CN105002481A

CN105002481A - Electroplating solution

Info

Publication number: CN105002481A
Application number: CN201510392002.4A
Authority: CN
Inventors: 向延海
Original assignee: Suzhou Rijin Machinery Equipment Co Ltd
Current assignee: Suzhou Rijin Machinery Equipment Co Ltd
Priority date: 2015-07-07
Filing date: 2015-07-07
Publication date: 2015-10-28

Abstract

The invention belongs to the field of non-electrolysis plating and specifically relates to an electroplating solution. The electroplating solution contains hydrophosphate, a complexing agent and an ion source of a coating. The ion source of the coating is one or more ingredients selected from palladium salt, copper salt, gold salt, tin salt and cobalt salt at any mass ratio. Thus, the electroplating solution can be widely applied to plating of various electronic products and has a good plating effect.

Description

Electroplate liquid

Technical field

The invention belongs to electroless plating field, be specially electroplate liquid.

Background technology

Electroless plating is on workpiece when not having impressed current, by the method for pure chemistry, forms the metal cladding of one deck densification, as chemical nickel plating, electroless copper, chemical silvering.Now become a ripe electroplating technology, be mainly used on the article of non-wafer at present; Therefore, in coating film thickness homogeneity, there is no strict demand, and rarely for the requirement of micropore plating.

In recent years, along with the fast development of semiconductor technology, electroless plating technology is applied to chance on wafer also along with significantly increasing; Such as the electroplating technology etc. at silicon wafer or gallium arsenide wafer back side guide hole (backsideviahole).Along with the development of electronic industry, electronic industry is to the requirement of electroless plating technology, more and more higher, for this reason, improvement for electroless plating technology mainly can be set about by two aspects: its a pair electroless plating equipment is improved, and second it be for researching and developing new plating solution formula.

Strive without many sections of patents existing in the improvement of electrolyzer, as Chinese patent CN102766858A " electroless plating apparatus and method for ", be applicable to carry out electroless plating process at least one wafer; Aforementioned device includes cell body unit, wafer carrying unit, electroless plating liquid feeding unit and ultrasonic oscillation unit; Wherein, aforementioned grooves body unit is provided with at least one water inlet, for taking up an electroless plating liquid; Aforementioned wafer carrying unit is incorporated in aforementioned grooves body unit; Aforementioned electroless plating liquid feeding unit be used for by electroless plating liquid through aforementioned water inlet, be supplied in this cell body unit; Aforementioned ultrasonic concussion unit is then incorporated into this electroless plating cell body unit, for the electroless plating liquid in this cell body unit of homogeneous perturbation.And for example Chinese patent CN103741177A " a kind of electroplating device of LED lead frame ", by pressing plate, patrix, counterdie, base plate, substrate, jet tray and electrode composition, patrix is that atresia is dull and stereotyped, patrix is fixed on the below of pressing plate, counterdie forms hollow hole to the position in requisition for plating, counterdie is fixed on base plate, base plate is fixed on substrate, the below installing electrodes of substrate and jet tray, base plate, substrate and jet tray have the through hole flow through for electroplate liquid, it is for selecting electrosilvering to the functional zone, the back side of LED lead frame, positive function district selects electrosilvering or the silver-plated one side of chip rest area local electric to select parcel plating operation, greatly reduce electrosilvering aspect to amass, argent is effectively used, reduce electroplating cost, and improve the bonding force of plastics and lead frame, reach anti-layering object, improve the quality of LED product.

But the electrolytic solution about electroless plating only has Chinese patent CN1421546 " palladium electroplating liquid " at present, it is at least containing being scaled the soluble palladium salt of 1 ~ 60g/L and the thionamic acid of 0.1 ~ 300g/L or the palladium electroplating liquid of its salt by palladium amount, and not containing gloss-imparting agent, wherein above-mentioned soluble palladium salt is selected from Pd (NH3) 4Cl2, Pd (NH3) 4I2, Pd (NH3) 4 (ONO) 2, Pd (NH3) 4 (NO3) 2, Pd (NH3) 4 (SO3) 2, Pd (NH3) 4 (SO4) 2 and Pd (NH3) 4 (NO2) 2.It is mainly in order to form the plating palladium layers with needle crystal on surface.

Just about how to improve electroplate liquid, the coating of each electronic product can be widely used in and possess the not corresponding research of good effect.

Summary of the invention

For solving the problems of the technologies described above, the invention provides a kind of electroplate liquid, can all kinds of coating of widespread use and each electronic product.

For solving the problems of the technologies described above, the concrete technical scheme that the present invention takes is:

Electroplate liquid, comprises the ion source of hydrophosphate, complexing agent, coating, and the ion source of described coating is the multiple of palladium salt, mantoquita, golden salt, pink salt, cobalt salt wherein a kind of or any mass ratio.

Wherein, the ion source mass concentration 63-80g/L of hydrophosphate mass concentration 77-90g/L, complexing agent mass concentration 10-13g/L, coating.

As the preferred technical solution of the present invention, described hydrophosphate is dipotassium hydrogen phosphate, Sodium phosphate dibasic, DAP or phosphoric acid hydrogen zinc.

As the preferred technical solution of the present invention, described complexing agent is aminocarboxylic acids complexing agent, carboxylic aminocarboxylic acids complexing agent or methylenephosphonic acid ester class complexing agent.

As the preferred technical solution of the present invention, described aminocarboxylic acid complexing agent is preferably: NTA, EDTA, DTPA, EDETATE SODIUM or EDTA tetra-sodium.

As the preferred technical solution of the present invention, carboxylic aminocarboxylic acids is preferably: HEDTA, EGTA or dicarboxyl glycine.

As the preferred technical solution of the present invention, methylenephosphonic acid ester class complexing agent is preferably amino two methene phosphonates, Amino Trimethylene Phosphonic Acid salt, ethylene diamine tetra methylene phosphonic acid salt, diethylene triamine pentamethylene phosphonic salt or hydroxyethylethylene diamine three methylenephosphonic acid.

As the preferred technical solution of the present invention, also comprise dust technology.

As the preferred technical solution of the present invention, described dust technology mass concentration is 8-10g/L.

Beneficial effect of the present invention:

1, plating solution composition of the present invention is simple, impurity tolerance is large;

2, the ion source of coating is that wherein a kind of or any mass ratio is multiple for palladium salt, mantoquita, golden salt, pink salt, cobalt salt, obtain different coating, and Deposit appearance is good by the ion source adjusting coating;

3, add hydrophosphate composition in electroplate liquid, add complexing agent, improve bath stability, ensure quality of coating, production range is wide.

Embodiment

In order to understand technical scheme of the present invention and beneficial effect better, hereafter the preferred embodiment of the present invention is illustrated in greater detail in conjunction with the embodiments.Should be appreciated that these explanations are only exemplary, and should not be construed as and by any way the present invention is construed as limiting.

Embodiment 1

The component of electroplate liquid and the large mass concentration of each component are:

Dipotassium hydrogen phosphate 77g/L

NTA 10g/L

Palladous nitrate 63g/L

Implementation result: coating crystallization shape is particulate state, Plating appearance semi-gloss.

Embodiment 2

Sodium phosphate dibasic 90g/L

EDTA 13g/L

Copper sulfate 80g/L

Dust technology 8g/L

Implementation result: coating crystallization shape needle-like, Plating appearance gloss.

Embodiment 3

DAP 80g/L

DTPA 11g/L

Nitric acid gold 65g/L

Dust technology 8.5g/L

Implementation result: coating crystallization shape is needle-like and particulate state, Plating appearance semi-gloss.

Embodiment 4

Phosphoric acid hydrogen zinc 80g/L

EDETATE SODIUM 12g/L

Hydroxy methane sulfonic acid tin 70g/L

Dust technology 9g/L

Embodiment 5

Dipotassium hydrogen phosphate 83g/L

EDTA tetra-sodium 11g/L

CoF2 76g/L

Dust technology 9.5g/L

Embodiment 6

Phosphoric acid hydrogen zinc 80g/L

HEDTA 10g/L

Palladous nitrate 63g/L

Cupric nitrate 80g/L

Dust technology 10g/L

Embodiment 7

DAP 81g/L

EGTA 11g/L

Palladous nitrate 63g/L

Cupric nitrate 70g/L

Nitric acid gold 80g/L

Dust technology 10g/L

Embodiment 8

Dipotassium hydrogen phosphate 79g/L

Dicarboxyl glycine 11g/L

Methanesulfonic tin 73g/L

Dust technology 8.5g/L

Embodiment 9

DAP 83g/L

Amino two methene Alendronate 13g/L

Palladous nitrate 68g/L

Dust technology 9g/L

Embodiment 10

Phosphoric acid hydrogen zinc 79g/L

Amino Trimethylene Phosphonic Acid sodium 12g/L

Co(NO3)2 75g/L

Dust technology 8.8g/L

Implementation result: coating crystallization shape needle-like and particulate state, Plating appearance semi-gloss.

Embodiment 11

DAP 79g/L

Hydroxyethylethylene diamine three methylenephosphonic acid 13g/L

Palladous nitrate 63g/L

CoBr2 80g/L

Dust technology 9g/L

Embodiment 12

Phosphoric acid hydrogen zinc 86g/L

Ethylene diamine tetra methylene phosphonic acid potassium 12.2g/L

CoBr2 77g/L

Dust technology 9.5g/L

Implementation result: coating crystallization shape: needle-like, Plating appearance gloss.

Embodiment 13

DAP 80g/L

Diethylene triamine pentamethylene phosphonic sodium 11.3g/L

Propane sulfonic acid tin 72.1g/L

CoF2 68.4g/L

Dust technology 8.8g/L

With reference to embodiment, specific descriptions have been done to the preferred embodiment of the present invention above, but these descriptions are only illustrative and nonrestrictive.Those skilled in the art, under the prerequisite not departing from marrow of the present invention and scope, can make various apparent change and amendment to these preferred implementations, and these change or amended embodiment still drops in protection scope of the present invention.

Claims

1. electroplate liquid, is characterized in that: the ion source comprising hydrophosphate, complexing agent and coating, and the ion source of described coating is the multiple of palladium salt, mantoquita, golden salt, pink salt, cobalt salt wherein a kind of or any mass ratio.

2. electroplate liquid according to claim 1, is characterized in that: the ionogenic mass concentration of hydrophosphate, complexing agent, coating is respectively: the ion source 63-80g/L of hydrophosphate 77-90g/L, complexing agent 10-13g/L, coating.

3. electroplate liquid according to claim 1, is characterized in that: described hydrophosphate is dipotassium hydrogen phosphate, Sodium phosphate dibasic, DAP or phosphoric acid hydrogen zinc.

4. electroplate liquid according to claim 1, is characterized in that: described complexing agent is aminocarboxylic acids complexing agent, carboxylic aminocarboxylic acids complexing agent or methylenephosphonic acid ester class complexing agent.

5. electroplate liquid according to claim 4, is characterized in that: described aminocarboxylic acid complexing agent is preferably: NTA, EDTA, DTPA, EDETATE SODIUM or EDTA tetra-sodium.

6. electroplate liquid according to claim 4, is characterized in that: carboxylic aminocarboxylic acids is preferably: HEDTA, EGTA or dicarboxyl glycine.

7. electroplate liquid according to claim 4, is characterized in that: methylenephosphonic acid ester class complexing agent is preferably amino two methene phosphonates, Amino Trimethylene Phosphonic Acid salt, ethylene diamine tetra methylene phosphonic acid salt, diethylene triamine pentamethylene phosphonic salt or hydroxyethylethylene diamine three methylenephosphonic acid.

8. the electroplate liquid according to claim 1,2,3,4,5,6 or 7, is characterized in that: also comprise dust technology.

9. electroplate liquid according to claim 8, is characterized in that: described dust technology mass concentration is 8-10g/L.