CN105038345A - Coating material for integrated circuit board and preparation method of coating material - Google Patents
Coating material for integrated circuit board and preparation method of coating material Download PDFInfo
- Publication number
- CN105038345A CN105038345A CN201510370854.3A CN201510370854A CN105038345A CN 105038345 A CN105038345 A CN 105038345A CN 201510370854 A CN201510370854 A CN 201510370854A CN 105038345 A CN105038345 A CN 105038345A
- Authority
- CN
- China
- Prior art keywords
- parts
- integrated circuit
- mounted integrated
- dimethylbenzene
- lma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a coating material for an integrated circuit board and a preparation method of the coating material. The coating material for the integrated circuit board comprises the following raw materials: methylbenzene, butyl methacrylate, dimethylbenzene, lauryl methacrylate, methyl ethyl ketone, methylacrylic acid, polyurethane, polyether, butanediol and ethyl acetate. After the integrated circuit board is soaked in the coating material, the integrated circuit board is taken out and dried, a film of 60 to 80 micrometers is obtained, the viscosity is 35 to 55s, the glossiness is 90 to 130, and the strength is 420 to 480 kg/cm<2>; surface dry needs 0.5 to 1.5 hours, hard dry needs 2 to 6 hours, and a stretch rate is 480% to 520%.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of surface-mounted integrated circuit coating and preparation method thereof.
Background technology
Coating, is called paint in Chinese tradition name.So-called coating is coated in protected or decorated body surface; and the continuous film of firm attachment can be formed with coated article, normally based on resin or oil or emulsion, add or do not add pigment, filler; add corresponding additive, with organic solvent or the formulated thick liquid of water.China's coating circle more authoritative " coating process " book is definition like this: " coating is a kind of material, and this material can be coated in article surface by different construction technologies, forms adhere well, has some strength, continuous print solid film.The film common name film of such formation, also known as paint film or coating.”
Coating (paint), our usual said paint is one wherein.Refer to coat body surface can form film under certain conditions and play protection, the class I liquid I of decoration or other specific functions (insulation, antirust, mildew-resistant, heat-resisting etc.) or solid material.Be main raw material mainly with vegetables oil greatly because of early stage coating, therefore also known as painting.Present synthetic resins instead of vegetables oil, therefore is called coating.Coating non-liquid, powder coating is the large class of coating variety one.
Coating belongs to organic chemical industry's macromolecular material, and the film formed belongs to macromolecular compound type.The classification of the Chemicals of passing through according to the modern times, coating belongs to fine chemical product.Modern coating is progressively becoming the polyfunctional engineering materials of a class, is an important industry in chemical industry.
Founding of New, over 60 years, along with the development of national economy every profession and trade, progressively develops into the requisite important industry of all fields of national economy as its supporting coatings industry from an extremely unobtrusive little industry.Through the struggling hard of several generations, pioneer and keep forging ahead, China has become second-biggest-in-the-world coating material production state and country of consumption, enters into the main flow of world's coating industry development.
The anti-paint of circuit card three, for the protection of the erosion from bad border of wiring board and relevant device thereof, thus improves and extends their work-ing life, guaranteeing the safety and reliability used.
Under real world conditions, as environment such as chemistry, vibrations, Gao Chen, salt fog, moist and high temperature, circuit card may produce that burn into softens, is out of shape, the problem such as to go mouldy, and causes circuit to break down.The anti-paint of circuit card three is coated on the surface of wiring board, forms one deck light and pliable and tough, and thickness is about the three anti-protective membranes (three prevent referring to protection against the tide, Defend salt fog, mildew-resistant) of 25-50 micron thickness.It can when such as containing protection circuit plate when chemical substance (such as: fuel, refrigerant etc.), vibrations, moisture, salt spray, moist and high temperature from infringement, thus the reliability of raising circuit card, increases its safety coefficient, and ensures its work-ing life.In addition, because the anti-paint of circuit card three can prevent electric leakage, therefore allow higher power and nearer printed board spacing, thus the object of miniaturization of components can be met.
Summary of the invention
The invention provides a kind of fast drying, moistureproof surface-mounted integrated circuit coating and preparation method thereof, solve the technical problems such as the dry slow and moisture-sensitive of existing surface-mounted integrated circuit coating.
The present invention is by the following technical solutions: a kind of surface-mounted integrated circuit coating, it is as follows that mass fraction proportioning pressed by its raw material: toluene 100 parts, butyl methacrylate 40-80 part, dimethylbenzene 40-60 part, lauryl methacrylate(LMA) 30-50 part, methylethylketone 15-35 part, methacrylic acid 2-8 part, urethane 10-30 part, polyethers 1-5 part, butyleneglycol 2-6 part, ethyl acetate 5-25 part.
As a preferred technical solution of the present invention: it is as follows that mass fraction proportioning pressed by the raw material of described surface-mounted integrated circuit coating: toluene 100 parts, butyl methacrylate 50 parts, dimethylbenzene 45 parts, lauryl methacrylate(LMA) 35 parts, methylethylketone 20 parts, methacrylic acid 3 parts, urethane 15 parts, polyethers 2 parts, butyleneglycol 3 parts, ethyl acetate 10 parts.
As a preferred technical solution of the present invention: it is as follows that mass fraction proportioning pressed by the raw material of described surface-mounted integrated circuit coating: toluene 100 parts, butyl methacrylate 70 parts, dimethylbenzene 55 parts, lauryl methacrylate(LMA) 45 parts, methylethylketone 30 parts, methacrylic acid 7 parts, urethane 25 parts, polyethers 4 parts, butyleneglycol 5 parts, ethyl acetate 20 parts.
As a preferred technical solution of the present invention: it is as follows that mass fraction proportioning pressed by the raw material of described surface-mounted integrated circuit coating: toluene 100 parts, butyl methacrylate 60 parts, dimethylbenzene 50 parts, lauryl methacrylate(LMA) 40 parts, methylethylketone 25 parts, methacrylic acid 5 parts, urethane 20 parts, polyethers 3 parts, butyleneglycol 4 parts, ethyl acetate 15 parts.
As a preferred technical solution of the present invention: the preparation method of described surface-mounted integrated circuit coating, step is:
The first step: take toluene, butyl methacrylate, dimethylbenzene, lauryl methacrylate(LMA), methylethylketone, methacrylic acid, urethane, polyethers, butyleneglycol and ethyl acetate according to mass fraction proportioning;
Second step: butyl methacrylate, lauryl methacrylate(LMA) and methacrylic acid are dropped in reactor, be heated to 60-80 DEG C, stirs 30-50min with 200-400r/min speed;
3rd step: add methylethylketone and dimethylbenzene, adds surplus stock and drop into shredder grinding 2-8h, packaging after filtering at 80-100 DEG C after mixing.
beneficial effect
A kind of surface-mounted integrated circuit coating of the present invention and preparation method thereof adopts above technical scheme compared with prior art, has following technique effect: after 1, surface-mounted integrated circuit being immersed above-mentioned coating, takes out dry, obtains 60-80 μm of thick film; 2, viscosity 35-55s, glossiness 90-130, intensity 420-480kg/cm
2; 3, surface drying 0.5-1.5h, does solid work 2-6h, extensibility 480-520%, and preparation method is simple, and raw material is simple and easy to get, the widespread production not division of history into periods can replace current material.
Embodiment
Below in conjunction with example, the invention will be further described, and embodiment, only for the present invention will be described, does not form the restriction to right, and other alternative means that it may occur to persons skilled in the art that, all within the scope of the claims in the present invention.
Embodiment 1:
The first step: take toluene 100 parts according to mass fraction proportioning, butyl methacrylate 40 parts, dimethylbenzene 40 parts, lauryl methacrylate(LMA) 30 parts, methylethylketone 15 parts, methacrylic acid 2 parts, urethane 10 parts, polyethers 1 part, butyleneglycol 2 parts, ethyl acetate 5 parts.
Second step: butyl methacrylate, lauryl methacrylate(LMA) and methacrylic acid are dropped in reactor, be heated to 60 DEG C, stirs 30min with 200r/min speed.
3rd step: add methylethylketone and dimethylbenzene, adds surplus stock and drop into shredder grinding 2h, packaging after filtering at 80 DEG C after mixing.
After surface-mounted integrated circuit is immersed above-mentioned coating, take out dry, obtain 60 μm of thick films, viscosity 35s, glossiness 90, intensity 420kg/cm
2; Surface drying 1.5h, does solid work 6h, extensibility 480%.
Embodiment 2:
The first step: take toluene 100 parts according to mass fraction proportioning, butyl methacrylate 80 parts, dimethylbenzene 60 parts, lauryl methacrylate(LMA) 50 parts, methylethylketone 35 parts, methacrylic acid 8 parts, urethane 30 parts, polyethers 5 parts, butyleneglycol 6 parts, ethyl acetate 25 parts.
Second step: butyl methacrylate, lauryl methacrylate(LMA) and methacrylic acid are dropped in reactor, be heated to 80 DEG C, stirs 50min with 400r/min speed.
3rd step: add methylethylketone and dimethylbenzene, adds surplus stock and drop into shredder grinding 8h, packaging after filtering at 100 DEG C after mixing.
After surface-mounted integrated circuit is immersed above-mentioned coating, take out dry, obtain 65 μm of thick films, viscosity 35-55s, glossiness 100, intensity 440kg/cm
2; Surface drying 1.2h, does solid work 5h, extensibility 510%.
Embodiment 3:
The first step: take toluene 100 parts according to mass fraction proportioning, butyl methacrylate 50 parts, dimethylbenzene 45 parts, lauryl methacrylate(LMA) 35 parts, methylethylketone 20 parts, methacrylic acid 3 parts, urethane 15 parts, polyethers 2 parts, butyleneglycol 3 parts, ethyl acetate 10 parts.
Second step: butyl methacrylate, lauryl methacrylate(LMA) and methacrylic acid are dropped in reactor, be heated to 60 DEG C, stirs 30min with 200r/min speed.
3rd step: add methylethylketone and dimethylbenzene, adds surplus stock and drop into shredder grinding 2h, packaging after filtering at 80 DEG C after mixing.
After surface-mounted integrated circuit is immersed above-mentioned coating, take out dry, obtain 70 μm of thick films, viscosity 45s, glossiness 110, intensity 450kg/cm
2; Surface drying 1h, does solid work 4h, extensibility 500%.
Embodiment 4:
The first step: take toluene 100 parts according to mass fraction proportioning, butyl methacrylate 70 parts, dimethylbenzene 55 parts, lauryl methacrylate(LMA) 45 parts, methylethylketone 30 parts, methacrylic acid 7 parts, urethane 25 parts, polyethers 4 parts, butyleneglycol 5 parts, ethyl acetate 20 parts.
Second step: butyl methacrylate, lauryl methacrylate(LMA) and methacrylic acid are dropped in reactor, be heated to 80 DEG C, stirs 50min with 400r/min speed.
3rd step: add methylethylketone and dimethylbenzene, adds surplus stock and drop into shredder grinding 8h, packaging after filtering at 100 DEG C after mixing.
After surface-mounted integrated circuit is immersed above-mentioned coating, take out dry, obtain 75 μm of thick films, viscosity 50s, glossiness 120, intensity 460kg/cm
2; Surface drying 0.8h, does solid work 3h, extensibility 510%.
Embodiment 5:
The first step: take toluene 100 parts according to mass fraction proportioning, butyl methacrylate 60 parts, dimethylbenzene 50 parts, lauryl methacrylate(LMA) 40 parts, methylethylketone 25 parts, methacrylic acid 5 parts, urethane 20 parts, polyethers 3 parts, butyleneglycol 4 parts, ethyl acetate 15 parts.
Second step: butyl methacrylate, lauryl methacrylate(LMA) and methacrylic acid are dropped in reactor, be heated to 70 DEG C, stirs 40min with 300r/min speed.
3rd step: add methylethylketone and dimethylbenzene, adds surplus stock and drop into shredder grinding 5h, packaging after filtering at 90 DEG C after mixing.
After surface-mounted integrated circuit is immersed above-mentioned coating, take out dry, obtain 80 μm of thick films, viscosity 55s, glossiness 130, intensity 480kg/cm
2; Surface drying 0.5h, does solid work 2h, extensibility 520%.
Claims (5)
1. a surface-mounted integrated circuit coating, it is characterized in that, it is as follows that mass fraction proportioning pressed by the raw material of described surface-mounted integrated circuit coating: toluene 100 parts, butyl methacrylate 40-80 part, dimethylbenzene 40-60 part, lauryl methacrylate(LMA) 30-50 part, methylethylketone 15-35 part, methacrylic acid 2-8 part, urethane 10-30 part, polyethers 1-5 part, butyleneglycol 2-6 part, ethyl acetate 5-25 part.
2. a kind of surface-mounted integrated circuit coating according to claim 1, it is characterized in that, it is as follows that mass fraction proportioning pressed by the raw material of described surface-mounted integrated circuit coating: toluene 100 parts, butyl methacrylate 50 parts, dimethylbenzene 45 parts, lauryl methacrylate(LMA) 35 parts, methylethylketone 20 parts, methacrylic acid 3 parts, urethane 15 parts, polyethers 2 parts, butyleneglycol 3 parts, ethyl acetate 10 parts.
3. a kind of surface-mounted integrated circuit coating according to claim 2, it is characterized in that, it is as follows that mass fraction proportioning pressed by the raw material of described surface-mounted integrated circuit coating: toluene 100 parts, butyl methacrylate 70 parts, dimethylbenzene 55 parts, lauryl methacrylate(LMA) 45 parts, methylethylketone 30 parts, methacrylic acid 7 parts, urethane 25 parts, polyethers 4 parts, butyleneglycol 5 parts, ethyl acetate 20 parts.
4. a kind of surface-mounted integrated circuit coating according to claim 1, it is characterized in that: the raw material of described surface-mounted integrated circuit coating is as follows by mass fraction proportioning: toluene 100 parts, butyl methacrylate 60 parts, dimethylbenzene 50 parts, lauryl methacrylate(LMA) 40 parts, methylethylketone 25 parts, methacrylic acid 5 parts, urethane 20 parts, polyethers 3 parts, butyleneglycol 4 parts, ethyl acetate 15 parts.
5. prepare a method for surface-mounted integrated circuit coating according to claim 1, it is characterized in that, comprise the steps:
The first step: take toluene, butyl methacrylate, dimethylbenzene, lauryl methacrylate(LMA), methylethylketone, methacrylic acid, urethane, polyethers, butyleneglycol and ethyl acetate according to mass fraction proportioning;
Second step: butyl methacrylate, lauryl methacrylate(LMA) and methacrylic acid are dropped in reactor, be heated to 60-80 DEG C, stirs 30-50min with 200-400r/min speed;
3rd step: add methylethylketone and dimethylbenzene, adds surplus stock and drop into shredder grinding 2-8h, packaging after filtering at 80-100 DEG C after mixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510370854.3A CN105038345A (en) | 2015-06-30 | 2015-06-30 | Coating material for integrated circuit board and preparation method of coating material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510370854.3A CN105038345A (en) | 2015-06-30 | 2015-06-30 | Coating material for integrated circuit board and preparation method of coating material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105038345A true CN105038345A (en) | 2015-11-11 |
Family
ID=54445334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510370854.3A Pending CN105038345A (en) | 2015-06-30 | 2015-06-30 | Coating material for integrated circuit board and preparation method of coating material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105038345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106147528A (en) * | 2016-07-20 | 2016-11-23 | 沈旭源 | A kind of metal alkali formula coating |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1398940A (en) * | 2001-07-20 | 2003-02-26 | 罗姆和哈斯公司 | Water-containing adhesive composition and its prepn |
-
2015
- 2015-06-30 CN CN201510370854.3A patent/CN105038345A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1398940A (en) * | 2001-07-20 | 2003-02-26 | 罗姆和哈斯公司 | Water-containing adhesive composition and its prepn |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106147528A (en) * | 2016-07-20 | 2016-11-23 | 沈旭源 | A kind of metal alkali formula coating |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103232787A (en) | Aqueous crackle coating | |
| CN104004444A (en) | Unsaturated polyester varnish and use method thereof | |
| CN102492342A (en) | Medium density fiberboard water-based bulge-proof white priming paint, its preparation method and application | |
| CN106543805B (en) | High-solid content polyvinyl chloride film gravure white ink and preparation method thereof | |
| CN104004443A (en) | Tin soldering and electroplating resistant crystal protection paint and preparation method thereof | |
| CN104817887A (en) | Water-based printing ink for printing PET (polyethylene terephthalate) films and method for manufacturing water-based printing ink | |
| CN104263146A (en) | Water-soluble electroplating glazing oil and manufacturing method thereof | |
| CN105038345A (en) | Coating material for integrated circuit board and preparation method of coating material | |
| CN104231757A (en) | Novel environment-friendly paint | |
| CN104974564A (en) | Integrated circuit board high temperature resistant insulation paint and preparation method thereof | |
| CN105001777A (en) | Integrated circuit plate insulating coating and preparation method thereof | |
| CN106118283A (en) | A kind of metal antirust coatings | |
| CN104263076A (en) | Environment-friendly coca-red double-PE ink and preparation method thereof | |
| CN106065269A (en) | A kind of metal alkyd rustproof paint | |
| CN104449209A (en) | Epoxy baking varnish | |
| CN108300170A (en) | A kind of water-based ultraviolet (UV) curable coating and its preparation process | |
| CN105885731A (en) | Two-component water-based sprayable neoprene adhesive and preparation technology and treating system thereof | |
| CN104130674A (en) | Vehicle primer | |
| CN104151944A (en) | Nitro wear-resistant matte varnish capable of electrostatic spraying and preparation method thereof | |
| CN106010248A (en) | Magnetic antirust coating for metals | |
| CN106147528A (en) | A kind of metal alkali formula coating | |
| CN105950018A (en) | Acid-resistant bituminous coating for metal | |
| CN106189554A (en) | A kind of metal rust transformation coating | |
| CN108129907A (en) | A kind of environment friendly coated layer material and projection screen | |
| CN105949996A (en) | Anti-corrosive coating for metal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151111 |