CN105034370A - Rapid forming method based on mask film curing - Google Patents
Rapid forming method based on mask film curing Download PDFInfo
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- CN105034370A CN105034370A CN201510408214.7A CN201510408214A CN105034370A CN 105034370 A CN105034370 A CN 105034370A CN 201510408214 A CN201510408214 A CN 201510408214A CN 105034370 A CN105034370 A CN 105034370A
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Abstract
The invention discloses a rapid forming method based on mask film curing. The method comprises the following steps of S1 data pre-processing and S2 forming. The S1 step comprises the steps that S11 the three-dimensional model data of parts which need to be formed are designed; S12 the three-dimensional model data are transformed into a model of a standard template library (STL) format; S13 the STL model is imported through slice software for slicing, and cross-sectional information is generated; the S2 step comprises the steps that S21 initialization is conducted, and forming parameters are set; S22 the cross-sectional information is output to an LCD; S23 ultraviolet light penetrates through an LCD mask film and illuminates resin for curing; S24 a stepping motor is controlled to move and demold operation is carried out. The rapid forming method based on the mask film curing has the advantages of low cost, stable working and high forming precision.
Description
Technical field
The present invention relates to rapid shaping technique field, particularly relate to a kind of quick molding method based on mask solidification.
Background technology
The main application of current rapid shaping can be divided into new product development checking, business exchange and the market propaganda and parts in small batch and complex parts directly to produce three aspects.Ginseng Figure 1 shows that the schematic flow sheet of rapid shaping, the cad model of required shaped object is first designed by modeling software, cad model is undertaken cutting into slices by certain thickness and obtains all two-dimensional section information of model by use Slice Software, generate corresponding numerical control code simultaneously, numerical control code or vector artwork are transferred in rapid forming equipment, form each cross section, progressively accumulation is until shaping complete.Shaping complete after whether model satisfied the demands verify, if existing defects, modify to the model of design, the step before repetition is carried out again shaping.Briefly, Quick-forming uses software by threedimensional model discretization (converting two dimension to by three-dimensional) exactly, then carries out the process of material stacking (from 2 d-to-3 d).Compared to the process needing designing mould, mfg. moulding die and die trial in conventional fabrication process, substantially reduce manufacturing cycle and the cost of product, and the complexity of product is higher, this benefit is more obvious.
Rapid shaping technique can be divided into stereolithography (StereoLithographyApparatus according to the difference of forming method, SLA), layer separated growth (LaminatedObjectManufacturing, LOM), fused glass pellet (FusedDepositionManufacturing, and selective laser sintering (SelectedLaserSintering, SLS) etc. [4] FDM).SLA has good model accuracy and surface quality compared to other several forming methods, and stock utilization almost reaches 100% [5], but causes cost of equipment costly because its complexity is higher, fails to be utilized widely.
Therefore, for above-mentioned technical problem, need to propose a kind of quick molding method based on mask solidification.
Summary of the invention
In view of this, in order to solve existing deficiency, the invention provides a kind of quick molding method based on mask solidification.
To achieve these goals, the technical scheme that provides of the embodiment of the present invention is as follows:
Based on a quick molding method for mask solidification, said method comprising the steps of:
S1, data prediction;
S11, design the three-dimensional modeling data needing forming part;
S12, three-dimensional modeling data is converted into the model of STL form;
S13, utilize Slice Software to import STL model to cut into slices, generate cross section information;
S2, shaping;
S21, initialization be arranged to shape parameter;
S22, export cross section information to LCD;
S23, UV light permeability LCD mask are radiated on resin and are cured;
S24, control step motor movement carry out stripping operation.
As a further improvement on the present invention, described step S13 also comprises:
Utilize Slice Software to import STL model, the requirement according to user is specified slicing parameter, and rear generation cross section information of having cut into slices, described slicing parameter comprises section thickness, every layer of hardening time.
As a further improvement on the present invention, the cross section information in described step S13 is BMP format-pattern.
As a further improvement on the present invention, described BMP format-pattern comprises bitmap file head, message bit pattern head, bitmap color table and data bitmap array four part.
As a further improvement on the present invention, the read method of described BMP format-pattern is:
S01, reading bitmap file head;
S02, determine whether BMP type, if so, perform step S02, if not, then terminate to read;
S03, reading message bit pattern head;
S04, judge whether to read successfully, if so, perform step S05, if not, then read end;
S05, the height obtaining BMP format-pattern, width and figure place information;
S06, judge whether figure place is less than 24, if so, perform step S07, if not, perform step S08;
S07, reading bitmap color table;
S08, reading data bitmap array;
S09, judge whether to read successfully, if so, then show to LCD, if not, then terminate to read.
As a further improvement on the present invention, also comprise after described step S13:
Cross section information is saved on SD card, carries out the transmission of cross section information with SD card as carrier.
As a further improvement on the present invention, described step S23 is:
Top-down being radiated on resin through LCD mask of ultraviolet light is cured;
Or bottom-up being radiated on resin through LCD mask of ultraviolet light is cured.
As a further improvement on the present invention, also comprise after described step S2:
Post processing, it comprises one or more in cure process, surface finish, coloring treatment.
The present invention has the advantages that cost is lower, working stability, formed precision are high, effectively reduces the complexity of secondary development, lay a good foundation for rapid prototyping system moves towards market while completing first one-step forming function.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of rapid shaping in prior art;
Fig. 2 is the particular flow sheet of rapid shaping in the embodiment of the invention;
Fig. 3 is the particular flow sheet of reading (parsing) method of BMP format-pattern in the embodiment of the invention;
Fig. 4 a, 4b are respectively top-down in the present invention and bottom-up molding mode schematic diagram.
Detailed description of the invention
Technical scheme in the present invention is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
The invention discloses a kind of quick molding method based on mask solidification, comprise the following steps:
S1, data prediction;
S11, design the three-dimensional modeling data needing forming part;
S12, three-dimensional modeling data is converted into the model of STL form;
S13, utilize Slice Software to import STL model to cut into slices, generate cross section information;
S2, shaping;
S21, initialization be arranged to shape parameter;
S22, export cross section information to LCD;
S23, UV light permeability LCD mask are radiated on resin and are cured;
S24, control step motor movement carry out stripping operation.
Preferably, also comprise after step S2 in the present invention:
S3, post processing, it comprises one or more in cure process, surface finish, coloring treatment.
Below in conjunction with detailed description of the invention, the invention will be further described.
Shown in ginseng Fig. 2, in the specific embodiment of the present invention, the quick molding method based on mask solidification comprises:
S1, data preprocessing phase, modeling software is adopted to design the threedimensional model needing forming part, then the model of STL form is converted into, recycling Slice Software imports STL model and cuts into slices, specify according to the parameter of the requirement of user to section in slicing processes, as section thickness and every layer of hardening time etc., generate a series of cross section information (BMP format-pattern) and corresponding numerical control code after having cut into slices, more all images are mounted on MRPCS (rapid prototyping system) by SD card.
S2, formative stage, MRPCS (rapid prototyping system) first carries out the rezero operation of extreme position, determine working range, then UV-LED light source is lighted, the cross section information read in SD card by FatFs file system interface is resolved, and exports cross section information to LCD after being parsed.UV light permeability LCD mask is radiated on resin and is cured, and after having solidified one deck, control system control step motor carries out stripping operation, and from SD card, then reading lower piece image, to carry out display shaping, repeats this step until shapingly to complete.
Also need after S3, shaping end to continue processing after correlation operation, because the reason resin solidification hardness such as irradiation time may not be very high when shaping, carry out that cure process surface is smooth not also needs sanding operation if need to be put in ultraviolet light baking oven, also need to carry out coloring treatment to model to the words that the model colored of final molding requires.
One of difficult point of the present invention is the parsing of BMP form, and bitmap (BitMaP, BMP) is the standard image file format in Windows operating system, and it adopts replacement response storage format.The picture depth of BMP file comprises 1,4,8,16 and 24 etc., representative stores the size needed for each pixel, typical BMP image file is made up of this four part of bitmap file head, message bit pattern head, bitmap color table and data bitmap array, provides content and codes implement form that each part comprises below.
1. bitmap file head
It comprises the information such as type, size of BMP image file, and its size is 14 bytes, and its data structure is as follows:
The type of bitmap file, this value necessarily 0x4D42, namely character ' BM', size is 2 bytes;
Bitmap file size, with byte representation, size is 4 bytes;
Bitmap file reserved word, size is 4 bytes;
The original position of data bitmap, size is 4 bytes.
2. message bit pattern head
It includes size, the information such as compression method and definitions of color of BMP image, and its size is 40 bytes, and its data structure is as follows:
The length of bitmap information header structure is described, size is 4 bytes;
The width of bitmap, in units of pixel, size is 4 bytes;
The height of bitmap, in units of pixel, size is 4 bytes;
The rank of target device, is necessary for 1, and size is 2 bytes;
Figure place needed for each pixel, its value is 1,4,8,16,24 or 32, and size is 2 bytes;
Bits compression type, size is 4 bytes;
The size of bitmap, size is 4 bytes;
Bitmap horizontal direction every meter of pixel count, size is 4 bytes;
Bitmap vertical direction every meter of pixel count, size is 4 bytes;
Bitmap actual use number of colours, size is 4 bytes;
Bitmap procedure for displaying uses number of colours, and size is 4 bytes.
3. color table
The bitmap that color table part is less than 24 for picture depth is necessary, but the bitmap that picture depth equals 24 not this, because the bitmap of the 24 bit image degree of depth has been RGB, do not need color table to compress color, its data structure is as follows again:
Blue brightness (value scope is 0-255);
Green brightness (value scope is 0-255);
Red brightness (value scope is 0-255);
Retain, be necessary for 0.
4. data bitmap array
The color data of each pixel in data bitmap representative image, according to from top to bottom, mode from left to right stores.The picture depth of BMP bitmap is less than the color index value in the use color table of 24, such as when the figure place that BMP bitmap uses is 1,8 pixels account for 1 byte, by that analogy.When picture depth is 24, each pixel uses 3 bytes to represent, stores successively according to blue, green, red order.
Shown in ginseng Fig. 3, in present embodiment, reading (parsing) method of BMP format-pattern is specially:
S01, reading bitmap file head;
S02, determine whether BMP type, if so, perform step S02, if not, then terminate to read;
S03, reading message bit pattern head;
S04, judge whether to read successfully, if so, perform step S05, if not, then read end;
S05, the height obtaining BMP format-pattern, width and figure place information;
S06, judge whether figure place is less than 24, if so, perform step S07, if not, perform step S08;
S07, reading bitmap color table;
S08, reading data bitmap array;
S09, judge whether to read successfully, if so, then show to LCD, if not, then terminate to read.
In the present invention, step S23 comprises two kinds of curing modes:
Ultraviolet light top-down being radiated at through LCD mask resin is cured and bottom-up to be radiated on resin through LCD mask of ultraviolet light is cured.
MRPCS (rapid prototyping system) adopts mask solidification method in stereolithography method as forming method, mask solidification method can be divided into top-down and bottom-up molding mode according to the forming direction of model, and both molding modes are to such as shown in Fig. 4 a, 4b.
In Fig. 4 a, top-down molding mode is that top light source being placed on resin storage tank is irradiated resin, start shaping front console and be positioned at resin liquid level place, after a shaping cross section, the thickness sent behind by workbench, and so forth until whole model completes.Adopt top-down molding mode to mean that the height of the model that needs are shaping is less than the degree of depth of resin liquid bath in Fig. 4 b, and no matter required shaping model size how, all need with resin, resin liquid bath to be filled, and at least reach the height of model.Bottom-up molding mode is contrary with top-down, light source is positioned at the below of resin storage tank, the bottom of resin liquid bath adopts transparent medium with the light launched through light source, start the bottom that shaping front console is positioned at resin liquid bath, the thickness that brings Forward of a shaping cross section workbench at every turn, and so forth until whole model completes.The benefit of bottom-up molding mode is adopted to be not need resin to be all filled to resin liquid bath before shaping, because model proposes by workbench from resin liquid level time shaping, the mobility due to resin makes the resin of surrounding be carried out filling in the space of cured portion rapidly and be convenient to carry out the shaping of next liquid level.Consider that the price of resin is not cheap, in order to minimize cost, in present embodiment, preferably adopt bottom-up molding mode in Fig. 4 b.
Compared with prior art, the quick molding method that the present invention is based on mask solidification has the advantages that cost is lower, working stability, formed precision are high, while completing first one-step forming function, effectively reduce the complexity of secondary development, lay a good foundation for rapid prototyping system moves towards market.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this description is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should by description integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.
Claims (8)
1., based on a quick molding method for mask solidification, it is characterized in that, said method comprising the steps of:
S1, data prediction;
S11, design the three-dimensional modeling data needing forming part;
S12, three-dimensional modeling data is converted into the model of STL form;
S13, utilize Slice Software to import STL model to cut into slices, generate cross section information;
S2, shaping;
S21, initialization be arranged to shape parameter;
S22, export cross section information to LCD;
S23, UV light permeability LCD mask are radiated on resin and are cured;
S24, control step motor movement carry out stripping operation.
2. method according to claim 1, is characterized in that, described step S13 also comprises:
Utilize Slice Software to import STL model, the requirement according to user is specified slicing parameter, and rear generation cross section information of having cut into slices, described slicing parameter comprises section thickness, every layer of hardening time.
3. method according to claim 1, is characterized in that, the cross section information in described step S13 is BMP format-pattern.
4. method according to claim 3, is characterized in that, described BMP format-pattern comprises bitmap file head, message bit pattern head, bitmap color table and data bitmap array four part.
5. method according to claim 4, is characterized in that, the read method of described BMP format-pattern is:
S01, reading bitmap file head;
S02, determine whether BMP type, if so, perform step S02, if not, then terminate to read;
S03, reading message bit pattern head;
S04, judge whether to read successfully, if so, perform step S05, if not, then read end;
S05, the height obtaining BMP format-pattern, width and figure place information;
S06, judge whether figure place is less than 24, if so, perform step S07, if not, perform step S08;
S07, reading bitmap color table;
S08, reading data bitmap array;
S09, judge whether to read successfully, if so, then show to LCD, if not, then terminate to read.
6. method according to claim 1, is characterized in that, also comprises after described step S13: be saved to by cross section information on SD card, carry out the transmission of cross section information with SD card as carrier.
7. method according to claim 1, is characterized in that, described step S23 is:
Top-down being radiated on resin through LCD mask of ultraviolet light is cured;
Or bottom-up being radiated on resin through LCD mask of ultraviolet light is cured.
8. method according to claim 1, is characterized in that, also comprises: post processing after described step S2, and it comprises one or more in cure process, surface finish, coloring treatment.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106042390A (en) * | 2016-07-28 | 2016-10-26 | 北京工业大学 | Multi-source large-scale face exposure 3D printing method |
| CN112976582A (en) * | 2021-02-05 | 2021-06-18 | 深圳市创必得科技有限公司 | Printing execution control method and device for photocuring 3D printing of multiple sets of slicing parameters |
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