CN105048257A - Laser module and temperature regulation method thereof - Google Patents
Laser module and temperature regulation method thereof Download PDFInfo
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- CN105048257A CN105048257A CN201510184195.4A CN201510184195A CN105048257A CN 105048257 A CN105048257 A CN 105048257A CN 201510184195 A CN201510184195 A CN 201510184195A CN 105048257 A CN105048257 A CN 105048257A
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Abstract
The present invention relates to a laser module and a temperature regulation method thereof. The laser module of a modulation light source and an optical part comprises a light source emitting laser; an optical part arranged in a light path of the laser emitted from the light source; a substrate installed at one side surface of the light source and the optical part; a housing storing the substrate; a temperature regulation device arranged between the other side surface of the substrate and the inner surface of the housing with respect to the other side surface, contacted with the substrate and configured to adjust the temperature of the substrate; and an insulation component arranged between the side surface and the inner surface of the housing.
Description
The cross reference of related application
The application based on and the priority of the Japanese patent application No.2014-085222 requiring submit to on 02 27th, 2014, its full content is incorporated herein for reference.
Technical field
The present invention relates to laser module and optics that modularization such as sends the light source of laser, and the temperature control method of laser module.
Background technology
In the technical field of optical communication, laser module, optics etc. that modularization sends the light source of laser are known.
Fig. 4 A is the vertical view of the laser module of other example of the composition relevant with the present invention, and Fig. 4 B is sectional view.
Fig. 4 A and the laser module shown in Fig. 4 B 100 have light source 110, lens 120a, optical modulator 120b, lens 120c, substrate 130, housing 140 and peltier module 150.
Light source 110, lens 120a, optical modulator 120b and lens 120c are arranged on substrate 130.Substrate 130 is supported by peltier module 150 and is arranged in housing 140.
In laser module 100, from laser scioptics 120a, optical modulator 120b and the lens 120c one by one that light source 110 sends, and enter in the optical transmission line 201 be attached with the external plates of housing 140.
Wavelength and the intensity of the laser sent from light source 110 are easy to the variations in temperature according to light source 110 and change.Therefore, in laser module 100, equipment regulates the peltier module 150 of the temperature of substrate 130 equably.
Need the large-sized substrate 130 for mounted lens 120a, optical modulator 120b and lens 120c.Therefore, in order to stably support large-sized substrate 130, large-sized peltier module 150 is needed.
According to the peltier module 15 strengthened, the demand of Mechanical Reliability (such as resistance to vibration and resistance to impact) also becomes strict.
But, because in peltier module 150, the thermoelectric device (not shown) mechanicalness of equipment is poor, therefore, be difficult to manufacture large-sized peltier module 150.
In addition, by peltier module 150, the temperature of substrate 130 is cooled to enough lower than the temperature of the temperature of housing 140.
Therefore, when the area of peltier module 150 is concerning time very little the area of substrate 130, the hot-fluid flowing into substrate 130 from this housing 140 raises (see Fig. 4 B) between the lower surface and the inner surface of housing 140 of substrate 130.
Because substrate 130 is heated by this hot-fluid, therefore, exist and regulate by the temperature of peltier module 150 pairs of substrates 130 possibility be obstructed.
Then, the structure of laser module is as fig. 5 a and fig. 5b considered.Fig. 5 A is the vertical view of the laser module of other example of the composition relevant with the present invention, and Fig. 5 B is sectional view.
In Fig. 5 A and Fig. 5 B, in the mode of the parts of similar above-mentioned laser module 100, identical symbol is used to same parts, and omit its detailed description.Fig. 5 A and the laser module shown in Fig. 5 B 200 have light source 110, lens 120a, optical modulator 120b, lens 120c, substrate 130a and 130b, housing 140, peltier module 150a and 150b.
Substrate 130a installs light source 110 and lens 120a.On the other hand, substrate 130b installs optical modulator 120b and lens 120c.Substrate 130a is supported by peltier module 150a.On the other hand, substrate 130b is supported by peltier module 150b.
By this laser module 200, two or more optical modulator is installed, without the need to adding large substrates and peltier module 150.
Patent documentation 1 discloses as above-mentioned laser module 200, and two or more optics installed by two or more substrate, and by the technology of the two or more substrate of each self-supporting of two or more peltier module.
(patent documentation 1) Japanese patent application No.2004-134776
In order to stably send laser, being necessary to prevent the optical axis deviation of laser and the technology utilizing laser module 200 or above-mentioned patent documentation 1, two or more optics is arranged on two or more substrate.
But in the case of that construction, owing to considering warpage and the distortion of each substrate, must determine the layout of each optics, installment work is very difficult.
Therefore, the laser module by light source and optics being installed on one substrate is needed.
But, as mentioned above, manufacture have the structure of light source and optics being installed on one substrate, corresponding to the peltier module difficulty of large-sized substrate, become and be difficult to stably regulate substrate temperature.
Summary of the invention
Therefore, main purpose of the present invention is to provide a kind of laser module, even if large-sized substrate is large-sized, also stably can regulate substrate temperature, and provide the temperature control method of laser module.
The laser module of modularized light source and optics comprises the optics the light source sending laser, the light path being arranged on the laser sent from light source; Light source and optics are arranged on the substrate on surface, side; The housing of storing substrate; Be arranged between the opposite side surface of substrate and the inner surface of the housing relative with this opposite side surface, with substrate contacts, and regulate the temperature-adjusting device of the temperature of substrate, and be arranged on the thermal insulation member between this side surface and inner surface of housing.
According to the present invention, even if add large substrates, the temperature of substrate becomes can be stablized.
Accompanying drawing explanation
Example feature of the present invention and advantage will become apparent from following detailed description with the accompanying drawing, wherein:
Figure 1A is the vertical view of the laser module according to the first exemplary embodiment of the present invention;
Figure 1B is the sectional view of the laser module shown in Figure 1A;
Fig. 2 is the sectional view of the structure that temperature adjusting member is shown;
Fig. 3 A is the vertical view of the laser module according to the second exemplary embodiment of the present invention;
Fig. 3 B is the sectional view of the laser module of Fig. 3 A;
Fig. 4 A is the vertical view of the laser module relevant with the present invention;
Fig. 4 B is the sectional view of the laser module of Fig. 4 A;
Fig. 5 A is the vertical view of other laser module relevant with the present invention; And
Fig. 5 B is the sectional view of the laser module of Fig. 5 A.
Embodiment
< first exemplary embodiment >
First exemplary embodiment of the present invention is described
Figure 1A is the vertical view of the laser module according to the first exemplary embodiment.Figure 1B is the sectional view of the laser module according to the first exemplary embodiment.
As shown in FIG. 1A and 1B, the laser module 1 of this exemplary embodiment has light source 11, lens 12a (the first lens), optical modulator 12b, lens 12c (the second lens), substrate 13, housing 14, temperature-adjusting device 15 and thermal insulation member 16.
Light source 11, lens 12a, optical modulator 12b and lens 12c are arranged on a surface of substrate 13 and (in the present example embodiment, are upper surface) (see Figure 1B).
Light source 11 sends laser.Lens 12a, optical modulator 12b and lens 12c are arranged on the light path of the laser sent from light source 11.Such as, lens 12a be arranged on laser 11 anterior position and from the position in the direction X of the laser of this light source 11, and the laser sent from light source 11 to be focused in the direction of optical modulator 12b.
Optical modulator 12b is arranged on the position in the anterior position of lens 12a and the X-direction of laser, and through or stop the laser that scioptics 12a assembles.Lens 12c is arranged on the position in the anterior position of optical modulator 12b and the X-direction of laser, and the laser through optical modulator 12b is converged to the optical transmission line 20 be attached with the external plates of housing 14.
In this exemplary embodiment, optical transmission line 20 is optical fiber.
In addition, in the present example embodiment, although lens 12a, optical modulator 12b and lens 12c install on the substrate 13, the optics installed on the substrate 13 is not limited to these.As the amendment of this exemplary embodiment, optics, the driver of such as optical modulator 12b, regulates the variable optical attenuator (VOA) of the intensity of laser, inhibitory reflex and the isolator of light returned and the wavelength locker of stable oscillation stationary vibration wavelength to install on the substrate 13.
Substrate 13 leaves in housing 14.In this exemplary embodiment, housing 14 is formed by Kovar material.But, can by forming housing 14 through other material of light.
Temperature-adjusting device 15 is arranged between the opposite side surface (in this exemplary embodiment, being lower surface) of substrate 13 and the inner surface of the housing 14 relative to relevant lower surface.In this exemplary embodiment, temperature-adjusting device 15 utilizes solder, engages respectively with the lower surface of housing 14 and the inner surface of housing 14.
Temperature-adjusting device 15 supporting substrate 13 and regulate the temperature of substrate 13.
Fig. 2 is the sectional view of the structure that temperature-adjusting device 15 is shown.The temperature-adjusting device 15 of this exemplary embodiment is peltier module, as shown in Figure 2, has a pair thermoelectric device 15a, 15b, metal level 15c and a pair substrate 15d and 15e.
The side of a pair thermoelectric device 15a and 15b is P type thermoelectric device, and opposite side is N-type thermoelectric device.
As shown in Figure 2, among substrate 15d and 15e, alternately arrange that thermoelectric device is to 15a and 15b.
Metal level 15c performs being electrically connected in series of thermoelectric device 15a and 15b.
If electric current is supplied to thermoelectric device to 15a and 15b from metal level (electrode) 15c, then each thermoelectric device 15a and 15b is through substrate (plate) 15d, the heat of absorptive substrate 13, and through substrate (plate) 15e and housing 14, by heat radiation in air.
Therefore, raise, so the laser of wavelength stabilization and intensity can be sent with the temperature being arranged on the light source 11 on this substrate 13 owing to controlling substrate 13.
Thermal insulation member 16 is separated with temperature-adjusting device 15, and is arranged in the position between the inner surface of housing 14 and the lower surface of substrate 13.
This thermal insulation member 16 support temperature adjusting device 15 and substrate 13.In addition, this thermal insulation member 16 stops the hot-fluid from housing 14 to substrate 13.Expect that the material of thermal insulation member 16 is resin, be particularly easy to the plastics of molding.
In addition, in the present example embodiment, thermal insulation member 16 is the same with temperature-adjusting device 15, uses the lower surface of solder bonds to substrate 13 and the inner surface of housing 14.
In addition, in the present example embodiment, in order to cool the light source 11 serving as pyrotoxin, temperature-adjusting device 15 is arranged on the lower surface and the position relative with light source 11 (see Figure 1B) that are arranged in substrate 13.On the other hand, in order to keep the balance support of substrate 13, thermal insulation member 16 is separated with temperature-adjusting device 15, and is arranged in the position near lens 12c.
In the present example embodiment, light source 11 and two or more optics (lens 12a and 12c, optical modulator 12b) are installed on a substrate 13.To compare with the structure of installing two or more optics with distributing on two or more substrate, as the laser module 200 of Fig. 5, suppress the optical axis deviation of the laser sent from light source 11.Therefore, the stable output of laser can be obtained.
In addition, by the laser module 1 of this exemplary embodiment, in order to install one or more optics, large substrates 13 is added.Therefore, when being difficult to strengthen temperature-adjusting device 15, the same with the peltier module 100 of Fig. 4 A and Fig. 4 B, the support of substrate 13 becomes unstable.But, by the laser module 1 of this exemplary embodiment, owing to being increased the support of substrate 13 by thermal insulation member 16, can stably supporting substrate 13.
In addition, although use large-sized substrate 13, when being difficult to strengthen temperature-adjusting device 15, due to the hot-fluid raised with the temperature difference of housing 14, heated substrates 13.But the thermal insulation member 16 of the laser module 1 of this exemplary embodiment is arranged between the lower surface of substrate 13 and the inner surface of the housing 14 relative with lower surface.Therefore, owing to stopping from housing 14 to the heat insulating function of the hot-fluid of substrate 13 by thermal insulation member 16, the temperature of substrate 13 is stabilized.Therefore, owing to stabilizing the temperature of the light source 11 installed by substrate 13, the laser of wavelength stabilization and intensity can be sent.
< second exemplary embodiment >
Second exemplary embodiment of the present invention is described.Hereinafter, mainly the feature different from the first embodiment will be described.
Fig. 3 A is the vertical view of the laser module according to the second exemplary embodiment.Fig. 3 B is the sectional view of the laser module of the second exemplary embodiment.
In Fig. 3 A and Fig. 3 B, use identical symbol to represent the parts identical with the laser module 1 of the first exemplary embodiment, and detailed.
As shown in figs 3 a andb, the laser module 2 of this exemplary embodiment has the thermal insulation member 26 of the laser module 1 being different from the first exemplary embodiment.
This thermal insulation member 26 is formed as can (in the present example embodiment, perpendicular to the direction on the surface of substrate 13) flexible bellows-shaped or coil shape in the Y direction.The thermal insulation member 26 of bellows-shaped as shown in Figure 3 B.
Because the temperature between the substrate 13 and housing 14 of laser module 2 is different, among those, set temperature adjusting device 15 and thermal insulation member 26.By this temperature difference, heat load add in the Y of this direction both.
But, in the present example embodiment, when thermal insulation member 26 in the Y direction in flexible time, suppress the destruction of the balance support produced due to the distortion of temperature-adjusting device 15.
In addition, with compared with the block-shaped thermal insulation member 16 described in the first exemplary embodiment, about from substrate 13 to the heat conducting distance of housing 14, thermal insulation member 26 is longer.Therefore, the thermal endurance of thermal insulation member 26 becomes and is greater than thermal insulation member 16.Therefore, because the insulation effect between substrate 13 and housing 14 improves, the temperature stability of substrate 13 improves further.
Claims (9)
1. a laser module for modularized light source and optics, comprising:
Send the light source of laser;
Be arranged on the optics the light path of the described laser sent from described light source;
Described light source and described optics are arranged on the substrate on surface, side;
Deposit the housing of described substrate;
Temperature-adjusting device, described temperature-adjusting device is arranged between the opposite side surface of described substrate and the inner surface of the described housing relative with described opposite side surface, with substrate contacts, and regulates the temperature of described substrate; And
Be arranged on the thermal insulation member between described side surface and the described inner surface of described housing.
2. laser die block device according to claim 1, wherein,
Described temperature-adjusting device is peltier module.
3. laser die block device according to claim 2, wherein,
Described substrate is supported by described temperature-adjusting device and described thermal insulation member.
4. laser die block device according to claim 3, wherein,
Away from described thermostatic position, along the described optical channel of described laser, described thermal insulation member is set.
5. laser die block device according to claim 4, wherein,
Described thermal insulation member is formed with the bellows-shaped can stretched in vertically crossing with described substrate direction or coil shape.
6. laser die block device according to claim 5, wherein,
Described optics comprises:
Assemble the first lens of described laser;
Through or stop the optical modulator of described laser utilizing described first lens to assemble; And
Described laser through described optical modulator is converged to the second lens of the optical transmission line be attached with the outside of described housing.
7. laser die block device according to claim 6, wherein,
Described thermal insulation member is the product be made of plastics.
8. a temperature control method, regulate the temperature of the substrate in laser module, described laser module comprises and light source and optics is mounted to a surperficial described substrate, and the temperature-adjusting device equipped between the opposite side surface of described substrate and the inner surface of the housing relative with described opposite side surface; Described temperature control method comprises:
By being arranged on the thermal insulation member between the described opposite side surface of described substrate and the described inner surface of described housing, suppress the heat trnasfer on the described opposite side surface from the described inner surface of described housing to described substrate.
9. temperature control method according to claim 8, wherein,
Described temperature-adjusting device is peltier module.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-085222 | 2014-04-17 | ||
| JP2014085222A JP6318802B2 (en) | 2014-04-17 | 2014-04-17 | Laser module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105048257A true CN105048257A (en) | 2015-11-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510184195.4A Pending CN105048257A (en) | 2014-04-17 | 2015-04-17 | Laser module and temperature regulation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6318802B2 (en) |
| CN (1) | CN105048257A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08125282A (en) * | 1994-10-28 | 1996-05-17 | Sumitomo Electric Ind Ltd | Semiconductor laser module and thermoelectric cooling unit |
| US5653672A (en) * | 1995-06-28 | 1997-08-05 | Hitachi Koki Co., Ltd. | Centrifugal separator with thermo-module |
| JP2001326412A (en) * | 2000-05-12 | 2001-11-22 | Nippon Telegr & Teleph Corp <Ntt> | Optical semiconductor module |
| US6519157B1 (en) * | 2001-10-23 | 2003-02-11 | Nlight Photonics Corporation | System and method for mounting a stack-up structure |
| CN1883088A (en) * | 2003-11-27 | 2006-12-20 | 索尼株式会社 | Laser system |
| US20120062640A1 (en) * | 2009-05-29 | 2012-03-15 | Konica Minolta Holdings, Inc. | Inkjet recording device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3704368B2 (en) * | 1994-01-20 | 2005-10-12 | Ｎｅｃトーキン株式会社 | Optical electric field sensor |
| JP3617193B2 (en) * | 1995-06-28 | 2005-02-02 | 日立工機株式会社 | centrifuge |
| JP4280290B2 (en) * | 2007-03-28 | 2009-06-17 | Ｏｋｉセミコンダクタ株式会社 | Optical module and manufacturing method thereof |
| JP2009224494A (en) * | 2008-03-14 | 2009-10-01 | Fujitsu Ltd | Optical semiconductor device |
| JP5171538B2 (en) * | 2008-10-17 | 2013-03-27 | ファイベスト株式会社 | Optical modulator and tunable laser module |
-
2014
- 2014-04-17 JP JP2014085222A patent/JP6318802B2/en active Active
-
2015
- 2015-04-17 CN CN201510184195.4A patent/CN105048257A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08125282A (en) * | 1994-10-28 | 1996-05-17 | Sumitomo Electric Ind Ltd | Semiconductor laser module and thermoelectric cooling unit |
| US5653672A (en) * | 1995-06-28 | 1997-08-05 | Hitachi Koki Co., Ltd. | Centrifugal separator with thermo-module |
| JP2001326412A (en) * | 2000-05-12 | 2001-11-22 | Nippon Telegr & Teleph Corp <Ntt> | Optical semiconductor module |
| US6519157B1 (en) * | 2001-10-23 | 2003-02-11 | Nlight Photonics Corporation | System and method for mounting a stack-up structure |
| CN1883088A (en) * | 2003-11-27 | 2006-12-20 | 索尼株式会社 | Laser system |
| US20120062640A1 (en) * | 2009-05-29 | 2012-03-15 | Konica Minolta Holdings, Inc. | Inkjet recording device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6318802B2 (en) | 2018-05-09 |
| JP2015207575A (en) | 2015-11-19 |
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