CN105070589A - Non-epoxy sealed mini temperature controller - Google Patents
Non-epoxy sealed mini temperature controller Download PDFInfo
- Publication number
- CN105070589A CN105070589A CN201510445311.3A CN201510445311A CN105070589A CN 105070589 A CN105070589 A CN 105070589A CN 201510445311 A CN201510445311 A CN 201510445311A CN 105070589 A CN105070589 A CN 105070589A
- Authority
- CN
- China
- Prior art keywords
- housing
- plastic
- pedestal
- unit
- spring leaf
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
- H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
- H01H37/5427—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting encapsulated in sealed miniaturised housing
Abstract
A non-epoxy sealed mini temperature controller relates to the field of electric components. The controller comprises a casing, the casing is internally provided with a metal substrate, the metal substrate is provided with a pedestal and a static contact, the pedestal is provided with a contact sheet, a spring leaf and a bimetallic strip are arranged in the casing over the pedestal, one end of spring leaf and one end of the bimetallic strip are welded to the contact sheet, the middle portion of the spring leaf and the middle portion of the bimetallic strip are supported by the pedestal, the other end of the spring sheet is provided with a movable contact cooperated with the static contact, an open end of the casing is internally provided with two pins, one pin is electrically connected with the metal substrate, the other pin is electrically connected with the bimetallic strip, a plastic block is embedded into the open end of the casing, and the two pins penetrate the plastic block and extend out of the casing. The plastic block is used to replace epoxy resin embedding technology to overcome the disadvantages that epoxy resin is high in irritability, long in solidification time and high in material cost, the cost is saved, and the market efficiency is improved.
Description
Technical field
The present invention relates to electric elements field, be specially a kind of without epoxy sealed miniature temperature controller.
Background technology
On market, like product all adopts the mode of epoxy resin encapsulated, and to reach effect that is fixing and sealing, but epoxy resin anaphylaxis is strong, curing time is long, material cost is high.This just increases manufacture difficulty and cost virtually.And which cannot ensure that protector pin opens the consistency of distance, can pollute pin, make it can not be applicable to pcb board jack mounting means.
Summary of the invention
The object of this invention is to provide a kind of structure simple, pin-pitch is adjustable without epoxy sealed miniature temperature controller.
The technical scheme realizing above-mentioned purpose is: without epoxy sealed miniature temperature controller, comprise the housing of one end open, metal base plate is provided with in housing, metal base plate is provided with pedestal and fixed contact, pedestal is provided with contact chip away from one end of fixed contact, spring leaf and bimetal leaf is provided with in housing above pedestal, spring leaf overlays on bimetal leaf, one end of spring leaf and bimetal leaf is welded on contact chip, the midfoot support of spring leaf and bimetal leaf is on pedestal, and the other end of spring leaf is provided with the moving contact coordinated with fixed contact; Two horizontally disposed pins are provided with in the openend of housing, a pin is electrically connected with metal base plate, another root pin is electrically connected with bimetal leaf, it is characterized in that: in the openend of described housing, be equipped with unit of plastic, unit of plastic is provided with two through holes along its length, and described two pins are each passed through a through hole on unit of plastic and extend housing.
The present invention's unit of plastic replaces the technique of epoxy resin encapsulated of the prior art, overcomes the defect that epoxy resin anaphylaxis is strong, curing time is long, material cost is high, has saved cost, improve market efficiency.
Adopt ultrasonic bonding between described unit of plastic and housing, ensure sealing effectiveness.
The both sides of described unit of plastic are provided with arc groove, and the openend inwall of described housing is provided with the curved flanges coordinated with the arc groove of the both sides of unit of plastic, enhances the adhesion of housing and unit of plastic.
The two ends of two through holes on described unit of plastic are respectively arranged with chamfering, guiding convenient for assembly, and avoid cutting off protector pin.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 be in Fig. 1 A-A to cutaway view.
Embodiment
As shown in Figure 1, 2, comprise the housing 1 of one end open, metal base plate 2 is provided with in housing 1, metal base plate 2 is provided with pedestal 3 and fixed contact 4, one end away from fixed contact 4 is provided with contact chip 5 to pedestal 3, spring leaf 6 and bimetal leaf 7 is provided with in housing 1 above pedestal 3, spring leaf 6 overlays on bimetal leaf 7, one end of spring leaf 6 and bimetal leaf 7 is welded on contact chip 5, the midfoot support of spring leaf 6 and bimetal leaf 7 is on pedestal 3, and the other end of spring leaf 6 is provided with the moving contact 8 coordinated with fixed contact 4.
Two horizontally disposed pins 9 are provided with in the openend of housing 1, a pin 9 is electrically connected with metal base plate 2, another root pin 9 is electrically connected with bimetal leaf 7, unit of plastic 10 is equipped with in the openend of housing 1, ultrasonic bonding is adopted between unit of plastic 10 and housing 1, the two ends that unit of plastic 10 is provided with two through holes, 11, two through holes 11 are along its length respectively arranged with chamfering, and two pins 9 are each passed through a through hole on unit of plastic 10 and extend housing 1.
The both sides of unit of plastic 10 are provided with arc groove 12, and the openend inwall of housing 1 is provided with the curved flanges 13 coordinated with the arc groove 12 of the both sides of unit of plastic 10.
Claims (4)
1. without epoxy sealed miniature temperature controller, comprise the housing of one end open, metal base plate is provided with in housing, metal base plate is provided with pedestal and fixed contact, pedestal is provided with contact chip away from one end of fixed contact, spring leaf and bimetal leaf is provided with in housing above pedestal, spring leaf overlays on bimetal leaf, one end of spring leaf and bimetal leaf is welded on contact chip, the midfoot support of spring leaf and bimetal leaf is on pedestal, and the other end of spring leaf is provided with the moving contact coordinated with fixed contact; Two horizontally disposed pins are provided with in the openend of housing, a pin is electrically connected with metal base plate, another root pin is electrically connected with bimetal leaf, it is characterized in that: in the openend of described housing, be equipped with unit of plastic, unit of plastic is provided with two through holes along its length, and described two pins are each passed through a through hole on unit of plastic and extend housing.
2. according to claim 1 without epoxy sealed miniature temperature controller, it is characterized in that: between described unit of plastic and housing, adopt ultrasonic bonding.
3. according to claim 1 without epoxy sealed miniature temperature controller, it is characterized in that: the both sides of described unit of plastic are provided with arc groove, the openend inwall of described housing is provided with the curved flanges coordinated with the arc groove of the both sides of unit of plastic.
4. according to claim 1 without epoxy sealed miniature temperature controller, it is characterized in that: the two ends of two through holes on described unit of plastic are respectively arranged with chamfering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510445311.3A CN105070589A (en) | 2015-07-27 | 2015-07-27 | Non-epoxy sealed mini temperature controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510445311.3A CN105070589A (en) | 2015-07-27 | 2015-07-27 | Non-epoxy sealed mini temperature controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105070589A true CN105070589A (en) | 2015-11-18 |
Family
ID=54499932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510445311.3A Pending CN105070589A (en) | 2015-07-27 | 2015-07-27 | Non-epoxy sealed mini temperature controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105070589A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4278960A (en) * | 1978-07-15 | 1981-07-14 | Limitor Ag | Temperature controlled bimetal switch |
| CN2458721Y (en) * | 2000-12-08 | 2001-11-07 | 许正昌 | Temp controlling protector for chargeable cell |
| US20020130755A1 (en) * | 2001-03-19 | 2002-09-19 | Yoshiaki Takasugi | Protector device |
| CN203553041U (en) * | 2013-11-08 | 2014-04-16 | 南京海川电子有限公司 | Miniature bimetallic strip type overheating protector |
| CN104064402A (en) * | 2014-06-30 | 2014-09-24 | 扬州宝珠电器有限公司 | High-fidelity high-temperature-resistant temperature controller |
| CN204885016U (en) * | 2015-07-27 | 2015-12-16 | 扬州宝珠电器有限公司 | Miniature temperature controller of no epoxy sealed |
-
2015
- 2015-07-27 CN CN201510445311.3A patent/CN105070589A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4278960A (en) * | 1978-07-15 | 1981-07-14 | Limitor Ag | Temperature controlled bimetal switch |
| CN2458721Y (en) * | 2000-12-08 | 2001-11-07 | 许正昌 | Temp controlling protector for chargeable cell |
| US20020130755A1 (en) * | 2001-03-19 | 2002-09-19 | Yoshiaki Takasugi | Protector device |
| CN203553041U (en) * | 2013-11-08 | 2014-04-16 | 南京海川电子有限公司 | Miniature bimetallic strip type overheating protector |
| CN104064402A (en) * | 2014-06-30 | 2014-09-24 | 扬州宝珠电器有限公司 | High-fidelity high-temperature-resistant temperature controller |
| CN204885016U (en) * | 2015-07-27 | 2015-12-16 | 扬州宝珠电器有限公司 | Miniature temperature controller of no epoxy sealed |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151118 |
|
| WD01 | Invention patent application deemed withdrawn after publication |