CN105072800A - Structure for realizing microwave coaxial transmission at different layer of PCB board - Google Patents
Structure for realizing microwave coaxial transmission at different layer of PCB board Download PDFInfo
- Publication number
- CN105072800A CN105072800A CN201510354636.0A CN201510354636A CN105072800A CN 105072800 A CN105072800 A CN 105072800A CN 201510354636 A CN201510354636 A CN 201510354636A CN 105072800 A CN105072800 A CN 105072800A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- microwave
- transitional pore
- line
- coaxial transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/10—Wire waveguides, i.e. with a single solid longitudinal conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09636—Details of adjacent, not connected vias
Abstract
The present invention discloses a structure for realizing microwave coaxial transmission at different layers of PCB boards. The structure comprises PCB boards with at least two layers of circuits, microwave transmission lines are disposed on the double layers of circuits, connection of the microwave transmission lines of the double layers of circuits is realized through metal connection transition holes between the double layers of circuits, and metal earthing transition holes are arranged around the metal transition holes. A quasi-TEM mode of the PCB board transmission lines is changed into a TEM mode of coaxial transmission and then into a TEM mode of the transmission lines, thereby realizing transition with the minimum loss under the same mode. The problem of transmission of signals among different layers of double-layer and multi-layer PCB boards at RF, microwave and millimeter wave bands can be solved.
Description
Technical field
The present invention relates to microwave transmission, particularly a kind of pcb board different aspects realize the structure of microwave coaxial transmission.
Background technology
Current PCB transmits microwave signal mainly in same layer transmission line, for Quasi-TEM mode, along with the development of technology, no matter microwave device or microwave sub-system or system, miniaturized, integrated, complanation, lightweight becomes the trend of microwave regime, and in microwave product miniaturization, device is integrated, miniaturization is one of current main trend, the miniaturization of pcb board is also another main trend simultaneously, pcb board miniaturization is by original double sided board integrated device mode, develop into the mode using multi-layer sheet integrated device, pcb board is from original two-layer, 4 layers may be become, 6 layers, 8 layers even tens layers, tens layers.Only microwave signal is transmitted at same layer by microwave 50 ohm transmission line by original, develop in the transmission microwave signal for different layers, and for the microwave transmission line of different layers, traditional approach directly connects transmission line with excessive through hole, but the transmission that frequency ratio is lower can only be supported in this kind of excessive hole, for microwave frequency band, millimeter wave frequency band, mismatch that this excessive hole through hole causes becomes large, and transmission performance significantly declines, very to such an extent as to can not use.
Summary of the invention
The object of the present invention is to provide a kind of pcb board different aspects to realize the structure of microwave coaxial transmission, realize RF, microwave by arranging auxiliary transmission hole on pcb board, even millimeter wave frequency band effectively can transmit by different layers on pcb board.
To achieve these goals, the solution of the present invention is:
A kind of pcb board different aspects realize the structure of microwave coaxial transmission, comprising is at least the pcb board of double-deck circuit, double-deck circuit is respectively equipped with microwave transmission line, the connection of double-deck circuit microwave transmission line connects transitional pore by the metal between double-deck circuit and realizes, wherein, described metal transfer hole is provided with metallic ground transitional pore.
A kind of pcb board different aspects realize the structure of microwave coaxial transmission, comprise multiple frequency microwave device and multilayer line pcb board, bus plane and frequency microwave control circuitry layer is respectively arranged with in the intermediate layer of described multilayer line pcb board, on the top line plate that described multiple frequency microwave device is arranged on multilayer circuit board respectively and on wiring underlayer plate, wherein, the frequency microwave device setting in column in a row anyhow respectively of top line plate and wiring underlayer plate, its position is mutually corresponding in pairs up and down, described top line plate frequency microwave device between row and row with wiring underlayer plate frequency microwave device between the column and the column, or be respectively arranged with printed foil wire between row and row with wiring underlayer plate frequency microwave device between the column and the column at described top line plate frequency microwave device, many printed foil wires of top line plate and wiring underlayer plate are that mutual right-angled intersection state is arranged, wherein, right-angled intersection point is provided with metal and connects transitional pore, upper and lower printed foil wire is communicated with by metal throuth hole, described metal transfer hole is provided with metallic ground transitional pore.
Scheme is further: described multilayer line pcb board is 6 sandwich circuit pcb boards, top layer and the bottom of 6 sandwich circuit pcb boards are separately installed with frequency microwave device, between described 6 sandwich circuit board top layers and bottom from top layer be downwards top layer frequency microwave device ground layer, top layer frequency microwave device signal key-course, bottom frequency microwave device signal key-course, bottom frequency microwave device ground layer respectively.
Scheme is further: described ground connection is connection line power cathode.
Scheme is further: described metal connects transitional pore parameter by formula
determine, wherein: Z
0for impedance,
for pcb board material electric medium constant, D be connect transitional pore overall diameter, d is the interior diameter that D subtracts copper facing thickness.
Scheme is further: described impedance Z
0be 50 ohm, it is 0.3mm to 0.4mm that described metal connects transitional pore overall diameter D.
Scheme is further: described metallic ground transitional pore diameter is 0.3mm to 0.4mm, and metallic ground transitional pore distance metal connects transitional pore Edge Distance and is not more than 5mm.
Scheme is further: described pcb board is the pcb board being greater than two-layer multilayer line, connects transitional pore circumference be provided with metallic ground transitional pore around the metal between multilayer line microwave transmission line.
Scheme is further: described microwave transmission line between the layers linearly mutually square crossing arrange.
The invention has the beneficial effects as follows:
1) by the Quasi-TEM mode of pcb board transmission line, become the TEM pattern of coaxial transmission, after degree to the TEM pattern of transmission line, realize under pattern of the same race, minimal losses is transmitted.
2) can solve at RF, microwave, millimeter wave frequency band, signal is at double-deck, multi-layer PCB board different layers transmission problem.
Below in conjunction with drawings and Examples, the present invention is described in detail.
Accompanying drawing explanation
Fig. 1 is the structural representation of traditional PCB printed line road coaxial transmission;
Fig. 2 is the structural representation of pcb board microwave coaxial of the present invention transmission;
Fig. 3 is the structural representation of the pcb board microwave coaxial transmission of the double-deck circuit of the present invention;
Fig. 4 is the structural representation of the embodiment of the present invention 2 microwave coaxial transmission;
Fig. 5 the present invention 6 layers of pcb board circuit board structure schematic diagram.
Embodiment
Fig. 1 illustrates the structure of traditional PCB printed line road coaxial transmission, the transmission line 2 of pcb board 1 both sides connects logical 3 holes of transition by metal and directly connects, but this kind of through hole can only support the transmission that frequency ratio is lower, for microwave frequency band, millimeter wave frequency band, mismatch that this through hole will cause becomes large, and transmission performance significantly declines, very to such an extent as to can not use.
Embodiment 1:
A kind of pcb board different aspects of the present embodiment realize the structure of microwave coaxial transmission, as shown in Figures 2 and 3, comprising is at least the pcb board 1 of double-deck circuit, transmission line 2 on double-deck circuit is microwave transmission line respectively, the connection of double-deck circuit microwave transmission line connects transitional pore 3 by the metal between double-deck circuit and realizes, the present embodiment and conventional transmission difference are, described metal transfer hole circle week is provided with metallic ground transitional pore 4.
In embodiment: described pcb board is the pcb board being greater than two-layer multilayer line, the connection of multilayer line microwave transmission line connects transitional pore by the metal between multilayer line and realizes, and connects transitional pore circumference be provided with metallic ground transitional pore around the metal between multilayer line microwave transmission line; As further preferred version: described microwave transmission line is linearly square crossing setting mutually between the layers.
Embodiment 2:
A kind of pcb board frequency microwave Transfer-matrix circuit structure, comprise multiple frequency microwave device and multilayer line pcb board, bus plane and frequency microwave control circuitry layer is respectively arranged with in the intermediate layer of described multilayer line pcb board, on the top line plate that described multiple frequency microwave device is arranged on multilayer circuit board respectively and on wiring underlayer plate, wherein, as shown in Figure 4, the top line plate 5 of multilayer line pcb board and the setting in column in a row anyhow respectively of the frequency microwave device 7 of wiring underlayer plate 6, its position is mutually corresponding in pairs up and down, described top line plate frequency microwave device between row and row with wiring underlayer plate frequency microwave device between the column and the column, or be respectively arranged with printed foil wire 8 between row and row with wiring underlayer plate frequency microwave device between the column and the column at described top line plate frequency microwave device, many printed foil wires of top line plate and wiring underlayer plate are that mutual right-angled intersection state is arranged, wherein, right-angled intersection point is provided with metal and connects transitional pore 3, upper and lower printed foil wire is communicated with by metal throuth hole, described metal transfer hole circle week is provided with metallic ground transitional pore 4.
A preferred version of the present embodiment is: as shown in Figure 5, described multi-layer PCB board is 6 sandwich circuit pcb boards, top layer 9 and the bottom 10 of 6 sandwich circuit pcb boards are separately installed with frequency microwave device, between described 6 sandwich circuit board top layers and bottom from top layer be downwards top layer frequency microwave device ground layer 11 (power cathode) respectively, top layer frequency microwave device signal key-course 12, bottom frequency microwave device signal key-course 13, bottom frequency microwave device ground layer 14 (power cathode), described top layer frequency microwave device and bottom frequency microwave device transmission line are connected transitional pore by a metal to connect 3, connect transitional pore circumference around described metal and be provided with metallic ground transitional pore 4.
Described ground connection in above-mentioned two embodiments is connection line power cathode.
Described metal in above-mentioned two embodiments connects transitional pore parameter by formula
determine, wherein: Z
0for impedance,
for pcb board material electric medium constant, D be connect transitional pore overall diameter, d is the interior diameter that D subtracts copper facing thickness.Electric medium constant wherein
be that constant can be found according to material in table always, usually need the pcb board material selecting to be suitable for high-frequency transmission.
As a preferred version: described impedance Z
0be 50 ohm, it is 0.3mm to 0.4mm that described metal connects transitional pore overall diameter D.
In above-mentioned two embodiments: described metallic ground transitional pore diameter is 0.3mm to 0.4mm, metallic ground transitional pore distance metal connects transitional pore Edge Distance and is not more than 5mm.
For PCB coaxial transmission structure in above-described embodiment, metal connects that transitional pore arranges should be The more the better, but considers practical wiring, the impacts such as processing technology, in the interference-free situation that should ensure to connect up, connects transitional pore periphery do as far as possible many ground holes at metal.
The pcb board of above-described embodiment realizes coaxial microwave transmission structure, uses the inner wire of through hole as coaxial line in suitable aperture, appropriate location, outer ring, do suitable aperture, some grounding through hole, can solve signal at microwave and millimeter wave, double-deck, multi-layer PCB board different layers transmission problem.By the accurate TEM mould of pcb board transmission line, become the TEM mould of coaxial transmission, after degree to the TEM mould of transmission line, realize under pattern of the same race, minimal losses is transmitted.The highest frequency that selected printed board sheet material is supported, this kind of structure also can support this frequency in respective plates.
Metal transfer hole through-hole aperture in embodiment, metallic ground transitional pore aperture, spacing, quantity etc.Simultaneously different live widths, material, sheet metal thickness, these parameters all can to microwave transmission performance generation respective change.Therefore will realize this coaxial transmission structure, signal metal transitional pore through-hole aperture, metallic ground transitional pore through-hole aperture, spacing, quantity etc., all will do corresponding optimizing and revising, and early stage is optimized, and calculates, and accurately emulation is particularly important.
Claims (9)
1. pcb board different aspects realize the structure of microwave coaxial transmission, comprising is at least the pcb board of double-deck circuit, double-deck circuit is respectively equipped with microwave transmission line, the connection of double-deck circuit microwave transmission line connects transitional pore by the metal between double-deck circuit and realizes, it is characterized in that, described metal transfer hole is provided with metallic ground transitional pore.
2. pcb board different aspects realize the structure of microwave coaxial transmission, comprise multiple frequency microwave device and multilayer line pcb board, bus plane and frequency microwave control circuitry layer is respectively arranged with in the intermediate layer of described multilayer line pcb board, on the top line plate that described multiple frequency microwave device is arranged on multilayer line pcb board respectively and on wiring underlayer plate, it is characterized in that, the frequency microwave device setting in column in a row anyhow respectively of top line plate and wiring underlayer plate, its position is mutually corresponding in pairs up and down, described top line plate frequency microwave device between row and row with wiring underlayer plate frequency microwave device between the column and the column, or be respectively arranged with printed foil wire between row and row with wiring underlayer plate frequency microwave device between the column and the column at described top line plate frequency microwave device, many printed foil wires of top line plate and wiring underlayer plate are that mutual right-angled intersection state is arranged, wherein, right-angled intersection point is provided with metal and connects transitional pore, upper and lower printed foil wire is communicated with by metal throuth hole, described metal transfer hole is provided with metallic ground transitional pore.
3. the structure of microwave coaxial transmission according to claim 1 and 2, it is characterized in that, described multilayer line pcb board is 6 sandwich circuit pcb boards, top layer and the bottom of 6 sandwich circuit pcb boards are separately installed with frequency microwave device, between described 6 sandwich circuit pcb board top layers and bottom from top layer be downwards top layer frequency microwave device ground layer, top layer frequency microwave device signal key-course, bottom frequency microwave device signal key-course, bottom frequency microwave device ground layer respectively.
4. the structure of the microwave coaxial transmission according to claim 1 or 2 or 3, it is characterized in that, described ground connection is connection line power cathode.
5. the structure of the microwave coaxial transmission according to claim 1 or 2 or 3, is characterized in that, described metal connects transitional pore parameter by formula
determine, wherein: Z
0for impedance,
for pcb board material electric medium constant, D be connect transitional pore overall diameter, d is the interior diameter that D subtracts copper facing thickness.
6. the structure of microwave coaxial transmission according to claim 5, is characterized in that, described impedance Z
0be 50 ohm, it is 0.3mm to 0.4mm that described metal connects transitional pore overall diameter D.
7. the structure of the microwave coaxial transmission according to claim 1 or 2 or 3, it is characterized in that, described metallic ground transitional pore diameter is 0.3mm to 0.4mm, and metallic ground transitional pore distance metal connects transitional pore Edge Distance and is not more than 5mm.
8. the structure of microwave coaxial transmission according to claim 1, it is characterized in that, described pcb board is the pcb board being greater than two-layer multilayer line, connects transitional pore circumference be provided with metallic ground transitional pore around the metal between multilayer line microwave transmission line.
9. the structure of microwave coaxial transmission according to claim 8, is characterized in that, described microwave transmission line is linearly square crossing setting mutually between the layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510354636.0A CN105072800B (en) | 2015-06-25 | 2015-06-25 | A kind of pcb board different aspects realize the pcb board structure of microwave coaxial transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510354636.0A CN105072800B (en) | 2015-06-25 | 2015-06-25 | A kind of pcb board different aspects realize the pcb board structure of microwave coaxial transmission |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105072800A true CN105072800A (en) | 2015-11-18 |
| CN105072800B CN105072800B (en) | 2016-04-06 |
Family
ID=54502036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510354636.0A Active CN105072800B (en) | 2015-06-25 | 2015-06-25 | A kind of pcb board different aspects realize the pcb board structure of microwave coaxial transmission |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105072800B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112103603A (en) * | 2020-08-20 | 2020-12-18 | 深圳市信维通信股份有限公司 | Excitation structure of high-performance strip line |
| TWI786414B (en) * | 2020-06-30 | 2022-12-11 | 連騰科技股份有限公司 | Transmission cable structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1799290A (en) * | 2003-06-02 | 2006-07-05 | 日本电气株式会社 | Compact via transmission line for printed circuit board and its designing method |
| CN101292393A (en) * | 2005-10-18 | 2008-10-22 | 日本电气株式会社 | Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element |
| CN104093270A (en) * | 2014-07-08 | 2014-10-08 | 西安电子工程研究所 | Interlayer signal transmission structure of microwave mixed printed circuit board |
| CN204681672U (en) * | 2015-06-25 | 2015-09-30 | 北京中微普业科技有限公司 | A kind of pcb board frequency microwave Transfer-matrix circuit structure |
-
2015
- 2015-06-25 CN CN201510354636.0A patent/CN105072800B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1799290A (en) * | 2003-06-02 | 2006-07-05 | 日本电气株式会社 | Compact via transmission line for printed circuit board and its designing method |
| CN101292393A (en) * | 2005-10-18 | 2008-10-22 | 日本电气株式会社 | Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element |
| CN104093270A (en) * | 2014-07-08 | 2014-10-08 | 西安电子工程研究所 | Interlayer signal transmission structure of microwave mixed printed circuit board |
| CN204681672U (en) * | 2015-06-25 | 2015-09-30 | 北京中微普业科技有限公司 | A kind of pcb board frequency microwave Transfer-matrix circuit structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI786414B (en) * | 2020-06-30 | 2022-12-11 | 連騰科技股份有限公司 | Transmission cable structure |
| CN112103603A (en) * | 2020-08-20 | 2020-12-18 | 深圳市信维通信股份有限公司 | Excitation structure of high-performance strip line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105072800B (en) | 2016-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9125314B2 (en) | Printed circuit board | |
| CN107969065B (en) | Printed circuit board | |
| CN204761829U (en) | Structure of perpendicular interconnection of radio frequency circuit is realized to multiply wood | |
| WO2020258743A1 (en) | Millimeter wave active antenna unit, and interconnect structure between pcb boards | |
| JP2019165213A (en) | Coupling of signals on multi-layer substrates | |
| TWI429343B (en) | Printed circuit board | |
| US8362856B2 (en) | RF transition with 3-dimensional molded RF structure | |
| US20110114380A1 (en) | Electromagnetic bandgap structure and printed circuit board comprising the same | |
| US20060108143A1 (en) | Signal transmission structure and circuit substrate thereof | |
| US9525200B2 (en) | Multi-layer substrate and method of manufacturing multi-layer substrate | |
| JP2009004790A (en) | Printed circuit board having electromagnetic bandgap structure | |
| US10045435B2 (en) | Concentric vias and printed circuit board containing same | |
| US9716305B2 (en) | Balun | |
| JP2014165424A (en) | Electronic circuit and electronic apparatus | |
| CN105072800B (en) | A kind of pcb board different aspects realize the pcb board structure of microwave coaxial transmission | |
| TWI752743B (en) | Vertical interconnection structure of a multi-layer substrate | |
| US20100319980A1 (en) | Printed circuit board | |
| US20060017529A1 (en) | Multi-layer integrated RF/IF circuit board | |
| CN115224462B (en) | Microwave multilayer board interlayer interconnection matching method | |
| US20140132371A1 (en) | Noise suppression device and multilayer printed circuit board carrying same | |
| EP2941939B1 (en) | Printed circuit board | |
| CN106876851A (en) | A kind of radio frequency strip transmission line | |
| US20060019505A1 (en) | Multi-layer integrated RF/IF circuit board | |
| CN112638032B (en) | Circuit board and antenna device compatible with digital circuit and radio frequency circuit | |
| CN204681672U (en) | A kind of pcb board frequency microwave Transfer-matrix circuit structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |