CN105088173A - Semiconductor equipment - Google Patents
Semiconductor equipment Download PDFInfo
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- CN105088173A CN105088173A CN201410156195.9A CN201410156195A CN105088173A CN 105088173 A CN105088173 A CN 105088173A CN 201410156195 A CN201410156195 A CN 201410156195A CN 105088173 A CN105088173 A CN 105088173A
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- corrugated tube
- tubular axis
- corrugated pipe
- ripple tubular
- mounting block
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Abstract
The present invention provides semiconductor equipment, which comprises a reaction chamber and a corrugated pipe apparatus, wherein the corrugated pipe apparatus comprises a corrugated pipe, a corrugated pipe shaft and a corrugated pipe fixation member, the corrugated pipe fixation member achieves fixing the corrugated pipe apparatus on the bottom portion of the reaction chamber, the corrugated pipe and the corrugated pipe fixation member sleeve on the outer side wall of the corrugated pipe shaft, both ends of the corrugated pipe are respectively and fixedly connected with the corrugated pipe shaft and the corrugated pipe fixation member, the movement up and down of the substrate on the corrugated pipe shaft in the reaction chamber is achieved through the axial stretching of the corrugated pipe along the corrugated pipe shaft, a position limiting member is arranged on the outer side wall of the corrugated pipe shaft, the outer diameter of the position limiting member is not less than the inner diameter of the corrugated pipe fixation member, and the axial position of the position limiting member on the corrugated pipe shaft is arranged at the contact position of the position limiting member and the corrugated pipe fixation member under the stretching of the corrugated pipe to the maximum allowable length. With the semiconductor equipment of the present invention, the service life, the precision, the stability and the reliability of the corrugated pipe can be improved, the disassembly is convenient and easy, and the equipment maintenance time is reduced.
Description
Technical field
The invention belongs to semiconductor devices manufacturing technology field, be specifically related to a kind of semiconductor devices.
Background technology
Physical vapor deposition (PhysicalVaporDeposition, hereinafter referred to as PVD) equipment is Application comparison semiconductor processing equipment widely, by adopting physical method at the deposited on silicon film of the workpieces to be machined such as substrate.The main method of PVD comprises vacuum evaporation, sputter coating and arc plasma plated film etc., and the film deposited comprises metallic film, alloy film, compound film, ceramic membrane, semiconductor film and polymkeric substance etc.
The process environments of PVD equipment is generally vacuum environment, and often needs to carry out displacement action in vacuum environment.Because corrugated tube is a kind of tubular elastomeric sensor connected into along folding retractable direction with collapsible wrinkle sheet, therefore, the elastic sealing device often adopting corrugated tube to form in PVD equipment is to realize carrying out displacement action under the condition of the fluctuating load and larger displacement of bearing more cycle index.Fig. 1 is the structure diagram with existing PVD equipment.Fig. 2 is the upward view of bellows arrangement in Fig. 1.See also Fig. 1 and Fig. 2, PVD equipment comprises reaction chamber 10 and bellows arrangement, bellows arrangement comprises ripple tubular axis 11, corrugated tube 12, corrugated tube flange 13, mounting plate 14, screw 15 and sealing-ring 16, wherein, corrugated tube 12 and corrugated tube flange 13 are nested with on the outer side wall of ripple tubular axis 11, and the two ends of corrugated tube 12 are welded and fixed with ripple tubular axis 11 and corrugated tube flange 13 respectively; Mounting plate 14 is also nested with on the outer side wall of ripple tubular axis 11, and is positioned at the below of corrugated tube flange 13; Ripple tubular axis 11 runs through the through hole (not shown) of reaction chamber 10 base plate, and corrugated tube flange 13 and mounting plate 14 lay respectively at the inner side and outer side of reaction chamber 10 at this lead to the hole site place, and the two is fixed by screw 15; Sealing-ring 16 is arranged on the position that corrugated tube flange 13 and reaction chamber 10 base plate contact, in order to sealed reaction chamber 10; In addition, the upper surface of ripple tubular axis 11 is provided with basal disc 17, for carrying substrates S, this bellows arrangement is by the Tension and Compression to corrugated tube 12, the relative corrugated tube flange 13 of ripple tubular axis 11 can be realized move up and down in its axial direction, to realize driving substrate to move up and down in reaction chamber 10, and the maximum value that corrugated tube 12 stretches is less than the maximum permission length of corrugated tube 12, and so-called maximum permission length refers to the maximum length under the prerequisite of viscous deformation does not occur corrugated tube 12.
When installing above-mentioned bellows arrangement, first sealing-ring 16 is installed; Then the top of the ripple tubular axis 11 be fixedly connected with, corrugated tube 12 and corrugated tube flange 13 autoreaction chamber 10 is entered in reaction chamber 10, and make ripple tubular axis 11 run through the through hole of reaction chamber 10 base plate; Again mounting plate 14 is nested with from bottom to top in the outside of ripple tubular axis 11, and with screw 15, corrugated tube flange 13 and mounting plate 14 is fixed.When dismantling above-mentioned bellows arrangement, first screw 15 is dismantled; Then mounting plate 14 is separated with ripple tubular axis 11 from top to bottom; Again ripple tubular axis 11 is upwards carried corrugated tube flange 13 is separated with the base plate of reaction chamber 10, and the top of autoreaction chamber 10 spreads out of reaction chamber.
In actual applications, owing to being vacuum environment in the reaction chamber 10 when PVD equipment works, and inside corrugated tube 12, be atmospheric environment, this makes the base plate of corrugated tube flange 13 with reaction chamber 10 to be bonded together in barometric point effect lower seal 16, therefore, following technical problem can be there is: even if corrugated tube 12 is stretched to maximum permission length when dismantling bellows arrangement, still corrugated tube flange 13 can not be separated with reaction chamber 10 base plate, if corrugated tube 12 continues to be stretched can reduce its precision, stability and reliability, and need frequently corrugated tube 12 excessive tensile could be realized corrugated tube flange 13 be separated with reaction chamber 10 base plate in the process of dismounting, this can cause the work-ing life of corrugated tube 12 low, vacuum leak can be caused time serious, thus affect the vacuum tightness of whole vacuum system.For this reason, after being stretched to maximum permission length by corrugated tube 12 and still corrugated tube flange 13 can not being separated with reaction chamber 10 base plate, usual needs apply extra external force from the bottom to top to corrugated tube flange and are separated by its base plate with reaction chamber 10, this causes unloading process more complicated, thus causes the maintenance of the equipment time long.
Summary of the invention
The present invention is intended to solve in prior art the technical problem existed, and provides a kind of semiconductor devices, and it not only can improve work-ing life of corrugated tube, precision, stability and reliability; And bellows arrangement dismounting can be made to be more prone to, to facilitate, and then the maintenance of the equipment time can be reduced.
For solving the problem, the invention provides a kind of semiconductor devices, comprise reaction chamber and bellows arrangement, described bellows arrangement comprises corrugated tube, ripple tubular axis and corrugated tube mounting block, wherein, described corrugated tube mounting block is for realizing the bottom described bellows arrangement being fixed on described reaction chamber, described corrugated tube and corrugated tube mounting block are nested with on the outer side wall of described ripple tubular axis, and the two ends of described corrugated tube are fixedly connected with corrugated tube mounting block with ripple tubular axis respectively, by the axial stretching of described corrugated tube along described ripple tubular axis, move up and down at described reaction chamber to realize the substrate be positioned on described ripple tubular axis, the outer side wall of described ripple tubular axis is provided with locating part, the external diameter of described locating part is not less than the internal diameter of described corrugated tube mounting block, and described locating part is set in the position axially of described ripple tubular axis: be stretched to the condition of maximum permission length at described corrugated tube under, the position that described locating part contacts with described corrugated tube mounting block.
Wherein, described locating part comprises multiple protuberance, and multiple described protuberance is arranged along the circumferential interval of described ripple tubular axis, and the external diameter of each described protuberance is not less than the internal diameter of described corrugated tube mounting block.
Wherein, described multiple protuberance along described ripple tubular axis circumferential interval and evenly arrange.
Wherein, described locating part is the annular protrusion arranged along the circumference of described ripple tubular axis, and the external diameter of described annular protrusion is not less than the internal diameter of described corrugated tube mounting block.
Wherein, described annular protrusion and described ripple tubular axis adopt integrated mode to process.
Wherein, described annular protrusion and described ripple tubular axis adopt thread connecting mode to fix.
Wherein, each described protuberance adopts the mode be threaded to fix with described ripple tubular axis.
Wherein, described corrugated tube mounting block comprises corrugated tube flange and mounting plate, and described corrugated tube flange is fixedly connected with described corrugated tube; Described ripple tubular axis runs through the diapire of described reaction chamber, and described corrugated tube flange and mounting plate lay respectively at the both sides of described diapire, and the two is fixedly connected with; And the internal perisporium on described mounting plate is provided with and runs through its upper and lower surface, and the recess corresponding with described locating part, the external diameter of described recess is not less than the external diameter of described locating part.
Wherein, also comprise sealing-ring, described sealing-ring is arranged on the position that described corrugated tube flange contacts with described diapire, for sealing the gap of the two.
Wherein, described corrugated tube flange and described mounting plate adopt thread connecting mode to fix.
The present invention has following beneficial effect:
Semiconductor devices provided by the invention, it is provided with locating part on the outer side wall of ripple tubular axis, and the external diameter of locating part is not less than the internal diameter of corrugated tube mounting block, locating part is set in corrugated tube position axially: be stretched to the condition of maximum permission length at corrugated tube under, the position that locating part contacts with corrugated tube mounting block, therefore, in the process of dismounting bellows arrangement, when corrugated tube is axially carried locating part is contacted with corrugated tube mounting block time, now corrugated tube is stretched to maximum permission length, corrugated tube is continued axially to carry, corrugated tube can not continue to be stretched, and the pulling force upwards carried can be applied to the bottom of corrugated tube mounting block from locating part, corrugated tube mounting block can be finally realized to be separated with diapire.As from the foregoing, in unloading process, corrugated tube is not stretched and exceedes maximum permission length, this compared with prior art, do not need corrugated tube excessive tensile, do not need to apply extra external force to corrugated tube mounting block, thus not only can improve work-ing life of corrugated tube, precision, stability and reliability yet; And bellows arrangement dismounting can be made to be more prone to, to facilitate, and then the maintenance of the equipment time can be reduced.
Accompanying drawing explanation
Fig. 1 is the structure diagram with existing PVD equipment;
Fig. 2 is the upward view of bellows arrangement in Fig. 1;
The structural representation of semiconductor processing equipment of Fig. 3 for there is the embodiment of the present invention providing;
Fig. 4 is the upward view of the bellows arrangement shown in Fig. 3; And
Fig. 5 is the partial enlarged drawing of the region I shown in Fig. 3.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, semiconductor devices provided by the invention is described in detail.
The structural representation of semiconductor processing equipment of Fig. 3 for there is the embodiment of the present invention providing.Fig. 4 is the upward view of the bellows arrangement shown in Fig. 3.Fig. 5 is the partial enlarged drawing of the region I shown in Fig. 3.See also Fig. 3, Fig. 4 and Fig. 5, the semiconductor devices that the present embodiment provides, comprise reaction chamber 30 and bellows arrangement.Bellows arrangement comprises corrugated tube 20, ripple tubular axis 21 and corrugated tube mounting block.Wherein, corrugated tube mounting block is for realizing bottom bellows arrangement being fixed on reaction chamber, corrugated tube 20 and corrugated tube mounting block are nested with on the outer side wall of ripple tubular axis 21, and the two ends of corrugated tube 20 are fixedly connected with (such as with ripple tubular axis 21 with corrugated tube mounting block respectively, be welded and fixed), by the axial stretching of corrugated tube 20 along ripple tubular axis 21, move up and down at reaction chamber 30 to realize the substrate S be positioned on ripple tubular axis 21, as shown in Figure 3, particularly, ripple tubular axis 21 is provided with the basal disc 28 for carrying substrates S, corrugated tube mounting block comprises corrugated tube flange 22 and mounting plate 23, for bellows arrangement being fixed on the diapire 31 of reaction chamber 30, in this case, corrugated tube flange 22 is fixedly connected with (such as with corrugated tube 20, be welded and fixed), ripple tubular axis 21 runs through diapire 31, corrugated tube flange 22 and mounting plate 23 lay respectively at the both sides of diapire 31, and the two is fixedly connected with, particularly, the two adopts thread connecting mode to be fixedly connected with, screw 24 as shown in Figure 4, certainly, in actual applications, the two can also adopt other modes to fix, and does not enumerate at this.
The outer side wall of ripple tubular axis 21 is provided with locating part, the external diameter of locating part is not less than the internal diameter of corrugated tube mounting block, locating part is set in ripple tubular axis 21 position axially: be stretched to the condition of maximum permission length at corrugated tube 20 under, the position that locating part contacts with corrugated tube mounting block, so-called maximum permission length refers to the maximum length stretched under the prerequisite of viscous deformation does not occur corrugated tube 20, particularly, locating part comprises multiple protuberance 25, multiple protuberance 25 is arranged along the circumferential interval of ripple tubular axis 21, and the outer diameter D of each protuberance 25 is not less than the internal diameter of corrugated tube mounting block, particularly, in the present embodiment, corrugated tube mounting block adopts the fixed sturcture of corrugated tube flange 22 and mounting plate 23, in this case, the internal perisporium of mounting plate 23 is provided with and runs through its upper and lower surface, and with protuberance 25(be, locating part) corresponding recess 231, namely the outer diameter D 2 of recess 231 is not less than protuberance 25(, locating part) outer diameter D, and, the outer diameter D of protuberance 25 is not less than the internal diameter D1 of corrugated tube flange 22, by the recess 231 of mounting plate 23 and the position one_to_one corresponding of protuberance 25, this can make the mounting plate 23 when mounting and dismounting can load onto via this protuberance 25 or unload along ripple tubular axis 21, or, the protuberance 25 when upwards being carried by ripple tubular axis 21 can be made to contact with corrugated tube flange 22 via this recess 231.
In addition, particularly, as shown in Figure 4, locating part comprises three protuberances 25, and each protuberance 25 adopts the mode be threaded to fix with ripple tubular axis 21, bolt 26 as shown in Figure 5, certainly, in actual applications, each protuberance 25 and ripple tubular axis 21 also can adopt other modes to fix.
Preferably, multiple protuberance 25 along ripple tubular axis 21 circumferential interval and evenly arrange, can make when ripple tubular axis 21 is upwards carried protuberance 25 is contacted with corrugated tube flange 22 time, the pulling force upwards carried successively by ripple tubular axis 21, bolt 26, protuberance 25(namely, locating part) be applied to the bottom of corrugated tube flange 22 equably, thus the stability of bellows arrangement unloading process can be improved.
In the present embodiment, bellows arrangement is sealing-ring 27 also, and sealing-ring 27 is arranged on the position that corrugated tube flange 22 contacts with diapire 31, for sealing the gap of the two, to ensure the vacuum tightness in reaction chamber 30.
The installation and removal process of the bellows arrangement in the semiconductor devices that the present embodiment provides is described below in detail.Particularly, installation process: first install sealing-ring 27; Then the top of the ripple tubular axis 21 be fixedly connected with, corrugated tube 20 and corrugated tube flange 22 autoreaction chamber 30 is entered in reaction chamber 30, and make ripple tubular axis 21 run through the diapire 31 of reaction chamber 30; Again by the recess 231 on mounting plate 23 and protuberance 25 position one_to_one corresponding, be nested with from bottom to top on the outer side wall of ripple tubular axis 21 via protuberance 25, and by screw 24, corrugated tube flange 22 and mounting plate 23 fixed;
Unloading process: first screw 24 is dismantled; Then by the position one_to_one corresponding of recess 231 with protuberance 25, mounting plate 23 is pulled down from ripple tubular axis 21 from top to bottom via protuberance 25; Again ripple tubular axis 21 is upwards carried, protuberance 25 is touched with the bottom connection of corrugated tube flange 22, now corrugated tube 20 is stretched to maximum permission length, and continue ripple tubular axis 21 upwards to carry, corrugated tube 20 can not continue to be stretched, and the pulling force upwards carried can be applied to the bottom of corrugated tube flange 22 successively by ripple tubular axis 21, bolt 26, protuberance 25, until be separated with the diapire 31 of reaction chamber 30 by corrugated tube flange 22, and the top of the ripple tubular axis 21 be fixedly connected with, corrugated tube 20 and corrugated tube flange 22 autoreaction chamber 30 is spread out of reaction chamber 30.
It should be noted that, in the present embodiment, locating part comprises three protuberances 25, and three protuberances 25 along ripple tubular axis 21 circumferential interval and evenly arrange.But the present invention is not limited thereto, in actual applications, the quantity of protuberance 25 can be arranged as the case may be, and multiple protuberance 25 also can along the uneven setting in circumferential interval of ripple tubular axis 21; In addition, the shape of each protuberance 25 does not specifically limit.
Also it should be noted that, in actual applications, locating part also can be the annular protrusion arranged along the circumference of ripple tubular axis 21, the external diameter of annular protrusion is not less than the internal diameter of corrugated tube mounting block, and in this case, the external diameter of annular protrusion is not less than the internal diameter D1 of corrugated tube flange 22, recess 231 on mounting plate 23 is annular recess, that is, expand the internal diameter D2 of mounting plate 23, and the internal diameter D2 of mounting plate 23 is not less than the external diameter of annular protrusion.Wherein, annular protrusion and ripple tubular axis 21 can adopt integrated mode to process; Certainly, also can ripple tubular axis 21 separate with both annular protrusions, and the two adopts the mode to be such as threaded etc. to fix.
It should be noted that in addition, in the present embodiment, corrugated tube mounting block adopts the concrete structure of corrugated tube flange 22 and mounting plate 23.But, the present invention is not limited thereto, in actual applications, corrugated tube mounting block can adopt other fixed sturctures, and such as, corrugated tube mounting block only comprises corrugated tube flange 22, corrugated tube flange 22 adopts the mode be threaded directly to be fixed on the inner side of the diapire 31 of reaction chamber 30, in this case, particularly, the external diameter of locating part only needs the internal diameter being not less than corrugated tube flange 22.
In sum, in the process of dismounting bellows arrangement, when ripple tubular axis 21 is upwards carried locating part is contacted with corrugated tube mounting block time, now corrugated tube 20 is stretched to maximum permission length, ripple tubular axis 21 is continued upwards to carry, corrugated tube 20 can not continue to be stretched, and the pulling force upwards carried can be applied to the bottom of corrugated tube mounting block from locating part, can finally realize corrugated tube mounting block to be separated with diapire 31.Therefore, in unloading process, corrugated tube 20 is not stretched and exceedes maximum permission length, this compared with prior art, do not need corrugated tube 20 excessive tensile, do not need to apply extra external force to corrugated tube mounting block, thus not only can improve work-ing life of corrugated tube, precision, stability and reliability yet; And bellows arrangement dismounting can be made to be more prone to, to facilitate, and then the maintenance of the equipment time can be reduced.
Be understandable that, the illustrative embodiments that above embodiment is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, when not departing from principle of the present invention and essence, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a semiconductor devices, comprise reaction chamber and bellows arrangement, described bellows arrangement comprises corrugated tube, ripple tubular axis and corrugated tube mounting block, wherein, described corrugated tube mounting block is for realizing the bottom described bellows arrangement being fixed on described reaction chamber, described corrugated tube and corrugated tube mounting block are nested with on the outer side wall of described ripple tubular axis, and the two ends of described corrugated tube are fixedly connected with corrugated tube mounting block with ripple tubular axis respectively, by the axial stretching of described corrugated tube along described ripple tubular axis, move up and down at described reaction chamber to realize the substrate be positioned on described ripple tubular axis, it is characterized in that, the outer side wall of described ripple tubular axis is provided with locating part, the external diameter of described locating part is not less than the internal diameter of described corrugated tube mounting block, and
Described locating part is set in the position axially of described ripple tubular axis: be stretched to the condition of maximum permission length at described corrugated tube under, the position that described locating part contacts with described corrugated tube mounting block.
2. semiconductor devices according to claim 1, is characterized in that, described locating part comprises multiple protuberance, and multiple described protuberance is arranged along the circumferential interval of described ripple tubular axis, and the external diameter of each described protuberance is not less than the internal diameter of described corrugated tube mounting block.
3. semiconductor devices according to claim 2, is characterized in that, described multiple protuberance along described ripple tubular axis circumferential interval and evenly arrange.
4. semiconductor devices according to claim 1, is characterized in that, described locating part is the annular protrusion arranged along the circumference of described ripple tubular axis, and the external diameter of described annular protrusion is not less than the internal diameter of described corrugated tube mounting block.
5. semiconductor devices according to claim 4, is characterized in that, described annular protrusion and described ripple tubular axis adopt integrated mode to process.
6. semiconductor devices according to claim 4, is characterized in that, described annular protrusion and described ripple tubular axis adopt thread connecting mode to fix.
7. semiconductor devices according to claim 2, is characterized in that, each described protuberance adopts the mode be threaded to fix with described ripple tubular axis.
8. the semiconductor devices according to claim 1-7 any one, is characterized in that, described corrugated tube mounting block comprises corrugated tube flange and mounting plate, and described corrugated tube flange is fixedly connected with described corrugated tube;
Described ripple tubular axis runs through the diapire of described reaction chamber, and described corrugated tube flange and mounting plate lay respectively at the both sides of described diapire, and the two is fixedly connected with; And
Internal perisporium on described mounting plate is provided with and runs through its upper and lower surface, and the recess corresponding with described locating part, the external diameter of described recess is not less than the external diameter of described locating part.
9. semiconductor devices according to claim 8, is characterized in that, also comprises sealing-ring, and described sealing-ring is arranged on the position that described corrugated tube flange contacts with described diapire, for sealing the gap of the two.
10. semiconductor devices according to claim 8, is characterized in that, described corrugated tube flange and described mounting plate adopt thread connecting mode to fix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410156195.9A CN105088173B (en) | 2014-04-17 | 2014-04-17 | A kind of semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410156195.9A CN105088173B (en) | 2014-04-17 | 2014-04-17 | A kind of semiconductor equipment |
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| Publication Number | Publication Date |
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| CN105088173A true CN105088173A (en) | 2015-11-25 |
| CN105088173B CN105088173B (en) | 2017-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410156195.9A Active CN105088173B (en) | 2014-04-17 | 2014-04-17 | A kind of semiconductor equipment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108300966A (en) * | 2017-01-12 | 2018-07-20 | Ald真空技术股份有限公司 | Device and method for coating workpieces |
| CN110813636A (en) * | 2019-11-27 | 2020-02-21 | 东台市富安合成材料有限公司 | Sealed dismantlement formula synthetic leather coating unit |
| CN113013010A (en) * | 2019-12-20 | 2021-06-22 | 中微半导体设备(上海)股份有限公司 | Corrugated pipe structure, method for adjusting verticality and plasma processing device thereof |
| CN116837339A (en) * | 2023-09-01 | 2023-10-03 | 无锡尚积半导体科技有限公司 | Bell plate device and magnetron sputtering equipment |
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| CN102269629A (en) * | 2010-06-07 | 2011-12-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Temperature measuring device and temperature measuring system |
| CN103489805A (en) * | 2012-06-12 | 2014-01-01 | 苏州美图半导体技术有限公司 | Wafer bonding system |
| CN103663262A (en) * | 2012-09-03 | 2014-03-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting mechanism and base plate loading device comprising same |
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| JPH01272768A (en) * | 1988-04-21 | 1989-10-31 | Anelva Corp | Vertical tray conveyance type sputtering device |
| CN102269629A (en) * | 2010-06-07 | 2011-12-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Temperature measuring device and temperature measuring system |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108300966A (en) * | 2017-01-12 | 2018-07-20 | Ald真空技术股份有限公司 | Device and method for coating workpieces |
| CN108300966B (en) * | 2017-01-12 | 2022-03-01 | Ald真空技术股份有限公司 | Apparatus and method for coating workpieces |
| CN110813636A (en) * | 2019-11-27 | 2020-02-21 | 东台市富安合成材料有限公司 | Sealed dismantlement formula synthetic leather coating unit |
| CN113013010A (en) * | 2019-12-20 | 2021-06-22 | 中微半导体设备(上海)股份有限公司 | Corrugated pipe structure, method for adjusting verticality and plasma processing device thereof |
| CN113013010B (en) * | 2019-12-20 | 2023-09-29 | 中微半导体设备(上海)股份有限公司 | Corrugated pipe structure, method for adjusting verticality and plasma processing device thereof |
| CN116837339A (en) * | 2023-09-01 | 2023-10-03 | 无锡尚积半导体科技有限公司 | Bell plate device and magnetron sputtering equipment |
| CN116837339B (en) * | 2023-09-01 | 2023-11-28 | 无锡尚积半导体科技有限公司 | Bell plate device and magnetron sputtering equipment |
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|---|---|
| CN105088173B (en) | 2017-10-13 |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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