CN105058609A - Positioning tool for cutting of silicon ingots - Google Patents
Positioning tool for cutting of silicon ingots Download PDFInfo
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- CN105058609A CN105058609A CN201510456581.4A CN201510456581A CN105058609A CN 105058609 A CN105058609 A CN 105058609A CN 201510456581 A CN201510456581 A CN 201510456581A CN 105058609 A CN105058609 A CN 105058609A
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- silicon ingot
- positioning tool
- positioning
- locating piece
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Abstract
The invention discloses a positioning tool for cutting of silicon ingots. The positioning tool comprises a base of a rectangular structure, wherein a limiting block is arranged on the periphery of the upper end surface of the base; a plurality of positioning block groups are arranged on the base in parallel; longitudinal positioning spaces where the silicon ingots are placed are formed between the adjacent positioning block groups; each positioning block group is composed of a plurality of positioning blocks, and transverse positioning spaces where the silicon ingots are placed are formed between the adjacent positioning blocks in each positioning block group. Pressing blocks are installed on the positioning blocks and provided with pressing rods used for clamping the silicon ingots. The positioning tool for cutting of the silicon ingots is simple in structure, easy to realize, low in production cost, convenient and easy to operate and capable of positioning multiple silicon ingots at a time, and effectively resolves the problems that an original positioning tool for cutting of the silicon ingots is complex in structure and high in production cost.
Description
Technical field
The present invention relates to solar silicon wafers and manufacture field, particularly relate to a kind of silicon ingot cutting positioning tool.
Background technology
In crystal silicon chip production process, need through cutting, remove photoresist, the production process such as cleaning.At present, the cutting of crystal silicon chip adopts cutter to cut usually, and it is low that it exists production efficiency, the problem that loss is large, for this problem, Some Enterprises utilizes wire cutting machine to realize the cutting of crystal silicon chip, but its positioning tool adopted exists complex structure, the problem that production cost is high, thus, is badly in need of solving.
Summary of the invention
The object of the invention is to for the problems referred to above, a kind of silicon ingot cutting positioning tool is provided, to solve existing silicon ingot cutting positioning tool complex structure, the problem that production cost is high.
The object of the invention is to be achieved through the following technical solutions:
A kind of silicon ingot cutting positioning tool, comprise the base of rectangular configuration, the periphery of described base upper surface is provided with limited block, and many group locating piece groups that base has been arranged in parallel, the longitudinal register space of placing silicon ingot is formed between adjacent positioned block group, often organize locating piece group to be made up of spaced apart multiple locating piece, the located lateral space of placing silicon ingot is formed between adjacent positioned block with a positioning block group, described locating piece being provided with briquetting, described briquetting being provided with the depression bar for clamping silicon ingot.
As a preferred embodiment of the present invention, the corner of described base has the connecting hole being convenient to install.
As a preferred embodiment of the present invention, described locating piece has installing hole, described briquetting is provided with the fixed block of circular configuration, described fixed block is provided with opening, briquetting is fixed on locating piece through opening, installing hole by hex bolts successively, and the bore of described opening is less than the radius of bolt head on hex bolts.
As a preferred embodiment of the present invention, described limited block is fixedly connected with base by bolt.
Beneficial effect of the present invention is, described silicon ingot cutting positioning tool structure is simple, is easy to realize, production cost is low, and it is convenient and simple for operation, once can realize the location of polylith silicon ingot, efficiently solve original silicon ingot cutting positioning tool complex structure, the problem that production cost is high.
Accompanying drawing explanation
Fig. 1 is the structural representation of silicon ingot cutting positioning tool of the present invention;
Fig. 2 is the using state structural representation of silicon ingot cutting positioning tool of the present invention.
In figure:
1, base; 2, connecting hole; 3, limited block; 4, longitudinal register space; 5, located lateral space; 6, locating piece; 7, briquetting; 8, fixed block; 9, longitudinal depression bar; 10, horizontal depression bar; 11, silicon ingot.
Detailed description of the invention
Technical scheme of the present invention is further illustrated by detailed description of the invention below in conjunction with accompanying drawing.Be understandable that, embodiment described herein is only for explaining the present invention, but not limitation of the invention.
Please refer to shown in Fig. 1 and Fig. 2, Fig. 1 is the structural representation of silicon ingot cutting positioning tool of the present invention; Fig. 2 is the using state structural representation of silicon ingot cutting positioning tool of the present invention.
In the present embodiment, a kind of silicon ingot cutting positioning tool, comprise the base 1 of rectangular configuration, the corner of described base 1 has the connecting hole 2 being convenient to install, the periphery of base 1 upper surface is provided with limited block 3, described limited block 3 is fixedly connected with base 1 by bolt, base 1 has been arranged in parallel three groups of locating piece groups, the longitudinal register space 4 of placing silicon ingot is formed between adjacent positioned block group, often organize locating piece group to be made up of spaced apart six locating pieces 6, described locating piece 6 is provided with briquetting 7, described locating piece 6 has installing hole, described briquetting 7 is provided with the fixed block 8 of circular configuration, described fixed block 8 is provided with opening, hex bolts is successively through opening, briquetting 7 is fixed on locating piece 6 by installing hole, the bore of described opening is less than the radius of bolt head on hex bolts, the located lateral space 5 of placing silicon ingot is formed between adjacent positioned block 6 with a positioning block group, described briquetting 7 is provided with the depression bar for clamping silicon ingot, described depression bar comprises the horizontal depression bar 10 for compressing silicon ingot in located lateral space 5 and the longitudinal depression bar 9 for compressing silicon ingot in longitudinal register space 4.
During installation, silicon ingot is loaded in longitudinal register space 4, located lateral space 5, limited block 3 is coordinated to realize the location of silicon ingot by depression bar, convenient and simple for operation, after installation, can be placed on wire cutting machine and cut, once can complete the cutting work of polylith silicon ingot, substantially increase production efficiency.
Above embodiment has just set forth general principle of the present invention and characteristic; the present invention does not limit by above-described embodiment; without departing from the spirit and scope of the present invention, the present invention also has various change and change, and these changes and change all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (4)
1. a silicon ingot cutting positioning tool, it is characterized in that: the base comprising rectangular configuration, the periphery of described base upper surface is provided with limited block, and many group locating piece groups that base has been arranged in parallel, the longitudinal register space of placing silicon ingot is formed between adjacent positioned block group, often organize locating piece group to be made up of spaced apart multiple locating piece, the located lateral space of placing silicon ingot is formed between adjacent positioned block with a positioning block group, described locating piece being provided with briquetting, described briquetting being provided with the depression bar for clamping silicon ingot.
2. silicon ingot cutting positioning tool according to claim 1, is characterized in that: the corner of described base has the connecting hole being convenient to install.
3. silicon ingot cutting positioning tool according to claim 1, it is characterized in that: described locating piece has installing hole, described briquetting is provided with the fixed block of circular configuration, described fixed block is provided with opening, briquetting is fixed on locating piece through opening, installing hole by hex bolts successively, and the bore of described opening is less than the radius of bolt head on hex bolts.
4. silicon ingot cutting positioning tool according to claim 1, is characterized in that: described limited block is fixedly connected with base by bolt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510456581.4A CN105058609B (en) | 2015-07-29 | 2015-07-29 | Silicon ingot cutting positioning tool |
Applications Claiming Priority (1)
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CN201510456581.4A CN105058609B (en) | 2015-07-29 | 2015-07-29 | Silicon ingot cutting positioning tool |
Publications (2)
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CN105058609A true CN105058609A (en) | 2015-11-18 |
CN105058609B CN105058609B (en) | 2017-07-25 |
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CN201510456581.4A Active CN105058609B (en) | 2015-07-29 | 2015-07-29 | Silicon ingot cutting positioning tool |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115537934A (en) * | 2022-09-21 | 2022-12-30 | 常州时创能源股份有限公司 | Novel semi-automatic bar splicing equipment for silicon ingots and production process of novel semi-automatic bar splicing equipment |
Citations (6)
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EP0346997A2 (en) * | 1988-06-16 | 1989-12-20 | AISA S.p.A. | Apparatus for the automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits |
CN201415450Y (en) * | 2009-05-11 | 2010-03-03 | 北京石晶光电科技股份有限公司 | Multi-knife cutting pressing device |
KR100960307B1 (en) * | 2009-10-21 | 2010-06-04 | 신삼범 | Design of a materials slab of stone use super high pressure water |
CN202399420U (en) * | 2011-12-31 | 2012-08-29 | 常州天合光能有限公司 | Silicon ingot cutting edge flaw-piece gear lever device |
CN102700013A (en) * | 2012-05-28 | 2012-10-03 | 江苏美科硅能源有限公司 | Silicon ingot cutting method |
CN204955170U (en) * | 2015-07-29 | 2016-01-13 | 高佳太阳能股份有限公司 | Silicon bulk cutting is with location frock |
-
2015
- 2015-07-29 CN CN201510456581.4A patent/CN105058609B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0346997A2 (en) * | 1988-06-16 | 1989-12-20 | AISA S.p.A. | Apparatus for the automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits |
CN201415450Y (en) * | 2009-05-11 | 2010-03-03 | 北京石晶光电科技股份有限公司 | Multi-knife cutting pressing device |
KR100960307B1 (en) * | 2009-10-21 | 2010-06-04 | 신삼범 | Design of a materials slab of stone use super high pressure water |
CN202399420U (en) * | 2011-12-31 | 2012-08-29 | 常州天合光能有限公司 | Silicon ingot cutting edge flaw-piece gear lever device |
CN102700013A (en) * | 2012-05-28 | 2012-10-03 | 江苏美科硅能源有限公司 | Silicon ingot cutting method |
CN204955170U (en) * | 2015-07-29 | 2016-01-13 | 高佳太阳能股份有限公司 | Silicon bulk cutting is with location frock |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115537934A (en) * | 2022-09-21 | 2022-12-30 | 常州时创能源股份有限公司 | Novel semi-automatic bar splicing equipment for silicon ingots and production process of novel semi-automatic bar splicing equipment |
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CN105058609B (en) | 2017-07-25 |
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