CN105047570B - A kind of chip BGA package reinforcement means - Google Patents
A kind of chip BGA package reinforcement means Download PDFInfo
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- CN105047570B CN105047570B CN201510340456.7A CN201510340456A CN105047570B CN 105047570 B CN105047570 B CN 105047570B CN 201510340456 A CN201510340456 A CN 201510340456A CN 105047570 B CN105047570 B CN 105047570B
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- bga package
- glue
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- bga
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- 239000003292 glue Substances 0.000 claims abstract description 81
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- 239000000178 monomer Substances 0.000 claims description 34
- 229920001187 thermosetting polymer Polymers 0.000 claims description 31
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a kind of chip BGA package reinforcement means, comprise the following steps, chip fills BGA package reinforced glue between chip and pcb board, normal temperature cure 5 30 minutes, that is, complete the reinforcing to chip BGA package after BGA is mounted on pcb board.BGA package reinforcement means condition of cure disclosed by the invention is simple, room temperature is curable, avoid to reinforce in the prior art and need the complicated technology of the wafer damage brought and ultra-violet curing of being heating and curing, solidify quick during use but use preceding shelf-stable, avoid because the problem of accelerating the storge quality difference that solidification is brought；And it is convenient that the glue after solidifying removes, and can also be removed photoresist completely under normal temperature, overcomes the defects of prior art needs heating just to remove photoresist, protects the quality of bga chip, effectively improve product yield.
Description
Technical field
The invention belongs to electronic product preparing technical field, and in particular to a kind of chip BGA package reinforcement means, under normal temperature
The reinforcing after chip BGA package can be completed.
Background technology
With the development of integrated circuit technique, silicon Single-Chip Integration degree improves constantly, and the encapsulation requirement to integrated circuit is more
Add strict, to develop for satisfaction needs, BGA arises at the historic moment, and current BGA was once contour as south, north bridge chips on CPU, mainboard
The optimal selection of density, high-performance, more pin packages.
Packaging plastic refers to that some components can be sealed, encapsulates or a kind of the electronics glue or adhesive of embedding,
The effect such as waterproof, protection against the tide, shockproof, dust-proof, radiating, secrecy can be played after embedding.Common packaging plastic mainly includes epoxies
Packaging plastic, organic silicon packaging plastic, polyurethane packaging plastic and ultraviolet photo-curing packaging plastic etc..Epoxies packaging plastic：Typically
All it is rigid, hard, most of to need to use after reconciling for two-component, the needs heating of small part one-component could solidify.Have
Machine silicon class wrapper glue is nearly all softer, elastic, identical with epoxy, and wherein most is that two-component needs to use after reconciling, few
The needs heating of part one-component could solidify.
The interconnection mode of bga structure chips and substrate mainly has two kinds：Wire bonding and flip chip bonding.Tension is strong
Degree, characterize the drag of material maximum uniform plastic deformation.For tensile sample before maximum tension stress is born, deformation is uniformity
, but after exceeding, metal starts necking occur, that is, produces and concentrate deformation.When I/O numbers<When 600, wire bonding into
This is less than flip chip bonding, and processes flexible.But the requirement of para-linkage silk is higher, it is necessary to have in good, low radian long arc it is linear
Can, and good toughness and tensile strength.Reached capacity so its shortcomings that is the existing welding precision set.
Due to pin number huge in high density circuit board, revolutionary challenge is brought to encapsulation technology.Work as mobile phone
Or the bga chip in other handheld devices when being packaged, there is welding rosin joint, asked with steam bubble etc. in traditional sealing means
Topic, drop test and repeatedly case action generation grave danger can be subjected to the component in product.In order to ensure bga chip
To be welded on PCBA without exception, the glue reinforced during BGA package is studied one after another by many Electronics Factories, carries out chip BGA package reinforcing, with
Anti-drop is improved, reaches the purpose for reinforcing component.
The reinforcing mode of chip BGA package is roughly divided into two kinds on the market at present：One kind is underfill, using asphalt mixtures modified by epoxy resin
Fat, by solidifying 8 ~ 20mins under the hot conditions in pot arch or baking box；Another kind is to use UV curing materials, is passed through
UV irradiation solidifications are carried out in the UV-device such as UV stoves or LED area light source.Both modes be not required to 100 degrees Celsius with
On high temperature be exactly to need accurate complicated equipment to complete solidification process, add manufacturing process, reduce production efficiency,
Production cost is added, caused heat does not carry out positive effect to environment also band in production process, neither saves also not environmentally.
When chip or component SMT encapsulation occur rosin joint, air etc. it is abnormal when, it is necessary to which heavy industry, the purpose of heavy industry are
To remove reinforced glue, complete to repeat a upper processing procedure.Existing BGA package reinforced glue can only use heating when removing, but root
Different according to colloidal materials, heating-up temperature is totally different, and temperature is too high sometimes can cause irreversible damage, removing glue side to periphery component
Method is single, make originally can the PCB working plates of heavy industry become " chicken ribs " of " tastele when eaten but a pity to throw away ".
The content of the invention
It is an object of the invention to overcome above-mentioned deficiency, there is provided a kind of chip BGA package reinforcement means, can be complete under normal temperature
Into reinforcing, the stability after chip BGA package is significantly improved, improves the anti-drop of encapsulating products.
To achieve the above object of the invention, the technical solution adopted by the present invention is：A kind of chip BGA package reinforcement means, bag
Following steps are included, chip fills BGA package reinforced glue, normal temperature cure after BGA is mounted on pcb board between chip and pcb board
10-30 minutes, that is, complete the reinforcing to chip BGA package；
The BGA package reinforced glue, by mass parts, including following components：
Ludox 50-60 parts
Thermosetting acrylic resin prepolymer 30-40 parts
Paraffin 1-5 parts
Aqueous polyurethane compound 1-3 parts
In the Ludox, the mass fraction of silica is 30-50%；
The thermosetting acrylic resin prepolymer is by monofunctional acrylates' ester monomer and nitrogenous vinyl monomer through anti-
It should be formed；
The molecular weight of the thermosetting acrylic resin prepolymer is 3500-5000, molecular weight distribution 1.5-1.7；
The molecular weight of the aqueous polyurethane compound is 10000-14000.
Provided by the present invention for the reinforcement means after chip BGA package, after SMT part pieces cross stove, in bga chip
BGA package reinforced glue on four angle points, room temperature 5-30 minutes, solidify within preferably 10 minutes, add so as to complete chip BGA package
Gu；In case of part is reprocessed, it is necessary to during removing glue, it is only necessary to a small amount of solvent, reinforced glue is can remove under normal temperature, beneficial to fetching for chip,
Particularly, reinforced glue disclosed by the invention can also use mode of heating to remove, and hot temperature of removing photoresist is far below temperature during existing removing glue
Degree.
The Ludox of the present invention is inorganic high component Ludox, and concentration reaches 30-50%, and silica particle size range is 20-
30nm, when Ludox moisture evaporation, hydroxyl and the PCB substrate and chip on micelle surface form strong active force so that glue
Body particle is securely attached to body surface, and forming silica between particle combines, can good sticky object.
Thermosetting acrylic resin prepolymer refers to using acrylate monomer as basis, with vinyl monomer through certain
The polymer formed is reacted, with substantial amounts of reactive group, passes through the reactive group of the urethanes of addition in glue
Reaction, ultimately forms network structure, reaches insoluble insoluble thermosetting effect, can lift the hardness and intensity of glue, and make glue
Water mechanical performance, chemical resistance greatly improve.The thermosetting acrylic resin prepolymer of the present invention is by simple function group propylene
Acid ester monomer and the reacted formation of nitrogenous vinyl monomer, monofunctional acrylates' ester monomer, nitrogenous vinyl monomer
Structural formula is respectively：、。
The thermosetting acrylic resin prepolymer of the present invention retains all heteroaromatics of monomer and phosphate group, heteroaromatic
Resin system solidifies the filling of post-crosslinking density, improves the intensity of glue；Phosphate group also acts as the effect of coupling, not only can be with
Phosphate is formed with the hydroxyl reaction of silicon face in Ludox, increases system internal bond strength, can also be with substrate and silicon core
The anti-biochemical coupled action in piece surface, the active force of formation are much larger than physical absorption power, due to the generation of chemical bond, greatly improved
The adhesive property of whole system, ensure consolidation effect.Thermosetting acrylic resin prepolymer is the resin body in glue, its
Remaining component is infiltrated by it, its curing performance to glue, contraction when particularly solidifying, has to the expansive force of chip pin solder joint
Very big influence, the thermosetting acrylic resin prepolymer shrinkage that preparation is polymerize using above-mentioned monomer of the invention is good,
As resin is contained, good with other components compatibility, obtained reinforcing adhesive curing time delay malleability is good, will not extrude chip welding spot,
The CTE between chip and substrate is reduced, plastic deformation is converted into elastic deformation, it is big to avoid existing glue stress in solidification
Solder joint is touched, the defects of so as to cause solder joint displacement.
Preferably, react to form thermosetting acrylic resin in monofunctional acrylates' ester monomer and nitrogenous vinyl monomer
During prepolymer, monofunctional acrylates' ester monomer and the mol ratio of nitrogenous vinyl monomer are 1:（1.25-1.35）.This is not letter
It is single in order to react complete, and conventional meanses for slightly improving a certain material rate used, but creative setting simple function
The mol ratio of group acrylate monomer and nitrogenous vinyl monomer, vinyl major part and simple function on nitrogenous vinyl monomer
Vinyl crosslinking on group's acrylate monomer, while also have part to form ehter bond with hydroxyl, in further increase prepolymer
While cross-link intensity, assign prepolymer certain pliability again, using this prepolymer as matrix resin, for reinforced glue, solid
Ductility is good during change, and cure shrinkage is suitable, there is certain toughness, while itself rigid radical and and other components after solidification
Crosslinking ensure that hardness, intensity, solidification rate and the anti-shearing, tensile strength of glue, achieve unexpected effect.
Meanwhile in the present invention, monofunctional acrylates' ester monomer is with P elements, element silicon, nitrogenous vinyl monomer band
There is nitrogen, both react the reaction of formation, and to form thermosetting acrylic resin prepolymer not only heat-resist, with PCB substrate
（And silicon）Adhesive strength is high, is advantageous to improve the adhesive force of chip and substrate layer, in the case of particularly heated, still energy
Keep chip bonding with base material；Particularly, the resin system can form cooperative flame retardant effect, can produce the fire-retardant effect of silicon nitrogen phosphorus
Should, the fire resistance of system is improved, in the case where meeting fire conditions, phosphorus source barrier, nitrogen source expansion, silicon source are heat-resisting, and three's collaboration can
Spread with retarded combustion, progressively reach flame retardant effect；And avoid such as microcosmic concentration effect that filler fire retardant is brought etc.
Harmful effect.This be existing reinforced glue without effect, but fire-retardant performance necessary to being electronic product, while also need to keep away
Exempt from the acyclic environment friendly flame-retardant factor such as halogen, the invention propose can be fire-retardant reinforced glue, there is provided existing reinforced glue is not
The performance possessed.
Urethanes are polyurethanes, with aminated compounds（Ethylenediamine）For chain extender, by organic two isocyanide
Acid esters or polyisocyanate compound are formed with dihydroxy or polyol addition polymerization, and hydrophilic radical is introduced in polyurethane chain
（Generally carboxyl, amido）And obtain being dissolved in the aqueous polyurethane compound of water；Its contain highly polar carbamate groups,
Amido etc., the reactive group carried with thermosetting acrylic resin prepolymer（Hydroxyl）Reaction, can obtain build cross-linked network
Structure；There is high intensity, high abrasion and solvent resistant, improve the toughness of glue.
Paraffin is hydrocarbon compound, and as organic matter, it is good with system other compositions compatibility, can be with adjustable rooting glue
Viscosity and can improve product ageing resistance and increase pliability.
The molecular weight of thermosetting acrylic resin prepolymer of the present invention is 3500-5000, molecular weight distribution 1.5-1.7,
Strand has certain length in prepolymer, does not crosslink, and institute's band reactive group is more, is evenly distributed, in Ludox
Under promotion, it can be reacted with the reactive group of polyurethane, without crosslinking points so that in course of reaction, acrylic molecules chain maximum journey
Being reacted with other components for degree, improves overall compatibility, while molecular weight distribution is small, ensures the uniformity of reaction, will not go out
Existing defect centrostigma；It is reactive for the purposes of increase, improve the combination property of solidified after-product, the molecular weight of urethanes
For 10000-14000；Molecular weight is too small, causes small segment excessive so that and system crosslinking degree is low after solidification, and molecular weight is excessive,
System reflecting point is few, can equally slacken the crosslinking of molecule interchain.
Reinforcing glue composition disclosed by the invention is reasonable, is acted synergistically between each component strong, avoids lacking for a certain component
Fall into the problem of glue combination property brought declines.Reinforce glue it is excellent in adhesion, can be bonded well silicon base chip with
Plexiglas cloth base PCB substrate, chip and substrate strong bonded make it that after solidification, reach the effect of BGA package reinforcing；On the one hand
Ludox surface carries great amount of hydroxy group, and strong Hyarogen-bonding can be formed with body surface, can also be with such as resin base table
The amino reaction in face produces chemical interactions, and Ludox is good with silicon compatibility, beneficial to both attachments；On the other hand, it is hot
The organic matters such as solidity acrylic resin prepolymer, urethanes all carry substantial amounts of reactive group, can be in chip and base
Effective active force is formed between plate, good with the resin boundary surface effect in pcb board, beneficial to both attachments, and organic matter is taken
It can be reacted with group with the hydroxyl of Ludox, form three-dimensional build cross-linked network, including the more silicon of Ludox micelle
Acid particles react to each other the tridimensional network to be formed, acrylate copolymer tridimensional network, acroleic acid polyurethane three dimensional network
Cross-linked structure between shape structure and silica segment and polymer molecular chain, a variety of cross-linked structures cross one another, are effectively ensured
The stability of glue, adhesive force of the glue to sticky object being improved, system crosslinking degree is reasonable, high strength after curing, and toughness is high,
Avoid fragility, the easy to cracking of thermosetting cement of inorganic matter glue.
In the present invention, above-mentioned normal temperature solidified BGA package reinforced glue preparation method, comprise the following steps, Ludox is fallen
Enter in container A；Thermosetting acrylic resin prepolymer is put into container B, stirred, then by the thermoset acrylics after stirring
Resin prepolymer is added in Ludox, stirring；Then urethanes are added, lasting stirring；Paraffin is eventually adding, is stirred
After obtain normal temperature solidified BGA package reinforced glue.Following steps are specifically included, Ludox is poured into container A, maintenance temperature is
25℃；Thermosetting acrylic resin prepolymer is put into container B, 1h is stirred in 80 DEG C, then by thermosetting acrylic resin
Prepolymer is added in Ludox, stirs 0.5h；Then urethanes are added in container A, persistently stirs 2h；Finally by stone
Wax is added in container A, and normal temperature solidified BGA package reinforced glue is obtained after stirring 0.5h.Go out container encapsulation, can be according to customer demand
Viscosity in container A plus paraffin regulation glue viscosity.
In above-mentioned technical proposal, the invention by the first pre- thermal agitation of thermosetting acrylic resin prepolymer, then add
Enter in Ludox, be advantageous to the scattered of organic-inorganic thing, overcome prior art and add inorganic matter while organic matter is stirred
The inorganic matter brought such as gathers at the bad phenomenon；Paraffin is eventually adding, does not interfere with the mixing of main substance, also allows for viscosity tune
Control；And the present invention is stirred after novel substance is mixed, fully dispersed each component, be advantageous to system uniformity, reduce the flaw
Fault.
The reinforcing glue of the present invention need not add solvent, not only beneficial to environmental protection, it is important to avoid excessive organic molten
The corrosion of agent to accurate chip package interface etc. adversely affects；It can consolidate without curing process, the room temperature such as heating, ultraviolet
Change, solidified after-product cementability, mechanical property are splendid, comprehensive good；Ludox not only its very strong bonding effect, silicon member therein
Element, hydroxyl play catalytic action to the cross-linking reaction of organic matter, accelerate the reaction between organic matter functional group, again can be with organic matter shape
Into cross-linked structure so that after glue normal temperature cure, excellent performance, meet chip BGA package reinforcement criteria.
Because above-mentioned technical proposal is used, the present invention has following advantages compared with prior art:
1st, BGA package reinforcement means condition of cure disclosed by the invention is simple, and room temperature is curable, avoids existing
Being reinforced in technology needs the complicated technology of the wafer damage brought and ultra-violet curing of being heating and curing, and solidification is quick still during use
Using preceding shelf-stable, avoid because the problem of accelerating the storge quality difference that solidification is brought；And the glue removal side after solidifying
Just, it also can completely be removed photoresist under normal temperature, overcome the defects of prior art needs heating just to remove photoresist, protect the matter of bga chip
Amount, effectively improves product yield.
2nd, when BGA package reinforced glue disclosed by the invention is used for the reinforcement process after chip BGA package, about 5 points under normal temperature
Colloid is curable after clock, meets product requirement；From the shear strength test of glue, room temperature 10 minutes and 48h intensity
It is closer to, it is believed that be fully cured after 10；Relative to similar application product, curing apparatus and loss can be saved.
3rd, glue elasticity is big after chip BGA package of the invention is reinforced, after its reinforcement BGA package, product mechanical property
It is good, compared with the sample that existing UV glue is reinforced, tensile strength lifting 10%；Compared with not reinforcing sample, tensile strength improves 26%.
4th, BGA package reinforced glue of the invention composition is reasonable, and compatibility is good between each component, greater homogeneity, convenient storage,
It is suitable for tetra- jiaos of edge bindings of BGA；Glue after solidification is except excellent in mechanical performance, also with excellent surface insulation impedance,
24h, 96h and 168h sheet resistance are all higher than 108ohms。
5th, in BGA package reinforcement means of the invention, ductility is good during adhesive curing, will not extrude chip welding spot, reduce core
CTE between piece and substrate, makes plastic deformation be converted into elastic deformation, avoids the big touching weldering of existing glue stress in solidification
Point, it is final to influence the defects of chip performance even makes chip invalid so as to cause solder joint displacement；Advantageously ensure that the quality of product
With yield rate, scrappage is reduced.When substrate is impacted, reduce substrate with chip in the relative deformation of Z-direction, Jin Erda
To protection solder joint.
6th, the cooperative flame retardant that formed in resin system of the invention is acted on, and silicon nitrogen can be produced in disclosed reinforced glue
Phosphorus fire retarding effect, the fire resistance of system is improved, in the case where meeting fire conditions, phosphorus source barrier, nitrogen source expansion, silicon source are heat-resisting, and three
Person cooperates with, and can be spread with retarded combustion, progressively reach flame retardant effect, achieve unexpected effect.
Brief description of the drawings
Fig. 1 is chip BGA package consolidation effect figure of the present invention；
Fig. 2 is chip BGA package reinforcing product removing glue design sketch of the present invention.
Embodiment
The synthesis of the monofunctional acrylates' ester monomer of synthesis example one
12mL hydroxy acrylic acids, 5ml Dimethylsilanediols and 100ml absolute ethyl alcohols and 1g amino are added into there-necked flask
Sulfonic acid, return stirring react 3 hours, cooling, are filtrated to get liquid；The 85% anhydrous second of phosphoric acid 2ml, 50ml is added into liquid again
Alcohol, backflow, stirring reaction 10 hours, through silica gel column chromatography, solvent is dichloromethane, obtains weak yellow liquid, as single official
Acrylate monomer can be rolled into a ball,1H NMR (400 MHz, CDCl3) δ 5.58 (s, -C=CH 2 , 1H), 6.11 (s, -C= CH 2 , 1H), 1.85(s, CH 3 , 3H);31P-NMR(ppm):1.11。
Embodiment one：The preparation of thermosetting acrylic resin prepolymer
According to the constitutive molar ratio example and response parameter of table 1, first by benzoyl peroxide（For acrylic monomers quality
3%）Added with dioxane in reactor, be heated to flowing back, then add monofunctional acrylates' ester monomer, nitrogenous vinyl
Monomer, back flow reaction, 60 DEG C are then cooled to, vacuum removes solvent, is eventually adding hydramine（For the 5% of acrylic monomers quality）,
Column chromatography obtains thermosetting acrylic resin prepolymer, and it is water solubility, and molecular weight and molecular weight distribution are shown in Table 1.
The acrylic monomers of table 1 forms and molecular weight of product
Monofunctional acrylates' ester monomer, the structural formula of nitrogenous vinyl monomer are respectively：、。
Embodiment two：The preparation of reinforced glue
By the mass parts of table 2, Ludox is poured into container A, it is 25 DEG C to maintain temperature；Thermosetting acrylic resin is pre-
Polymers is put into container B, is stirred 1h in 80 DEG C, is then added thermosetting acrylic resin prepolymer in Ludox, stirring
0.5h；Then aqueous polyurethane compound is added in container A, persistently stirs 2h；Finally paraffin is added in container A, stirring
Normal temperature solidified BGA package reinforced glue is obtained after 0.5h；Go out container encapsulation.
The reinforced glue of table 2 forms（Mass parts）
| Group | Ludox | Thermosetting acrylic resin prepolymer | Aqueous polyurethane compound | Paraffin |
| 1 | 50 | 30（A） | 1 | 1 |
| 2 | 55 | 40（B） | 1 | 3 |
| 3 | 56 | 35（C） | 2 | 4 |
| 4 | 60 | 40（A） | 3 | 5 |
| 5 | 58 | 38（B） | 2 | 2 |
| 6 | 52 | 40（D） | 2 | 3 |
Wherein, 30（A）It is 30 parts to represent thermosetting acrylic resin prepolymer, is the A groups thermosetting third in embodiment one
Olefin(e) acid resin prepolymer.
Embodiment three：Chip BGA package reinforcement means
Above-mentioned reinforced glue is applied and reinforced in BGA package.Chip is after BGA is mounted on pcb board, in chip corner and PCB
BGA package reinforced glue, normal temperature cure 10 minutes are filled between plate（4 normal temperature cure of group 48 hours）, that is, complete to seal chip BGA
The reinforcing of dress.Shape keeps good after glue curing, without caving in and deforming, lustrous surface after solidification, there is slight elasticity.
Comparative example one
Chip fills epoxy glue after BGA is mounted on pcb board between chip and pcb board（Loctite 3549）, in
130-150 DEG C solidifies 15 minutes, that is, completes the reinforcing to chip BGA package.
Comparative example two
Chip fills different SGA water (Loctite after BGA is mounted on pcb board between chip and pcb board
190024 / 3705;EICT UV3200), it is ultraviolet（The nm of source exposure intensity@365）Solidification 5 seconds, that is, complete to seal chip BGA
The reinforcing of dress.
Performance test is carried out to the product after above-mentioned reinforcing, while reinforced glue is injected into mould, after normal temperature cure 10 minutes,
Oxygen index (OI) test is carried out, the results are shown in Table 3.
The performance test results of product after the reinforcing of table 3
| Group | Shear strength/N | Tensile strength/N | Table insulation impedance/109ohms | Glass transition temperature/DEG C | Oxygen index (OI) |
| Group 1 | 3.0 | 252 | 1.09 | 80 | 28 |
| Group 2 | 3.3 | 240 | 1.07 | 75 | 28 |
| Group 3 | 2.8 | 243 | 1.07 | 77 | 28 |
| Group 4 | 2.9 | 249 | 1.08 | 77 | 27 |
| Group 5 | 2.8 | 245 | 1.08 | 76 | 27 |
| Group 6 | 2.6 | 241 | 1.07 | 66 | 27 |
| Comparative example one | 2.3 | 221 | 0.91 | 38 | - |
| Comparative example two | 2.2 | 219 | 1.01 | 67 | - |
Reworkable property is tested
Solvent removing glue method is respectively adopted and heats reinforcing of the removing glue method to group 1, group 5, comparative example one, comparative example two
Chip bga removing glue afterwards.
Solvent removing glue method：Group 1 uses alcohol, group 5 to use isopropanol as solvent, 5 minutes, 8 minutes processing time；It is right
Ratio one and comparative example two can not use solvent removing glue.
Heat removing glue method：Group 1, group 5 use heating platform, and 150 DEG C are handled 2 minutes；Comparative example one uses heated flat
Platform and baking rifle, 220-240 DEG C of processing 5-8 minute；Comparative example two is using heating platform and dries rifle, 150-170 DEG C of 5-8 points of processing
Clock.
Fig. 1 is that reinforced glue of the present invention is applied in BGA package consolidation effect figure；Fig. 2 is BGA envelopes after application reinforced glue of the present invention
Fill reinforcing product（Group 5）Removing glue design sketch, it can be seen that glue curing thing of the invention can dilute glue after solvent soaking
Body, viscosity, easily removal and cleaning are reduced, the requirement of BGA package reinforced glue removing glue is fully achieved.
To verify the unfailing performance of curing, a series of reliability is carried out after BGA package reinforcing to said chip
Experiment, test mode is as follows, is as a result all to pass through.
1、 ATC（Accelerate thermal shock）Test, two cycles an of hour, altogether 46 cycle period, -30 DEG C to 65
DEG C/7 minutes → 65 DEG C to -30 DEG C/7 minutes → -30 DEG C/resident 8 minutes → 65 DEG C/resident 8 minutes.
2nd, (hot and humid) experiments of THB, condition：Under conditions of 65 DEG C, 90%RH, the continuously roasting machine of 72 hours
Test.
3rd, high temperature is tested, condition：Under the conditions of 40 DEG C, the continuously roasting machine test of 48 hours.
4th, vibration experiment, condition：- the 200HZ of vibration frequency 2, under random vibration pattern, with acceleration 1.04g, x, y, z
Mutually each 15 minutes of the every axle of axle.
5. drop test, condition：One jiao, Mitsubishi, six faces；Distance 76cm. 6, Cross-section slice tests：
, it is necessary to make slice test to its glue point after a series of reliability test, and cut with the glue point before reliability test is made
Piece analyzes, and checks whether its surface structure can change, and confirms whether its structural reliability meets to require.
Result above understands that chip BGA package reinforcement means disclosed by the invention is normal temperature solidified, and curing performance is good, core
Piece and substrate bonding power are strong, it is ensured that BGA package consolidation effect；Removing glue mode during removing glue is simpler than existing way,
Temperature is lower during heating, advantageously ensures that the stabilization and quality of original paper.
Claims (6)
- A kind of 1. chip BGA package reinforcement means, it is characterised in that comprise the following steps, chip after BGA is mounted on pcb board, BGA package reinforced glue is filled between chip and pcb board, normal temperature cure 5-30 minutes, that is, completes to add chip BGA package Gu；The BGA package reinforced glue, by mass parts, including following components：Ludox 50-60 partsThermosetting acrylic resin prepolymer 30-40 partsParaffin 1-5 partsAqueous polyurethane compound 1-3 partsIn the Ludox, the mass fraction of silica is 30-50%；The thermosetting acrylic resin prepolymer is by monofunctional acrylates' ester monomer and the reacted shape of nitrogenous vinyl monomer Into；The molecular weight of the thermosetting acrylic resin prepolymer is 3500-5000, molecular weight distribution 1.5-1.7；The molecular weight of the aqueous polyurethane compound is 10000-14000；The structural formula of monofunctional acrylates' ester monomer is：；The structural formula of the nitrogenous vinyl monomer is：。
- 2. chip BGA package reinforcement means according to claim 1, it is characterised in that：The silica particle size range is 20-30nm。
- 3. chip BGA package reinforcement means according to claim 1, it is characterised in that：Monofunctional acrylates' ester list The mol ratio of body and nitrogenous vinyl monomer is 1:（1.25-1.35）.
- 4. chip BGA package reinforcement means according to claim 1, it is characterised in that：Four angles of chip and pcb board it Between fill BGA package reinforced glue.
- 5. chip BGA package reinforcement means according to claim 1, it is characterised in that：Normal temperature cure 10 minutes.
- 6. chip BGA package reinforcement means according to claim 1, it is characterised in that the preparation of the BGA reinforced glues includes Following steps, Ludox is poured into container A；Thermosetting acrylic resin prepolymer is put into container B, stirred, then will Thermosetting acrylic resin prepolymer after stirring is added in Ludox, stirring；Then aqueous polyurethane compound is added, is held Continuous stirring；Paraffin is eventually adding, normal temperature solidified BGA package reinforced glue is obtained after stirring.
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