CN105033253A - Rapid 3D forming equipment and method for sintering powder by movement of one-dimensional laser scanning vibrating mirror - Google Patents
Rapid 3D forming equipment and method for sintering powder by movement of one-dimensional laser scanning vibrating mirror Download PDFInfo
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- CN105033253A CN105033253A CN201510447053.2A CN201510447053A CN105033253A CN 105033253 A CN105033253 A CN 105033253A CN 201510447053 A CN201510447053 A CN 201510447053A CN 105033253 A CN105033253 A CN 105033253A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention relates to rapid 3D forming equipment and a method for sintering powder by movement of a one-dimensional laser scanning vibrating mirror, pertaining to the field of 3D printing. The equipment comprises a laser, a power conveying cylinder, a scraping plate, a computer, a linear motion module, a forming part, a support plate, a Z shaft and a motion control system. A three-dimensional model is sliced to a two-dimensional pattern according to forming accuracy. By setting up elevating precision and movement and scanning speed of a platform, powder is laid on the support plate. The computer is utilized for controlling the one-dimensional laser scanning vibrating mirror to move and on-off of laser in order to form a two-dimensional pattern. By radiating and sintering powder material, the support plate descends after one layer is finished and then a second-layer powder-laying and scanning operation can be performed. By layer-by-layer scanning, three-dimensional sinter forming is finished. Then, the forming part is taken down from the support plate. The rapid 3D forming equipment is large in size, high in speed, and low in cost and is capable of increasing size according to needs.
Description
Technical field
The present invention relates to a kind of one dimension laser scanning galvanometer and move the shaping method of the quick 3D of sintered powder.
Background technology
It is novel rapid prototyping & manufacturing technology (RP) that 3D prints.It is with the rapid shaping technique of accumulation method implementation model, is an important breakthrough in manufacturing technology field.It can overcome the special construction obstacle that traditional machining cannot realize, and the simplification that can realize any complex components is produced, can automatically, directly, accurately just design philosophy, from cad model, is converted into the model or device with certain function.Existing 3D printing technique is divided into thermoplastic cement basic technology FDM, selective laser sintering forming technique SLS, the regions curing forming technique SLA of photocurable liquid Choice of Resin.But FDM technology is by molten plastic silk, realizes three-dimensionally shaped by plastic extrusion shower nozzle.SLA is then shaping by laser scanning curing photosensitive resin, and selective laser sintering is by powder sintered shaping by laser scanning.These rapid prototyping & manufacturing technology existing use two-dimensional scanning mirrors all to also exist and can only scan zonule, manufacture the drawback of small size part.Realizing large format adopts the mode of the splicing of several scanning galvanometer or rear dynamic focusing to realize, the cost greatly increased.For SLA, SLS technology, large format product cost increases by 1 times, make this commercialization the earliest, application also the application of rapid shaping technique be the most widely restricted.No matter the present invention, to large format scanning moulding, is theory, technique or the reduction etc. of production cost, has important impact to the popularization and application of rapid prototyping & manufacturing technology.
Summary of the invention
For above content, the present invention will propose a kind of line sweep quick forming fabri-cation method, and sweep limits is large, can be used to manufacture fast large scale model.
The present invention can realize the unlimited expansion of processing breadth in theory, utilizes one-dimensional scanning galvanometer to realize two dimensional image scanning in conjunction with rectilinear motion.Limitting by experiment condition, use one-dimensional scanning vibration mirror scanning scope to be 500mm, rectilinear motion distance 500mm, cost reduces half than two-dimensional scanning mirrors, and the restriction both having breached large format processing again reduces cost, ensure that formed precision.In addition, optical maser wavelength has multiple, according to used power and wavelength connecting shaping material, can meet different forming requirements.
One dimension laser scanning galvanometer moves the quick 3D former of sintered powder, it is characterized in that comprising: laser instrument, powder feeding cylinder, scraper plate, computer, rectilinear motion module, profiled member supporting plate Z axis kinetic control system; Computer controlled laser, rectilinear motion module and profiled member supporting plate Z axis kinetic control system; Rectilinear motion module is controlled to drive one-dimensional scanning galvanometer to do rectilinear motion by computer, and profiled member supporting plate Z axis kinetic control system makes shaping supporting plate move at vertical direction.
Further, laser instrument that is visible or infrared wavelength is used.
Apply the method for described equipment, it is characterized in that, step comprises:
(1) manufacture threedimensional model is set up with 3D modeling software in a computer;
(2) threedimensional model is cut into slices as surface model;
(3) according to material type to be formed and version, power output and slicing layer thickness is selected;
(4) be layered on shaping supporting plate by scraper plate by the powder in powder feeding cylinder, paving powder thickness is consistent with slice thickness; Mobile one dimension laser scanning galvanometer, carries out scanning to material and irradiates sintering; The open and close of the two-dimensional surface image control laser generated according to section; The translational speed of one dimension laser scanning galvanometer and sweep speed determine scanning irradiation time; Then translational speed and sweep speed are fast to use high power laser, and irradiation time is short, otherwise slowly, irradiation time is long for the little translational speed of laser power and sweep speed;
(5) often complete one deck, decline a height; Carry out the paving powder of lower one deck, then carry out the scanning sintering of lower one deck; Such circulation is gone down and is to the last obtained three-dimensional body.
Accompanying drawing explanation
In Fig. 1 the present invention, one dimension laser scanning galvanometer moves quick 3D forming technique schematic diagram
In figure: 1, computer control.2, Z axis.3, shaping supporting plate.4, profiled member.5, material.6, one dimension laser scanning galvanometer.7, scraper plate.8, powder feeding cylinder.
Detailed description of the invention
Described 3D modeling software can be: 3DMAX, Pro/E, solidworks, AUTOCAD etc.
Described two-dimensional surface image refers to two cross-section data information threedimensional model being separated into each face and obtaining.
Described section precision refers to that the layer precision in conjunction with threedimensional model size and system of processing determines threedimensional model to be separated into how many, and precision is higher, more than discrete.
Described processing platform refers to that an energy carries out the platform of accurately movement at vertical direction, is used for being moved into shaped piece supporting plate at vertical direction (Z axis).
Described irradiation time is moved by one-dimensional scanning galvanometer and determines with sweep speed.
Described one dimension laser scanning galvanometer laser is radiated on a speculum, and speculum does reciprocal yaw motion, makes laser form a reciprocating line.
Operation principle of the present invention is: dusty material sintering curing under laser irradiates sticks into one.First produce the laser scanning galvanometer of one dimension, one-dimensional scanning galvanometer can be obtained a removal in existing two-dimensional scanning mirrors.Under computer and drive circuit control, the horizontal image signal that one dimension laser scanning galvanometer provides according to computer program, the open and close of the movement and laser that control one dimension laser scanning galvanometer form two-dimensional pattern.Like this, the powder be irradiated to will be sintered and be solidified into a two-dimensional pattern.Every one deck X-Y scheme is shaping complete after, control mobile profiled member supporting plate under Z-axis direction by computer, displacement is thick layer, carries out lower one deck paving powder, realizes successively motion scan and irradiates.When the two dimensional image that threedimensional model is cut into slices successively scan irradiate shaping after, then obtain the entity of whole threedimensional model.
Feature of the present invention is:
1., compared with traditional two dimensional laser scanning mode, the shaping cost of the present invention is low, and scan area is large.
2. the present invention can compact dimensions large, and can infinitely to expand as required.Current large-scale SLA two-dimensional scan is shaping all needs very large equipment size to meet light path configuration, and the present invention adopts scanning to combine with mobile, and light path is short, and machine dimensions is little.
3. in the present invention, the visible or infrared laser of materials'use and dusty material.
Claims (3)
1. one dimension laser scanning galvanometer moves the quick 3D former of sintered powder, it is characterized in that comprising: laser instrument, powder feeding cylinder, scraper plate, computer, rectilinear motion module, profiled member supporting plate Z axis kinetic control system; Computer controlled laser, rectilinear motion module and profiled member supporting plate Z axis kinetic control system; Rectilinear motion module is controlled to drive one-dimensional scanning galvanometer to do rectilinear motion by computer, and profiled member supporting plate Z axis kinetic control system makes shaping supporting plate move at vertical direction.
2. equipment according to claim 1, is characterized in that: use laser instrument that is visible or infrared wavelength.
3. application rights requires the method for equipment described in 1, and it is characterized in that, step comprises:
(1) manufacture threedimensional model is set up with 3D modeling software in a computer;
(2) threedimensional model is cut into slices as surface model;
(3) according to material type to be formed and version, power output and slicing layer thickness is selected;
(4) be layered on shaping supporting plate by scraper plate by the powder in powder feeding cylinder, paving powder thickness is consistent with slice thickness; Mobile one dimension laser scanning galvanometer, carries out scanning to material and irradiates sintering; The open and close of the two-dimensional surface image control laser generated according to section; The translational speed of one dimension laser scanning galvanometer and sweep speed determine scanning irradiation time; Then translational speed and sweep speed are fast to use high power laser, and irradiation time is short, otherwise slowly, irradiation time is long for the little translational speed of laser power and sweep speed;
(5) often complete one deck, decline a height; Carry out the paving powder of lower one deck, then carry out the scanning sintering of lower one deck; Such circulation is gone down and is to the last obtained three-dimensional body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510447053.2A CN105033253A (en) | 2015-07-27 | 2015-07-27 | Rapid 3D forming equipment and method for sintering powder by movement of one-dimensional laser scanning vibrating mirror |
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| CN201510447053.2A CN105033253A (en) | 2015-07-27 | 2015-07-27 | Rapid 3D forming equipment and method for sintering powder by movement of one-dimensional laser scanning vibrating mirror |
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| CN105033253A true CN105033253A (en) | 2015-11-11 |
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| CN201510447053.2A Pending CN105033253A (en) | 2015-07-27 | 2015-07-27 | Rapid 3D forming equipment and method for sintering powder by movement of one-dimensional laser scanning vibrating mirror |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106003725A (en) * | 2016-06-29 | 2016-10-12 | 北京易速普瑞科技有限公司 | Nail patch manufacturing method and device |
| CN106216665A (en) * | 2016-09-21 | 2016-12-14 | 珠海天威飞马打印耗材有限公司 | Photocuring metal 3 D-printing device and Method of printing thereof |
| CN106216665B (en) * | 2016-09-21 | 2019-07-16 | 珠海天威飞马打印耗材有限公司 | Photocuring metal 3 D-printing device and its Method of printing |
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| JP2003127238A (en) * | 2001-07-31 | 2003-05-08 | Three D Syst Inc | Selective laser sintering wherein filling scan is interleaved |
| CN201300207Y (en) * | 2008-10-30 | 2009-09-02 | 华中科技大学 | Selective laser melting rapid molding device for metal parts |
| CN103071795A (en) * | 2013-01-23 | 2013-05-01 | 西安铂力特激光成形技术有限公司 | Mobile galvanometer selective laser melting (SLM) forming device |
| CN203470904U (en) * | 2013-09-03 | 2014-03-12 | 华中科技大学 | High surface precision 3D printer |
| CN104001915A (en) * | 2014-05-22 | 2014-08-27 | 华中科技大学 | Equipment for manufacturing large-size metal part in high energy beam additive manufacturing mode and control method of equipment |
| CN204953900U (en) * | 2015-07-27 | 2016-01-13 | 北京工业大学 | One -dimensional laser scanning shakes mirror and removes quick 3D former of sintering powder |
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2015
- 2015-07-27 CN CN201510447053.2A patent/CN105033253A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003127238A (en) * | 2001-07-31 | 2003-05-08 | Three D Syst Inc | Selective laser sintering wherein filling scan is interleaved |
| CN201300207Y (en) * | 2008-10-30 | 2009-09-02 | 华中科技大学 | Selective laser melting rapid molding device for metal parts |
| CN103071795A (en) * | 2013-01-23 | 2013-05-01 | 西安铂力特激光成形技术有限公司 | Mobile galvanometer selective laser melting (SLM) forming device |
| CN203470904U (en) * | 2013-09-03 | 2014-03-12 | 华中科技大学 | High surface precision 3D printer |
| CN104001915A (en) * | 2014-05-22 | 2014-08-27 | 华中科技大学 | Equipment for manufacturing large-size metal part in high energy beam additive manufacturing mode and control method of equipment |
| CN204953900U (en) * | 2015-07-27 | 2016-01-13 | 北京工业大学 | One -dimensional laser scanning shakes mirror and removes quick 3D former of sintering powder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106003725A (en) * | 2016-06-29 | 2016-10-12 | 北京易速普瑞科技有限公司 | Nail patch manufacturing method and device |
| CN106216665A (en) * | 2016-09-21 | 2016-12-14 | 珠海天威飞马打印耗材有限公司 | Photocuring metal 3 D-printing device and Method of printing thereof |
| CN106216665B (en) * | 2016-09-21 | 2019-07-16 | 珠海天威飞马打印耗材有限公司 | Photocuring metal 3 D-printing device and its Method of printing |
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Effective date of registration: 20170106 Address after: 100070 Beijing Fengtai District headquarters base Ying Kun Century Towers, block C, 606 Applicant after: Liu Hongjie Applicant after: Beijing City Building Intelligent Technology Co Ltd Address before: 100124 Chaoyang District, Beijing Ping Park, No. 100 Applicant before: Beijing Polytechnic College |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151111 |