CN105005544A - Method, device and system for preventing hot-plugging chip from being damaged - Google Patents
Method, device and system for preventing hot-plugging chip from being damaged Download PDFInfo
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- CN105005544A CN105005544A CN201510416094.5A CN201510416094A CN105005544A CN 105005544 A CN105005544 A CN 105005544A CN 201510416094 A CN201510416094 A CN 201510416094A CN 105005544 A CN105005544 A CN 105005544A
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- hard disk
- pin
- out pin
- way conduction
- conduction element
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
- G06F13/4081—Live connection to bus, e.g. hot-plugging
Abstract
The invention provides a method, a device and a system for preventing a hot-plugging chip from being damaged. The method comprises the following steps of: connecting a hard disk bus with an OUT PIN on the charged hot-plugging chip, and collecting a sensing current value passing through the OUT PIN; selecting a corresponding unidirectional conducting element according to the sensing current value; and connecting the unidirectional conducting element in parallel with the OUT PIN, wherein the current can flow to the OUT PIN end through the unidirectional conducting element. The device comprises the hot-plugging chip, the hard disk bus and the unidirectional conducting element, wherein the hot-plugging chip comprises a hot-plugging chip body and the OUT PIN; the hard disk bus is connected with the OUT PIN; one end of the unidirectional conducting element is connected between the hard disk end of the hard disk bus and the hot-plugging chip body and is connected in parallel with the OUT PIN; and the unidirectional conducting element can allow the current to flow to the OUT PIN end. The method, the device and the system have the advantage that the damage rate of the hot-plugging chip can be reduced.
Description
Technical field
The present invention relates to computer hardware field, particularly a kind of method, Apparatus and system preventing hot plug wafer damage.
Background technology
Along with the fast development of Internet technology, server is widely used and every field, user to the stability of server and after breaking down fast restoration capabilities it is also proposed higher requirement, therefore hot plug technology is widely used, when not to server power-off, Fast Installation or more exchange device.Hard disk is server important component part, for storing data, general employing plug-and-play circuit is powered, when hard disk goes wrong or need to increase hard disk, just need when server not power-off, hard disk bus is pulled up from power panel, changes or again hard disk bus is inserted on power panel after increase hard disk.
At present, general server hard disk adopts and is connected on a backboard by multiple hard disk, the power supply mode that backboard is connected with power panel by a hard disk bus, when needs increase or change hard disk be, directly hard disk bus is pulled up from power panel, after to be increased or replacing hard disk completes, direct again hard disk bus is inserted on power panel, because the length of hard disk bus is longer, when hard disk bus is inserted on power panel, larger induction current can be produced, relative to the hard disk end that electromotive force is zero, negative voltage is produced at power panel end, and then the OUT PIN pin of the hot plug chip on power panel is damaged, server is caused to crash.
Therefore, be directed to the device of current this hot plug, the spoilage of hot plug chip is higher.
Summary of the invention
The invention provides a kind of method, the Apparatus and system that prevent hot plug wafer damage, the spoilage of hot plug chip can be reduced.
Embodiments provide a kind of method preventing hot plug wafer damage, comprising:
Hard disk bus is connected with the OUT PIN pin on charged hot plug chip, gathers the induced electricity flow valuve by described OUT PIN pin;
According to described induced electricity flow valuve, select corresponding one-way conduction element;
Described one-way conduction element is in parallel with described OUT PIN pin, and wherein electric current can flow to described OUT PIN pin end by described one-way conduction element.
Preferably, described according to described induced electricity flow valuve, select corresponding one-way conduction element to comprise: according to the induced electricity flow valuve collected, to obtain maximum induced electricity flow valuve, according to this maximum induced electricity flow valuve, select the one-way conduction element allowing to be greater than this maximum induced electricity flow valuve by electric current.
Preferably, described described one-way conduction element to be comprised with the parallel connection of described OUT PIN pin: be connected with described OUT PIN pin end by the negative electrode of described one-way conduction element, plus earth line GND, with the form place in circuit in parallel with OUT PIN pin.
Preferably, described being connected with described OUT PIN pin end by the negative electrode of described one-way conduction element comprises:
The negative electrode of described one-way conduction element is connected between the body of described hot plug chip and described OUTPIN pin;
Or,
The negative electrode of described one-way conduction element is connected in described hard disk bus near described OUT PIN pin one end.
Preferably, described one-way conduction element comprises: schottky diode or Zener diode.
Preferably, described according to described induced electricity flow valuve, corresponding taking a step forward of one-way conduction element is selected to comprise:
According to the induced electricity flow valuve of described collection, the inductive voltage value by hard disk bus two ends described in following formulae discovery:
Wherein, described V is the inductive voltage value at described hard disk bus two ends, and described L is the inductance value of described hard disk bus, and described i is induced electricity flow valuve, and t is the induction current duration;
According to the inductive voltage value V at described hard disk bus two ends, after judging that hard disk bus is connected with the OUT PIN pin on hot plug chip, whether OUT PIN pin place negative voltage exceeds its withstand voltage scope, if, perform described according to described induced electricity flow valuve, select corresponding one-way conduction element.
Embodiments provide a kind of device preventing hot plug wafer damage, comprising: hot plug chip, hard disk bus and one-way conduction element;
Described hot plug chip comprises hot plug chip body and OUT PIN pin;
Described hard disk bus is connected with described OUT PIN pin;
Described one-way conduction element one end is connected between the hard disk end of described hard disk bus and described hot plug chip body, in parallel with described OUT PIN pin;
Described one-way conduction element can allow OUT PIN pin end described in current direction.
Preferably, the negative electrode of described one-way conduction element is connected between described hot plug chip body and described OUT PIN pin, plus earth line GND;
Or,
The negative electrode of described one-way conduction element is connected near described OUT PIN pin one end in described hard disk bus, plus earth line GND.
Preferably, described one-way conduction element comprises: schottky diode or Zener diode.
The embodiment of the present invention additionally provides a kind of system preventing hot plug wafer damage, comprising: any one providing in backboard, at least one hard disk and foregoing invention embodiment prevents the device of hot plug wafer damage;
Described backboard, one end is connected with the hard disk bus in the described device preventing hot plug wafer damage, and the other end is connected with at least one hard disk described;
Each hard disk described, is connected with described backboard, for receiving the electric energy that described backboard transmits, works accordingly.
Embodiments provide a kind of method preventing hot plug wafer damage, Apparatus and system, after hard disk bus is connected with the OUT PIN pin on charged hot plug chip, gather the induced electricity flow valuve by OUT PIN pin, one-way conduction element is selected according to this induced electricity flow valuve, this one-way conduction element is in parallel with OUT PIN pin, ensure that electric current can flow to OUT PIN pin end by this one-way conduction element, like this, after again hard disk bus being connect electricity, the negative voltage that OUT PIN pin end produces can make one-way conduction element conductive, current direction OUT PIN pin end, the negative voltage of OUT PIN pin end is made to be decreased within the scope of the withstand voltage of OUT PIN pin, prevent OUT PIN pin damaged, and then reduce the spoilage of hot plug chip.
Accompanying drawing explanation
Fig. 1 is a kind of method flow diagram preventing hot plug wafer damage that one embodiment of the invention provides;
Fig. 2 is a kind of method flow diagram preventing hot plug wafer damage that another embodiment of the present invention provides;
Fig. 3 is a kind of device schematic diagram preventing hot plug wafer damage that one embodiment of the invention provides;
Fig. 4 is a kind of device schematic diagram preventing hot plug wafer damage that another embodiment of the present invention provides;
Fig. 5 is a kind of system schematic preventing hot plug wafer damage that one embodiment of the invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
As shown in Figure 1, one embodiment of the invention provides a kind of method preventing hot plug wafer damage, comprising:
Step 101: hard disk bus be connected with the OUT PIN pin on charged hot plug chip, gathers the induced electricity flow valuve by described OUT PIN pin;
Step 102: according to described induced electricity flow valuve, selects corresponding one-way conduction element;
Step 103: described one-way conduction element is in parallel with described OUT PIN pin, wherein electric current can flow to described OUT PIN pin end by described one-way conduction element.
By a kind of method preventing hot plug wafer damage that the embodiment of the present invention provides, after hard disk bus is connected with the OUT PIN pin on charged hot plug chip, gather the induced electricity flow valuve by OUT PIN pin, one-way conduction element is selected according to this induced electricity flow valuve, by in parallel with OUTPIN pin for this one-way conduction element, ensure that electric current can flow to OUT PIN pin end by this one-way conduction element, like this, after again hard disk bus being connect electricity, the negative voltage that OUT PIN pin end produces can make one-way conduction element conductive, current direction OUT PIN pin end, the negative voltage of OUT PIN pin end is made to be decreased within the scope of the withstand voltage of OUT PIN pin, prevent OUT PIN pin damaged, and then reduce the spoilage of hot plug chip.
In an embodiment of the invention, after hard disk bus is connected with the OUT PIN pin of hot plug chip, collect the induction current by OUT PIN pin, according to this induced electricity flow valuve, obtain maximum induced electricity flow valuve, further according to this maximum induced electricity flow valuve, the one-way conduction element allowing to be greater than by electric current this maximum induced electricity flow valuve is selected to be such as diode, this one-way conduction element is such as that one-way conduction is played in two poles, conducting state is in when hard disk bus heat is inserted, reduce the negative voltage of OUT PIN pin end, protection OUT PIN pin, when normally working, one-way conduction element is such as that two poles are in cut-off state, ensure normally for hard disk is powered, be such as two poles by selecting suitable one-way conduction element, ensure that the induction current produced can not be burnt out.
In an embodiment of the invention, the negative electrode of one-way conduction element such as diode is connected with OUT PIN pin end, plus earth line GND, like this, after OUT PIN pin end produces negative voltage, one-way conduction element such as diode is in conducting state, electric current can flow to OUT PIN pin end from GND, reduce negative voltage amplitude, avoid damaging OUT PIN pin and making hot plug wafer damage, when OUTPIN pin end is without negative voltage, one-way conduction element such as diode is in the state of cut-off, ensures normally for hard disk is powered.
In an embodiment of the present invention, the one-way conduction element mode in parallel with described OUT PIN pin has multiple, such as: the negative electrode of mode 1, one-way conduction element such as diode can be connected between the body of hot plug chip and OUT PIN pin, plus earth line GND; Mode 2, also the negative electrode of one-way conduction element such as diode can be connected in hard disk bus and be close to OUT PIN pin one end, plus earth line GND.Under can ensureing the prerequisite do not damaged at hot plug chip like this, arrange the position of diode neatly, facilitate the realization of this technology.
In an embodiment of the invention; one-way conduction element can be schottky diode or Zener diode; because schottky diode or Zener diode all possess one-way conduction effect; and reversed time is short; be quick on the draw; meeting fast conducting after OUT PIN pin produces negative voltage; protection hot plug chip; end rapidly again after negative voltage disappears; ensure that the power supply of hard disk is normal; in addition, the structure of schottky diode or Zener diode is simple, low price, is more conducive to the enforcement of this technology.
In an embodiment of the invention, in order to whether the negative voltage detecting the generation when carrying out hot plug of hard disk electric power system can damage hot plug chip, needed, according to the induced electricity flow valuve collected, to pass through formula before step 102
calculate the inductive voltage value at hard disk bus two ends, wherein V is the inductive voltage value at hard disk bus two ends, and L is the inductance value of hard disk bus, and i is induced electricity flow valuve, and t is the induction current duration.Owing to hard disk bus to be connect the moment of electricity, in hard disk bus, the electromotive force of hard disk end is zero, so the inductive voltage value at hard disk bus two ends is the negative voltage amplitude of OUT PIN pin end, the safe voltage value of OUT PIN pin relatively on hot plug chip and the inductive voltage value at hard disk bus two ends, if the inductive voltage value at hard disk bus two ends is greater than the safe voltage value of OUT PIN pin, then just there is impaired danger in this OUT PIN pin, need to perform step 102 to protect, if the inductive voltage value at hard disk bus two ends is less than the safe voltage value of OUT PIN pin, then can protect.
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with drawings and the specific embodiments, the present invention is described in further detail.
As shown in Figure 2, one embodiment of the invention provides a kind of method preventing hot plug wafer damage, and for one-way conduction element for diode is described, the method comprises:
Step 201: hard disk bus is connected with the OUT PIN pin on charged hot plug chip.
In an embodiment of the invention, after hard disk being increased, changes or keeping in repair, hard disk bus heat is inserted power panel, is connected, for hard disk is powered with the OUT PIN pin on charged hot plug chip by hard disk bus.
Step 202: gather the induced electricity flow valuve in hard disk bus.
In an embodiment of the invention, after hard disk bus being connected with the OUT PIN pin of charged hot plug chip, gather the induced electricity flow valuve in hard disk bus, line item of going forward side by side.Such as, after hard disk bus being connected with the OUT PIN pin on charged hot plug chip, utilize oscillograph, gathered the induced electricity flow valuve i in hard disk bus by gallon side, line item of going forward side by side.
Step 203: according to the induced electricity flow valuve collected, calculates the inductive voltage value at hard disk bus two ends.
In an embodiment of the invention, by the induced electricity flow valuve collected, calculate the inductive voltage value at hard disk bus two ends.Such as, answered the inductive voltage value at hard disk bus two ends by following formulae discovery,
Wherein, V is the inductive voltage value at hard disk two ends, and L is the inductance value of hard disk bus, and i is the induced electricity flow valuve in the hard disk bus that collects, and t is the faradic duration.
By above-mentioned formula, the inductive voltage value calculating current bus two ends is 8V.
Step 204: according to the inductive voltage value at hard disk bus two ends, judges whether pluggable chip exists impaired danger, if so, performs step 206, if not, performs step 205.
In an embodiment of the invention, during due to hard disk bus is just connected with the OUTPIN pin on charged hot plug chip, hard disk bus is zero near the electromotive force of hard disk end, so hard disk bus equals the inductive voltage value at hard disk bus two ends near the voltage magnitude of OUT PIN pin end, therefore, by the withstand voltage of the OUT PIN pin on the inductive voltage value at hard disk bus two ends and hot plug chip is compared, just can judge whether hot plug chip exists impaired danger, if the inductive voltage value at hard disk bus two ends is more than or equal to the withstand voltage of OUT PIN pin, then there is impaired danger in hot plug chip, step 206 is performed for this kind of situation, if the inductive voltage value at hard disk bus two ends is less than the withstand voltage of OUT PIN pin, then there is not the danger that sensed voltage damages in hot plug chip, perform step 205.Such as, the withstand voltage of the OUT PIN pin on hot plug chip is 2V, and the inductive voltage value due to hard disk bus two ends is 8V, be greater than the withstand voltage of OUT PIN pin, there is the danger that sensed voltage damages in OUT PIN pin, for this situation, performs step 206.
Step 205: terminate current process.
In an embodiment of the invention, if the inductive voltage value at hard disk bus two ends is less than the withstand voltage of OUT PIN pin, then OUT PIN pin can not damage by sensed voltage, thus hot plug chip also would not insert due to the heat of hard disk bus and damage, so do not need to transform hard disk supply line, and terminate current process.
Step 206: according to the induced electricity flow valuve in hard disk bus, selects the diode of suitable types.
In an embodiment of the invention, after judging that OUT PIN pin exists the danger of sensed voltage damage, by the induced electricity flow valuve in the hard disk bus that collects, obtain maximum induced electricity flow valuve, according to this maximum induced electricity flow valuve, select the diode allowing to be greater than this maximum induced electricity flow valuve by electric current.Such as, according to the induced electricity flow valuve in the hard disk bus collected, getting maximum induced electricity flow valuve is 2A, and according to this maximum application current value, selecting one to allow by electric current is the schottky diode of 3A.
Step 207: be connected in circuit with the form in parallel with OUT PIN pin by the diode of selection, wherein the negative electrode of diode is connected with OUT PIN pin end, and anode is connected wires GND.
In an embodiment of the invention, be connected in circuit by the diode chosen, this diode adopts the form in parallel with OUT PIN pin, and wherein, the negative electrode of diode is connected with OUT PIN pin end, plus earth line GND.
In this step, for schottky diode, by the mode that the diode of selection is connected in circuit with the form in parallel with OUT PIN pin can be:
Be connected in circuit by the schottky diode chosen, wherein the negative electrode of schottky diode is connected between the body of hot plug chip and OUT PIN pin, plus earth line;
Or,
The negative electrode of the schottky diode chosen is connected to one end near OUT PIN pin in hard disk bus, plus earth line.
Certainly, the mode that the diode of selection is connected in circuit with the form in parallel with OUT PIN pin also for other modes, can be changed according to actual conditions flexibly.
Step 208: again hard disk bus is connected with the OUT PIN pin on hot plug chip, hot plug chip is protected.
In an embodiment of the invention, after the diode chosen being connected in circuit by step 207, after hard disk bus is connected with the OUT PIN pin on hot plug chip again again, because hard disk bus self exists inductance, hard disk bus can produce induction current, relative to the hard disk end that electromotive force is zero, OUT PIN pin end produces negative voltage, now the electromotive force of GND is higher than the electromotive force of OUT PIN pin end, diode is in conducting state, electric current flows to OUT PIN pin by GND, the negative voltage amplitude of OUT PIN pin end reduces accordingly, the negative voltage amplitude at this place is made to be less than the withstand voltage of OUTPIN pin, the sensed voltage of OUT PIN pin is avoided to damage, thus prevent hot plug wafer damage.When by hot plug chip and hard disk bus be hard disk carry out normal power supply time, OUT PIN pin end electromotive force is greater than the electromotive force of GND, and diode is in reverse blocking state, and electric current is normally for hard disk is powered.
One embodiment of the invention provides a kind of device preventing hot plug wafer damage, comprising: hot plug chip, hard disk bus and one-way conduction element;
Hot plug chip comprises: hot plug chip body and OUT PIN pin;
Hard disk bus is connected with OUT PIN pin;
One-way conduction element one end is connected between the hard disk end of hard disk bus and hot plug chip body, is parallel relationship between one-way conduction element and OUT PIN pin;
One-way conduction element can allow current direction OUT PIN pin end.
In an embodiment of the invention, one-way conduction element can be schottky diode or Zener diode, and the negative electrode of diode is connected with OUT PIN pin end, plus earth line, with the form place in circuit in parallel with OUT PIN pin.
In an embodiment of the invention, one-way conduction element one end is connected between the hard disk end of hard disk bus and hot plug chip body, for parallel relationship comprises two kinds of modes between one-way conduction element and OUT PIN pin, below using schottky diode as one-way conduction element, these two kinds of modes are described in detail:
Mode 1: as shown in Figure 3, this prevents the device of hot plug wafer damage, comprising: hot plug chip 301, hard disk bus 302 and schottky diode 303;
Hot plug chip 301 comprises further: hot plug chip body 3011 and OUT PIN pin 3012;
Hot plug chip body 3011 is connected with OUT PIN pin 3012, and schottky diode 303 negative electrode is connected between hot plug chip body 3011 and OUT PIN pin 3012, plus earth line GND.
After hard disk bus 302 to be connected with OUT PIN pin 3012 and to be energized, because hard disk bus 302 self exists inductance, induction current can be produced in hard disk bus 302, when hard disk bus 302 is just connected, the electromotive force of its hard disk end is zero, so negative voltage can be produced in the OUT PIN pin end of hard disk bus 302, when there is negative voltage in OUT PIN pin 3012 end, schottky diode 303 forward conduction, electric current flows to OUT PIN pin 3012 end by GND, reduce the negative voltage amplitude of OUT PIN pin 3012 end, within the withstand voltage scope being decreased to OUT PIN pin 3012, avoid OUT PIN pin 4012 damaged and cause hot plug chip 301 to damage, after hard disk bus 302 and OUT PIN pin 3012 being connected and hard disk normally works, the electromotive force at OUT PIN pin 3012 place is greater than the electromotive force of GND, schottky diode 303 is in reverse blocking state, electric current flows to hard disk bus 302 by OUT PIN pin 3012, for hard disk carries out normal power supply.
Mode 2: as shown in Figure 4, this prevents the device of hot plug wafer damage, comprising: hot plug chip 401, hard disk bus 402 and schottky diode 403;
Hot plug chip 401 comprises further: hot plug chip body 4011 and OUT PIN pin 4012;
Hot plug chip body 4011 is connected with OUT PIN pin 4012, and schottky diode 403 negative electrode is connected to hard disk bus 402 near OUT PIN pin 4012 one end, plus earth line GND.
After hard disk bus 402 to be connected with OUT PIN pin 4012 and to be energized, because hard disk bus 402 self exists inductance, induction current can be produced in hard disk bus 402, relative to the hard disk end that electromotive force in hard disk bus 402 is zero, OUT PIN pin end in hard disk bus 402 can produce negative voltage, now schottky diode 403 forward conduction, electric current is flowed to the OUT PIN pin one end in hard disk bus 402 by GND, within withstand voltage scope negative value being herein decreased to OUT PIN pin 4012, avoid OUT PIN pin 4012 damaged and cause hot plug chip 401 to damage, when normally powering to hard disk, the electromotive force of the OUT PIN pin one end in hard disk bus 402 is greater than the electromotive force of GND, and schottky diode 403 is in reverse blocking state, and electric current flows through hard disk bus 402 and normally powers to hard disk.
As shown in Figure 5, one embodiment of the invention provides a kind of system preventing hot plug wafer damage, comprising: any one providing in backboard 501, at least one hard disk 502 and this foregoing invention embodiment prevents the device 503 of hot plug wafer damage;
Backboard 501, one end is connected with the hard disk bus in the device 503 preventing hot plug wafer damage, and the other end is connected with each hard disk 502;
Each hard disk 502, is connected with backboard 501, for receiving the electric energy that backboard 501 transmits, works accordingly.
According to such scheme, a kind of method, Apparatus and system preventing hot plug wafer damage that the embodiment of the present invention provides, at least has following beneficial effect:
1, in the embodiment of the present invention, after hard disk bus is connected with the OUT PIN pin on charged hot plug chip, gather the induced electricity flow valuve by OUT PIN pin, one-way conduction element is selected according to this induced electricity flow valuve, this one-way conduction element is in parallel with OUT PIN pin, ensure that electric current can flow to OUT PIN pin end by this one-way conduction element, like this, after again hard disk bus being connect electricity, the negative voltage that OUT PIN pin end produces can make one-way conduction element conductive, current direction OUT PIN pin end, the negative voltage of OUT PIN pin end is made to be decreased within the scope of the withstand voltage of OUT PIN pin, prevent OUTPIN pin damaged, and then reduce the spoilage of hot plug chip.
2, in the embodiment of the present invention, diode can be adopted as one-way conduction element, diode cathode is connected with OUT PIN pin end, plus earth line, when OUT PIN pin place produces negative voltage, diode forward conducting, electric current flows to OUT PIN pin from GND, reduce negative voltage within the scope of the safe withstand voltage of OUT PIN pin, avoid OUT PIN pin to cause hot plug wafer damage because induced voltage damages.Diode configuration is simple, and low price, is conducive to the realization of this programme.
3, in the embodiment of the present invention; schottky diode or Zener diode can be adopted as one-way conduction element; because schottky diode and Zener diode all possess the function of one-way conduction; and reversed time is short; be quick on the draw, meeting fast conducting after OUT PIN pin place produces negative voltage, protection hot plug chip; end rapidly again after negative voltage disappears, ensure that the power supply of hard disk is normal.
4, in the embodiment of the present invention, when adopting diode as one-way conduction element, the negative electrode of diode can be connected between the body of hot plug chip and OUT PIN pin, also can be connected in hard disk bus and be close to OUT PIN pin one end in pole, according to actual conditions, arrange the position of diode flexibly, be conducive to the realization of this programme.
5, in the embodiment of the present invention, gather the induced electricity flow valuve in hard disk bus after hard disk bus being connected with OUT PIN pin, the inductive voltage value at hard disk bus two ends is calculated by this current value, judge whether OUT PIN pin exists impaired danger by this inductive voltage value, if with good grounds induced electricity flow valuve, select the diode allowing to be greater than maximum induction current model by electric current, like this, can determine whether according to demand to need to transform hard disk supply line, and guarantee that transforming rear diode can not burn by sensed electric current, ensure the effect preventing hot plug wafer damage.
It should be noted that, in this article, the relational terms of such as first and second and so on is only used for an entity or operation to separate with another entity or operational zone, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element " being comprised a 〃 〃 〃 〃 〃 〃 " limited by statement, and be not precluded within process, method, article or the equipment comprising described key element and also there is other same factor.
One of ordinary skill in the art will appreciate that: all or part of step realizing said method embodiment can have been come by the hardware that programmed instruction is relevant, aforesaid program can be stored in the storage medium of embodied on computer readable, this program, when performing, performs the step comprising said method embodiment; And aforesaid storage medium comprises: ROM, RAM, magnetic disc or CD etc. various can be program code stored medium in.
Finally it should be noted that: the foregoing is only preferred embodiment of the present invention, only for illustration of technical scheme of the present invention, be not intended to limit protection scope of the present invention.All any amendments done within the spirit and principles in the present invention, equivalent replacement, improvement etc., be all included in protection scope of the present invention.
Claims (10)
1. prevent a method for hot plug wafer damage, it is characterized in that, comprising:
Hard disk bus is connected with the OUT PIN pin on charged hot plug chip, gathers the induced electricity flow valuve by described OUT PIN pin;
According to described induced electricity flow valuve, select corresponding one-way conduction element;
Described one-way conduction element is in parallel with described OUT PIN pin, and wherein electric current can flow to described OUT PIN pin end by described one-way conduction element.
2. method according to claim 1, it is characterized in that, described according to described induced electricity flow valuve, corresponding one-way conduction element is selected to comprise: according to the induced electricity flow valuve collected, obtain maximum induced electricity flow valuve, according to this maximum induced electricity flow valuve, select the one-way conduction element allowing to be greater than this maximum induced electricity flow valuve by electric current.
3. method according to claim 1, it is characterized in that, described described one-way conduction element to be comprised with the parallel connection of described OUT PIN pin: the negative electrode of described one-way conduction element is connected with described OUT PIN pin end, plus earth line GND, with the form place in circuit in parallel with OUT PIN pin.
4. method according to claim 3, is characterized in that, described being connected with described OUT PIN pin end by the negative electrode of described one-way conduction element comprises:
The negative electrode of described one-way conduction element is connected between the body of described hot plug chip and described OUTPIN pin;
Or,
The negative electrode of described one-way conduction element is connected in described hard disk bus near described OUT PIN pin one end.
5. method according to claim 1, is characterized in that, described one-way conduction element comprises: schottky diode or Zener diode.
6. method according to claim 1, is characterized in that, described according to described induced electricity flow valuve, selects corresponding taking a step forward of one-way conduction element to comprise:
According to the induced electricity flow valuve of described collection, the inductive voltage value by hard disk bus two ends described in following formulae discovery:
Wherein, described V is the inductive voltage value at described hard disk bus two ends, and described L is the inductance value of described hard disk bus, and described i is induced electricity flow valuve, and t is the induction current duration;
According to the inductive voltage value V at described hard disk bus two ends, after judging that hard disk bus is connected with the OUT PIN pin on hot plug chip, whether OUT PIN pin place negative voltage exceeds its withstand voltage scope, if, perform described according to described induced electricity flow valuve, select corresponding one-way conduction element.
7. prevent a device for hot plug wafer damage, it is characterized in that, comprising: hot plug chip, hard disk bus and one-way conduction element;
Described hot plug chip comprises hot plug chip body and OUT PIN pin;
Described hard disk bus is connected with described OUT PIN pin;
Described one-way conduction element one end is connected between the hard disk end of described hard disk bus and described hot plug chip body, in parallel with described OUT PIN pin;
Described one-way conduction element can allow OUT PIN pin end described in current direction.
8. device according to claim 7, is characterized in that,
The negative electrode of described one-way conduction element is connected between described hot plug chip body and described OUT PIN pin, plus earth line GND;
Or,
The negative electrode of described one-way conduction element is connected near described OUT PIN pin one end in described hard disk bus, plus earth line GND.
9. the device according to claim 7 or 8, is characterized in that,
Described one-way conduction element comprises: schottky diode or Zener diode.
10. prevent a system for hot plug wafer damage, it is characterized in that, comprising: in backboard, at least one hard disk and claim 7 to 9, any one prevents the device of hot plug wafer damage;
Described backboard, one end is connected with the hard disk bus in the described device preventing hot plug wafer damage, and the other end is connected with at least one hard disk described;
Hard disk described in each, is connected with described backboard, for receiving the electric energy that described backboard transmits, works accordingly.
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| CN201510416094.5A CN105005544A (en) | 2015-07-15 | 2015-07-15 | Method, device and system for preventing hot-plugging chip from being damaged |
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| CN201510416094.5A CN105005544A (en) | 2015-07-15 | 2015-07-15 | Method, device and system for preventing hot-plugging chip from being damaged |
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| CN201510416094.5A Pending CN105005544A (en) | 2015-07-15 | 2015-07-15 | Method, device and system for preventing hot-plugging chip from being damaged |
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| CN (1) | CN105005544A (en) |
Cited By (1)
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| CN108932043A (en) * | 2018-06-27 | 2018-12-04 | 郑州云海信息技术有限公司 | A kind of fan board heat inserts control system and method |
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