CN105063683A - Cyanide-free silver plating electroplating liquid and electroplating method thereof - Google Patents
Cyanide-free silver plating electroplating liquid and electroplating method thereof Download PDFInfo
- Publication number
- CN105063683A CN105063683A CN201510520736.6A CN201510520736A CN105063683A CN 105063683 A CN105063683 A CN 105063683A CN 201510520736 A CN201510520736 A CN 201510520736A CN 105063683 A CN105063683 A CN 105063683A
- Authority
- CN
- China
- Prior art keywords
- concentration
- cyanogen
- silver
- free silver
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention provides cyanide-free silver plating electroplating liquid and an electroplating method thereof. The cyanide-free silver plating electroplating liquid comprises silver nitrate with the concentration being 60-90 g/L, sodium sulfate with the concentration being 10-20 g/L, pyridine carboxylic acid with the concentration being 80-120 g/L, sodium pyrosulfite with the concentration being 20-40 g/L and sodium hydroxide with the concentration being 70-80 g/L. The cyanide-free silver plating electroplating liquid is good in stability, high in electroplating speed, safe and environmentally friendly, and does not contain highly toxic substances. Clad layers obtained through electroplating are good in combination and excellent in color change resistance.
Description
Technical field
The present invention relates to electroplating technology field, particularly relate to a kind of cyanogen-free silver-plating solution and electro-plating method thereof.
Background technology
Silvered film is easy to polishing, there are very strong reflective ability and good heat conduction, conduction, welding property, high to the chemical stability of organic bronsted lowry acids and bases bronsted lowry, and its price is cheap relative to other precious metals, has been widely used in the field of electronic industry, ornament, tableware and various artwork.
The advantages such as current efficiency is high, dispersive ability good, covering power is strong owing to having, coating crystallization is careful, at present, mostly still adopt both at home and abroad and have cyanogen silver plating process to electroplate silver layer.But prussiate silver plating liquid has hypertoxicity, serious environment pollution, the health of the harm producer, and also treatment cost of waste liquor is higher, so people wish to replace prussiate electrosilvering technique with other electroplating technology.But the problems such as the non-cyanide silver coating system ubiquity bath stability used at present is poor, coating performance is lower; therefore from the viewpoint of safety, environment protection etc., a kind of low toxicity, stable silver plating liquid and silver plating process is developed to replace the of far-reaching significance and extremely urgent of prussiate electrosilvering.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of cyanogen-free silver-plating solution, cyanogen-free silver-plating solution good stability of the present invention, and electroplating velocity is fast, not containing highly toxic substance, and safety and environmental protection.
The present invention by the following technical solutions.
A kind of cyanogen-free silver-plating solution, comprises Silver Nitrate 60 ~ 90g/L, sodium sulfate 10 ~ 20g/L, pyridine carboxylic acid 80 ~ 120g/L, Sodium Pyrosulfite 20 ~ 40g/L and sodium hydroxide 70 ~ 80g/L.
Preferably, the deionized water of Silver Nitrate 70 ~ 80g/L, sodium sulfate 15 ~ 20g/L, pyridine carboxylic acid 90 ~ 100g/L, Sodium Pyrosulfite 30 ~ 40g/L, sodium hydroxide 70 ~ 75g/L and surplus is comprised.
Preferably, the deionized water of Silver Nitrate 75g/L, sodium sulfate 15g/L, pyridine carboxylic acid 90g/L, Sodium Pyrosulfite 30g/L, sodium hydroxide 70g/L and surplus is comprised.
Preferably, cyanogen-free silver-plating solution pH value is 5 ~ 5.5.
The present invention provides a kind of method preparing above-mentioned cyanogen-free silver-plating solution on the other hand, and employing the method is electroplated the coating obtained and combined good and anti-discoloration excellence.
Use an above-mentioned electroplate liquid electric plating method, comprise the following steps:
(1) sodium hydroxide and sodium sulfate are dissolved in deionized water, add pyridine carboxylic acid and Sodium Pyrosulfite is stirred to dissolving, make mixed solution;
(2) being dissolved in by silver nitrate solution after in deionized water dropwise instills in described mixed solution, obtained cyanogen-free silver-plating solution, wherein, in cyanogen-free silver-plating solution, the concentration of Silver Nitrate is 60 ~ 90g/L, the concentration of sodium sulfate is 10 ~ 20g/L, the concentration of pyridine carboxylic acid is 80 ~ 120g/L, and the concentration of Sodium Pyrosulfite is 20 ~ 40g/L, and the concentration of sodium hydroxide is 70 ~ 80g/L;
(3) do anode with silver plate, workpiece does negative electrode, electroplates.
Preferably, in step (3), the temperature of plating is 50 ~ 60 DEG C.
Preferably, in step (3), the current density of plating is 25 ~ 35mA/cm
2.
Preferably, in step (3), the distance of negative electrode and positive electrode is 6 ~ 12cm.
Compared with prior art, beneficial effect of the present invention: cyanogen-free silver-plating solution of the present invention comprises Silver Nitrate 60 ~ 90g/L, sodium sulfate 10 ~ 20g/L, pyridine carboxylic acid 80 ~ 120g/L, Sodium Pyrosulfite 20 ~ 40g/L and sodium hydroxide 70 ~ 80g/L.Cyanogen-free silver-plating solution good stability of the present invention, electroplating velocity is fast, not containing highly toxic substance, safety and environmental protection; Electroplate the coating obtained and combine good and anti-discoloration excellence.
Embodiment
Further illustrate technical scheme of the present invention respectively below in conjunction with the embodiments.
Raw material involved in following examples is commercially available.
Embodiment 1: the cyanogen-free silver-plating solution of the present embodiment comprises following component:
Use above-mentioned cyanogen-free silver-plating solution electric plating method as follows:
Sodium hydroxide and sodium sulfate are dissolved in deionized water, add pyridine carboxylic acid and Sodium Pyrosulfite is stirred to dissolving, make mixed solution; Being dissolved in by silver nitrate solution after in deionized water dropwise instills in described mixed solution, obtained cyanogen-free silver-plating solution, wherein, in cyanogen-free silver-plating solution, the concentration of Silver Nitrate is 60g/L, the concentration of sodium sulfate is 10g/L, the concentration of pyridine carboxylic acid is 80g/L, and the concentration of Sodium Pyrosulfite is 20g/L, and the concentration of sodium hydroxide is 70g/L; Do anode with silver plate, workpiece does negative electrode, and the distance of negative electrode and positive electrode is 8cm, is 50 DEG C at bath temperature, and current density is 25mA/cm
2electroplate under condition.
Embodiment 2: the cyanogen-free silver-plating solution of the present embodiment comprises following component:
Use above-mentioned cyanogen-free silver-plating solution electric plating method as follows:
Sodium hydroxide and sodium sulfate are dissolved in deionized water, add pyridine carboxylic acid and Sodium Pyrosulfite is stirred to dissolving, make mixed solution; Being dissolved in by silver nitrate solution after in deionized water dropwise instills in described mixed solution, obtained cyanogen-free silver-plating solution, wherein, in cyanogen-free silver-plating solution, the concentration of Silver Nitrate is 70g/L, the concentration of sodium sulfate is 16g/L, the concentration of pyridine carboxylic acid is 95g/L, and the concentration of Sodium Pyrosulfite is 35g/L, and the concentration of sodium hydroxide is 75g/L; Do anode with silver plate, workpiece does negative electrode, and the distance of negative electrode and positive electrode is 10cm, is 55 DEG C at bath temperature, and current density is 30mA/cm
2electroplate under condition.
Embodiment 3: the cyanogen-free silver-plating solution of the present embodiment comprises following component:
Use above-mentioned cyanogen-free silver-plating solution electric plating method as follows:
Sodium hydroxide and sodium sulfate are dissolved in deionized water, add pyridine carboxylic acid and Sodium Pyrosulfite is stirred to dissolving, make mixed solution; Being dissolved in by silver nitrate solution after in deionized water dropwise instills in described mixed solution, obtained cyanogen-free silver-plating solution, wherein, in cyanogen-free silver-plating solution, the concentration of Silver Nitrate is 75g/L, the concentration of sodium sulfate is 15g/L, the concentration of pyridine carboxylic acid is 90g/L, and the concentration of Sodium Pyrosulfite is 30g/L, and the concentration of sodium hydroxide is 70g/L; Do anode with silver plate, workpiece does negative electrode, and the distance of negative electrode and positive electrode is 12cm, is 60 DEG C at bath temperature, and current density is 30mA/cm
2electroplate under condition.
Testing method:
1, the displacement laboratory qualitative of copper is adopted to detect the stability of cyanogen-free silver-plating solution
In order to verify the content of free silver ions in the stability of cyanogen-free silver-plating solution and plating solution, carry out the displacement experiment of Copper Foil, control temperature is in electroplating temperature scope, workpiece is put into electroplate liquid, the change of workpiece surface is observed under well-beaten condition, when workpiece surface occurs that white dirt settling then proves that electroplate liquid can not tolerate displacement experiment, the stability of electroplate liquid can be verified by displacement experiment.
2, K is adopted
2the anti-tarnishing ability of S immersion test inspection coating
Coating is SO in an atmosphere
2, H
2under the effect of the corrosive mediums such as S, can make that Surface Creation is faint yellow, tawny even the silver sulfide film of chocolate.After coating color, not only affect outward appearance, the more important thing is that contact resistance increases, affect electroconductibility, and cause welding difficulty, reduce use value.In order to verify the discoloration-resisting of coating more accurately, carry out K
2s solution soaking is tested, and uses the K of 0.1mol/L at normal temperatures
2s solution coating, the changing conditions of record coating color in immersion, the anti-tarnishing ability of more various coating.
3, the bonding strength of test piece bending test coating is used
After workpiece plating, by workpiece repeatedly 90-degree bent, observe whether have peeling, stripping, break-off.
Above-mentioned test result is as following table
Find cyanogen-free silver-plating solution good stability of the present invention by above-mentioned test result and do not contain highly toxic substance, safety and environmental protection; Electroplating the coating obtained combines good, and anti-discoloration is excellent, and especially embodiment 3 best performance, can meet the application that decorative electroplating and functional plating etc. are multi-field; Cyanogen-free silver-plating solution electroplating velocity of the present invention is fast simultaneously.
Cyanogen-free silver-plating solution good stability of the present invention, electroplating velocity is fast, not containing highly toxic substance, safety and environmental protection; Electroplate the coating obtained and combine good and anti-discoloration excellence.
It should be noted that and understand, when not departing from the spirit and scope of accompanying claim the present invention for required protection, various amendment and improvement can be made to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not by the restriction of given any specific exemplary teachings.
Applicant states, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, namely do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (8)
1. a cyanogen-free silver-plating solution, is characterized in that, comprises Silver Nitrate 60 ~ 90g/L, sodium sulfate 10 ~ 20g/L, pyridine carboxylic acid 80 ~ 120g/L, Sodium Pyrosulfite 20 ~ 40g/L and sodium hydroxide 70 ~ 80g/L.
2. cyanogen-free silver-plating solution according to claim 1, it is characterized in that, comprise the deionized water of Silver Nitrate 70 ~ 80g/L, sodium sulfate 15 ~ 20g/L, pyridine carboxylic acid 90 ~ 100g/L, Sodium Pyrosulfite 30 ~ 40g/L, sodium hydroxide 70 ~ 75g/L and surplus.
3. cyanogen-free silver-plating solution according to claim 1, is characterized in that, comprises the deionized water of Silver Nitrate 75g/L, sodium sulfate 15g/L, pyridine carboxylic acid 90g/L, Sodium Pyrosulfite 30g/L, sodium hydroxide 70g/L and surplus.
4. cyanogen-free silver-plating solution according to claim 1, is characterized in that, cyanogen-free silver-plating solution pH value is 5 ~ 5.5.
5. use the electroplate liquid electric plating method described in claim 1, it is characterized in that, comprise the following steps:
(1) sodium hydroxide and sodium sulfate are dissolved in deionized water, add pyridine carboxylic acid and Sodium Pyrosulfite is stirred to dissolving, make mixed solution;
(2) being dissolved in by silver nitrate solution after in deionized water dropwise instills in described mixed solution, obtained cyanogen-free silver-plating solution, wherein, in cyanogen-free silver-plating solution, the concentration of Silver Nitrate is 60 ~ 90g/L, the concentration of sodium sulfate is 10 ~ 20g/L, the concentration of pyridine carboxylic acid is 80 ~ 120g/L, and the concentration of Sodium Pyrosulfite is 20 ~ 40g/L, and the concentration of sodium hydroxide is 70 ~ 80g/L;
(3) do anode with silver plate, workpiece does negative electrode, electroplates.
6. method according to claim 5, is characterized in that, in described step (3), the temperature of plating is 50 ~ 60 DEG C.
7. method according to claim 5, is characterized in that, in described step (3), the current density of plating is 25 ~ 35mA/cm
2.
8. method according to claim 5, is characterized in that, in step (3), the distance of negative electrode and positive electrode is 6 ~ 12cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510520736.6A CN105063683A (en) | 2015-08-21 | 2015-08-21 | Cyanide-free silver plating electroplating liquid and electroplating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510520736.6A CN105063683A (en) | 2015-08-21 | 2015-08-21 | Cyanide-free silver plating electroplating liquid and electroplating method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105063683A true CN105063683A (en) | 2015-11-18 |
Family
ID=54493179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510520736.6A Pending CN105063683A (en) | 2015-08-21 | 2015-08-21 | Cyanide-free silver plating electroplating liquid and electroplating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105063683A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101760768A (en) * | 2010-01-20 | 2010-06-30 | 河南科技大学 | Electroplating solution for cyanide-free silver plating and cyanide-free silver plating method |
| CN101781782A (en) * | 2010-04-02 | 2010-07-21 | 宁波舜佳电子有限公司 | Cyanide-free high-speed silver plating electroplating solution |
| CN102168290A (en) * | 2011-04-08 | 2011-08-31 | 哈尔滨工业大学 | Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof |
| CN104404580A (en) * | 2014-11-29 | 2015-03-11 | 沈阳飞机工业（集团）有限公司 | Preprocessing method of improving binding force of stainless steel non-cyanide plating silver |
-
2015
- 2015-08-21 CN CN201510520736.6A patent/CN105063683A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101760768A (en) * | 2010-01-20 | 2010-06-30 | 河南科技大学 | Electroplating solution for cyanide-free silver plating and cyanide-free silver plating method |
| CN101781782A (en) * | 2010-04-02 | 2010-07-21 | 宁波舜佳电子有限公司 | Cyanide-free high-speed silver plating electroplating solution |
| CN102168290A (en) * | 2011-04-08 | 2011-08-31 | 哈尔滨工业大学 | Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof |
| CN104404580A (en) * | 2014-11-29 | 2015-03-11 | 沈阳飞机工业（集团）有限公司 | Preprocessing method of improving binding force of stainless steel non-cyanide plating silver |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102168290B (en) | Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof | |
| CN102817056B (en) | Electroplating process for lead wire frame palladium-nickel alloy plating layer | |
| CN103397355A (en) | Cyanide-free electrosilvering solution applicable to high-speed electroplating and electroplating process | |
| CN102560571B (en) | Non-cyanide silver coating stable electrical plating solution, preparation method and silver-plated method thereof | |
| CN101760768A (en) | Electroplating solution for cyanide-free silver plating and cyanide-free silver plating method | |
| CN102453933A (en) | Selective plating method for aluminum material | |
| CN102817055B (en) | Ultrathin palladium plating and gold plating process for lead wire frame | |
| CN105154930A (en) | Cyanide-free silver plating electroplating liquid and electroplating method thereof | |
| CN103806053A (en) | Dual-pulse gold plating process | |
| CN105332025A (en) | Copper-nickel-manganese alloy electroplating solution and method | |
| CN102383154A (en) | Cyanide-free gold-plating electroplating solution | |
| CN110592623B (en) | Formula and method of nickel electroplating solution for improving uniform distribution of neodymium iron boron magnet coating | |
| CN105002528A (en) | Cyanide-free silver electroplating solution and electroplating method thereof | |
| CN107881538B (en) | A kind of surface black processing method of electroplate liquid and rolled copper foil | |
| CN103540970B (en) | A kind of method of non-cyanide silver coating | |
| CN105369305A (en) | A copper-nickel alloy electroplating solution and an electroplating method thereof | |
| CN104342726A (en) | Cyanide-free silver plating method | |
| CN102732862A (en) | Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer | |
| CN105018978A (en) | Surface processing technology improving high-temperature stripping-resisting performance of electrolytic copper foil | |
| CN105112952A (en) | Electroplating solution for non-cyanide silver electrodeposition, and electroplating method | |
| CN102181892B (en) | Method for improving bonding force of non-cyanide silver plating layer on nickel layer | |
| CN204634170U (en) | A kind of printed circuit board (PCB) sinks nickeline processing unit | |
| CN105063683A (en) | Cyanide-free silver plating electroplating liquid and electroplating method thereof | |
| CN108060443B (en) | A kind of preparation method of the melanism composite layer on extruded metal foil surface | |
| CN105063677A (en) | Electroplating nickel solution and electroplating method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151118 |