CN105009439A - Power conversion apparatus - Google Patents
Power conversion apparatus Download PDFInfo
- Publication number
- CN105009439A CN105009439A CN201480012241.6A CN201480012241A CN105009439A CN 105009439 A CN105009439 A CN 105009439A CN 201480012241 A CN201480012241 A CN 201480012241A CN 105009439 A CN105009439 A CN 105009439A
- Authority
- CN
- China
- Prior art keywords
- wind direction
- mentioned
- base plate
- direction board
- installation base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inverter Devices (AREA)
Abstract
An airflow-direction unit (30) is provided with air-intake openings (32) communicating with the interior space of a housing (2B) on the side facing a semiconductor power module (11), and discharge openings (33) communicating with the interior space of the housing on the side facing a first mounting substrate (23) farthest separated from the semiconductor power module, and the airflow-direction unit (30) is configured so as to generate a natural convection current of air from the semiconductor power module side toward the first mounting substrate side such that air from the housing interior is taken in through the air-intake opening, and air from the interior of the airflow-direction unit is discharged to the housing from the discharge opening.
Description
Technical field
The present invention relates to a kind of comprise the thyristor being built-in with electric power conversion semiconductor power component and with the power inverter of the stacked multiple installation base plates of the mode opening predetermined distance relative to this semiconductor power component sky, relate to the cooling construction of semiconductor power component and multiple installation base plate.
Background technology
The power inverter of patent documentation 1 is so a kind of device: be accommodated with the electric power conversion power semiconductor of the IGBT etc. as thyristor in framework inside, for the driving substrate of driving power semiconductor and cooling fan etc., by rotary actuation cooling fan, suck extraneous air from the ventilating opening being located at framework thus make extraneous air produce forced convertion in framework inside.Like this, utilize the forced convertion of the air produced by cooling fan, by the power semiconductor generated heat because of electric loss when electric power is changed, drive substrate cooling.
prior art document
patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2009-33910 publication
Summary of the invention
the problem that invention will solve
But, because the power inverter of above-mentioned patent documentation 1 sucks extraneous air from ventilating opening, therefore, dust may be caused, moisture enters framework inside, and make cooling characteristics decline or cause internal part to corrode.
In addition, need regular cooling fan is safeguarded, and have problems in maintenance cost.
So, the object of the present invention is to provide and a kind ofly can prevent from the impact of dust, moisture etc. and not need to be serviced detecting thus the power inverter of maintenance cost can being reduced.
for the scheme of dealing with problems
In order to reach above-mentioned purpose, the power inverter involved by technical scheme of the present invention comprises: semiconductor power component, cooling body, its face is engaged in this semiconductor power component, multiple installation base plate, it is provided with the circuit block for driving above-mentioned semiconductor power component, stacked in upper direction relative to above-mentioned semiconductor power component, framework, it receives above-mentioned semiconductor power component and above-mentioned multiple installation base plate hermetically, and wind direction portion, it configures in the mode of the periphery surrounding above-mentioned semiconductor power component and above-mentioned multiple installation base plate in the inside of this framework, this wind direction portion arranges the air inlet be communicated with the inner space of above-mentioned framework in above-mentioned semiconductor power component side, in the 1st installation base plate side farthest away from above-mentioned semiconductor power component, the exhaust outlet be communicated with the inner space of above-mentioned framework is set, to suck the air of above-mentioned framework inside from above-mentioned air inlet, and from above-mentioned exhaust outlet, the air of the inside in above-mentioned wind direction portion is produced free convection from above-mentioned semiconductor power component side towards the air of above-mentioned 1st installation base plate side to the mode that above-mentioned framework is discharged.
According to the power inverter involved by the technical scheme of this invention, cool owing to utilizing the circuit block of free convection to the heating being equipped on multiple installation base plate of the air produced in the inside in wind direction portion, therefore, compared to the device in the past using the device of cooling fan etc. forcibly to produce cooling-air, do not need to be serviced detection, and maintenance cost can be reduced significantly.
In addition, due to the inner loop of air in wind direction portion of the framework of confined space, therefore, it is possible to prevent dust, moisture etc. to the harmful effect of semiconductor power component and multiple installation base plate.
In addition, in the power inverter involved by technical solution of the present invention, above-mentioned wind direction portion comprises wind direction board, this wind direction board is along the long limit of above-mentioned semiconductor power component and above-mentioned multiple installation base plate or minor face configuration, and erect and supremely state the 1st installation base plate side, this wind direction board is formed multiple above-mentioned air inlet.
In addition, in the power inverter involved by technical scheme of the present invention, above-mentioned wind direction portion comprises a pair long side wind direction board, this a pair long side wind direction board configures along the long limit of above-mentioned semiconductor power component and above-mentioned multiple installation base plate, and erect and supremely state the 1st installation base plate side, on the direction on above-mentioned long limit, be formed with multiple above-mentioned air inlet at this pair long side wind direction board.
In addition, in the power inverter involved by technical scheme of the present invention, above-mentioned wind direction portion comprises pair of short edges side wind direction board, this pair of short edges side wind direction board configures along the minor face of above-mentioned semiconductor power component and above-mentioned multiple installation base plate, and erect and supremely state the 1st installation base plate, on the direction of above-mentioned minor face, be formed with multiple above-mentioned air inlet at this pair of short edges side wind direction board.
In addition, in the power inverter involved by technical scheme of the present invention, above-mentioned wind direction portion comprises top wind direction board, and this top wind direction board, to configure close to the mode of above-mentioned 1st installation base plate side, the length direction of this top wind direction board is formed with multiple exhaust outlet.
According to the power inverter involved by the technical scheme of these inventions, because the air that increases the free convection of flow is to the long side flowing of semiconductor power component and multiple installation base plate, therefore, it is possible to improve cooling effectiveness.
In addition, in the power inverter involved by technical scheme of the present invention, above-mentioned long side wind direction board is provided with horizontal wind direction board, and this horizontal wind direction board is configured to the midway extending to the short brink of this pair installation base plate between a pair neighbouring installation base plate.
According to the power inverter involved by the technical scheme of this invention, due to cooling-air can be made directly to contact with the circuit block of the heating of the installation base plate of regulation, thus cooling effectiveness can be improved further.
In addition, in the power inverter involved by technical scheme of the present invention, above-mentioned wind direction portion comprises fixed part, and this fixed part is fixed on above-mentioned semiconductor power component integratedly.
According to the power inverter involved by the technical scheme of this invention, by making wind direction portion integrated with semiconductor power component by fixed part, the assembling man-hour of power inverter can be reduced.
In addition, in the power inverter involved by technical scheme of the present invention, above-mentioned a pair long side wind direction board is heat transfer supporting member, and this heat transfer supporting member is used for above-mentioned multiple installation base plate to keep the mode at interval to support between above-mentioned multiple installation base plate and above-mentioned semiconductor power component and to be used for the heat of above-mentioned multiple installation base plate to cooling body transmission.
According to the power inverter of the technical scheme of this invention, possesses the function of the free convection of function and the generation air transmitted to cooling body by the heat of installation base plate due to heat transfer supporting member, therefore, it is possible to improve cooling effectiveness further.
the effect of invention
Adopt power inverter involved in the present invention, cool owing to utilizing the circuit block of free convection to the heating being equipped on multiple installation base plate of the air produced in the inside in wind direction portion, therefore, compared to the device in the past using the device of cooling fan etc. forcibly to produce cooling-air, do not need to be serviced detection, and maintenance cost can be reduced significantly, and due to the inner loop of air in wind direction portion of the framework as confined space, therefore, it is possible to prevent dust, moistures etc. are to the harmful effect of semiconductor power component and multiple installation base plate.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the power inverter representing the 1st execution mode involved in the present invention seen from short side direction.
Fig. 2 is the cutaway view of the power inverter representing the 1st execution mode involved in the present invention seen from long side direction.
Fig. 3 is the figure of the free convection representing the air produced in the inside of the power inverter of the 1st execution mode involved in the present invention.
Fig. 4 is the cutaway view of the power inverter representing the 2nd execution mode involved in the present invention seen from short side direction.
Fig. 5 is the cutaway view of the power inverter representing the 3rd execution mode involved in the present invention seen from short side direction.
Fig. 6 is the figure of the free convection representing the air produced in the inside of the power inverter of the 3rd execution mode involved in the present invention.
Fig. 7 is the cutaway view of the power inverter representing the 4th execution mode involved in the present invention seen from short side direction.
Fig. 8 is the end view of the heat transfer supporting member representing the 4th execution mode involved in the present invention.
Embodiment
Below, explain for implementing mode of the present invention (hereinafter referred to as execution mode with reference to accompanying drawing.)。
1st execution mode
Below, the application that sees figures.1.and.2 is in the 1st execution mode of the power inverter involved in the present invention of the motor drive circuit of vehicle, and this motor drive circuit is for driving traveling motor.
The cutaway view of Fig. 1 to be the outward appearance seen from short side direction be power inverter of rectangular shape, Fig. 2 is the cutaway view of the power inverter 1 seen from long side direction.
The power inverter 1 of present embodiment comprises the framework 2 be made up of the metal of aluminium alloy etc., and framework 2 comprises bottom framework 2A and top framework 2B, bottom framework 2A and top framework 2B across have water collar structure cooling body 3 and separated up and down.
Aluminium higher for thermal conductivity, aluminium alloy are such as formed with rectangular shape injection moulding by cooling body 3.End side on the long side direction of this cooling body 3 is formed with through hole 3e, and this through hole 3e runs through along the vertical direction for the positive and negative electrode 4a covered that insulated of the film capacitor 4 being held in bottom framework 2A.
And be formed with cooling water path 3a on this cooling body 3, the one end being configured to cooling water path 3a is connected to not shown cooling water supply source, and is externally discharged by cooling water from the other end of cooling water path 3a.
Bottom framework 2A is formed by there being end square tube body, and its open upper part cooled body 3 covers, and is accommodated with level and smooth film capacitor 4 in the inside of this bottom framework 2A.On the other hand, top framework 2B comprises the lid 2b making the square tube body 2a of top and bottom opening and the upper end for closed the party's cylindrical shell 2a.The lower end cooled body 3 of square tube body 2a is closed.Although not shown, but be folded with by being coated with aqueous sealant between the lower end and cooling body 3 of the party's cylindrical shell 2a, sandwich the encapsulant that rubber seal etc. realizes.
As shown in Figure 1, power inverter 1 possesses semiconductor power component 11, and this semiconductor power component 11 is built-in with the such as insulated gate bipolar transistor (IGBT) such as forming the thyristor of inverter circuit as electric power conversion.
Semiconductor power component 11 is built-in with IGBT in the housing 12 of flat rectangular-shaped insulating properties, is formed with metal radiating component 13 at the lower surface of housing 12.Corner place when the top view of housing 12 and radiating component 13 is formed with the through hole 15 as fixed component, by the screwed hole of the hold-down screw be applied in through hole 15 14 with the upper surface being formed at cooling body 3 is screwed, thus semiconductor power component 11 is fixed on the upper surface of cooling body 3.
The substrate securing part 16 of specified altitude is formed highlightedly at four positions of the upper surface of housing 12.
Be fixed with drive circuit substrate 21 in the upper end of substrate securing part 16, this drive circuit substrate 21 is provided with the drive circuit etc. for driving the IGBT being built in semiconductor power component 11.
Above drive circuit substrate 21, be fixed with power circuit substrate 22 while the direction relative with drive circuit substrate 21 keeps predetermined distance.Power circuit substrate 22 is provided with power circuit etc., and this power circuit comprises for the heating circuit parts of IGBT supply power being built in semiconductor power component 11.
Further, above power circuit substrate 22, the direction relative with power circuit substrate 22 keeps predetermined distance control circuit substrate 23 is fixed with.Control circuit substrate 23 is provided with control circuit etc., and this control circuit, for controlling the IGBT being built in semiconductor power component 11, comprises the heating circuit parts that caloric value is relatively large or heat generation density is relatively large.
And, drive circuit substrate 21 is fixed in the following way: the external thread part of through attachment screw 24 in the through hole being formed at the position relative with substrate securing part 16 of drive circuit substrate 21, and is screwed by the internal thread part of this external thread part with the upper surface being formed at substrate securing part 16.
In addition, power circuit substrate 22 is by fixing as follows: the external thread part of through attachment screw 25 in the through hole being formed at the position relative with internal thread part of power circuit substrate 22, and the internal thread part of this external thread part and attachment screw 24 is screwed, wherein, this internal thread part is formed at the upper end of attachment screw 24.
And, control circuit substrate 23 is fixed in the following way: through hold-down screw 26 in the through hole being formed at the position relative with internal thread part of control circuit substrate 23, and this hold-down screw 26 is screwed with the internal thread part of attachment screw 25, wherein, this internal thread part is formed at the upper end of attachment screw 25.
Like this, each substrate 21,22,23 is laminated in the top of semiconductor power component 11 with opening predetermined distance with the state making long side consistent with short brink sky by substrate securing part 16, attachment screw 24,25.
The surrounding of semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 is covered by wind direction portion 30.
Wind direction portion 30 is the component having top box shape of lower surface opening, comprising: long side wind direction board 30a, 30b, and its long limit along semiconductor power component 11 and each substrate 21,22,23 erects; Short brink wind direction board 30c, 30d, its minor face along semiconductor power component 11 and each substrate 21,22,23 erects; Top wind direction board 30e, it is formed in the mode of the closed upper part by long side wind direction board 30a, 30b and short brink wind direction board 30c, 30d; And flange 30f, it is four frame shapes, gives prominence to laterally from the bottom of long side wind direction board 30a, 30b and short brink wind direction board 30c, 30d.
And, by making flange 30f be fixed on the upper surface of cooling body 3 by hold-down screw 31, thus the surrounding of semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 is surrounded by long side wind direction board 30a, the 30b in wind direction portion 30, short brink wind direction board 30c, 30d and top wind direction board 30e.
At this, the top wind direction board 30e in wind direction portion 30 is to configure close to the mode of control circuit substrate 23.
In addition, as shown in Figure 2, the position close to flange 30f (position near cooling body 3) of the long side wind direction board 30b in this wind direction portion 30 is formed with the air inlet 32 of multiple toroidal with opening predetermined distance along long side direction sky.In addition, although not shown, but be also formed with multiple air inlet 32 with opening predetermined distance along long side direction sky in the position close to flange 30f of long side wind direction board 30a.
In addition, short brink wind direction board 30c, the 30db in this wind direction portion 30 are also formed with the air inlet 32 of multiple toroidal in the position of close cooling body 3 along short side direction sky with opening predetermined distance.
Further, the central portion on the short side direction of top wind direction board 30e is also formed with multiple exhaust outlets 33 of toroidal with opening predetermined distance along long side direction sky.
In addition, as shown in Figure 2, the positive and negative DC input terminal 11a being located at the end side on long side direction of semiconductor power component 11 is connected with one end of aerial lug 50, utilizes hold-down screw 51 to be linked with the positive and negative electrode 4a running through cooling body 3 of film capacitor 4 at the other end of this aerial lug 50.In addition, DC input terminal 11a is fixed with crimp type terminal 53, this crimp type terminal 53 is fixed on the front end of the connecting line 52 be connected with the rectifier of outside (not shown).
Further, the three-phase alternating current lead-out terminal 11b being located at the other end on long side direction of semiconductor power component 11 utilizes hold-down screw 56 to be connected to bus 55, is configured with current sensor 57 in the midway of this bus 55.And utilize hold-down screw 60 to be connected with crimp type terminal 59 at the other end of bus 55, this crimp type terminal 59 is fixed on the front end of the motor connection cable 58 be connected with the three-phase electric motor of outside (not shown).
In this condition, from rectifier (not shown) the supply direct current power of outside, and the power circuit making to be installed on power circuit substrate 22, the control circuit being installed on control circuit substrate 23 are in running order, such as will be supplied to semiconductor power component 11 as the signal of pulse width modulating signal from control circuit via the drive circuit being installed on drive circuit substrate 21.Thus, control the IGBT being built in semiconductor power component 11, thus direct current power is converted to alternating electromotive force.The alternating electromotive force be converted to can be supplied to motor connection cable 58 from three-phase alternating current lead-out terminal 11b via bus 55, thus can control above-mentioned three-phase electric motor and make it drive.
Now, semiconductor power component 11 generates heat because of built-in IGBT, but directly contacts with cooling body 3 due to the radiating component 13 being formed at semiconductor power component 11, and therefore this heating can utilize the cooling water of the cooling water path 3a being supplied to cooling body 3 to cool.
In addition, framework involved in the present invention corresponds to top framework 2B, and the 1st installation base plate farthest away from semiconductor power component involved in the present invention corresponds to control circuit substrate.
Then, the action effect of present embodiment is described.
The power circuit being installed on power circuit substrate 22 and the control circuit being installed on control circuit substrate 23 comprise heating circuit parts, when supplying direct current power from the rectifier of outside, the heating circuit parts of power circuit substrate 22 and the heating circuit parts heating of control circuit substrate 23.
The inside in wind direction portion 30 becomes: the air being fixed on the lower space of the surrounding of the semiconductor power component 11 of the upper surface of cooling body 3 is colder, and the air being configured with the upper space of power circuit substrate 22 and control circuit substrate 23 is warmer.Like this, because of along with the temperature difference between the lower space of inside, wind direction portion 30 and the air of upper space and the density contrast produced cause producing buoyancy to air, with reference to shown in Fig. 3, produce the free convection of air upward along long side wind direction board 30a, the 30b erected in the vertical direction and short brink wind direction board 30c, 30d in the inside in wind direction portion 30.
The air of free convection is created while power circuit substrate 22 and control circuit substrate 23 are cooled while flow towards top wind direction board 30e in the inside in wind direction portion 30, because making flow velocity accelerate by the narrow stream between top wind direction board 30e and control circuit substrate 23, and flow out from the multiple exhaust outlets 33 being located at top wind direction board 30e to the outside (top framework 2B) in wind direction portion 30.And cold air flows into from the multiple air inlets 32 near the position of cooling body 3 of being located at of long side wind direction board 30a, 30b and short brink wind direction board 30c, 30d to the inside in wind direction portion 30.Like this, when the heating circuit parts of power circuit substrate 22 and the heating circuit parts adstante febre of control circuit substrate 23, produce the free convection of air by the inside in wind direction portion 30 thus heat generating components is cooled.
Thus, present embodiment utilizes the free convection of the air produced in the inside in wind direction portion 30 to cool heating part (the heating circuit parts of power circuit substrate 22 and the heating circuit parts of control circuit substrate 23), therefore, compared to the device in the past using the device of cooling fan etc. forcibly to produce cooling-air, do not need to be serviced detection, and maintenance cost can be reduced significantly.
In addition, due to the inner loop of air in wind direction portion 30 of the top framework 2B as confined space, therefore, it is possible to prevent semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 to be subject to the harmful effect of dust, moisture etc.
In addition, multiple air inlet 32 is formed along its length in the bottom (cooling body 3 side) of long side wind direction board 30a, 30b, multiple exhaust outlet 33 is formed along its length in the Width central authorities of top wind direction board 30e, owing to increasing the long side flowing of the long side of air to semiconductor power component 11, drive circuit substrate 21 of the free convection of flow, power circuit substrate 22 and control circuit substrate 23, therefore, it is possible to improve cooling effectiveness.
And, carry out the temperature of heat exchange higher air in the inside in wind direction portion 30 by the narrow stream between top wind direction board 30e and control circuit substrate 23 and improved flow velocity and discharge from the exhaust outlet 33 of top wind direction board 30e to top framework 2B, and the air making temperature lower easily enters from the air inlet 32 being located at long side wind direction board 30a, 30b and short brink wind direction board 30c, 30d, the cooling effectiveness of the inside in wind direction portion 30 thus can be improved further.
2nd execution mode
Then, Fig. 4 represents the 2nd execution mode involved in the present invention, is the cutaway view of the power inverter 1 seen from short side direction.In addition, identical Reference numeral marked to the structure division identical with the structure shown in Fig. 1 to Fig. 3 and omit the description.
Identical with the 1st execution mode, the wind direction portion 34 of present embodiment is also the parts having top box shape of lower surface opening.
The wind direction portion 34 of present embodiment comprises: top wind direction board 34a, and it is rectangle shape; A pair long side wind direction board 34b, 34c, the long side edge of itself and this top wind direction board 34a is integrally formed, and erects parallel to each other; Fixed head 34d, 34e, it is given prominence to the inside from the open edge of long side wind direction board 34b, 34b; And pair of short edges side wind direction board 34f (illustrate only a short brink wind direction board 34f in the diagram), it closes two peristomes in handling mode freely, and two peristomes utilize a pair long side wind direction board 34b, 34c and top wind direction board 34a and from length direction opening.
In the side close to fixed head 34d, 34e of a pair long side wind direction board 34b, 34c, be formed with the air inlet 35 of multiple toroidal with opening predetermined distance in long side direction overhead.In addition, in the side close to cooling body 3 of pair of short edges side wind direction board 34f, open the air inlet 35 that predetermined distance ground is also formed with multiple toroidal in short side direction overhead.
Further, the central portion on the short side direction of top wind direction board 34a, is also formed with the exhaust outlet 36 of multiple circle with opening predetermined distance in long side direction overhead.
In the present embodiment, making after semiconductor power component 11, power circuit substrate 22 and control circuit substrate 23 configure integratedly by substrate securing part 16, attachment screw 24,25, the bottom of a pair long side wind direction board 34b, the 34c in wind direction portion 34 is utilized to be surrounded by the sidepiece of the housing 12 of semiconductor power component 11, and by fixing fixed head 34d, 34e in the bottom of housing 12, thus make a pair long side wind direction board 34b, 34c and top wind direction board 34a integrated with semiconductor power component 11.
And, after the hold-down screw 14 running through through hole 15 being screwed with the screwed hole of the upper surface being formed at cooling body 3 thus semiconductor power component 11 has been fixed on the upper surface of cooling body 3, by pair of short edges side wind direction board 34f is fixed on a pair long side wind direction board 34b, 34c and top wind direction board 34a, thus form the wind direction portion 34 the having top box shape surrounding of semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 be surrounded.
In addition, fixed part involved in the present invention corresponds to fixed head 34d, 34e of a pair long side wind direction board 34b, 34c.
According to the present embodiment, the air of free convection is created while the power circuit substrate 22 of heating and control circuit substrate 23 are cooled while flow towards top wind direction board 34a in the inside in wind direction portion 34, because making flow velocity accelerate by the narrow stream between top wind direction board 34a and control circuit substrate 23, and flow out from the multiple exhaust outlets 36 being located at top wind direction board 34a to the outside (top framework 2B) in wind direction portion 34.And cold air flows into from the multiple air inlets 35 be located near the position of cooling body 3 of long side wind direction board 34b, 34c and pair of short edges side wind direction board 34f to the inside in wind direction portion 34.
Thus, present embodiment is identical with the 1st execution mode, do not need to be serviced detection, and maintenance cost can be reduced significantly, and semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 can be prevented to be subject to the harmful effect of dust, moisture.
In addition, present embodiment is alongst formed with multiple air inlet 35 in the bottom (cooling body 3 side) of long side wind direction board 34b, 34c, multiple exhaust outlet 36 is alongst formed in the Width central authorities of top wind direction board 34a, because the air that increases the free convection of the flow long side to semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 flows, thus cooling effectiveness can be improved.
In addition, carry out the temperature of heat exchange higher air in the inside in wind direction portion 34 by the narrow stream between top wind direction board 34a and control circuit substrate 23 and improved flow velocity and discharge from the exhaust outlet 36 of top wind direction board 34a to top framework 2B, and the air making temperature lower easily enters from air inlet 35, the cooling effectiveness of the inside in wind direction portion 34 thus can be improved further.
And a pair long side wind direction board 34b, 34c and the top wind direction board 34a in the formation wind direction portion 34 of present embodiment are integrated with semiconductor power component 11, therefore, it is possible to reduce the assembling man-hour of power inverter 1.
3rd execution mode
Then, Fig. 5 and Fig. 6 represents the 3rd execution mode involved in the present invention, is the cutaway view of the power inverter 1 seen from short side direction.Present embodiment too, marks identical Reference numeral to the structure division identical with the structure shown in Fig. 1 to Fig. 3 and omits the description.
The wind direction portion 37 of present embodiment comprises: the 1st wind direction board 38, and it is fixed on the long side portion of the side of semiconductor power component 11; With the 2nd wind direction board 39, it is fixed on the long side portion of the opposite side of semiconductor power component 11.
1st wind direction board 38 comprises: standing board 38a, and its long limit along the side of semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 erects; Fixed head 38b, it is given prominence to the inside from the lower end of standing board 38a; 1st level board 38c, it extends in the mode of the upper surface close to control circuit substrate 23 abreast from the upper end of standing board 38a; And the 2nd level board 38d, it is extending in the space between drive circuit substrate 21 and power circuit substrate 22 from standing board 38a than the 1st level board 38c position on the lower.
And, be formed with the air inlet 40 of multiple toroidal in the lower side close to fixed head 38b of standing board 38a with opening predetermined distance along long side direction sky.
2nd wind direction board 39 comprises: standing board 39a, and its long limit along the opposite side of semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 erects; Fixed head 39b, it is given prominence to the inside from the lower end of standing board 39a; And the 3rd level board 39c, it extends in the space between power circuit substrate 22 and control circuit substrate 23 from the upper end of standing board 39a.
And, be formed with the air inlet 40 of multiple toroidal in the lower side close to fixed head 38b of standing board 38a with opening predetermined distance along long side direction sky.
In the present embodiment, making after semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 configure integratedly by substrate securing part 16, attachment screw 24,25, by the fixed head 39b of the fixed head 38b and the 2nd wind direction board 39 that fix the 1st wind direction board 38 in the bottom of housing 12, thus make the 1st wind direction board 38 and the 2nd wind direction board 39 integrated with semiconductor power component 11.
In addition, the peristome of the end on the length direction divided by the 1st wind direction board 38 and the 2nd wind direction board 39 peristome of direction (in the table in Fig. 5) utilizes not shown closure member to close.
In addition, fixed part involved in the present invention corresponds to the fixed head 38b of the 1st wind direction board 38, the fixed head 39b of the 2nd wind direction board 39, and horizontal wind direction board involved in the present invention corresponds to the 2nd level board 38d, the 3rd level board 39c.
Then, the action effect of present embodiment is described.
When supplying direct current power from the rectifier of outside, the heating circuit parts of power circuit substrate 22 and the heating circuit parts heating of control circuit substrate 23.The inside in wind direction portion 37 becomes: the air being fixed on the lower space of the surrounding of the semiconductor power component 11 of the upper surface of cooling body 3 is colder, and the air being configured with the upper space of power circuit substrate 22 and control circuit substrate 23 is warmer, thus, the free convection of air is upward produced in the inside in wind direction portion 37.
As shown in Figure 6,2nd level board 38d of the 1st wind direction board 38 extends in the space between drive circuit substrate 21 and power circuit substrate 22, therefore, the air of the 1st wind direction board 38 side of rising because of free convection along drive circuit substrate 21 upper surface flowing and the upper surface of drive circuit substrate 21 is cooled, then the lower surface along power circuit substrate 22 flows and continues to cool the lower surface of power circuit substrate 22, and rises along standing board 38a.
In addition, because the 3rd level board 39c of the 2nd wind direction board 39 extends in the space between power circuit substrate 22 and control circuit substrate 23, therefore, the air of the 2nd wind direction board 39 side of rising because of free convection along power circuit substrate 22 upper surface flowing and the upper surface of power circuit substrate 22 is cooled.
Then, the air after rising is by the narrow stream between the 1st level board 38c and control circuit substrate 23 thus flow velocity is accelerated, and flows out from the exhaust outlet 41 of the end of the 1st level board 38c to the outside in wind direction portion 37.Then, cold air flows into from the multiple air inlets 40 near the position of cooling body 3 of being located at of the 1st wind direction board 38 and the 2nd wind direction board 39 to the inside in wind direction portion 37.Like this, at the heating circuit parts of power circuit substrate 22 and the heating circuit parts adstante febre of control circuit substrate 23, produce the free convection of air in the inside in wind direction portion 37, cooling-air is to the upper surface of drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 and lower surface inflow while cooled by heat generating components.
Thus, because present embodiment utilizes the free convection of the air produced in wind direction portion 37 to cool heating part (the heating circuit parts of power circuit substrate 22 and the heating circuit parts of control circuit substrate 23), therefore, compared to the device in the past using the device of cooling fan etc. to produce cooling-air forcibly, do not need to be serviced detection, and maintenance cost can be reduced significantly.
In addition, due to the inner loop of air in wind direction portion 37 of the top framework 2B as confined space, therefore, it is possible to prevent semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 to be subject to the harmful effect of dust, moisture etc.
In addition, length direction along the 1st wind direction board 38 and the 2nd wind direction board 39 is formed with multiple air inlet 40, and the air increasing the free convection of flow flows to the long side of semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23, thus can improve cooling effectiveness.
And, having carried out the temperature of heat exchange higher air in the inside in wind direction portion 37 by the narrow stream between the 1st level board 38c and control circuit substrate 23 improves flow velocity and discharges from exhaust outlet 41 to top framework 2B, and the air making temperature lower easily enters from air inlet 40, the cooling effectiveness of the inside in wind direction portion 37 thus can be improved further.
4th execution mode
Then, Fig. 7 and Fig. 8 represents the 4th execution mode involved in the present invention, and Fig. 7 is the cutaway view of the power inverter 1 seen from short side direction, and Fig. 8 is the end view of the heat transfer supporting member representing the power inverter 1 forming present embodiment.
As shown in Figure 7, the power inverter 1 of present embodiment is connected with one end of aerial lug 50 on the positive and negative DC input terminal 11a being located at the end side on short side direction of semiconductor power component 11, utilizes hold-down screw 51 to be linked with the positive and negative electrode 4a running through cooling body 3 of film capacitor 4 at the other end of this aerial lug 50.In addition, DC input terminal 11a is fixed with crimp type terminal 53, this crimp type terminal 53 is fixed on the front end of the connecting line 52 be connected with the rectifier of outside (not shown).
In addition, the three-phase alternating current lead-out terminal 11b being located at the other end on short side direction of semiconductor power component 11 utilizes hold-down screw 56 to be connected to bus 55, is configured with current sensor 57 in the midway of this bus 55.And be connected with crimp type terminal 59 at the other end of bus 55 by hold-down screw 60, this crimp type terminal 59 is fixed on the front end of the motor connection cable 58 be connected with the three-phase electric motor of outside (not shown).
The power circuit substrate 22 of present embodiment and control circuit substrate 23 are not supported by heat transfer supporting member 42,43 by framework 2 with forming the heat dissipation path of leading to cooling body 3 by oneself.The metal that this heat transfer supporting member 42,43 utilizes thermal conductivity higher such as aluminum or aluminum alloy is formed.
Heat transfer supporting member 42 comprises flat heat transfer supporting board 42a and has the heat transfer supporting side plate portion 42c of kink in the vertical direction.Heat transfer supporting board 42a utilizes hold-down screw to be fixed with power circuit substrate 22 across heat transfer member 45, and is formed with multiple air vent hole 42a1 at the position not being fixed with power circuit substrate 22 throughly.Heat transfer member 45 is for having the elastomer of retractility and being configured to the overall dimension identical with power circuit substrate 22.As this heat transfer member 45, the inside applied by making metallic stuffing get involved silicon rubber plays insulation property and improves the component of conductivity of heat.
Heat transfer supporting side plate portion 42c comprises: base plate 44, and it is fixed on the upper surface of cooling body 3; Web portion 42d, the outer peripheral edges of the long side of itself and this base plate 44 link integratedly and extend upward, and extend along the long side of semiconductor power component 11; And upper plate portion 42e, it is formed as extending to the right in same figure from the upper end of this web portion 42d.
And heat transfer supporting board 42a utilizes hold-down screw 42b to fix together with wind direction board 46 described later with the upper plate portion 42e of heat transfer supporting side plate portion 42c.
In addition, the supporting member 43 that conducts heat comprises flat heat transfer supporting board 43a and has the heat transfer supporting side plate portion 43c of kink in the vertical direction.Heat transfer supporting board 43a utilizes hold-down screw to be fixed with control circuit substrate 23 across heat transfer member 47, and is formed through multiple air vent hole 43a1 not being fixed with control circuit substrate 23 position.Heat transfer member 47 is for having the elastomer of retractility and being configured to the overall dimension identical with control circuit substrate 23.As this heat transfer member 47, the inside applied by making metallic stuffing get involved silicon rubber plays the component that improve conductivity of heat of insulation property.
Heat transfer supporting side plate portion 43c comprises: base plate 44, and it is fixed on the upper surface of cooling body 3; Web portion 43d, the outer peripheral edges of the long side of itself and this base plate 44 link integratedly and extend upward, and extend along the long side of semiconductor power component 11; And upper plate portion 43e, it is formed as extending to the left in same figure from the upper end of this web portion 43d.
And heat transfer supporting board 43a utilizes hold-down screw 43b to fix together with wind direction board 46 with the upper plate portion 43e of heat transfer supporting side plate portion 43c.
Wind direction board 46 comprises: top 46a, and it is to configure close to the mode of control circuit substrate 23; 1st flange 46b, it is connected to the heat transfer supporting board 42a of heat transfer supporting member 42 and utilizes hold-down screw 42b to be fixed on heat transfer supporting board 42a; And the 2nd flange 46c, it is connected to the heat transfer supporting board 43a of heat transfer supporting member 43 and utilizes hold-down screw 43b to be fixed on heat transfer supporting board 43a.And the central portion on the short side direction of top 46a is formed with the exhaust outlet 46d of multiple toroidal with opening predetermined distance in long side direction overhead.
In addition, as shown in Figure 8, on web portion 43d in the heat transfer supporting side plate portion 43c of heat transfer supporting member 43, three such as circular through hole 43i of through bus 55 are formed in the position that the three-phase alternating current lead-out terminal 11b with semiconductor power component 11 is corresponding, further, between adjacent through hole 43i, be formed with the heat transfer path Lh of relative wide cut.
In addition, similarly, on the web portion 42d in the heat transfer supporting side plate portion 42c of heat transfer supporting member 42, be respectively equipped with at positive pole and negative terminal 11a relative position with semiconductor power component 11 the through hole 42i formed in the same way.
In addition, not shown closure member is utilized to close by the peristome peristome of direction (in the table of Fig. 7) of the end on heat transfer supporting member 42,43 and the length direction that marks off of wind direction board 46.
And, the power inverter 1 of present embodiment supplies direct current power from the rectifier (not shown) of outside, and the power circuit making to be installed on power circuit substrate 22, the control circuit being installed on control circuit substrate 23 are in running order, such as will be supplied to semiconductor power component 11 as the signal of pulse width modulating signal from control circuit via the drive circuit being installed on drive circuit substrate 21.Thus, control the IGBT being built in semiconductor power component 11, thus direct current power is converted to alternating electromotive force.The alternating electromotive force be converted to is supplied to motor connection cable 58 from three-phase alternating current lead-out terminal 11b via bus 55, thus above-mentioned three-phase electric motor can be controlled makes it drive.
Now, semiconductor power component 11 generates heat because of built-in IGBT, but directly contacts with cooling body 3 due to the radiating component 13 being formed at semiconductor power component 11, and therefore this heating can utilize the cooling water of the cooling water path 3a being supplied to cooling body 3 to cool.
In addition, heat transfer supporting member involved in the present invention corresponds to heat transfer supporting member 42,43.
Then, the action effect of present embodiment is described.
Power inverter 1 according to the present embodiment, when being built in the IGBT adstante febre of (PCC) power 11, liquid contacting part 17 due to the lower surface central portion being located at the radiating component 13 of (PCC) power 11 enters in the dipping portion 5 being located at cooling body 3 and is immersed in cooling fluid thus is directly cooled, therefore, it is possible to (PCC) power 11 is cooled efficiently.
In addition, because the heat transfer direct face of supporting metallic plate 42,43 is engaged in the upper surface of cooling body 3, therefore, the heat being delivered to heat transfer supporting metallic plate 32,33 from control circuit substrate 22 and power circuit substrate 23 can diffuse to cooling body 3, and can dispel the heat efficiently.
In addition, in the present embodiment, the heat transfer supporting metallic plate 42,43 being fixed on wind direction board 46 forms wind direction portion 47, produces free convection thus is cooled by heating part.
Namely, when the heating circuit parts of power circuit substrate 22 and the heating circuit parts adstante febre of control circuit substrate 23, the inside (wind direction portion 47) be surrounded by wind direction board 46 and heat transfer supporting metallic plate 42,43 becomes: the air being fixed on the lower space of the surrounding of the semiconductor power component 11 of the upper surface of cooling body 3 is colder, and the air being configured with the upper space of power circuit substrate 22 and control circuit substrate 23 is warmer.Like this, because of the temperature difference between the lower space of the inside along with wind direction portion 47 and the air of upper space and the density contrast produced cause producing buoyancy to air, with reference to shown in Fig. 7, produce the free convection of the air upward by the air vent hole 42a1 of heat transfer supporting board 42a, the air vent hole 43a1 of heat transfer supporting board 43a along heat transfer supporting side plate portion 42c, 43c of erecting in the vertical direction.
The air of free convection is created while power circuit substrate 22 and control circuit substrate 23 are cooled while flow towards top 46a in the inside in wind direction portion 47, because making flow velocity accelerate by the narrow stream between top 46a and control circuit substrate 23, and flow out from the multiple exhaust outlet 46d being located at top 46a to the outside (top framework 2B) in wind direction portion 47.And cold air flows into from multiple through hole 42i, 43i of being located at heat transfer supporting metallic plate 42,43 to the inside in wind direction portion 47.Like this, when the heating circuit parts of power circuit substrate 22 and the heating circuit parts adstante febre of control circuit substrate 23, produce the free convection of air by the inside in wind direction portion 47 thus heat generating components is cooled.
Like this, owing to utilizing the free convection of the air produced in the inside in the wind direction portion 47 be made up of wind direction board 46 and heat transfer supporting metallic plate 42,43, heating part (the heating circuit parts of power circuit substrate 22 and the heating circuit parts of control circuit substrate 23) is cooled, therefore, it is possible to improve cooling effect further.
In addition, due to the inner loop of air in wind direction portion 30 of the top framework 2B as confined space, therefore, it is possible to prevent semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 to be subject to the harmful effect of dust, moisture etc.
In addition, due to the inner loop of air in wind direction portion 47 of the top framework 2B as confined space, therefore, it is possible to prevent semiconductor power component 11, drive circuit substrate 21, power circuit substrate 22 and control circuit substrate 23 to be subject to the harmful effect of dust, moisture etc.
In addition, the air higher due to the temperature of having carried out heat exchange in the inside in wind direction portion 30 is improve flow velocity by the narrow stream between top 46a and control circuit substrate 23 and is discharged from the exhaust outlet 46d of top 46a to top framework 2B, and the air making temperature lower easily enters from through hole 42i, 43a, therefore, it is possible to improve the cooling effectiveness of the inside in wind direction portion 47 further.
And, because the through hole 43a being used for supplying bus 55 through of the web portion 43d of the through through hole 42i of aerial lug 50 and heat transfer supporting member 43 that is used for supplying of the web portion 42d by heat transfer supporting member 42 is used as the air inlet being used for sucking air in wind direction portion 47, therefore, it is possible to seek the reduction of manufacturing cost.
In addition, the air inlet 32,25,40 shown in each execution mode utilizes toroidal to represent, but the peristome of other shapes also can be utilized to be formed.
In addition, in above-mentioned power inverter 1, describe and apply the situation of film capacitor 4 as level and smooth capacitor, but be not limited thereto, also can apply columned electrolytic capacitor.
In addition, in the respective embodiments described above, describe situation power inverter of the present invention being applied to electric automobile, but be not limited thereto, also can apply the present invention to the rail truck travelled in orbit, arbitrary electro-motive vehicle can also be applied to.And power inverter is not limited to electro-motive vehicle, in other industrial equipment, also can apply power inverter of the present invention for driving when the driver of electro-motor etc.
utilizability in industry
As mentioned above, power inverter involved in the present invention can prevent the impact of dust, moisture etc., does not need to be serviced and detects thus contribute to reducing maintenance cost.
description of reference numerals
1, power inverter; 2, framework; 2A, bottom framework; 2B, top framework; 2a, square tube body; 2b, lid; 3, cooling body; 3a, cooling water path; 3e, through hole; 4, film capacitor; 4a, electrode; 11, semiconductor power component; 11a, DC input terminal; 11b, cross streams lead-out terminal; 12, housing; 13, radiating component; 14, hold-down screw; 15, through hole; 16, substrate securing part; 21, drive circuit substrate; 22, power circuit substrate; 23, control circuit substrate; 30, wind direction portion; 30a, 30b, long side wind direction board; 30c, 30d, short brink wind direction board; 30e, top wind direction board; 30f, flange; 32, air inlet; 33, exhaust outlet; 34, wind direction portion; 34a, top wind direction board; 34b, 34c, long side wind direction board; 34d, 34e, fixed head; 34f, short brink wind direction board; 35, air inlet, 36, exhaust outlet; 37, wind direction portion; 38, the 1st wind direction board; 38a, standing board; 38b, fixed head; 38c, the 1st level board; 38d, the 2nd level board; 39, the 2nd wind direction board; 39a, standing board; 39b, fixed head; 39c, the 3rd level board; 40, air inlet; 41, exhaust outlet; 42,43, conduct heat supporting member; 42a, heat transfer supporting board; 42b, hold-down screw; 42c, heat transfer supporting side plate portion; 42a1, base plate; 42d, web portion; 42e, upper plate portion; 42i, through hole; 43a, heat transfer support plate; 43b, hold-down screw; 43c, heat transfer supporting side plate portion; 43d, web portion; 43e, upper plate portion; 43i, through hole; 44, base plate; 45, heat transfer member; 46, wind direction board; 46a, top; 46b, the 1st flange; 46c, the 2nd flange; 47, wind direction portion; 50, aerial lug; 52, connecting line; 53, crimp type terminal; 55, bus; 57, current sensor; 58, motor connection cable; 59, crimp type terminal.
Claims (8)
1. a power inverter, is characterized in that,
This power inverter comprises:
Semiconductor power component;
Cooling body, its face is engaged in this semiconductor power component;
Multiple installation base plate, it is provided with the circuit block for driving above-mentioned semiconductor power component, stacked in upper direction relative to above-mentioned semiconductor power component;
Framework, it receives above-mentioned semiconductor power component and above-mentioned multiple installation base plate hermetically; And
Wind direction portion, it configures in the mode of the periphery surrounding above-mentioned semiconductor power component and above-mentioned multiple installation base plate in the inside of this framework,
This wind direction portion arranges the air inlet be communicated with the inner space of above-mentioned framework in above-mentioned semiconductor power component side, in the 1st installation base plate side farthest away from above-mentioned semiconductor power component, the exhaust outlet be communicated with the inner space of above-mentioned framework is set, to suck the air of above-mentioned framework inside from above-mentioned air inlet, and from above-mentioned exhaust outlet, the air of the inside in above-mentioned wind direction portion is produced free convection from above-mentioned semiconductor power component side towards the air of above-mentioned 1st installation base plate side to the mode that above-mentioned framework is discharged.
2. power inverter according to claim 1, is characterized in that,
Above-mentioned wind direction portion comprises wind direction board, and this wind direction board along the long limit of above-mentioned semiconductor power component and above-mentioned multiple installation base plate or minor face configuration, and erects and supremely states the 1st installation base plate side, and this wind direction board is formed multiple above-mentioned air inlet.
3. power inverter according to claim 2, is characterized in that,
Above-mentioned wind direction portion comprises a pair long side wind direction board, this a pair long side wind direction board configures along the long limit of above-mentioned semiconductor power component and above-mentioned multiple installation base plate, and erect and supremely state the 1st installation base plate side, on the direction on above-mentioned long limit, be formed with multiple above-mentioned air inlet at this pair long side wind direction board.
4. power inverter according to claim 3, is characterized in that,
Above-mentioned wind direction portion comprises pair of short edges side wind direction board, this pair of short edges side wind direction board configures along the minor face of above-mentioned semiconductor power component and above-mentioned multiple installation base plate, and erect and supremely state the 1st installation base plate, on the direction of above-mentioned minor face, be formed with multiple above-mentioned air inlet at this pair of short edges side wind direction board.
5. power inverter according to claim 1, is characterized in that,
Above-mentioned wind direction portion comprises top wind direction board, and this top wind direction board, to configure close to the mode of above-mentioned 1st installation base plate side, the length direction of this top wind direction board is formed with multiple exhaust outlet.
6. power inverter according to claim 3, is characterized in that,
Above-mentioned long side wind direction board is provided with horizontal wind direction board, and this horizontal wind direction board is configured to the midway extending to the short brink of this pair installation base plate between a pair neighbouring installation base plate.
7., according to the power inverter in claim 1 ~ 6 described in any one, it is characterized in that,
Above-mentioned wind direction portion comprises fixed part, and this fixed part is fixed on above-mentioned semiconductor power component integratedly.
8., according to the power inverter in claim 3,4,6 described in any one, it is characterized in that,
Above-mentioned a pair long side wind direction board is heat transfer supporting member, and this heat transfer supporting member is used for above-mentioned multiple installation base plate to keep the mode at interval to support between above-mentioned multiple installation base plate and above-mentioned semiconductor power component and to be used for the heat of above-mentioned multiple installation base plate to cooling body transmission.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013076313 | 2013-04-01 | ||
| JP2013-076313 | 2013-04-01 | ||
| PCT/JP2014/000917 WO2014162652A1 (en) | 2013-04-01 | 2014-02-21 | Power conversion apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105009439A true CN105009439A (en) | 2015-10-28 |
| CN105009439B CN105009439B (en) | 2017-08-08 |
Family
ID=51657968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480012241.6A Expired - Fee Related CN105009439B (en) | 2013-04-01 | 2014-02-21 | Power inverter |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6187582B2 (en) |
| CN (1) | CN105009439B (en) |
| WO (1) | WO2014162652A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106856375A (en) * | 2015-12-04 | 2017-06-16 | 富士电机株式会社 | DC-to-AC converter |
| US20220102288A1 (en) * | 2020-09-25 | 2022-03-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105009439B (en) * | 2013-04-01 | 2017-08-08 | 富士电机株式会社 | Power inverter |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005083633A (en) * | 2003-09-08 | 2005-03-31 | Fuji Electric Systems Co Ltd | Induction heating type pyrolysis furnace |
| CN101640495A (en) * | 2008-07-29 | 2010-02-03 | 株式会社日立制作所 | Power conversion apparatus and electric vehicle |
| JP4816036B2 (en) * | 2005-12-01 | 2011-11-16 | 株式会社Ｉｈｉ | Inverter device |
| CN102651354A (en) * | 2011-02-28 | 2012-08-29 | 株式会社丰田自动织机 | Semiconductor device |
| WO2013031147A1 (en) * | 2011-09-02 | 2013-03-07 | 富士電機株式会社 | Power conversion device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2961858B2 (en) * | 1990-10-01 | 1999-10-12 | 松下電器産業株式会社 | Radiator for electronic equipment |
| JPH07312491A (en) * | 1994-05-18 | 1995-11-28 | Mitsubishi Electric Corp | Naturally cooled housing and convection heat control mechanism |
| JP3750394B2 (en) * | 1999-02-09 | 2006-03-01 | 富士電機システムズ株式会社 | Uninterruptible power system |
| JP2004282804A (en) * | 2003-03-12 | 2004-10-07 | Toshiba Corp | Inverter device |
| JP5644434B2 (en) * | 2010-12-02 | 2014-12-24 | 富士電機株式会社 | Power converter and electric drive vehicle using the same |
| CN105009439B (en) * | 2013-04-01 | 2017-08-08 | 富士电机株式会社 | Power inverter |
-
2014
- 2014-02-21 CN CN201480012241.6A patent/CN105009439B/en not_active Expired - Fee Related
- 2014-02-21 WO PCT/JP2014/000917 patent/WO2014162652A1/en active Application Filing
- 2014-02-21 JP JP2015509876A patent/JP6187582B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005083633A (en) * | 2003-09-08 | 2005-03-31 | Fuji Electric Systems Co Ltd | Induction heating type pyrolysis furnace |
| JP4816036B2 (en) * | 2005-12-01 | 2011-11-16 | 株式会社Ｉｈｉ | Inverter device |
| CN101640495A (en) * | 2008-07-29 | 2010-02-03 | 株式会社日立制作所 | Power conversion apparatus and electric vehicle |
| CN102651354A (en) * | 2011-02-28 | 2012-08-29 | 株式会社丰田自动织机 | Semiconductor device |
| WO2013031147A1 (en) * | 2011-09-02 | 2013-03-07 | 富士電機株式会社 | Power conversion device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106856375A (en) * | 2015-12-04 | 2017-06-16 | 富士电机株式会社 | DC-to-AC converter |
| CN106856375B (en) * | 2015-12-04 | 2020-07-24 | 富士电机株式会社 | Inverter device |
| US20220102288A1 (en) * | 2020-09-25 | 2022-03-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and manufacturing method thereof |
| US12094836B2 (en) * | 2020-09-25 | 2024-09-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014162652A1 (en) | 2014-10-09 |
| JP6187582B2 (en) | 2017-08-30 |
| JPWO2014162652A1 (en) | 2017-02-16 |
| CN105009439B (en) | 2017-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9730311B2 (en) | Device having heat sink | |
| US10128770B2 (en) | Converter and electric power conversion apparatus | |
| US10122247B2 (en) | Inverter-integrated electric compressor | |
| US11509196B2 (en) | Motor vehicle and power converter device for a motor vehicle | |
| CN102868258B (en) | Electronic-controlled installation | |
| CN104704934B (en) | Cooling device and power converter provided with same | |
| US9526194B2 (en) | Power conversion device with flow conduits for coolant | |
| EP2879476B1 (en) | Electric apparatus | |
| US20180013355A1 (en) | Power Converter | |
| JP6312114B1 (en) | Rotating electric machine for vehicles | |
| US9788458B2 (en) | Motor controller and fan system comprising the same | |
| JP5634905B2 (en) | Inverter | |
| JP6433631B2 (en) | Power converter | |
| JP2007198684A (en) | Power source box for air conditioner, and air conditioner | |
| JPWO2014057622A1 (en) | Power converter | |
| CN104704629A (en) | Cooling structure and heat generating body | |
| CN104969313A (en) | Cooling structure for magnetic component, and power converter provided with same | |
| KR101608159B1 (en) | A bldc type blower motor using a heating vents having higher heat transmitting efficiency | |
| JP2012223089A (en) | Variable speed drive with optimized architecture | |
| CN104303412A (en) | Cooling structure and power converter | |
| CN105009439A (en) | Power conversion apparatus | |
| CN105406791A (en) | Electric vehicle motor controller and structure mode of controller assembly | |
| CN103999343A (en) | Power conversion apparatus | |
| WO2016129117A1 (en) | Outdoor unit for air conditioning devices | |
| CN208238065U (en) | Outdoor unit and air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170808 Termination date: 20190221 |