CN105097618B - A kind of wafer with protection method of wafer reaction chamber and wafer reaction chamber - Google Patents
A kind of wafer with protection method of wafer reaction chamber and wafer reaction chamber Download PDFInfo
- Publication number
- CN105097618B CN105097618B CN201510435942.7A CN201510435942A CN105097618B CN 105097618 B CN105097618 B CN 105097618B CN 201510435942 A CN201510435942 A CN 201510435942A CN 105097618 B CN105097618 B CN 105097618B
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- wafer
- reaction chamber
- filler ring
- ring carrier
- space
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of wafer reaction chamber, including：Reaction chamber body, air intake valve and outlet valve are set, and enclose the accommodating cavity to form wafer；Filler ring carrier, in towards being arranged at the bottom plate of reaction chamber body, and " convex " type space is being formed in towards the side of setting, and filler ring carrier moves in the presence of motor；Wafer filler ring, it is arranged on the side different from bottom plate of filler ring carrier；Seal washer, it is arranged on the side inward flange different from bottom plate of filler ring carrier；First telescope support, it is arranged in " convex " type space；Vacuum insulation lampshade, extension type are arranged at the top plate of reaction chamber body.Wafer reaction chamber of the present invention is in board failure, confined space can be automatically formed, and re-establishing vacuum environment, when being passed through reacting gas, wafer is back at wafer filler ring out of confined space, it is not only simple in structure, is easy to use, and effectively avoiding forming Particulate Pollution in impact process, improves product yield.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, more particularly to a kind of wafer reaction chamber and wafer reaction chamber it
Wafer with protection method.
Background technology
As wafer fabrication techniques are increasingly sophisticated, will have increasing factor in wafer manufacturing process may
Cause the interruption of wafer manufacturing process.Especially, for needing the manufacturing process of vacuum environment, interruption will certainly cause reaction chamber
House vacuum degree changes, or vacuum changes in its reaction chamber after reaction is restarted.It is apparent that different periods
Vacuum change can all cause the wafer that air outside vacuum reaction chamber room is impacted in vacuum reaction chamber room, and then cause wafer
Surface forms substantial amounts of Particulate Pollution.
Conventional wafer reaction chamber, such as the reaction chamber of situ steam oxidator (ISSG), cause in board alarm
When course of reaction is interrupted, reaction chamber meeting automatic-closing valve, reaction chamber is set to keep vacuum environment.But when reaction is restarted
When, the valve closed will automatically open up, and the wafer that extraneous air will be in impact-response chamber, cause wafer table occur
Face Particulate Pollution.
For the Particulate Pollution of crystal column surface, industry generally use wet-cleaning is removed.Although wet-cleaning can
So that the Particulate Pollution of crystal column surface to be removed, but if crystal column surface is more fragile, wet clean process can not used
When, this can only be scrapped by the wafer of particle contamination.
Seek it is a kind of because board occur it is abnormal interrupt when, can automatic protection wafer, avoid the formation of the pollution of surface particles thing
Reaction chamber and its guard method of wafer turn into one of those skilled in the art's technical problem urgently to be resolved hurrily.
Therefore the problem of existing for prior art, this case designer is by the experience of the industry for many years is engaged in, actively research
Improvement, then there is a kind of wafer with protection method of wafer reaction chamber and wafer reaction chamber of the invention.
The content of the invention
The present invention be directed in the prior art, traditional wafer reaction chamber vacuum when technique board breaks down becomes
Change, the defects of causing wafer Particulate Pollution occur, or even scrapping provide a kind of wafer reaction chamber and wafer reaction chamber it
Wafer with protection method.
The second purpose of the present invention is in the prior art, traditional wafer reaction chamber breaks down in technique board
When vacuum change, the defects of causing wafer Particulate Pollution occur, or even scrapping, provides a kind of wafer of wafer reaction chamber
Guard method.
To realize the purpose of the present invention, a kind of wafer reaction chamber of present invention offer, the wafer reaction chamber, including：
Reaction chamber body, air intake valve and outlet valve are set, and enclose the accommodating cavity to form the wafer for treating PROCESS FOR TREATMENT；Filler ring carries
Body, in towards being arranged at the bottom plate of the reaction chamber body, and in the filler ring carrier it is in side shape towards setting
Into by longitudinally superimposed " convex " the type space in the first space and second space, and the filler ring carrier enters in the presence of motor
Row movement；Wafer filler ring, it is arranged on the side different from the bottom plate of the filler ring carrier；Seal washer, it is arranged on the support
The side different from the bottom plate of ring carrier, and positioned at the inward flange of the filler ring carrier；First telescope support, it is arranged on by institute
In " convex " the type space for stating the formation of filler ring carrier；Vacuum insulation lampshade, with the wafer for treating PROCESS FOR TREATMENT be in towards setting, and
Extension type is arranged at the top plate of the reaction chamber body.
Alternatively, the filler ring carrier is moved towards in the presence of motor, to realize the filler ring carrier
Merging, or moved backward in the presence of motor, to realize the separation of the filler ring carrier.
Alternatively, first space in described " convex " type space is less than the second space in " convex " the type space.
Alternatively, the quantity of first telescope support is 3.
Alternatively, the vacuum insulation lampshade passes through the be arranged on the top plate of the reaction chamber body second flexible branch
Frame extension type is connected with the top plate of the reaction chamber body.
To realize the second purpose of the present invention, the present invention provides a kind of guard method of the wafer of wafer reaction chamber, institute
The wafer with protection method of wafer reaction chamber is stated, including：
Perform step S1：The air intake valve and outlet valve of the wafer reaction chamber are closed, and keep the reaction chamber
Vacuum state in body；
Perform step：The first telescope support stretching, extension, and the wafer for treating PROCESS FOR TREATMENT is held, and the filler ring carries
Body and the wafer filler ring are mobile backwards in the presence of motor, and first space in " convex " the type space is more than
The size of the wafer for treating PROCESS FOR TREATMENT；
Perform step S3：First telescope support shrinks, and treats that the wafer of PROCESS FOR TREATMENT moves downwardly to described in carrying
In the second space in " convex " the type space, and the filler ring carrier and the wafer filler ring are opposite in the presence of motor
It is mobile so that the filler ring carrier and the wafer filler ring merge sealing；
Perform step S4：The vacuum insulation lampshade is treated under the extension force of second telescope support along described
The direction movement of the wafer of PROCESS FOR TREATMENT, and the seal washer is held, to be formed by the vacuum insulation lampshade, seal washer
The confined space formed with filler ring carrier, the air intake valve and outlet valve of the wafer reaction chamber are opened, ambient atmosphere punching
Hit the reaction chamber body；
Perform step S5：Re-establish vacuum environment, and be passed through reacting gas, by the wafer for treating PROCESS FOR TREATMENT from by
State and be back in the confined space that vacuum insulation lampshade, seal washer and filler ring carrier are formed at the wafer filler ring.
Alternatively, the side of the bottom plate different from reaction chamber body of the filler ring carrier synthesizes round double semicircles for that can match somebody with somebody
Shape.
Alternatively, the wafer filler ring synthesizes round double semicircle shapes for that can match somebody with somebody.
Alternatively, the stroke of first telescope support is that can hold to treat work when first telescope support is in stretching, extension
The wafer of skill processing, it can be carried when first telescope support is in compression and treat that " convex " type described in the wafer entrance of PROCESS FOR TREATMENT is empty
Between second space in.
Alternatively, the seal washer in fall " eight " word be arranged on the filler ring carrier different from the bottom plate side
Edge.
In summary, wafer reaction chamber of the present invention is in board failure, can automatically form by the vacuum insulation lampshade,
The confined space that seal washer and filler ring carrier are formed, and when re-establishing vacuum environment, and being passed through reacting gas, by described in
Treat PROCESS FOR TREATMENT wafer be back to out of confined space that formed by stating vacuum insulation lampshade, seal washer and filler ring carrier it is described
At wafer filler ring, it is not only simple in structure, is easy to use, and effectively avoiding forming Particulate Pollution in impact process, improves production
Product yield.
Brief description of the drawings
Fig. 1 show the side view of wafer reaction chamber of the present invention；
Fig. 2 (a)~Fig. 2 (b) interim top views for wafer reaction chamber of the present invention；
Fig. 3 (a)~Fig. 3 (d) show the interim schematic diagram of the wafer with protection of wafer reaction chamber of the present invention.
Embodiment
To describe technology contents, construction feature, institute's reached purpose and effect of the invention in detail, below in conjunction with reality
Apply example and coordinate accompanying drawing to be described in detail.
Fig. 1, Fig. 2 (a)~Fig. 2 (b) are referred to, Fig. 1 show the side view of wafer reaction chamber of the present invention.Fig. 2 (a)~
Fig. 2 (b) interim top views for wafer reaction chamber of the present invention.The wafer reaction chamber 1, including：Reaction chamber
Body 11, the reaction chamber body 11 sets air intake valve (not shown) and outlet valve (not shown), and encloses to be formed and treat
The accommodating cavity 111 of the wafer 2 of PROCESS FOR TREATMENT；Filler ring carrier 12, the filler ring carrier 12 are in towards being arranged on the reaction chamber
At the bottom plate 112 of body 11, and being formed in towards the side of setting by the first space 121 and second in the filler ring carrier 12
Longitudinally superimposed " convex " the type space 120 in space 122, and the filler ring carrier 12 is carried out in the presence of motor (not shown)
Move towards, to realize the merging of the filler ring carrier 12, or moved backward in the presence of motor, to realize
State the separation of filler ring carrier 12；Wafer filler ring 13, the wafer filler ring 13 be arranged on the filler ring carrier 12 different from the bottom
The side of plate 112；Seal washer 14, the seal washer 14 be arranged on the filler ring carrier 12 different from the bottom plate 112
Side, and positioned at the inward flange of the filler ring carrier 12；First telescope support 15, first telescope support 15 are arranged on by institute
In " convex " the type space 120 for stating the formation of filler ring carrier 12；Vacuum insulation lampshade 16, the vacuum insulation lampshade 16 treat work with described
The wafer 2 of skill processing is in towards setting, and extension type is arranged at the top plate 113 of the reaction chamber body 11.
Referring to Fig. 1, and combine and refer to Fig. 3 (a)~Fig. 3 (d), Fig. 3 (a)~Fig. 3 (d) show wafer of the present invention and reacted
The interim schematic diagram of the wafer with protection of chamber.In order to more intuitively disclose the technical scheme of the present invention, having for the present invention is highlighted
Beneficial effect, in conjunction with embodiment, the protection of the wafer of wafer reaction chamber and its wafer reaction chamber to the present invention
Method is illustrated.As specific embodiment, the size of the wafer reaction chamber of the present invention, component quantity etc. are only to arrange
Lift, be not construed as the limitation to technical solution of the present invention.Without limitation, balanced to realize, such as the described first flexible branch
The quantity of frame 15 is 3.The vacuum insulation lampshade 16 by be arranged on the top plate 113 of the reaction chamber body 11
The extension type of two telescope support 17 is connected with the top plate 113 of the reaction chamber body 11.It is apparent that " convex " the type space
120 the first space 121 is less than the second space 122 in " convex " the type space 120.
Please continue to refer to Fig. 3 (a)~Fig. 3 (d), when the technique board breaks down, the wafer reaction chamber it
Wafer with protection method, including：
Perform step S1：The air intake valve and outlet valve of the wafer reaction chamber 1 are closed, and keep the reaction chamber
Vacuum state in body 11；
Perform step S2：First telescope support 15 stretches, and holds the wafer 2 for treating PROCESS FOR TREATMENT, and described
Filler ring carrier 12 and the wafer filler ring 13 are mobile backwards in the presence of motor, and cause " convex " the type space 120
The first space 121 be more than the size of the wafer 2 for treating PROCESS FOR TREATMENT；
Perform step S3：First telescope support 15 shrinks, and treats that the wafer 2 of PROCESS FOR TREATMENT moves downward described in carrying
To the second space 122 in " convex " the type space 120, and the filler ring carrier 12 and the wafer filler ring 13 are in motor
In the presence of move towards so that the filler ring carrier 12 and the wafer filler ring 13 merge sealing；
Perform step S4：The vacuum insulation lampshade 16 is under the extension force of second telescope support 17 along institute
The direction movement for the wafer 2 for treating PROCESS FOR TREATMENT is stated, and holds the seal washer 14, to be formed by the vacuum insulation lampshade
16th, the confined space that seal washer 14 and filler ring carrier 12 are formed, the air intake valve and outlet valve of the wafer reaction chamber 1
Open, ambient atmosphere impacts the reaction chamber body 11；
Perform step S5：Re-establish vacuum environment, and be passed through reacting gas, by the wafer 2 for treating PROCESS FOR TREATMENT from
The wafer filler ring 13 is back in the confined space formed by stating vacuum insulation lampshade 16, seal washer 14 and filler ring carrier 12
Place, avoids forming Particulate Pollution in impact process.
As those skilled in the art, it is readily appreciated that ground, the wafer 2 for treating PROCESS FOR TREATMENT is from by the vacuum insulation lamp
It is back to use at the wafer filler ring 13 in the confined space that cover 16, seal washer 14 and filler ring carrier 12 are formed and treats work with described
The wafer 2 of skill processing enters opposite with the confined space that filler ring carrier 12 is formed by stating vacuum insulation lampshade 16, seal washer 14
Execution step, will not be described here.
As preferred embodiment, the side of the bottom plate 112 different from reaction chamber body 11 of the filler ring carrier 12
For double semicircle shapes of synthesis circle can be matched somebody with somebody.The wafer filler ring 13 synthesizes double semicircle shapes of circle for that can match somebody with somebody.First telescope support
15 stroke treats the wafer 2 of PROCESS FOR TREATMENT to meet that first telescope support 15 can be held in stretching, extension, and described first stretches
Contracting support 15 compression when can carry treat PROCESS FOR TREATMENT wafer 2 enter described in " convex " type space 120 second space 122 in be
Preferably.It is more specifically, close in order to improve and maintain to be made up of the vacuum insulation lampshade 16, seal washer 14 and filler ring carrier 12
Close the vacuum in space, the seal washer 14 in fall " eight " word be arranged on the filler ring carrier 12 different from the bottom plate 112
The inward flange of side.
It is apparent that wafer reaction chamber 1 of the present invention in board failure, can be automatically formed by the vacuum insulation lampshade
16th, the confined space that seal washer 14 and filler ring carrier 12 are formed, and vacuum environment is being re-established, and it is passed through reacting gas
When, by the wafer 2 for treating PROCESS FOR TREATMENT from by state vacuum insulation lampshade 16, seal washer 14 and filler ring carrier 12 form it is close
Close in space and be back at the wafer filler ring 13, be not only simple in structure, be easy to use, and effectively avoid being formed in impact process
Particulate Pollution, improve product yield.
In summary, wafer reaction chamber of the present invention is in board failure, can automatically form by the vacuum insulation lampshade,
The confined space that seal washer and filler ring carrier are formed, and when re-establishing vacuum environment, and being passed through reacting gas, by described in
Treat PROCESS FOR TREATMENT wafer be back to out of confined space that formed by stating vacuum insulation lampshade, seal washer and filler ring carrier it is described
At wafer filler ring, it is not only simple in structure, is easy to use, and effectively avoiding forming Particulate Pollution in impact process, improves production
Product yield.
Those skilled in the art, can be to this hair it will be appreciated that without departing from the spirit or scope of the present invention
Bright carry out various modifications and variations.Thus, if any modification or modification fall into the protection of appended claims and equivalent
In the range of when, it is believed that the present invention covers these modifications and variations.
Claims (10)
- A kind of 1. wafer reaction chamber, it is characterised in that the wafer reaction chamber, including：Reaction chamber body, air intake valve and outlet valve are set, and enclose the accommodating cavity to form the wafer for treating PROCESS FOR TREATMENT；Filler ring carrier, in towards being arranged at the bottom plate of the reaction chamber body, and in the filler ring carrier it is in towards setting The side put is formed by longitudinally superimposed " convex " the type space in the first space and second space, and the filler ring carrier is in motor In the presence of move；Wafer filler ring, it is arranged on the side different from the bottom plate of the filler ring carrier；Seal washer, the side different from the bottom plate of the filler ring carrier is arranged on, and positioned at the inner edge of the filler ring carrier Edge；First telescope support, it is arranged in " convex " the type space formed by the filler ring carrier；Vacuum insulation lampshade, it is in towards setting with the wafer for treating PROCESS FOR TREATMENT, and extension type is arranged on the reaction At the top plate of chamber body.
- 2. wafer reaction chamber as claimed in claim 1, it is characterised in that the filler ring carrier is in the presence of motor Moved towards, to realize the merging of the filler ring carrier, or moved backward in the presence of motor, to realize The separation of the filler ring carrier.
- 3. wafer reaction chamber as claimed in claim 1, it is characterised in that first space in " convex " the type space is less than institute State the second space in " convex " type space.
- 4. wafer reaction chamber as claimed in claim 1, it is characterised in that the quantity of first telescope support is 3.
- 5. wafer reaction chamber as claimed in claim 1, it is characterised in that the vacuum insulation lampshade is described by being arranged on The second telescope support extension type on the top plate of reaction chamber body is connected with the top plate of the reaction chamber body.
- A kind of 6. wafer with protection method of wafer reaction chamber as claimed in claim 1, it is characterised in that the wafer reaction The wafer with protection method of chamber, including：Perform step S1：The air intake valve and outlet valve of the wafer reaction chamber are closed, and keep the reaction chamber body Interior vacuum state；Perform step S2：The first telescope support stretching, extension, and the wafer for treating PROCESS FOR TREATMENT is held, and the filler ring carrier The movement backwards in the presence of motor with the wafer filler ring, and cause first space in " convex " the type space to be more than institute State the size for the wafer for treating PROCESS FOR TREATMENT；Perform step S3：First telescope support shrinks, and treat described in carrying PROCESS FOR TREATMENT wafer move downwardly to it is described In the second space in " convex " type space, and the filler ring carrier and the wafer filler ring move in opposite directions in the presence of motor It is dynamic so that the filler ring carrier and the wafer filler ring merge sealing；Perform step S4：The vacuum insulation lampshade treats PROCESS FOR TREATMENT under the extension force of the second telescope support along described Wafer direction movement, and hold the seal washer, carried with being formed by the vacuum insulation lampshade, seal washer and filler ring The confined space that body is formed, the air intake valve and outlet valve of the wafer reaction chamber are opened, and ambient atmosphere impact is described anti- Answer chamber body；Perform step S5：Vacuum environment is re-established, and is passed through reacting gas, by the wafer for treating PROCESS FOR TREATMENT from described true It is back in the confined space that sky isolation lampshade, seal washer and filler ring carrier are formed at the wafer filler ring.
- 7. the wafer with protection method of wafer reaction chamber as claimed in claim 6, it is characterised in that the filler ring carrier it is different In the side of the bottom plate of reaction chamber body round double semicircle shapes are synthesized for that can match somebody with somebody.
- 8. the wafer with protection method of wafer reaction chamber as claimed in claim 6, it is characterised in that the wafer filler ring is can Double semicircle shapes with synthesis circle.
- 9. the wafer with protection method of wafer reaction chamber as claimed in claim 6, it is characterised in that first telescope support Stroke be that can hold to treat the wafer of PROCESS FOR TREATMENT when first telescope support is in stretching, extension, when first telescope support It can carry and be treated described in the wafer entrance of PROCESS FOR TREATMENT in the second space in " convex " type space in compression.
- 10. the wafer with protection method of wafer reaction chamber as claimed in claim 6, it is characterised in that the seal washer is in " eight " word is arranged on the inward flange different from the bottom plate side of the filler ring carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510435942.7A CN105097618B (en) | 2015-07-22 | 2015-07-22 | A kind of wafer with protection method of wafer reaction chamber and wafer reaction chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510435942.7A CN105097618B (en) | 2015-07-22 | 2015-07-22 | A kind of wafer with protection method of wafer reaction chamber and wafer reaction chamber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105097618A CN105097618A (en) | 2015-11-25 |
| CN105097618B true CN105097618B (en) | 2018-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510435942.7A Active CN105097618B (en) | 2015-07-22 | 2015-07-22 | A kind of wafer with protection method of wafer reaction chamber and wafer reaction chamber |
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| Country | Link |
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| CN (1) | CN105097618B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112018007A (en) * | 2019-05-31 | 2020-12-01 | 芯恩（青岛）集成电路有限公司 | Connecting cover for SMIF and machine table, semiconductor equipment and manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4836434A (en) * | 1985-05-31 | 1989-06-06 | Hitachi, Ltd. | Method and apparatus for airtightly packaging semiconductor package |
| CN1954419A (en) * | 2004-05-25 | 2007-04-25 | 有限会社都波岐精工 | Tape bonding apparatus and tape bonding method and electronic device production method |
| CN101622703A (en) * | 2007-02-28 | 2010-01-06 | 周星工程股份有限公司 | Substrate support frame, and substrate processing apparatus including and method of loading and unloading substrate using the same |
| CN102172585A (en) * | 2010-12-31 | 2011-09-07 | 上海集成电路研发中心有限公司 | Immersion type water tank, cleaning device and silicon wafer cleaning method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3774951B2 (en) * | 1996-09-26 | 2006-05-17 | 神鋼電機株式会社 | Wafer cleaning equipment |
-
2015
- 2015-07-22 CN CN201510435942.7A patent/CN105097618B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4836434A (en) * | 1985-05-31 | 1989-06-06 | Hitachi, Ltd. | Method and apparatus for airtightly packaging semiconductor package |
| CN1954419A (en) * | 2004-05-25 | 2007-04-25 | 有限会社都波岐精工 | Tape bonding apparatus and tape bonding method and electronic device production method |
| CN101622703A (en) * | 2007-02-28 | 2010-01-06 | 周星工程股份有限公司 | Substrate support frame, and substrate processing apparatus including and method of loading and unloading substrate using the same |
| CN102172585A (en) * | 2010-12-31 | 2011-09-07 | 上海集成电路研发中心有限公司 | Immersion type water tank, cleaning device and silicon wafer cleaning method |
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|---|---|
| CN105097618A (en) | 2015-11-25 |
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