CN105002548A - Plating bath - Google Patents
Plating bath Download PDFInfo
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- CN105002548A CN105002548A CN201510373405.4A CN201510373405A CN105002548A CN 105002548 A CN105002548 A CN 105002548A CN 201510373405 A CN201510373405 A CN 201510373405A CN 105002548 A CN105002548 A CN 105002548A
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- anode plate
- plate
- cell body
- plating
- anode
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Abstract
The present invention relates to a plating bath, including a tank body. The upper end of the tank body is provided with a cross bar with a plurality of grooves on the surface; a first anode plate and a second plate anode are symmetrically arranged on the lower end of the cross bar; the opposite sides of the first anode plate and the second anode plate are respectively provided with a first shield plate with a through hole and a second shield plate with a through hole; the first anode plate, the second anode plate, the first shield plate and the second shield plate are respectively slidably connected with the cross bar; the tank body is provided with a vapor recovery unit; a heating device and a magnetic stirrer are arranged in the tank body; a battery is provided on the outer side of the tank body; the first anode plate, the second anode plate, the vapor recovery unit, the heating device and the magnetic stirrer are respectively connected to the battery. The present invention solves the problems of poor plating effect and uneven plating of the parts.
Description
Technical field
The present invention relates to a kind of plating tank, belong to electroplating technology field.
Background technology
Plating is exactly the process utilizing electrolysis principle to plate other metal or alloy of skim on some metallic surface, be utilize electrolytic action to make the technique of the surface attachment layer of metal film of metal or other material thus play to prevent burning (as corrosion), improve the effects such as wear resistance, electroconductibility, reflective, erosion resistance (copper sulfate etc.) and having improved aesthetic appearance.The skin of many coins is also plating.
During plating, coated metal or other insoluble materials do anode, and workpiece to be plated does negative electrode, and the positively charged ion of coated metal is reduced formation coating at workpiece surface to be plated.For getting rid of other cationic interference, and making coating evenly, firmly, electroplate liquid need be done, to keep the cationic concentration of coated metal constant with containing the cationic solution of coated metal.The object of plating plates metal plating on base material, changes substrate surface character or size.Plating can strengthen metal erosion resistance (the corrosion resistant metal of the many employings of coated metal), increase hardness, prevent abrasion, improve electroconductibility, slipperiness, thermotolerance and surface aesthetic.
Coating is single metal or alloy mostly, as titanium palladium, zinc, cadmium, gold or brass, bronze etc.; Also disperse layer is had, as nickel-silicon carbide, nickel-fluorographite etc.; Also has laminating layer, as the copper-nickel-layers of chrome on steel, the silver-indium layer etc. on steel.The body material of plating, except the cast iron of iron-based, steel and stainless steel, also has non-ferrous metal, or ABS plastic, polypropylene, polysulfones and phenoplast, but before plastic electroplating, has to pass through special activation and sensitized treatment.
Utilize electrolytic action on machinework, deposit the good but technology of the metal cover that performance is different with body material of attachment.Electrolytic coating is more even than hot dipping layer, generally all thinner, from several micron to tens microns not etc.By plating, decoration protectiveness and various functional upper layer can be obtained on machinework, the workpiece of wearing and tearing and processing error can also be repaired.
Plating is divided into rack plating, barrel plating, the continuously mode such as plating and brush plating, mainly relevant with batch with the size of unplated piece.Rack plating is applicable to the goods of stock size, as the collision bumper of automobile, and the handlebar etc. of bike.Barrel plating is applicable to smallclothes, as fastening piece, packing ring, pin etc.Continuous plating is applicable to mass-producted wire rod and band.Brush plating is applicable to local plating or repairs.Electroplate liquid has acidity that is acid, alkalescence and that be added with chelating agent and neutral solution, no matter adopts which kind of plating mode, the coating bath contacted, hangs tool etc. and should have versatility to a certain degree with goods to be plated with plating solution.
The low-voltage high-current power source that plating needs one are powered to plating tank and the electrolyzer be made up of electroplate liquid, part to be plated (negative electrode) and anode.Wherein to look coating different and different for electroplating bath components, but all containing the main salt providing metal ion, in the main salt of energy complexing, metal ion forms the complexing agent of complex compound, for the buffer reagent of stabilizing solution potential of hydrogen, anode activation agent and special additive (as brightening agent, grain-refining agent, leveling agent, wetting agent, stress relieving agent and inhibiting fog agent etc.).Electroplating process be the metal ion in plating solution under the effect of external electric field, be reduced into atoms metal through electrode reaction, and in the process of negative electrode enterprising row metal deposition.Therefore, this is a metal electrodeposition process comprising the steps such as mass transfer in liquid phase, electrochemical reaction and electrocrystallization.
In the coating bath filling electroplate liquid, through cleaning and the unplated piece of special pre-treatment as negative electrode, make anode with metal lining, the two poles of the earth connect with the negative pole of direct supply and positive pole respectively.Electroplate liquid is made up of the aqueous solution of the salt of the compound containing metal lining, conduction, buffer reagent, pH adjusting agent and additive etc.After energising, the metal ion in electroplate liquid, is moved on negative electrode in the effect of potential difference and forms coating.The metal of anode forms metal ion and enters electroplate liquid, to keep the concentration of the metal ion be plated.In some cases, as chromium plating, be the insoluble anode that employing is plumbous, lead antimony alloy is made, it only plays a part to transmit electronics, On current.Chromium ion concentration in electrolytic solution, need rely on and add chromium cpd to maintain termly in plating solution.During plating, the impurity, power supply wave shape etc. of the quality of anode material, the composition of electroplate liquid, temperature, current density, conduction time, stirring intensity, precipitation all can affect the quality of coating, need to control in good time.Electroplating principle comprises four aspects: the electrodeposition process of electroplate liquid, electroplating reaction, electrode and reaction principle, metal.
When people electroplate part, the most frequently used instrument is plating tank, and plating tank is most basic supporting in electroplating device.Plating tank is used for device solution, for zinc-plated, copper facing, nickel plating, gold-plated etc.Movable cathode plating tank serves as a contrast the cell body of soft polyvinyl chloride plastic, electric installation, steam heating tube and cathode moving device etc. by steel tank and forms.Cell body also can serve as a contrast Vybak manufacture with steelframe, and the factor such as character and temperature of bath solution is depended in the selection of trough body structure.But it is even that general plating bath plates article out there will be uneven coating, the problem that electroplating effect is bad.
Chinese utility model patent specification sheets CN 204198882 U openly so a kind of plating tank, relate to a kind of electroplanting device, comprise plating tank cell body, hanger and plating tank supporting beam, described plating tank also comprises a scaffold, and this scaffold is arranged in described plating tank cell body; Described plating tank supporting beam has roller support, is bearing steel plate under this roller support, is insulcrete below bearing steel plate, is plating tank pier body below insulcrete.But this plating bath plates effect is bad, it is uneven that part easily produces plating.
Chinese utility model patent specification sheets CN 202830207 U openly so a kind of plating tank, comprise for the cell body of splendid attire electroplate liquid, whipping appts and circulation device, the bottom of cell body is provided with at least one blast main in the horizontal direction, this blast main is provided with pore, and the opening of pore is inclined upwardly 30-45 degree in the horizontal direction; The pump that described circulation device comprises transfer tube and drives plating solution to flow along transfer tube, one end of transfer tube is communicated with the bottom of cell body, and the other end is communicated with the top of cell body.But this plating bath plates effect is bad, it is uneven that part easily produces plating.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of plating tank, and it is bad that this plating tank solves electroplating effect, and part easily produces the uneven problem of plating, and the steam in recoverable plating tank.
In order to solve the problems of the technologies described above, plating tank of the present invention comprises cell body, cell body upper end is provided with the cross bar of surface with several grooves, cross bar lower end has been arranged with first anode plate, second anode plate, described first anode plate, second anode plate in opposite directions side is respectively equipped with the first shielding slab having communicating pores, have the secondary shielding plate of communicating pores, described first anode plate, second anode plate, first shielding slab, secondary shielding plate is slidably connected with cross bar respectively, described cell body upper end is provided with vapor-recovery unit, heating unit is provided with in cell body, magnetic stirring apparatus, store battery is provided with outside cell body, described first anode plate, second anode plate, vapor-recovery unit, heating unit, magnetic stirring apparatus is connected with store battery respectively.
Described vapor-recovery unit is arranged on cell body upper end by pillar stiffener.
Communicating pores quantity on described first shielding slab, secondary shielding plate is two or more.
Described cell body is provided with liquid level charactron.
Described heating unit is heating tube.
Adopt this plating tank, have the following advantages:
1, because first anode plate, second anode plate, the first shielding slab, secondary shielding plate are slidably connected with cross bar respectively, the distance of cathode and anode can be regulated like this according to plated object, more effectively to electroplate; 2, because rail surface is with several grooves, positive plate, shielding slab can be hung on groove, prevent it from sliding, reduce irrelevant variable to the impact of test-results; 3, because cell body upper end is provided with vapor-recovery unit, the steam of cell body electroplate liquid can be recycled; 4, because the first shielding slab, secondary shielding plate are provided with communicating pores, the current density in electroplate liquid can be regulated, improve electroplating quality; 5, owing to being provided with magnetic stirring apparatus in cell body, can make electroplate liquid stir evenly, improve electroplating effect.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is the structural representation of plating tank of the present invention.
Wherein have: 1. cell body; 2. cross bar; 3. first anode plate; 4. the first shielding slab; 5. secondary shielding plate; 6. second anode plate; 7. pillar stiffener; 8. vapor-recovery unit; 9. heating unit; 10. magnetic stirring apparatus; 11. store batteries.
Embodiment
Plating tank shown in Fig. 1, comprise groove 1, cell body 1 upper end is provided with the cross bar 2 of surface with several grooves, cross bar 2 lower end has been arranged with first anode plate 3, second anode plate 6, described first anode plate 3, second anode plate 6 in opposite directions side is respectively equipped with the first shielding slab 4 having communicating pores, have the secondary shielding plate 5 of communicating pores, described first anode plate 1, second anode plate 6, first shielding slab 4, secondary shielding plate 5 is slidably connected with cross bar 2 respectively, described cell body 1 upper end is provided with vapor-recovery unit 8, heating unit 9 is provided with in cell body 1, magnetic stirring apparatus 10, store battery 11 is provided with outside cell body 1, described first anode plate 3, second anode plate 6, vapor-recovery unit 8, heating unit 9, magnetic stirring apparatus 10 is connected with store battery 11 respectively.
Described vapor-recovery unit 8 is arranged on cell body 1 upper end by pillar stiffener 7.
Communicating pores quantity on described first shielding slab 4, secondary shielding plate 5 is two or more.
Described cell body 1 is provided with liquid level charactron.
Described heating unit 9 is heating tube.
During plating, plated item is placed in plating tank, and be placed between first anode plate 1, second anode plate 6, at this moment, plated item is as negative electrode, then according to the size of plated item, regulate the distance of negative electrode and anode, then heating unit 9, magnetic stirring apparatus 10, vapor-recovery unit 8 is opened, electroplate liquid in heating unit 9 pairs of cell bodies 1 heats, and the electroplate liquid in magnetic stirring apparatus 10 pairs of cell bodies 1 stirs, and so just substantially increases electroplating effect, make coating more even, vapor-recovery unit 8 can recycle the steam that electroplate liquid produces.
Because cross bar 2 surface is with several grooves, positive plate, shielding slab can be hung on groove, prevents it from sliding, reduce irrelevant variable to the impact of test-results; Because the first shielding slab 4, secondary shielding plate 5 are provided with communicating pores, the current density in electroplate liquid can be regulated, improve electroplating quality.
The technical characteristic described in detail is not had to be prior art in the application.Above-described embodiment is the principle of illustrative the application and effect thereof only, but not for limiting the application.Any person skilled in the art scholar all under the spirit and category of the application, can modify above-described embodiment or changes.Therefore, have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the application discloses, must be contained by the claim of the application.
Claims (5)
1. a plating tank, it is characterized in that: comprise cell body, cell body upper end is provided with the cross bar of surface with several grooves, cross bar lower end has been arranged with first anode plate, second anode plate, described first anode plate, second anode plate in opposite directions side is respectively equipped with the first shielding slab having communicating pores, have the secondary shielding plate of communicating pores, described first anode plate, second anode plate, first shielding slab, secondary shielding plate is slidably connected with cross bar respectively, described cell body upper end is provided with vapor-recovery unit, heating unit is provided with in cell body, magnetic stirring apparatus, store battery is provided with outside cell body, described first anode plate, second anode plate, vapor-recovery unit, heating unit, magnetic stirring apparatus is connected with store battery respectively.
2. according to plating tank according to claim 1, it is characterized in that: described vapor-recovery unit is arranged on cell body upper end by pillar stiffener.
3. according to plating tank according to claim 1, it is characterized in that: the communicating pores quantity on described first shielding slab, secondary shielding plate is two or more.
4. according to plating tank according to claim 1, it is characterized in that: described cell body is provided with liquid level charactron.
5. according to plating tank according to claim 1, it is characterized in that: described heating unit is heating tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510373405.4A CN105002548A (en) | 2015-06-30 | 2015-06-30 | Plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510373405.4A CN105002548A (en) | 2015-06-30 | 2015-06-30 | Plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105002548A true CN105002548A (en) | 2015-10-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510373405.4A Pending CN105002548A (en) | 2015-06-30 | 2015-06-30 | Plating bath |
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| CN (1) | CN105002548A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109652846A (en) * | 2017-10-11 | 2019-04-19 | 天津市嘉腾环保设备股份有限公司 | A kind of high-efficiency electroplating equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2270737Y (en) * | 1996-05-21 | 1997-12-17 | 王明臣 | Internal hole plating iron device |
| CN201567379U (en) * | 2009-09-30 | 2010-09-01 | 上海新阳半导体材料股份有限公司 | Plating tank with shielding device |
| CN201574206U (en) * | 2009-12-23 | 2010-09-08 | 上海元豪表面处理有限公司 | Electroplating bath with shielding plate |
| CN201746598U (en) * | 2009-09-17 | 2011-02-16 | 江西铜业股份有限公司 | Deformation prevention shielding plate |
| CN203715769U (en) * | 2013-12-10 | 2014-07-16 | 中国石油大学(华东) | Adjustable anti-slip electroplating tank |
| CN204918821U (en) * | 2015-06-30 | 2015-12-30 | 苏州华日金菱机械有限公司 | Plating bath |
-
2015
- 2015-06-30 CN CN201510373405.4A patent/CN105002548A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2270737Y (en) * | 1996-05-21 | 1997-12-17 | 王明臣 | Internal hole plating iron device |
| CN201746598U (en) * | 2009-09-17 | 2011-02-16 | 江西铜业股份有限公司 | Deformation prevention shielding plate |
| CN201567379U (en) * | 2009-09-30 | 2010-09-01 | 上海新阳半导体材料股份有限公司 | Plating tank with shielding device |
| CN201574206U (en) * | 2009-12-23 | 2010-09-08 | 上海元豪表面处理有限公司 | Electroplating bath with shielding plate |
| CN203715769U (en) * | 2013-12-10 | 2014-07-16 | 中国石油大学(华东) | Adjustable anti-slip electroplating tank |
| CN204918821U (en) * | 2015-06-30 | 2015-12-30 | 苏州华日金菱机械有限公司 | Plating bath |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109652846A (en) * | 2017-10-11 | 2019-04-19 | 天津市嘉腾环保设备股份有限公司 | A kind of high-efficiency electroplating equipment |
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| PB01 | Publication | ||
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Application publication date: 20151028 |