CN105038077A - Thermal conductive and insulation material of high power LED substrate - Google Patents
Thermal conductive and insulation material of high power LED substrate Download PDFInfo
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- CN105038077A CN105038077A CN201510442017.7A CN201510442017A CN105038077A CN 105038077 A CN105038077 A CN 105038077A CN 201510442017 A CN201510442017 A CN 201510442017A CN 105038077 A CN105038077 A CN 105038077A
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Abstract
The invention relates to a thermal conductive and insulation material of a high power LED substrate. The thermal conductive and insulation material comprises, by mass, 30%-80% of nano-scale inorganic thermal conductive powder, 10%-60% of grafted copolymer and 0.25%-10% of dispersing agents, wherein the thermal conductivity coefficient of the nano-scale inorganic thermal conductive powder is larger than 10 W/mk; the grafted copolymer is composed of graft modifiers and polyolefins resin; the nano-scale inorganic thermal conductive powder is grated onto the graft modifiers, and the graft modifiers are grafted onto branches of the polyolefins resin; the graft modifiers are composed of maleic anhydride; the dispersing agents are composed of one or more organic dispersing agents or silane coupling agents out of tri-ethyl-hexyl phosphonic acid, lauryl sodium sulfate, methyl anyl alcohol, cellulose derivatives, polyacrylamide, Guar gum and fatty acid macrogol ester, the inorganic nano thermal conductive powder is added into a resin material so that the resin material can have good thermal conductive performance, and the rigidity of the resin material is improved.
Description
Technical field
The invention belongs to material chemistry technical field, relate to heat-conducting insulation material of a kind of high-capacity LED substrate and preparation method thereof.
Background technology
Lower powered LED, namely common pcb board can satisfy the demands, but for high-capacity LED, institute's input energy sources only has 20% to change into light, remaining all consumes with the form of heat, if these heat energy fail to get rid of the external world timely, so therefore the life-span of LED will have a greatly reduced quality.LED heat-sinking capability is usually subject to encapsulation mode and uses the thermal conductivity the subject of knowledge and the object of knowledge impact of material.
Traditional bullet cut encapsulation, use with plug-in type, be widely used in the pilot lamp of household electrical appliances or communication product, the color often seen mostly is red, yellow, and green coloured light, but because the heat that most of LED produces can only by two wires toward heat conduction on the substrate of assembling, effect is undesirable.
Plate packaged type, because overall and baseplate-laminating, overall heat-conducting area increases, and adds that substrate material is for heat radiation in recent years, does many research and development and improvement, and LED uses also just more extensive.High-power LED heat radiation substrate has: the aluminium base of high thermal conductance system, copper base and ceramic substrate.
High thermal conductivity aluminium base/copper base changes base material above and below substrate into aluminium alloy/fine copper, centre is thermal insulation layer, thermal conductivity and the middle thermal insulation layer of aluminium base/copper base have very large relation, the radiating effect of middle thermal insulation layer is better, then the thermal conductivity of whole aluminium base is also higher.
Ceramic substrate is by the LED-baseplate of ceramic post sintering, there is the advantages such as thermal diffusivity is good, high temperature resistant, humidity, but tooling cost is higher, there is the shortcoming that ceramics strength is not high simultaneously, in order to solve the problem existing for ceramic substrate, people start to seek to hit the good macromolecule resin material of performance substitute pottery by easily processing, Nai Red, make substrate.
The macromolecule resin material of heat conduction utilizes heat conductive filler to carry out uniform filling to macromolecule resin material, to improve the material of heat conductivility.Conventional heat conductive filler has aluminum oxide, magnesium oxide, oxidation diction, aluminium nitride, boron nitride, silicon carbide etc., these heat conductive fillers are filled in resin material and make resin material have high thermal conductivity, the proportion of heat conductive filler in resin is larger, the heat-conducting effect of resin is better, micron-sized heat conductive filler was added in resin in the past and put extruding pelletization in an extruder, because the interpolation of inorganics in resin makes the physical strength of resin reduce, the poor performance of counter-bending antitorque folding, shock resistance against pressure is deteriorated, so people begin one's study nano level mineral filler to add in organic resin material and go, but add in organic resin material due to nano level mineral filler and be difficult to nano level mineral filler is well disperseed, nano level mineral filler is easily reunited together, the physicals of heat-conducting resin material and heat conductivility is caused all to be deteriorated.
Summary of the invention
Object of the present invention is exactly to solve prior art Problems existing, proposes heat-conducting insulation material of a kind of high-capacity LED substrate and preparation method thereof.
Concrete technical scheme of the present invention is as follows:
The invention provides a kind of heat-conducting insulation material of high-capacity LED substrate, it is characterized in that, by mass percentage, this heat-conducting insulation material comprises:
Thermal conductivity is greater than the nano level inorganic heat conduction powder of 10W/mk: 30% ~ 80%;
The graft copolymer of graft modification agent and polyolefin resin: 10% ~ 60%;
Dispersion agent: 0.25% ~ 10%.
Described nano level inorganic heat conduction powder is grafted in graft modification agent, and graft modification agent is grafted on the side chain of polyolefin resin.
Described graft modification agent is maleic anhydride or vinylformic acid or oleic acid.
Described dispersion agent is one or more of the organic dispersing agents such as triethyl hexyl phosphoric acid, sodium lauryl sulphate, methyl amyl alcohol, derivatived cellulose, polyacrylamide, guar gum, fatty acid polyglycol ester or silane coupling agent.
Described inorganic heat conduction powder comprise in aluminum oxide, magnesium oxide, oxidation diction, aluminium nitride, boron nitride, carbonization baby one or more.
The present invention also provides a kind of method preparing the heat-conducting insulation material of high-capacity LED substrate described above, and it is characterized in that, the method comprises the steps:
(1) by mass parts, 30 ~ 80 parts of nano level inorganic heat conduction powder are added in 3 ~ 20 parts of graft modification agent, add 0.1 ~ 10 part of dispersion agent again, dispersed with stirring, makes nano level inorganic heat conduction powder be dispersed in the dispersion forming emulsion form in the mixed solvent of graft modification agent and dispersion agent;
(2) dispersion of the emulsion form obtained in above-mentioned steps is joined ullrasonic spraying drying plant to carry out drying and prepare matrix material;
(3) matrix material obtained in above-mentioned steps is joined in twin screw extruder together with 7 ~ 40 parts of polyolefin resins, and add 0.1 ~ 2 part of initiator to cause carry out graft copolymerization in twin screw extruder, extruding pelletization thus prepare heat-conducting insulation material simultaneously.
Described initiator is superoxide.
Described graft modification agent is maleic anhydride or vinylformic acid or oleic acid.
Described dispersion agent is one or more of the organic dispersing agents such as triethyl hexyl phosphoric acid, sodium lauryl sulphate, methyl amyl alcohol, derivatived cellulose, polyacrylamide, guar gum, fatty acid polyglycol ester or silane coupling agent.
Described inorganic heat conduction powder comprise in aluminum oxide, magnesium oxide, oxidation diction, aluminium nitride, boron nitride, carbonization baby one or more.
The technique effect that the present invention is useful is:
Being joined in resin material by inorganic nano heat conduction powder makes resin material can either have good heat conductivility, can not reduce again the physical and mechanical properties of resin material, also add the rigidity of resin material simultaneously.
By first inorganic nano heat conduction powder being grafted on polyolefin resin by grafting agent, thus avoiding and directly inorganic nano heat conduction powder is joined in resin material the problem causing inorganic nano heat conduction powder agglomeration.
By the emulsion dispersion employing ullrasonic spraying drying by comprising inorganic nano heat conduction powder, grafting agent, dispersion agent, again with polyolefin resin grafting in the molten state, can utilize high temperature that the by product of graft copolymerization is volatilized, thus graft copolymerization can be made abundant, and speed is fast, owing to being that dried dispersion and polyolefin resin react, thus the problem of inorganic nano heat conduction powder agglomeration can not be produced.
Embodiment
In order to make the object of invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that embodiment described herein only in order to explain the present invention, be not used for limiting the present invention.
Embodiment 1
The present embodiment provides a kind of heat-conducting insulation material of high-capacity LED substrate, and the heat-conducting insulation material of this high-capacity LED substrate is prepared from as follows:
(1) by mass parts, the silicon oxide powder being 10nm by 30 parts of median sizes adds in 3 parts of graft modification agent maleic anhydrides, adding 0.1 part of dispersion agent is again polyacrylamide, stir 10 ~ 15 minutes, then adopt ultrasonic wave dispersion 20-30 minute, make nano silicon oxide powder dispersion in the mixed solvent of maleic anhydride and polyacrylamide, form the dispersion of emulsion form;
(2) dispersion of emulsion form obtained in above-mentioned steps (1) is joined ullrasonic spraying drying plant to carry out spraying dry and prepare pulverous matrix material including nano silicon oxide;
(3) pulverous matrix material obtained in above-mentioned steps (2) being joined temperature together with 7 parts of polypropylene powder resins from the feeding mouth of twin screw extruder is set in the twin screw extruder of 200 ° of C ~ 240 ° C, and from feeding mouth, add 0.1 part of initiator hydrogen peroxide cause simultaneously, acrylic resin and matrix material carry out graft copolymerization in twin screw extruder, and reacted product is extruded machine extruding pelletization thus prepares heat-conducting insulation material.
The insulating heat-conduction material prepared, by mass percentage, comprises following component:
Nano silicon oxide: 75%;
Maleic anhydride and polyacrylic graft modification multipolymer: 24.75%;
Polyacrylamide: 0.25%.
Described nano silicon oxide is grafted on graft modification agent maleic anhydride, and maleic anhydride graft is on the side chain of acrylic resin.
Embodiment 2
The present embodiment separately provides a kind of heat-conducting insulation material of high-capacity LED substrate, and the heat-conducting insulation material of this high-capacity LED substrate is prepared from as follows:
(1) by shield amount part, the alumina powder being 30nm by 80 parts of median sizes adds in 20 parts of graft modification agent oleic acid, adding 10 parts of dispersion agents is again sodium lauryl sulphate, stir 10 ~ 15 minutes, then adopt ultrasonic wave dispersion 20-30 minute, make Nano-sized Alumina Powder be dispersed in the dispersion forming emulsion form in the mixed solvent of oleic acid and sodium lauryl sulphate;
(2) dispersion of emulsion form obtained in above-mentioned steps (1) is joined ullrasonic spraying drying plant to carry out spraying dry and prepare pulverous matrix material including nano silicon oxide;
(3) pulverous matrix material obtained in above-mentioned steps (2) being joined temperature together with 40 parts of polyethylene resin powder from the feeding mouth of twin screw extruder is set in the twin screw extruder of 200 ° of C ~ 240 ° C, and from feeding mouth, add 2 parts of initiator hydrogen peroxide cause simultaneously, acrylic resin and matrix material carry out graft copolymerization in twin screw extruder, and reacted product is extruded machine extruding pelletization thus prepares heat-conducting insulation material.
The heat-conducting insulation material of the high-capacity LED substrate prepared, by mass percentage, comprises following component:
Nano aluminium oxide: 54%;
Oleic acid and poly graft modification multipolymer: 39%;
Sodium lauryl sulphate: 7%.
Described nano aluminium oxide is grafted on graft modification agent oleic acid, and oleic acid modified is on the side chain of polyvinyl resin.
Embodiment 3
The present embodiment separately provides a kind of heat-conducting insulation material of high-capacity LED substrate, and the heat-conducting insulation material of this high-capacity LED substrate is prepared from as follows:
(1) by mass parts, the magnesium oxide powder being 50nm by 30 parts of median sizes adds in 20 parts of graft modification agent vinylformic acid, adding 10 parts of dispersion agents is again fatty acid polyglycol ester, stir 10 ~ 15 minutes, then adopt ultrasonic wave dispersion 20 ~ 30 minutes, make nano magnesia powder dispersion in the mixed solvent of vinylformic acid and fatty acid polyglycol ester, form the dispersion of emulsion form;
(2) dispersion of emulsion form obtained in above-mentioned steps (1) is joined ullrasonic spraying drying plant to carry out spraying dry and prepare pulverous matrix material including nano magnesia;
(3) pulverous matrix material obtained in above-mentioned steps (2) being joined temperature together with 40 parts of poly 1-butene toners from the feeding mouth of twin screw extruder is set in the twin screw extruder of 200 ° of C ~ 240 ° C, and from feeding mouth, add 1 part of initiator hydrogen peroxide cause simultaneously, acrylic resin and matrix material carry out graft copolymerization in twin screw extruder, and reacted product is extruded machine extruding pelletization thus prepares heat-conducting insulation material.
The heat-conducting insulation material of the high-capacity LED substrate prepared, by mass percentage, comprises following component:
Nano magnesia: 30%;
The graft modification multipolymer of vinylformic acid and poly 1-butene: 60%;
Fatty acid polyglycol ester: 10%.
Described nano magnesia is grafted on graft modification agent vinylformic acid, acrylic acid-grafted on the side chain of poly 1-butene resin.
Embodiment 4
The present embodiment provides a kind of heat-conducting insulation material of high-capacity LED substrate, and the heat-conducting insulation material of this high-capacity LED substrate is prepared from as follows:
(1) by mass parts, the alpha-silicon nitride powders being 50nm by 80 parts of median sizes adds in 3 parts of graft modification agent vinylformic acid, adding 10 parts of dispersion agents is again silane coupling agent, stir 10 ~ 15 minutes, then adopt ultrasonic wave dispersion 20-30 minute, make nano-silicon nitride powder be dispersed in the dispersion forming emulsion form in the mixed solvent of vinylformic acid and silane coupling agent;
(2) dispersion of emulsion form obtained in above-mentioned steps (1) is joined ullrasonic spraying drying plant to carry out spraying dry and prepare pulverous matrix material including nano silicon oxide;
(3) pulverous matrix material obtained in above-mentioned steps (2) being joined temperature together with 7 parts of poly-1-amylene toners from the feeding mouth of twin screw extruder is set in the twin screw extruder of 200 ° of C ~ 240 ° C, and from feeding mouth, add 0.5 part of initiator hydrogen peroxide cause simultaneously, acrylic resin and matrix material carry out graft copolymerization in twin screw extruder, and reacted product is extruded machine extruding pelletization thus prepares heat-conducting insulation material.
The heat-conducting insulation material of the high-capacity LED substrate prepared, by mass percentage, comprises following component:
Nano-silicon nitride: 80%;
Vinylformic acid and poly-1-amylene connect skill modified copolymer: 10%;
Silane coupling agent: 10%;
Described nano-silicon nitride is grafted on graft modification agent vinylformic acid, acrylic acid-grafted on the side chain of poly-1-amylene resin, and described nano-silicon nitride is dispersed in heat radiation plastics.
In a word, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (2)
1. a heat-conducting insulation material for high-capacity LED substrate, is characterized in that, by mass percentage, this heat-conducting insulation material comprises:
Thermal conductivity is greater than the nano level inorganic heat conduction powder of 10W/mk: 30%-80%;
The graft copolymer of graft modification agent and polyolefin resin: 10%-60%;
Dispersion agent: 0.25%-10%;
Described nano level inorganic heat conduction powder is grafted in graft modification agent, and graft modification agent is grafted on the side chain of polyolefin resin;
Described graft modification agent is vinylformic acid;
Described inorganic heat conduction powder comprises aluminum oxide.
2.-and kind to prepare the method for the heat-conducting insulation material of high-capacity LED substrate as claimed in claim 1, it is characterized in that, the method comprises the steps:
(1) by mass parts, nano level for 30-80 part inorganic heat conduction powder is added in 3-20 part graft modification agent, add 0.25-10 part dispersion agent again, dispersed with stirring, makes nano level inorganic heat conduction powder be dispersed in the dispersion forming emulsion form in the mixed solvent of graft modification agent and dispersion agent;
(2) dispersion of the emulsion form obtained in above-mentioned steps is joined ullrasonic spraying drying plant to carry out drying and prepare matrix material;
(3) matrix material obtained in above-mentioned steps is joined in twin screw extruder together with 7-40 part polyolefin resin, and add 0.1-2 part initiator to cause and in twin screw extruder, carry out graft copolymerization, extruding pelletization thus prepare heat-conducting insulation material simultaneously.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201280025968.9A CN103764743B (en) | 2012-08-07 | 2012-08-07 | Heat-conducting insulation material of high-capacity LED substrate and preparation method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280025968.9A Division CN103764743B (en) | 2012-08-07 | 2012-08-07 | Heat-conducting insulation material of high-capacity LED substrate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN105038077A true CN105038077A (en) | 2015-11-11 |
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Family Applications (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510442031.7A Withdrawn CN105038080A (en) | 2012-08-07 | 2012-08-07 | Preparation method of thermal conducting and insulating material of LED substrate |
| CN201510441899.5A Pending CN105037636A (en) | 2012-08-07 | 2012-08-07 | Preparing method for heat conduction insulation material of high-powder LED substrate |
| CN201510441901.9A Withdrawn CN105038076A (en) | 2012-08-07 | 2012-08-07 | Heat conduction insulation material of high-power LED substrate |
| CN201510442018.1A Withdrawn CN105038078A (en) | 2012-08-07 | 2012-08-07 | Heat-conduction insulation material good in heat conduction performance for LED substrate and preparing method of heat-conduction insulation material |
| CN201510442033.6A Withdrawn CN105038081A (en) | 2012-08-07 | 2012-08-07 | Preparation method of thermal conductive and insulation material of high power LED substrate |
| CN201510421720.XA Withdrawn CN104945820A (en) | 2012-08-07 | 2012-08-07 | High-power LED substrate heat conduction and insulation material and manufacturing method thereof |
| CN201510442017.7A Withdrawn CN105038077A (en) | 2012-08-07 | 2012-08-07 | Thermal conductive and insulation material of high power LED substrate |
| CN201510442035.5A Withdrawn CN105131493A (en) | 2012-08-07 | 2012-08-07 | Heat-conductive and electric-insulating material being excellent in heat conductivity for high-power LED substrate |
| CN201510442025.1A Withdrawn CN105038079A (en) | 2012-08-07 | 2012-08-07 | Thermal-conductivity insulating material with good thermal conducting property for LED substrate |
| CN201510441900.4A Pending CN105038075A (en) | 2012-08-07 | 2012-08-07 | Thermal conducting and insulating material of LED substrate |
Family Applications Before (6)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510442031.7A Withdrawn CN105038080A (en) | 2012-08-07 | 2012-08-07 | Preparation method of thermal conducting and insulating material of LED substrate |
| CN201510441899.5A Pending CN105037636A (en) | 2012-08-07 | 2012-08-07 | Preparing method for heat conduction insulation material of high-powder LED substrate |
| CN201510441901.9A Withdrawn CN105038076A (en) | 2012-08-07 | 2012-08-07 | Heat conduction insulation material of high-power LED substrate |
| CN201510442018.1A Withdrawn CN105038078A (en) | 2012-08-07 | 2012-08-07 | Heat-conduction insulation material good in heat conduction performance for LED substrate and preparing method of heat-conduction insulation material |
| CN201510442033.6A Withdrawn CN105038081A (en) | 2012-08-07 | 2012-08-07 | Preparation method of thermal conductive and insulation material of high power LED substrate |
| CN201510421720.XA Withdrawn CN104945820A (en) | 2012-08-07 | 2012-08-07 | High-power LED substrate heat conduction and insulation material and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510442035.5A Withdrawn CN105131493A (en) | 2012-08-07 | 2012-08-07 | Heat-conductive and electric-insulating material being excellent in heat conductivity for high-power LED substrate |
| CN201510442025.1A Withdrawn CN105038079A (en) | 2012-08-07 | 2012-08-07 | Thermal-conductivity insulating material with good thermal conducting property for LED substrate |
| CN201510441900.4A Pending CN105038075A (en) | 2012-08-07 | 2012-08-07 | Thermal conducting and insulating material of LED substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111635560A (en) * | 2020-06-23 | 2020-09-08 | 深圳市德立新材料科技有限公司 | Preparation method of nano nepheline powder for optical-grade PMMA modification |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105838293B (en) * | 2016-04-07 | 2017-11-24 | 衡山县佳诚新材料有限公司 | A kind of production method of heat-conducting glue band |
| CN106876565A (en) * | 2017-03-01 | 2017-06-20 | 盐城东紫光电科技有限公司 | It is exclusively used in the encapsulating structure of UV LED chip |
| CN111689690A (en) * | 2019-03-13 | 2020-09-22 | 陆焕炯 | Production process of silicate coating inside and outside stainless steel utensil |
| CN110996500B (en) * | 2019-12-30 | 2021-02-23 | 广德新三联电子有限公司 | Mini LED circuit board and preparation process thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1433829A1 (en) * | 2002-12-23 | 2004-06-30 | 3M Innovative Properties Company | Thermally-formable and cross-linkable precursor of a thermally conductive material |
| TW200503953A (en) * | 2003-06-12 | 2005-02-01 | Showa Denko Kk | Method for producing particulate alumina and composition containing particulate alumina |
| JP4714432B2 (en) * | 2004-07-09 | 2011-06-29 | スリーエム イノベイティブ プロパティズ カンパニー | Thermally conductive sheet |
| CN101225208B (en) * | 2007-12-18 | 2010-06-02 | 福建师范大学 | Method for preparing core-shell structural 'inorganic powder-elastomer' |
| CN101220216B (en) * | 2007-12-18 | 2010-08-11 | 福建师范大学 | Method for producing inorganic powder body with 'nucleus-shell' structure by surface modification |
| CN101377293B (en) * | 2008-09-29 | 2011-04-20 | 沈锦祥 | Lamp cup of LED light fitting and LED light fitting using the same |
| CN101948583B (en) * | 2010-10-25 | 2012-06-06 | 株洲时代工程塑料制品有限责任公司 | Crosslinked polyethylene composite material and preparation method thereof |
| CN102295878A (en) * | 2011-07-06 | 2011-12-28 | 上海大学 | Fill-type thermal conductive insulation impregnating varnish |
| CN102558609B (en) * | 2011-12-13 | 2013-07-31 | 金发科技股份有限公司 | Method for improving thermal conductivity of thermal conductive polymer |
-
2012
- 2012-08-07 CN CN201510442031.7A patent/CN105038080A/en not_active Withdrawn
- 2012-08-07 CN CN201510441899.5A patent/CN105037636A/en active Pending
- 2012-08-07 CN CN201510441901.9A patent/CN105038076A/en not_active Withdrawn
- 2012-08-07 CN CN201510442018.1A patent/CN105038078A/en not_active Withdrawn
- 2012-08-07 CN CN201510442033.6A patent/CN105038081A/en not_active Withdrawn
- 2012-08-07 CN CN201510421720.XA patent/CN104945820A/en not_active Withdrawn
- 2012-08-07 CN CN201510442017.7A patent/CN105038077A/en not_active Withdrawn
- 2012-08-07 CN CN201510442035.5A patent/CN105131493A/en not_active Withdrawn
- 2012-08-07 CN CN201510442025.1A patent/CN105038079A/en not_active Withdrawn
- 2012-08-07 CN CN201510441900.4A patent/CN105038075A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111635560A (en) * | 2020-06-23 | 2020-09-08 | 深圳市德立新材料科技有限公司 | Preparation method of nano nepheline powder for optical-grade PMMA modification |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104945820A (en) | 2015-09-30 |
| CN105038081A (en) | 2015-11-11 |
| CN105038078A (en) | 2015-11-11 |
| CN105038080A (en) | 2015-11-11 |
| CN105131493A (en) | 2015-12-09 |
| CN105038075A (en) | 2015-11-11 |
| CN105037636A (en) | 2015-11-11 |
| CN105038079A (en) | 2015-11-11 |
| CN105038076A (en) | 2015-11-11 |
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Application publication date: 20151111 |