CN105018978A - Surface processing technology improving high-temperature stripping-resisting performance of electrolytic copper foil - Google Patents
Surface processing technology improving high-temperature stripping-resisting performance of electrolytic copper foil Download PDFInfo
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- CN105018978A CN105018978A CN201510485060.1A CN201510485060A CN105018978A CN 105018978 A CN105018978 A CN 105018978A CN 201510485060 A CN201510485060 A CN 201510485060A CN 105018978 A CN105018978 A CN 105018978A
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Abstract
The invention relates to a surface processing technology improving high-temperature stripping-resisting performance of electrolytic copper foil, and belongs to the technical field of the electrolytic copper foil surface processing technology. The technology comprises the following steps that firstly, an electrolyte is prepared, after complexing agent potassium pyrophosphate, zinc sulfate, nickel sulfate and an additive A are mixed, the mixture is dissolved in water, and a complexing agent is kept clear; and secondly, the copper foil is electroplated, the preprocessed copper foil is placed in an electroplating bath containing the electrolyte obtained in the first step to be electroplated. The technology has the beneficial effects that by means of the technology, when the copper foil with the thickness of 12 microns is combined with a base material, the high-temperature stripping-resisting strength is larger than or equal to 1.2 N/mm, and it is very important for down-stream products; and meanwhile the technology is easy to operate, and stable running on a production line is easy to achieve.
Description
Technical field
The invention belongs to electrolytic copper foil surface treatment process technical field, be specifically related to a kind of process of surface treatment improving electrolytic copper foil high temperature peeling resistance.
Background technology
At present, along with the high-precision tipping development of electronic product, require that the quality of electrolytic copper foil promotes further.For the existing working condition of my company, develop a kind of novel surface processing technology with higher peel strength and there is very large necessity.Present invention process mainly adds single nickel salt in original galvanizing solution, forms Zn-Ni base binary alloy plating, improves the peel strength performance of basement membrane and Copper Foil to a certain extent.
Summary of the invention
The object of the present invention is to provide a kind of process of surface treatment improving electrolytic copper foil high temperature peeling resistance.
Based on above-mentioned purpose, the present invention takes following technical scheme:
Improve a process of surface treatment for electrolytic copper foil high temperature peeling resistance, comprise the steps: the preparation of (1) electrolytic solution, after complexing agent potassium pyrophosphate, zinc sulfate, single nickel salt and additive A are mixed, water-soluble, obtain settled solution, and K in solution
4p
2o
7concentration is 35g/L ~ 80g/L, Zn
2+concentration is 0.8g/L ~ 4.5g/L, Ni
2+concentration is 0.2g/L ~ 1.8g/L, and additive A concentration is 0.4g/L ~ 1.0g/L, and wherein additive A cationic is K
+, Zn
2+and Co
2+in at least one, negatively charged ion is at least one in chlorion, citrate ion and thiosulfate ion;
(2) Copper Foil plating: pretreated Copper Foil is put into the plating tank containing (1) electrolytic solution in steps and electroplate.
When electroplating in described step (2), the pH of electrolytic solution is 10.5-11.5, and temperature is 30-50 DEG C, and passing into galvanic current density on positive plate is 0.5-1.2A/dm
2.
The beneficial effect that the present invention produces is, by adopting Technology of the present invention, make 12 μm of Copper Foils and base material in conjunction with time, high temperature temperature peel strength >=1.2N/mm, significant to derived product, simultaneously, this technological operation is simple, is easy to the steady running realized on production line.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described, but protection scope of the present invention is not limited thereto.
Embodiment 1
Improve a process of surface treatment for electrolytic copper foil high temperature peeling resistance, comprise the steps:
(1) preparation of electrolytic solution, after complexing agent potassium pyrophosphate, zinc sulfate, single nickel salt, additive A mixing, water-soluble, obtain settled solution, K in solution
4p
2o
7concentration is 60g/L, Zn
2+concentration is 1.2g/L, Ni
2+concentration is 0.5g/L, the mixture of additive A concentration to be 0.4g/L(additive A be Potassium Thiosulphate and cobalt chloride, and both amount of substances are than being 3:8);
(2) Copper Foil plating: get 12 microns of electrolytic copper foils, after alligatoring, solidification treatment, puts into the plating tank containing (1) electrolytic solution in steps and electroplates by Copper Foil, Copper Foil through the speed of a motor vehicle of electrolytic solution be 25m/min, during plating, electrolytic solution pH is 10.5, and temperature is 40 DEG C, and current density is 0.5A/dm
2, electroplating time is 7s.Copper foil sample after test and base material pressing plate, test Copper Foil peel strength.
Embodiment 2
Improve a process of surface treatment for electrolytic copper foil high temperature peeling resistance, comprise the steps:
(1) preparation of electrolytic solution, after complexing agent potassium pyrophosphate, zinc sulfate, single nickel salt, additive A mixing, water-soluble, obtain settled solution, K in solution
4p
2o
7concentration is 35g/L, Zn
2+concentration is 0.8g/L, Ni
2+concentration is 0.2g/L, the mixture of additive A concentration to be 0.7g/L(additive A be zinc citrate and cobalt chloride, and amount of substance is than being 2:1);
(2) Copper Foil plating: by 12 microns of electrolytic copper foils, after alligatoring solidification treatment, puts into the plating tank containing (1) electrolytic solution in steps and electroplates by Copper Foil, Copper Foil through the speed of a motor vehicle of electrolytic solution be 30m/min, during plating, electrolytic solution pH is 11.5, and temperature is 50 DEG C, and current density is 0.8A/dm
2, electroplating time is 6s.Copper foil sample after test and base material pressing plate, test Copper Foil peel strength.
Embodiment 3
Improve a process of surface treatment for electrolytic copper foil high temperature peeling resistance, comprise the steps: the preparation of (1) electrolytic solution, after complexing agent potassium pyrophosphate, zinc sulfate, single nickel salt, additive A mixing, water-soluble, obtain settled solution, K in solution
4p
2o
7concentration is 75g/L, Zn
2+concentration is 1.5g/L, Ni
2+concentration is 0.6g/L, the mixture of additive A concentration to be 1.0g/L(additive A be Repone K and zinc chloride, and amount of substance is than being 6:5); (2) Copper Foil plating: by 12 microns of electrolytic copper foils, after alligatoring solidification treatment, puts into the plating tank containing (1) electrolytic solution in steps and electroplates by Copper Foil, Copper Foil through the speed of a motor vehicle of electrolytic solution be 35m/min, during plating, electrolytic solution pH is 11, and temperature is 30 DEG C, and current density is 1.2A/dm
2, electroplating time is 4s.Copper foil sample after test and base material pressing plate, test Copper Foil peel strength.
The peel strength value of embodiment 1 to 3 gained electrolytic copper foil sample is in table 1.
The peel strength value of table 1 embodiment 1-3 Copper Foil sample
As shown in Table 1, by adopting Technology of the present invention, make 12 μm of Copper Foils and base material in conjunction with time, high temperature peel strength >=1.2N/mm.
Claims (2)
1. improve a process of surface treatment for electrolytic copper foil high temperature peeling resistance, it is characterized in that, comprise the steps:
(1) preparation of electrolytic solution, after complexing agent potassium pyrophosphate, zinc sulfate, single nickel salt and additive A are mixed, water-soluble, obtain settled solution, and K in solution
4p
2o
7concentration is 35g/L ~ 80g/L, Zn
2+concentration is 0.8g/L ~ 4.5g/L, Ni
2+concentration is 0.2g/L ~ 1.8g/L, and additive A concentration is 0.4g/L ~ 1.0g/L, and wherein additive A cationic is K
+, Zn
2+and Co
2+in at least one, negatively charged ion is at least one in chlorion, citrate ion and thiosulfate ion;
(2) Copper Foil plating: pretreated Copper Foil is put into the plating tank containing (1) electrolytic solution in steps and electroplate.
2. the process of surface treatment of raising electrolytic copper foil high temperature peeling resistance according to claim 1, it is characterized in that, when electroplating in described step (2), the pH of electrolytic solution is 10.5-11.5, and temperature is 30-50 DEG C, and passing into galvanic current density on positive plate is 0.5-1.2A/dm
2.
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|---|---|---|---|
| CN201510485060.1A CN105018978B (en) | 2015-08-10 | 2015-08-10 | A kind of process of surface treatment improving electrolytic copper foil high temperature peeling resistance |
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| CN201510485060.1A CN105018978B (en) | 2015-08-10 | 2015-08-10 | A kind of process of surface treatment improving electrolytic copper foil high temperature peeling resistance |
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| CN105018978B CN105018978B (en) | 2018-07-27 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106498467A (en) * | 2016-11-16 | 2017-03-15 | 山东金宝电子股份有限公司 | A kind of preparation method of the ultra-thin carrier copper foil that stably can be peeled off |
| CN109137013A (en) * | 2018-07-13 | 2019-01-04 | 铜陵市华创新材料有限公司 | A kind of electrolytic copper foil surface electro-deposition ZN-NI-P-LA alloying technology |
| US20200332428A1 (en) * | 2017-11-15 | 2020-10-22 | Industrial Technology Research Institute | Method for manufacturing copper foil for high frequency circuit |
| CN114481245A (en) * | 2022-02-24 | 2022-05-13 | 广东盈华电子科技有限公司 | Surface treatment process of reverse electrolytic copper foil for flexible copper clad laminate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040241487A1 (en) * | 2002-07-04 | 2004-12-02 | Seiji Nagatani | Electrodeposited copper foil with carrier foil |
| CN1989793A (en) * | 2004-06-03 | 2007-06-27 | 三井金属矿业株式会社 | Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil |
| CN101906630A (en) * | 2010-08-03 | 2010-12-08 | 山东金宝电子股份有限公司 | Black surface treatment process of electrolytic copper foil |
| CN102277605A (en) * | 2011-08-12 | 2011-12-14 | 合肥铜冠国轩铜材有限公司 | Process for manufacturing smooth surface roughened electrolytic copper foil |
| CN102560584A (en) * | 2012-02-14 | 2012-07-11 | 联合铜箔(惠州)有限公司 | Additive for electrolytic copper foil and surface treatment process of very low profile electrolytic copper foil |
| CN102618902A (en) * | 2012-04-24 | 2012-08-01 | 山东金宝电子股份有限公司 | Surface treatment process of copper foil for flexible copper-clad plate |
-
2015
- 2015-08-10 CN CN201510485060.1A patent/CN105018978B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040241487A1 (en) * | 2002-07-04 | 2004-12-02 | Seiji Nagatani | Electrodeposited copper foil with carrier foil |
| CN1989793A (en) * | 2004-06-03 | 2007-06-27 | 三井金属矿业株式会社 | Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil |
| CN101906630A (en) * | 2010-08-03 | 2010-12-08 | 山东金宝电子股份有限公司 | Black surface treatment process of electrolytic copper foil |
| CN102277605A (en) * | 2011-08-12 | 2011-12-14 | 合肥铜冠国轩铜材有限公司 | Process for manufacturing smooth surface roughened electrolytic copper foil |
| CN102560584A (en) * | 2012-02-14 | 2012-07-11 | 联合铜箔(惠州)有限公司 | Additive for electrolytic copper foil and surface treatment process of very low profile electrolytic copper foil |
| CN102618902A (en) * | 2012-04-24 | 2012-08-01 | 山东金宝电子股份有限公司 | Surface treatment process of copper foil for flexible copper-clad plate |
Non-Patent Citations (1)
| Title |
|---|
| 简志超等: "电解铜箔镀锌镍钴合金及其性能", 《电镀与涂饰》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106498467A (en) * | 2016-11-16 | 2017-03-15 | 山东金宝电子股份有限公司 | A kind of preparation method of the ultra-thin carrier copper foil that stably can be peeled off |
| CN106498467B (en) * | 2016-11-16 | 2018-09-11 | 山东金宝电子股份有限公司 | A kind of preparation method of ultra-thin carrier copper foil that stablizing stripping |
| US20200332428A1 (en) * | 2017-11-15 | 2020-10-22 | Industrial Technology Research Institute | Method for manufacturing copper foil for high frequency circuit |
| CN109137013A (en) * | 2018-07-13 | 2019-01-04 | 铜陵市华创新材料有限公司 | A kind of electrolytic copper foil surface electro-deposition ZN-NI-P-LA alloying technology |
| CN114481245A (en) * | 2022-02-24 | 2022-05-13 | 广东盈华电子科技有限公司 | Surface treatment process of reverse electrolytic copper foil for flexible copper clad laminate |
| CN114481245B (en) * | 2022-02-24 | 2022-09-16 | 广东盈华电子科技有限公司 | Surface treatment process of reverse electrolytic copper foil for flexible copper clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105018978B (en) | 2018-07-27 |
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Effective date of registration: 20190321 Address after: 472500 Northwest corner of Jingyi Road and Weisan Road intersection in Lingbao City, Sanmenxia City, Henan Province Patentee after: Lingbaoxin Electronic Technology Co., Ltd. Address before: 472500 No. 131 Huanghe Road, Lingbao City, Sanmenxia City, Henan Province Patentee before: Lingbao Wason Copper Foil Co., Ltd. |
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