CN105058304A - Pin detaching method for waste chips - Google Patents

Pin detaching method for waste chips Download PDF

Info

Publication number
CN105058304A
CN105058304A CN201510485058.4A CN201510485058A CN105058304A CN 105058304 A CN105058304 A CN 105058304A CN 201510485058 A CN201510485058 A CN 201510485058A CN 105058304 A CN105058304 A CN 105058304A
Authority
CN
China
Prior art keywords
double wedge
pin
pedestal
waste chips
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510485058.4A
Other languages
Chinese (zh)
Inventor
吴光武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Hengtong Zhaoye Precision Machinery Co Ltd
Original Assignee
Chengdu Hengtong Zhaoye Precision Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Hengtong Zhaoye Precision Machinery Co Ltd filed Critical Chengdu Hengtong Zhaoye Precision Machinery Co Ltd
Priority to CN201510485058.4A priority Critical patent/CN105058304A/en
Publication of CN105058304A publication Critical patent/CN105058304A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B27/00Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
    • B25B27/02Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Clamps And Clips (AREA)

Abstract

The invention discloses a pin detaching method for waste chips. A cuboid base is adopted. A row of protruding teeth protruding out of the upper surface of the base are arranged at the top of the base and evenly distributed on the same straight line. The distances between the protruding teeth and the side face of the base are equal. By the adoption of the method, the pulling-out speed is high, the speed of an operator can reach 90 pieces per minute, the problem that pins of the chips are difficult to pull out is solved, and production cost is reduced by using the pins of the chips as welding pins of sensors; and by the adoption of the structural mode that anti-falling teeth are arranged at the two ends of the arranged protruding teeth, the possibility of external collision received by the protruding teeth can be lowered, the protruding teeth are well protected, the structure is simple, and use is convenient.

Description

A kind of pin method for dismounting of waste chips
Technical field
The present invention relates to a kind of aid in sensor manufacturing, specifically refer to a kind of pin method for dismounting of waste chips.
Background technology
Automobile wheel speed sensor is primarily of compositions such as inductive head, wire harness and annexes.The effect of inductive head is exactly coordinate with the target gear be contained on automobile chassis, the rotating speed of measured automobiles wheel, is made up of the part such as coil, magnetic pole.On this basis, ensure normal operation of sensor, sensor also must be enable reasonably to be installed on automobile chassis, and its mounting means has a lot.Existing normally used have a kind of wheel speed sensors to be the steel shell and the part that rely on inductive head outside, and namely resilient bushing coordinates, and loads in the corresponding mounting hole of chassis.During design sensor, need by magnet steel, magnetizer combination in centre, magnetic conductor is an iron core, and coil, around magnet steel and iron core, forms magnetic conduction coil.The change of the coil-induced surrounding magnetic field of magnetic conduction, produce the signal of telecommunication, this signal of telecommunication outputs to external device (ED) by capillary.The supporting mass of magnet steel, iron core, coil is called skeleton.Existing skeleton is split type skeleton, first needs injection moulding one frame body, reinstalls iron core, magnet steel, finally reinstall stopper, forms skeleton; The technical process forming sensing head is as follows: 1, processing parts: frame body, magnetic conductor, magnet steel, capillary, stopper, coil, cotton thread; 2, assembling process: iron core gluing loading frame body-coiling-twine cotton thread-dress magnet steel-stopper gluing assembling-coil the end of a thread line tail to be wound on capillary.
The capillary of automobile sensor has two kinds: a kind of is the large capillary being connected to automobile sensor probe, its dimension scale is different according to different model, common production method utilizes copper material to shear, then be worth by electroplating technique, applicants have invented new process units and new technique to produce this kind of capillary; Another kind is standard capillary, for being connected to circuit board or other preferred circuit equipment, its structure is identical with common electronic chip pin, also the mode of oneself processing can be adopted, but the cost of himself processing is higher, in order to reduce costs, existing chip pin can be extracted and can use, reduce costs with this, how to extract the thing that pin is comparatively difficulty always rapidly.
Summary of the invention
The object of the present invention is to provide a kind of pin method for dismounting of waste chips, the pin solving current electronic chip extracts more difficult problem, with the pin of electronic chip as the little capillary of automobile sensor, reaches the object reduced costs.
Object of the present invention is achieved through the following technical solutions:
A pin method for dismounting for waste chips, comprise the overall pedestal in cuboid, pedestal top is provided with the double wedge that a row protrudes from pedestal upper surface, and described double wedge is uniformly distributed point-blank, and the lateral distance of distance pedestal is identical.The entirety of pedestal is cuboid, be made up of bloom, in order to reduce weight, also can make with rigid plastics, the size of its entirety and common palmistry are coincide, so that operating personnel are dominated by hand, the bottom of pedestal is plane, for being placed on workbench, the top of pedestal is plane, top planes is provided with row's double wedge, double wedge is neat, be arranged in a straight line equably, the distance of this air line distance pedestal top is equal, electronic chip is faced upward and is placed on base top surface, make its pin all upwards, and chip contact base top surface itself, and allow the pin of chip between double wedge, chip pin clamped by operating personnel's tweezers or nipper plier, firmly pull outward, must not be upper and lower, roll, chip is originally under the stop of double wedge, pin is come off in chip, so, not only simple to operate, and the speed of extracting is very fast, the speed of operator can reach 90 pieces/minute, solve the problem that chip pin is difficult to extract, be used as sensor capillary with chip pin and reduce production cost.
Described double wedge entirety is in cuboid.Further, adopt rectangular-shaped double wedge, during use by the long limit of double wedge perpendicular to chip itself, the shorter base of its length is contacted with chip itself, while ensure that the maximum external force can born between entirety and pedestal, add the distance between double wedge, be conducive to pin to be put between double wedge.
Corner angle between the upper surface of described double wedge and side form level and smooth cambered surface after removing.Further, in order to ensure the safety of user, avoiding sharp corner to scratch the hand of operating personnel, forming the double wedge of level and smooth cambered surface after adopting corner angle to remove, without sharp corner angle, adding the comfortable feel degree of operating personnel, avoid scuffing.
Shatter-resistant tooth is provided with at the two ends of described row's double wedge.Further, as a further improvement on the present invention, adopt the version that shatter-resistant tooth is set respectively at the two ends of double wedge arrangement, be conducive to reducing double wedge and be subject to extraneous possibility of clashing into, protect double wedge well.
The present invention compared with prior art, has following advantage and beneficial effect:
The pin method for dismounting of a kind of waste chips of 1 the present invention, top planes is provided with row's double wedge, double wedge is neat, be arranged in a straight line equably, the distance of this air line distance pedestal top is equal, electronic chip is faced upward and is placed on base top surface, make its pin all upwards, and chip contact base top surface itself, and allow the pin of chip between double wedge, chip pin clamped by operating personnel's tweezers or nipper plier, firmly pull outward, must not be upper and lower, roll, chip is originally under the stop of double wedge, pin is come off in chip, so, not only simple to operate, and the speed of extracting is very fast, the speed of operator can reach 90 pieces/minute, solve the problem that chip pin is difficult to extract, be used as sensor capillary with chip pin and reduce production cost,
The pin method for dismounting of a kind of waste chips of 2 the present invention, adopt rectangular-shaped double wedge, during use by the long limit of double wedge perpendicular to chip itself, the shorter base of its length is contacted with chip itself, while ensure that the maximum external force can born between entirety and pedestal, add the distance between double wedge, be conducive to pin to put between double wedge;
The pin method for dismounting of a kind of waste chips of 3 the present invention, adopts the version arranging shatter-resistant tooth at the two ends of double wedge arrangement respectively, and be conducive to reducing double wedge and be subject to extraneous possibility of clashing into, protect double wedge well, structure is simple, easy to use.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Mark and corresponding parts title in accompanying drawing:
1-pedestal, 2-double wedge, 3-shatter-resistant tooth.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
Embodiment
As shown in Figure 1, the pin method for dismounting of a kind of waste chips of the present invention, comprise the overall pedestal 1 in cuboid, pedestal 1 top is provided with the double wedge 2 that a row protrudes from pedestal 1 upper surface, double wedge 1 entirety is in cuboid, corner angle between the upper surface of double wedge 2 and side form level and smooth cambered surface after removing, double wedge 2 is uniformly distributed point-blank, and the lateral distance of distance pedestal 1 is identical, shatter-resistant tooth 3 is respectively arranged with at the two ends of a row double wedge 2, the height of shatter-resistant tooth 3 is a little more than the height of double wedge 2, simultaneously, the width of shatter-resistant tooth 3 and length are all slightly larger than width and the length of double wedge 2.
The above is only preferred embodiment of the present invention, not does any pro forma restriction to the present invention, every according in technical spirit of the present invention to any simple modification, equivalent variations that above embodiment is done, all fall within protection scope of the present invention.

Claims (4)

1. the pin method for dismounting of a waste chips, it is characterized in that: comprise the overall pedestal (1) in cuboid, the double wedge (2) that a row protrudes from pedestal (1) upper surface is provided with at pedestal (1) top, described double wedge (2) is uniformly distributed point-blank, and the lateral distance of distance pedestal (1) is identical.
2. the pin method for dismounting of a kind of waste chips according to claim 1, is characterized in that: described double wedge (2) entirety is in cuboid.
3. the pin method for dismounting of a kind of waste chips according to claim 2, is characterized in that: the corner angle between the upper surface of described double wedge (2) and side form level and smooth cambered surface after removing.
4. the pin method for dismounting of a kind of waste chips as claimed in any of claims 1 to 3, is characterized in that: be provided with shatter-resistant tooth (3) at the two ends of described row's double wedge (2).
CN201510485058.4A 2015-08-10 2015-08-10 Pin detaching method for waste chips Pending CN105058304A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510485058.4A CN105058304A (en) 2015-08-10 2015-08-10 Pin detaching method for waste chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510485058.4A CN105058304A (en) 2015-08-10 2015-08-10 Pin detaching method for waste chips

Publications (1)

Publication Number Publication Date
CN105058304A true CN105058304A (en) 2015-11-18

Family

ID=54487928

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510485058.4A Pending CN105058304A (en) 2015-08-10 2015-08-10 Pin detaching method for waste chips

Country Status (1)

Country Link
CN (1) CN105058304A (en)

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20151118

WD01 Invention patent application deemed withdrawn after publication