearing basement.It is under stress two for product chip to be incorporated in the most common method on bearing wafer
Apply adhesion layer in one (or two kinds of substrates) in kind substrate and is brought into contact with.Adhesive is being reduced when separating (disengaging)
Adhesion strength after (temperature, UV radiation etc.) make bearing wafer and product chip separate-for example by moving crystalline substance in parallel with each other
Piece.Here, chip due to the so-called of negative pressure by being blocked (Chucks) and being kept.
Need to consider multiple critical factors when being detached from, and most important primary work be to make it is frangible and due to pre-add
Work and very expensive product chip is subjected to stress as small as possible and does not damage the product chip.Cost is answered on the other hand
Separating for bearing basement favorably and is rapidly realized with energy consumption as the smallest as possible.In known a variety of separating technologies,
Especially for the adhesion characteristics for cancelling adhesion layer among wafers, needing will be by bearing wafer and structured wafer/product chip
" stack portion (Stack) " (stacking) constituted is heated to for adhesive in specific temperature.
Summary of the invention
Therefore, it is an object of the invention to the such device and method for separating bearing basement of such improvement to make
Meticulous and considerably more rapid simultaneously separate must be can be realized.Meanwhile energy consumption should be reduced.
The purpose is realized using the feature of claim 1,4,8,12 and 17.The present invention is provided in the dependent claims
Be advantageously improved scheme.It is made of at least two in the feature that is provided in explanation, claim and/or attached drawing all
Combination is also fallen within the scope of this invention.For codomain, it is in the value within the mentioned limit and also should be used as limiting value and disclose
And it can propose to protect in any combination.
The basic idea of the invention is that being designed in this way for carrying base fixed when making bearing basement and product substrate is detached from
The bearing support at bottom, that is, the bearing support is configured to allow for bearing basement to be bent.According to the present invention, which has foot
Enough bending strengths, to cause particularly by from the edge lift of bearing basement for the de- of separated bearing basement and product substrate
From power.
According to the present invention, only slight bending, especially 45 ° of < of bending angle should be realized herein, preferably 40 ° of < curved
Bent angle, also preferably 30 ° of < of bending angle, particularly preferably the bending angle that 20 ° of <, it will also more preferably <
10 ° of bending angle, the bending angle that 5 ° of preferred ground <.Protect in this way also have it is certain, especially with carrying
The bearing basement of the similar bending strength of bracket is not damaged and protection product substrate first is not damaged.Due to bending, take off
It is acted at mobile disengaging front (L sefront) from the major part of power, the disengaging front is especially from the edge of bearing basement
It is moved on towards the direction at center.
Therefore, core of the invention is the flexibility for bearing basement fixed when making bearing basement and product substrate is detached from
Bearing support, wherein be provided at the bearing support be detached from device in the curved situation of bearing basement separate
Product substrate.
Therefore it is also possible to consider comprehensive (the vollfl chige) of bearing support, the embodiment party of other than ring type according to the present invention
Case, the especially bearing support made of the condensate with certain elasticity or bending strength.For fixed and receiving carrying base
Bottom, the bearing support have vacuum passage.Here, can be especially additionally provided to bearing basement is quiet to improve retentivity
It is fixed at bearing support electricly.
Bearing support can also at least partly include metal, ceramics or composite material.Used material must only allow
Functionality according to the present invention.
In addition, being provided with a kind of for making bearing basement and product substrate de- on off-direction L as independent invention
From device, have following characteristics:
For fixing bearing basement, the bearing support flexible on off-direction L,
It is used to fix the substrate frame of product substrate, and
Disengaging device for separating bearing basement with product substrate in the curved situation of bearing basement.
According to the present invention, off-direction L substantially-especially just-perpendicular to the table of bearing basement and/or product substrate
Face.The axis of bending of the bending section of bearing support and/or the bearing basement accommodated by bearing support is perpendicular to off-direction L.It should
Axis of bending especially place is at the surface for being parallel to product substrate and/or bearing basement.
In advantageous embodiment, the apparatus according to the invention may include pressure chamber, can be loaded with over-voltage, so as to
It is also more strongly fixed on the bearing basement at bearing support is fixed on using negative pressure at the bearing support.Exist in intracavitary pressure
This can > 1bar, preferably > 2bar, still more preferably > 5bar, still more preferably > 10bar, especially less than 100bar.
Advantageous embodiment according to the present invention is arranged to, and bearing support can be resiliently deformed on off-direction L.Root
According to the present invention, by the elasticity of bearing support breakaway force is correspondingly concentrated at mobile disengaging front, even if will
Pulling force is applied only to the peripheral region of bearing basement.
It is arranged to apply by disengaging device in another advantageous embodiment of the invention and acts on substrate frame
Peripheral region at least one pulling force and acted on the contrary with pulling force bearing support peripheral region at least one counter-force with edge
Disengaging front generate be detached from torque.Thus total load especially can be reduced when starting and separating.Also cause in this way stronger
Protect bearing basement and product substrate in ground.Here, being especially arranged to the synthesis added up into pulling force in the center of substrate frame
Pulling force-particularly by the peripheral region for by tension uniform being applied to substrate frame, and one or more counter-forces add up to Cheng Cheng
Carry the counter-force of the synthesis of the edge of bracket and in the mobile corresponding disengaging torque being detached from front.Therefore make carrying branch
Frame is tilted relative to substrate frame.
In order to also especially more strongly protect product substrate in the case where very sensitive or very expensive product substrate,
It is arranged according to the present invention at by substrate frame be configured to it is rigid, especially comprehensively accommodate product substrate receiving portion.
Another advantageous embodiment according to the present invention is arranged to, bearing support be configured to it is especially open, with can
The internal diameter D of adjustmentiRing.It can also be by ring geometry-especially ring width B relative to ring diameter D by annularaAnd/or ring
Height H come optimally for bearing basement adjust bending strength.In addition, annular causes to allow to carry in the region that ring is open
The stronger freedom of motion of substrate, to realize the common work of the bending strength of bearing support and the bending strength of bearing basement
With.Here, the bending strength of bearing support is especially at least equal to or higher than the bending strength of bearing basement.
Advantageously, the bending strength of bearing support is so selected according to the present invention, that is, its bending resistance for being in bearing basement is strong
Between 1/20 to 20 times of degree, especially between 1/10 to 10 times, preferably between 1/5 to 5 times, still more preferably between 1/2 to 2 times
Range in.As bearing basement, especially it is contemplated that by with 500 μm with m- preferably 600 μm of 750 μm-thickness d
Silicon made of chip.The chip can have the diameter D of 200mm or 300mmt。
Particularly advantageous here is be provided with it is especially being stretched on entire ring periphery, especially in the circumferential shoulder of rebound
The retainer member of form.It is possible thereby to which the simple geometry that can cost-effectively manufacture will be disengaged from power and be applied to bearing basement
On, especially it is applied to the entire peripheral region of bearing basement, and make when starting and separating to be detached from the especially critical initial of front
The peripheral region changed in bearing basement focuses at one or more positions.
According to the present invention, it is arranged to bearing support in improvement project to be configured to laterally substantially completely surrounding carrying base
Bottom especially surrounds at least the 98%, preferably at least 99% of periphery, still more preferably at least 99.5%.Therefore bearing basement is almost whole
It is supported on a periphery.Bearing support is especially configured to the ring in circumferential closure, and preferably at least the 98% of periphery is in circumferential closure
Ring, still more preferably at least 99% circumferential closure ring, still more preferably at least 99.5% circumferential closure ring.The ring may be used also
It is made of single segment.
According to advantageous embodiment, being detached from device has the driving element of translation for causing on off-direction L
The translational motion of the circumferential section of at least one of bearing support.
As independent invention, it is provided with a kind of for being detached from bearing basement and product substrate on off-direction L
Method has following steps, particular with following below scheme:
It is held using the fixed product substrate of substrate frame, and using bearing support fixation flexible on off-direction L
Substrate is carried, and
Bearing basement is separated with product substrate in the curved situation of bearing basement.
In addition, according to the present invention, being provided with a kind of for carrying base fixed when separating bearing basement with product substrate
The purposes of the bearing support flexible at bottom.
It is arranged to be separated in the case where such temperature in an advantageous embodiment of the invention, that is, temperature
200 DEG C of <, preferably 100 DEG C of <, still more preferably 50 DEG C of <, are ideally separated at ambient temperature, are not being had especially
Comprehensively separated in the case where heating device.
According to the present invention it is contemplated that especially accelerating to separate at disengaging front in the following manner, that is, pass through disconnector
Part-is locally applied to particularly by discrete device-and is detached from front.Discrete device may include mechanical separation and/or office
The heating in portion, the heating air stream of preferred orientation.It can specifically be provided with separating wedge, separation sword, separation individually or in combination
Line is directed toward the compressed air jet for being detached from the preferred heat of front.
Separating wedge is interpreted as the tool with preferred v-shaped profile.Separation sword is interpreted as the work with extremely sharp edge
Tool.Defiber is the line of very thin preferred high strength, by corresponding equipment in the flat of middle layer in the state of tensioning
It is mobile towards middle layer on face.Defiber is especially configured to heater wire, that is, is configured to heat.
According to the present invention also it is contemplated that such embodiment, that is, wherein, be detached from front and seem spiral during disengaging
Stretched along the periphery of product substrate inward towards center to shape.This acts on the de- of peripheral region by circumferentially improving in peripheral region
It is realized from power.
Illustrated feature correspondingly applies to the apparatus according to the invention and according to the method for the present invention and according to this
The purposes of invention.
Detailed description of the invention
Other advantages of the invention, feature and thin are obtained from the explanation to preferred embodiment and with reference to the accompanying drawings
Section.Wherein:
Fig. 1 shows the top view of bearing support according to the present invention with section line A-A,
Fig. 2 shows the section view of bearing support according to the section line A-A of Fig. 1,
Fig. 3 shows the view of the bearing support according to Fig. 1 from below,
Fig. 4 shows the detailed view of the details E of Fig. 2,
Fig. 5 a shows the side view for the stack portion being made of bearing basement, articulamentum and product substrate,
Fig. 5 b shows the top view for the stack portion being made of bearing basement, articulamentum and product substrate,
Fig. 6 shows the detailed view similar to Fig. 4 with the first embodiment of bearing support,
Fig. 7 shows the detailed view similar to Fig. 4 with the second embodiment of bearing support,
Fig. 8 shows the stack portion being fixed on film frame (Filmrahmen),
Fig. 9 a-9d is shown according to first embodiment according to the present invention with four method and steps according to the present invention
Device, and
Figure 10 a-10d shows the second embodiment of the apparatus according to the invention with four method and steps.
Identical in the accompanying drawings or phase same-action component indicates with the same references.
Specific embodiment
Fig. 1 shows the bearing support 1 that can be semi-automatically inserted into, and wherein, manually realizes through bearing support 1 and holds
Receive bearing basement 13.Bearing support 1 is used to separate bearing basement 13 and product substrate 11, passes through articulamentum 12 and bearing basement
It is connected.
Bearing support 1 includes the holding handle 2 being arranged at circumferential section 26 and sets unlimited with keeping handle 2 opposite
Ring 3.Spacing device 25 accordingly is provided with to be used at the end 24 that the opposite of ring 3 is set, 24' at the opening 3o of ring 3
Adjust the interval A between end 24,24'.By adjusting the internal diameter D of interval A adjustable collar 3iAnd outer diameter Da.In the present embodiment
In, spacing device 25 includes rod piece 4,5, wherein introducing at end 24 has rod piece 4, and introducing at the 24' of end has rod piece 5.
Rod piece 4,5 is passed through by adjustment element 14, can manually manipulate the adjustment element herein.According to the present invention it is contemplated that automatically converting
Above-mentioned manually kinematics.
It is realized keeping handle 2 to be fixed at ring 3 through the especially bolt of fixing element 10.According to the present invention, predetermined
Geometry (ring height H, ring width B, outer diameter Da, internal diameter Di) in the case where can so select the material of ring 3 to make ring 3 can
It is allowed to be resiliently bent by spacing device 25, that is, overcomes its power due to caused by bending strength.
Ring 3 has circumferential shoulder 7, protrudes from ring shoulder 6 and forms step 9.Stretch to 9 z shape of step-wherein,
Interior angle with 45 ° of 90 ° of < I < for being directed toward ring center, especially 80 ° of < of interior angle, preferably 70 ° of < of interior angle-and thus shape
At wall inclined-plane 17 that is especially circular, being terminated at the inner edge 8 of point.Inner edge 8 is parallel to ring shoulder 6 simultaneously for circumferential shoulder 7
The component part of the end face 7s of extension.End face 7s equidistantly has interval M relative to ring shoulder 6.According to the present invention, it is spaced M such as
This selection, that is, the thickness d of its high specific bearing basement 13 is slightly greater, the especially maximally big thickness of articulamentum 12 (referring to
Fig. 7).Preferably, so select interval M that it is made to be less than the thickness d of bearing basement 13 as in Fig. 6.Preferably, it is spaced
M is at least half of the thickness d of bearing basement 13.
By spacing device 25 can amplify it is being formed by inner edge 8, be in internal diameter DiWith outer diameter DaBetween diameter DkTo be used for
Bearing basement 13 is accommodated, until bearing basement 13 may pass through opening (the diameter D formed by inner edge 8k) be inserted into until ring shoulder 6.
And then, diameter D is made by spacing device 25kBecome smaller again, until the circumferential edge 13u of bearing basement 13 sticks on circumferential shoulder
It is fixed at the inclined-plane 17 in portion 7 and by the inclined-plane.Bearing basement 13 is kept by bearing support 1 flexible as a result,.Fixation is several
It is realized by clamping and/or shape cooperation.It is settable strong in the case where bearing basement 13 to be clamped at inclined-plane 17
Measurement device is to be especially placed at adjusting device 14 for controlling clamping.
Product substrate 11 is fixed at bearing support only by articulamentum 12.Bearing support 1 and product substrate 11 it
Between not set direct contact.Farthest in the case where avoiding the contact between bearing support 1 and product substrate 11
It protects product substrate 11 and actually eliminates pollution or damage.
Product substrate 11 and articulamentum 12 and bearing basement 13 are formed together stack portion 19, and (bearing basement-product substrate is multiple
Conjunction portion).Equally, the present invention is suitable for the composite part being made of bearing basement and product substrate, and in bearing basement and product base
Articulamentum is not present between bottom, is particularly suitable for so-called pre- conjugate, wherein, chip is in particular by means of van der waals force
(Van-der-Waals-Kr fte) is adhering to each other.
In the embodiment shown in Fig. 7, when stack portion 19 to be fixed at bearing support 1, sharp inner edge 8 is simultaneously
Separated as discrete device or in the following manner to initialize, i.e., by the top of inner edge 8 articulamentum 12 circumferential edge
Place is penetrated into articulamentum 12.
Bearing support 1 virtually completely surrounds bearing basement 13, in addition to ring opening 3o.
Fig. 8 shows the stack portion 19 on film frame 23, wherein product substrate 11 with and 21 phase of film that is connected of film frame 23
Connection.Stack portion 19, film frame 23 and film 21 (formation) film frame composite part 20.
By means of keeping handle 2 and can be by bearing basement 13 from product substrate by fixed product substrate 11 or film frame 23
11 remove.Here, being laterally applied to pulling force at bearing basement 13 due to keeping the unilateral arrangement of handle 2, that is, apply
At circumferential section 26.By the initialization being penetrated into inner edge 8 in articulamentum 12, make bearing basement 13 in 13 He of bearing basement
(power for overcoming it to generate due to bending strength) is since circumferential section 26 towards side that is opposite and setting in the case where the deformation of ring 3
Slowly separate.Here, it is mobile up to the opposite of bearing basement 13 is set from circumferential section 26 to be detached from front due to articulamentum 12
Side.Correspondingly, it according to the breakaway force for being detached from front and keeping the interval of handle 2 and being applied at holding handle 2, is limited
Torque along be detached from front work.
In the form of automation, this is shown in Fig. 9 a into 9d with first embodiment, and Figure 10 a extremely
It is shown in 10d with second embodiment, will be then described further.
Both embodiments are had in common that be suitable for the form of automation using described above for fixing
The bearing support 1 of bearing basement 13.
Important aspect of the invention is when starting to separate-i.e. when initialization is separated-the especially careful wing of offer
The operation of the wing executes the mechanical separation of articulamentum particularly by peripheral region or in its edge.
Accordingly show the rack 22 of base portion 27 and foundation on the base portion with stable for providing in figures 9 and 10
By other components of explanation below foundation structure and the fixed apparatus according to the invention.At rack 22 and/or base portion 27,
Driving element 15'(is especially provided between the cover 22d of rack 22 and the bottom 27b formed by base portion 27, and it is used to make to hold
The circumferential section translational motion for carrying the more specifically bearing support 1 of bracket 1, is moved in translation with being especially driven) and driver
(it is used for substrate frame 18 (receiving portion) translational motion for making to accommodate stack portion 19 or film frame composite part 20 to part 15, is especially driven
The translational motion of dynamic ground)).Driving element 15' can have idle running in a transverse direction, be formed particularly by expansion bearing.
In two embodiments according to Fig. 9 and 10, substrate frame 18 can on off-direction L-i.e. in drawing plane
In-translationally move up and/or down.Especially can be used herein in driving substrate frame 18 driving element 15 synchronously
Movement, is preferably driven by the motor especially stepper motor controlled by central control unit.
In the embodiment according to Fig. 9, set for bearing support 1 in the opposite with circumferential section 26 of bearing support 1
It is provided with only one driving element 15' at side, and is provided with joint bearing 16 at circumferential section 26, thus bearing support
It can swing around joint bearing 16, however be fixed on off-direction L.Therefore following methods process is obtained:
In the method and step shown in fig. 9 a, the bearing support of the especially bearing basement 13 of film frame composite part 20 will be suitable for
1 is mounted at the driving element 15' on top and joint bearing 16.Meanwhile film frame composite part 20 being fixed in advance or and then
On substrate frame 18, fixed particularly by vacuum is applied.Substrate frame 18 can be transported on off-direction L by driving element 15
It is dynamic.
Here, according to the present invention, alternatively it is contemplated that bearing support 1 peripheral region be arranged at a side it is multiple especially
Two driving element 15', and in opposite and multiple outstanding two joint bearings 16 of setting at the side set.
Bearing support 1 accordingly can be fixed on driving element 15' and pass by being arranged in the retainer member 28 at ring periphery 3u
At section bearing 16.Substrate frame 18 can be fixed at driving element 15 by retainer member 29.
Substrate frame 18 is driven in the position shown in figure 9b (therefore in disengaging side followed by following manner
Travelled on L towards bearing support 1), that is, substrate frame 18 is made to implement synchronous translational motion for driving element 15 until carrying base
Bottom 13 is sticked at ring shoulder 6 with its upside 13o.Control can be realized by central control unit, wherein bearing basement 13 is touched
Force measuring device (s that being identified by to ring shoulder 6 is especially integrated into substrate receiving portion 18 is realized.Preferably, in substrate
The peripheral region of receiving portion 18 is disposed with the power meter that quantity is n with the angular separation of 360 °/n with being distributed.
In order to which bearing basement 13 may be housed in bearing support 1, it is necessary to make diameter D in advancekCorrespondingly with the inner edge 8 of ring 3
Match, so as to bearing basement 13 can with its outer profile (it is especially circular, have diameter Dt) be received into bearing support 1.
When accommodating bearing basement 13, internal diameter DiLess than the diameter D of bearing basement 13t, so that bearing basement 13 is not slided.Once reaching
The position shown in figure 9b can reduce internal diameter Di, until bearing basement 13 is fixed in bearing support 1 (referring to Fig. 6 and 7),
It sticks at wall inclined-plane 17.
Once reaching the position shown in figure 9b, the driving element 15' on fixable top is just discharged, thus the driving
The side that is fixed on driving element 15' at of the device with freedom degree and bearing support 1 on off-direction L can be in disengaging side
The free movement on L.It in this embodiment can be without drivingly tectonic forcing device 15'.But according to the present invention it is also possible to consider
This controls movement by central control unit, so that driving element 15' is configured to not be passively (such as in preferred embodiment party
In formula like that), it is structured to active.
And then opposite and will accordingly refer to from carrying at two driving elements 15 being arranged at substrate frame 18 with setting
The driving force F of bracket 11(pulling force) and especially with driving force F1Identical driving force F2(pulling force) is especially synchronously applied to substrate
On bracket 18, to separate the bearing basement 13 being fixed at bearing support 1 and product substrate 11.
Joint bearing 16 at driving force F1And F2Land used is acted as in parallel with the driving force on the contrary and especially to exist instead
Power G (alternatively, if being provided with multiple joint bearings 16, there is multiple counter-force G).
Thus continue the separation process since inner edge 8, wherein be detached from front in bearing support 1 and bearing basement 13
Cumulative curved situation under from 16 extension of joint bearing until bearing support 1 with respect to and the side set.With driving force F1
And F2And (caused by the attachment force as articulamentum 12) counter-force G balances each other, torque is along disengaging front as infinitely small ground edge
Be detached from front distribution disengaging torque K1To KnIt works.
In the position shown in Fig. 9 c, bearing basement 13 has separated a greater part of, wherein is accomplished by the following way point
It opens, that is, not only bearing basement 13 deforms, but also the deformation of bearing support 1 (overcomes the bending resistance of bearing support 1 and bearing basement 13 strong
Degree).
In the position shown in Fig. 9 d, bearing basement 13 is separated with product substrate 11 completely.In the example shown, articulamentum 12
It is adhered at product substrate 11, but can also partially or completely be attached at bearing basement 13.
In separated period, bearing support 1 and bearing basement 13 have been bent the bending angle of 1 ° of 45 ° of < W <, are especially bent
The bending angle that 35 ° of W <, be about bent herein 6 ° bending angle (for average bending angle, especially bearing basement 13 with
Product substrate 11 measures when separating half).
In the second embodiment according to Figure 10 a to 10d, instead of driving element 15', it is provided at bearing support 1
Joint bearing 16, so that bearing support 1 is fixed on circumferential section 26 and circumferential section 26' that is opposite and setting on off-direction L
(according to the present invention, in bearing support 1 at (that is, at retainer member 28 that joint bearing 16 is mounted on bearing support 1 at this)
The settable multiple joints bearing of peripheral region 16).In section between circumferential section 26, bearing support 1 is in its flexible model
Bending strength can be overcome to move in enclosing.Relative to articulamentum 12 when therefore applying driving force in the method and step according to Figure 10 c
Center generate the disengaging front that the periphery of substantially ((gewellt) undulatedly) and articulamentum 12 concentrically stretches.Here,
In order to overcome the initial connection power of articulamentum 12, played an important role by the initialization of the inner edge 8 of bearing support.
In the embodiment according to Figure 10 a to 10d, when being detached from front advance, it is detached from torque K1To KnAccordingly along de-
It is acted predominantly at (contoured) circular section from front.Due to from all side actions peripheral region breakaway force K,
Bending angle W' is measured to edge from the centre of bearing basement 13, wherein in this case, as long as bearing support 1 and holding
Carry substrate 2 material and its size be in other aspects it is identical, bending angle W' is due to smaller section (Strecke)
And it is correspondingly smaller, and bending angle W is measured according to the lateral margin that Fig. 9 c is set relative to opposite with joint bearing.By reducing ring
Width B and/or ring height H can reduce the bending strength of ring 3, so that bending angle W' can be improved.
List of reference characters
1 bearing support
2 keep handle
3 rings
3o opening
3u ring periphery
4 rod pieces
5 rod pieces
6 ring shoulders
7 circumferential shoulders
The end face 7s
8 inner edges
9 steps
10 immobilising devices
11 product substrates
12 articulamentums
13 bearing basements
On the upside of 13o
13u circumferential edge
14 adjustment elements
15,15' driving element
The bearing of 16 joints
17 inclined-planes
18 substrate frames
19 stack portions
20 film frame composite parts
21 films
22 racks
22d cover
23 film framves
The end 24,24'
25 spacing devices
26 circumferential sections
27 base portions
The bottom 27b
28 retainer members
29 retainer members
The interval A
B ring width
DiInternal diameter
DaOuter diameter
DkDiameter
H ring height
The interval M
L off-direction
I interior angle
D thickness
F1,F2,FnDriving force (pulling force)
G counter-force
K1,K2,KnIt is detached from torque
W, W' bending angle.
Claims (20)
1. a kind of system for being detached from product substrate from bearing basement, wherein the product substrate passes through articulamentum temporarily
The bearing basement is connected to form stack portion, the system comprises:
Support the device of the stack portion；
The discrete device of heating and compressed air jet including part initializes the product substrate from the bearing basement
It is detached from, the discrete device has the top from the articulamentum that the circumferential edge of the articulamentum is penetrated into the stack portion
End；
First component has the surface extended in the plane of the plane on the surface for being parallel to the bearing basement；And
The extension extended from the first component, wherein the extension includes the peripheral edge for being configured to contact the bearing basement
The surface of edge,
Wherein the system applies force to the bearing basement so that the bearing basement to be bent far from the product substrate, thus
It is detached from the product substrate from the bearing basement.
2. system according to claim 1, wherein the first component is flexible.
3. system according to claim 1, wherein the one end on the surface of the extension terminates inside edge, it is described interior
Edge forms the top of the discrete device.
4. a kind of system for being detached from product substrate from bearing basement, wherein the product substrate passes through articulamentum temporarily
The bearing basement is connected to form stack portion, the system comprises:
Support the first support of the stack portion；And
The second support of the bearing basement is engaged, the second support includes:
Shoulder has the shoulder surface extended in the plane of the plane on the surface for being parallel to the bearing basement；
The extension extended from the shoulder, wherein the extension includes the circumferential edge for being configured to contact the bearing basement
Surface；And
The discrete device of heating and compressed air jet including part initializes the product substrate from the bearing basement
It is detached from, the discrete device has the top from the articulamentum that the circumferential edge of the articulamentum is penetrated into the stack portion
End,
Wherein the second support applies force to the bearing basement so that the bearing basement to be bent far from the product substrate,
To make the product substrate be detached from from the bearing basement.
5. system according to claim 4, wherein the second support is flexible.
6. system according to claim 4, wherein the one end on the surface of the extension terminates inside edge, it is described interior
Edge forms the top of the discrete device.
7. system according to claim 4, wherein the system also includes:
Driving element, it is separate by the bearing basement to apply force to the bearing basement to be used to move the second support
The product substrate bending.
8. a kind of system for being detached from bearing basement from product substrate, wherein the bearing basement passes through articulamentum temporarily
The product substrate is connected to form stack portion, the system comprises:
The bracket that can be engaged with the bearing basement for being temporarily attached to the product substrate, the bracket include:
Shoulder has the shoulder surface extended in the plane of the plane on the surface for being parallel to the bearing basement；
The extension extended from the shoulder, wherein the extension includes the circumferential edge for being configured to contact the bearing basement
Surface；And
The discrete device of heating and compressed air jet including part initializes the bearing basement from the product substrate
Disengaging, the discrete device has top from the articulamentum that the circumferential edge of the articulamentum is penetrated into the stack portion
End,
Wherein the bracket applies force to the bearing basement so that the bearing basement to be bent far from the product substrate, thus
It is detached from the bearing basement from the product substrate.
9. system according to claim 8, wherein the bracket is flexible.
10. system according to claim 8, wherein one end of the skewed surface of the extension terminates inside edge, institute
State the top that inward flange forms the discrete device.
11. system according to claim 8, wherein the system also includes:
Driving element is used to move the bracket to apply force to the bearing basement for the bearing basement far from described
The bending of product substrate.
12. a kind of system for being detached from bearing basement from product substrate, wherein the bearing basement is temporary by articulamentum
Ground is connected to the product substrate to form stack portion, the system comprises:
The discrete device of heating and compressed air jet including part；
The first support that can be engaged with the bearing basement, the first support include:
Shoulder has the surface extended in the plane of the plane on the surface for being parallel to the bearing basement, the carrying base
The surface at bottom is contacted with the articulamentum；And
The extension extended from the shoulder, wherein the extension has inward flange, and it is described to contact which provides top
The circumferential edge of bearing basement, to be penetrated into the articulamentum to initialize and make the bearing basement from the product substrate
The disengaging process of disengaging,
Wherein the first support applies force to the bearing basement so that the bearing basement to be bent far from the product substrate,
To make the bearing basement be detached from from the product substrate, the bearing basement originates in institute from the disengaging of the product substrate
It states at the circumferential edge of bearing basement.
13. system according to claim 12, wherein the first support is flexible.
14. system according to claim 12, wherein the system also includes:
First driving element is used to move the first support to apply force to the bearing basement for the bearing basement
It is bent far from the product substrate.
15. system according to claim 12, wherein the system also includes:
The second support that can be engaged with the product substrate.
16. system according to claim 15, wherein the system also includes:
Second driving element is used to move the second support relative to the first support.
17. a kind of system for being detached from bearing basement from product substrate, wherein the bearing basement is temporary by articulamentum
Ground is connected to the product substrate to form stack portion, the system comprises:
The discrete device of heating and compressed air jet including part；
For engaging the first support of the bearing basement, wherein the first support includes edge, the edge provide top with
The circumferential edge of the bearing basement is contacted, thus the disengaging that initialization is detached from the bearing basement from the product substrate
Journey；And
First device is used to move the first support to apply force to the bearing basement so that the bearing basement is separate
Product substrate bending, so that the bearing basement be made to be detached from from the product substrate, the bearing basement is from the product
The disengaging of substrate originates at the circumferential edge of the bearing basement.
18. system according to claim 17, wherein the first support is flexible.
19. system according to claim 17, wherein the system also includes:
The second support that can be engaged with the product substrate.
20. system according to claim 19, wherein the system also includes:
Second device is used to move the second support relative to the first support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510619239.1A CN105097620B (en) | 2011-04-11 | 2011-04-11 | System for being detached from product substrate from bearing basement |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510619239.1A CN105097620B (en) | 2011-04-11 | 2011-04-11 | System for being detached from product substrate from bearing basement |
| CN201180070028.7A CN103460369B (en) | 2011-04-11 | 2011-04-11 | Flexible bearing support, for the device making bearing basement depart from and method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180070028.7A Division CN103460369B (en) | 2011-04-11 | 2011-04-11 | Flexible bearing support, for the device making bearing basement depart from and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105097620A CN105097620A (en) | 2015-11-25 |
| CN105097620B true CN105097620B (en) | 2019-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510619239.1A Active CN105097620B (en) | 2011-04-11 | 2011-04-11 | System for being detached from product substrate from bearing basement |
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| CN (1) | CN105097620B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201737766A (en) * | 2016-01-21 | 2017-10-16 | 康寧公司 | Methods for processing a substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1876394A (en) * | 2005-06-07 | 2006-12-13 | 奥博杜卡特股份公司 | Apparatus and method for separating a composite |
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| JP4704828B2 (en) * | 2004-09-29 | 2011-06-22 | 積水化学工業株式会社 | Manufacturing method of pressure-sensitive adhesive sheet for attaching to wafer and IC chip with adhesive layer for die bonding |
| JP4729003B2 (en) * | 2007-06-08 | 2011-07-20 | リンテック株式会社 | Processing method for brittle members |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1876394A (en) * | 2005-06-07 | 2006-12-13 | 奥博杜卡特股份公司 | Apparatus and method for separating a composite |
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| CN105097620A (en) | 2015-11-25 |
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