CN104990175A - Radiation heat exchange plate assembly - Google Patents
Radiation heat exchange plate assembly Download PDFInfo
- Publication number
- CN104990175A CN104990175A CN201510450102.8A CN201510450102A CN104990175A CN 104990175 A CN104990175 A CN 104990175A CN 201510450102 A CN201510450102 A CN 201510450102A CN 104990175 A CN104990175 A CN 104990175A
- Authority
- CN
- China
- Prior art keywords
- heat exchange
- decoration panel
- heat
- radiation
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 56
- 238000005034 decoration Methods 0.000 claims description 51
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 51
- 238000009413 insulation Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 abstract description 11
- 239000013078 crystal Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 229910052755 nonmetal Inorganic materials 0.000 abstract 1
- 238000002834 transmittance Methods 0.000 abstract 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 10
- 239000004800 polyvinyl chloride Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000191 radiation effect Effects 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000013529 heat transfer fluid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- -1 steam Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0089—Systems using radiation from walls or panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Laminated Bodies (AREA)
Abstract
The embodiment of the invention discloses a radiation heat exchange plate assembly, which comprises a veneer, a heat exchange component and a support piece arranged between the veneer and the heat exchange component, wherein a hollow layer is formed between the veneer and the heat exchange component through the support piece, or a heat exchange base of the heat exchange component is of a box-shaped structure with a hollow layer. According to the radiation heat exchange plate assembly provided by the invention, the hollow layer is formed between the veneer and the heat exchange component, or the heat exchange base of the heat exchange component is directly formed into the hollow layer. According to the invention, the hollow layer is used for replacing the non-metal heat conducting layer in the prior art, the infrared transmittance of the hollow layer is higher than that of a PVC crystal plate, the radiation heat exchange effect is more obvious, the PVC material is omitted, the cost can be reduced, the quality is lightened, and the deformation along with the temperature change can be avoided.
Description
Technical field
The present invention relates to radiant panel technical field of heat exchange, more particularly, relate to a kind of radiation heat transfer board component.
Background technology
Most of air-conditioning system of the prior art is using the Transfer Medium of air as heat.But air conditioning energy consumption is higher, human sense of comfort is poor, and is unfavorable for getting rid of the pollutant in room air, and therefore radiant panel heat transfer technology arises at the historic moment.
Existing radiation heat transfer board component comprises metal radiant panel (decoration panel), heat exchanger components and outer cover.Arrange transparent nonmetallic heat conductive layer between metal radiant panel and heat exchanger components, nonmetallic heat conductive layer upper and lower surface contacts with heat exchanger components and metal radiant panel respectively.Heat exchanger components is made up of heat exchange pedestal and heat exchange coil usually, for passing into heat transferring medium in heat exchange coil, be used for heat heat transferring medium mainly contain hot water, steam, combustion gas, fuel oil etc., be used for freeze heat transferring medium mainly cold water, evaporant (freon, liquefied ammonia) etc.
Usually PVC (Polyvinyl chloride is adopted in prior art, polyvinyl chloride) crystal slab is as the equal hot material of nonmetallic heat conductive layer, to make the plate surface temperature of metal radiant panel more even, but PVC crystal slab heavier mass, cost is higher, and varies with temperature and easily deform.
Therefore, how to reduce costs, weight reduction, avoid varying with temperature and the distortion occurred, become the technical problem that those skilled in the art are urgently to be resolved hurrily.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of radiation heat transfer board component, to reduce costs, weight reduction, avoids varying with temperature and the distortion occurred.
For achieving the above object, the invention provides following technical scheme:
A kind of radiation heat transfer board component, comprises decoration panel and heat exchanger components, also comprises the support member be arranged between described decoration panel and described heat exchanger components, forms hollow layer between described decoration panel and described heat exchanger components by described support member.
Preferably, in above-mentioned radiation heat transfer board component, described hollow layer is air layer or vacuum layer.
Preferably, in above-mentioned radiation heat transfer board component, described heat exchanger components comprises:
Heat exchange pedestal, forms described hollow layer between described heat exchange pedestal and described decoration panel;
Heat exchange coil, described heat exchange coil is arranged in the side of described heat exchange pedestal back to described support member.
Preferably, in above-mentioned radiation heat transfer board component, described heat exchange seat surface is coated with infrared radiating coating to the surface back to described support member.
Preferably, in above-mentioned radiation heat transfer board component, also comprise:
Be arranged on the outer cover on described decoration panel;
Be arranged in the heat-insulation layer between described outer cover and described heat exchanger components.
Preferably, in above-mentioned radiation heat transfer board component, the one side of described outer cover described heat-insulation layer dorsad scribbles reflector layer.
A kind of radiation heat transfer board component, comprise decoration panel and heat exchanger components, described heat exchanger components comprises heat exchange pedestal and heat exchange coil;
Described heat exchange pedestal is the box like structure with hollow layer;
Described heat exchange pedestal is arranged on described decoration panel;
Described heat exchange coil is arranged in the side of described heat exchange pedestal back to described decoration panel.
Preferably, in above-mentioned radiation heat transfer board component, described hollow layer is air layer or vacuum layer.
Preferably, in above-mentioned radiation heat transfer board component, the described heat exchange pedestal inwall parallel with described decoration panel is coated with infrared radiating coating.
Preferably, in above-mentioned radiation heat transfer board component, also comprise:
Be arranged on the outer cover on described decoration panel;
Be arranged in the heat-insulation layer between described outer cover and described heat exchanger components, the one side of described outer cover described heat-insulation layer dorsad scribbles reflector layer.
As can be seen from above-mentioned technical scheme, radiation heat transfer board component provided by the invention, forms hollow layer between decoration panel and heat exchanger components, or directly the heat exchange pedestal of heat exchanger components is formed hollow layer.The present invention is by replacing nonmetallic heat conductive layer of the prior art by hollow layer, comparatively PVC crystal slab is higher for the infrared transmittivity of hollow layer, and thermal radiation effect is more remarkable, cancel this PVC material, can reduce costs, alleviate quality, nor can vary with temperature and deform.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The explosive view of the radiation heat transfer board component that Fig. 1 provides for the embodiment of the present invention;
The profile of the radiation heat transfer board component that Fig. 2 provides for the embodiment of the present invention;
The profile of the radiation heat transfer board component that Fig. 3 provides for another embodiment of the present invention.
Wherein, 101 is outer cover, and 102 is heat-insulation layer, and 103 is heat exchange pedestal, and 104 is heat exchange coil, and 105 is support member, and 106 is decoration panel, and 107 is hollow layer.
Detailed description of the invention
Core of the present invention is to provide a kind of radiation heat transfer board component, and to reduce costs, weight reduction, avoids varying with temperature and the distortion occurred.
Below, with reference to accompanying drawing, embodiment is described.In addition, the embodiment shown in below does not play any restriction effect to the summary of the invention described in claim.In addition, the solution that the full content of the formation below represented by embodiment is not limited to as the invention described in claim is necessary.
Refer to Fig. 1 and Fig. 2, the explosive view of the radiation heat transfer board component that Fig. 1 provides for the embodiment of the present invention; The profile of the radiation heat transfer board component that Fig. 2 provides for the embodiment of the present invention.
The radiation heat transfer board component that the embodiment of the present invention provides comprises decoration panel 106, heat exchanger components and support member 105.
Decoration panel 106 i.e. radiant panel is the part in direct faced chamber, has good outward appearance and enough intensity.Support member 105 is arranged between decoration panel 106 and heat exchanger components, decoration panel 106 is not directly contacted with heat exchanger components, namely forms hollow layer 107 by support member 105 between decoration panel 106 and heat exchanger components.Decoration panel 106 does not directly contact with heat exchanger components, and the plate surface temperature of decoration panel 106 can be made more even.
Radiation heat transfer board component provided by the invention, forms hollow layer 107 between decoration panel 106 and heat exchanger components.The present invention is by replacing nonmetallic heat conductive layer of the prior art by hollow layer 107, and comparatively PVC crystal slab is higher for the infrared transmittivity of hollow layer 107, and thermal radiation effect is more remarkable, cancel this PVC material, can reduce costs, alleviate quality, nor can vary with temperature and deform.
In the present invention one specific embodiment, hollow layer 107 can be air layer, also can be vacuum layer.If air layer, so heat exchanger components can directly be arranged on support member 105, without the need to doing other process; If vacuum layer, need to seal between heat exchanger components and decoration panel 106, and the middle hollow layer 107 formed vacuumizes.
In the present invention one specific embodiment, heat exchanger components comprises heat exchange pedestal 103 and heat exchange coil 104.Form hollow layer 107 between heat exchange pedestal 103 and decoration panel 106, heat exchange coil 104 is arranged in the side of heat exchange pedestal 103 back to support member 105.Heat exchange coil 104 for carrying heat-transfer fluid, with can adopt between heat exchange pedestal 103 bonding, weld, the mode such as fixing clamping is fixed.Heat exchange pedestal 103 is for carrying out lateral transport by the heat of heat exchange coil 104.
During cooling operating mode, when cooling medium is through heat exchange coil 104, with the heat transfer of heat exchange coil 104, heat exchange pedestal 103, by the radiation heat transfer of heat exchange pedestal 103 with decoration panel 106, decoration panel 106 temperature is reduced, and then carry out heat exchange with indoor airflow, thus reduce heat source temperature, reach the effect of cooling.Similar for thermal condition principle, repeat no more.
Further, heat exchange pedestal 103 is coated with infrared radiating coating towards with the surface back to support member 105.Warm-up movement between material and infra-red radiation have inherent close ties, all can emitting electromagnetic wave when material molecule does warm-up movement, and the frequency of material molecule warm-up movement is just in time in infra-red range, so the electromagnetic wave launched is exactly mainly infra-red radiation.Infrared radiating coating can improve the radiation coefficient on heat exchange pedestal 103 surface, effectively will improve diabatic process, reaches energy-conservation object.Black matrix has best radiation characteristic, and can all absorb and launch the radiation of any wavelength at any temperature, therefore infrared radiating coating is black coating.
In the present invention one specific embodiment, the present invention also can comprise outer cover 101 and heat-insulation layer 102.Wherein, outer cover 101 is arranged on decoration panel 106, for the protection of radiation heat exchange plate component internal structure; the structure of decoration panel 106 can be same as the prior art; be the box like structure of one end open, outer cover 101 is arranged at the openend of decoration panel 106, and is tightly connected with openend.Decoration panel 106 part parallel with outer cover 101 is the part in direct faced chamber.Heat-insulation layer 102 is arranged between outer cover 101 and heat exchanger components, for reducing to the heat loss through conduction on outer cover 101 direction, insulating sponge or foaming forming technique can be adopted to be incubated.
Further, the one side of outer cover 101 heat-insulation layer 102 dorsad scribbles reflector layer, for reducing external heat loss through radiation.
Refer to Fig. 3, the profile of the radiation heat transfer board component that Fig. 3 provides for another embodiment of the present invention.
The radiation heat transfer board component that another embodiment of the present invention provides comprises decoration panel 106 and heat exchanger components, and wherein, heat exchanger components comprises heat exchange pedestal 103 and heat exchange coil 104.Heat exchange pedestal 103 is for having the box like structure of hollow layer 107, and heat exchange pedestal 103 is arranged on decoration panel 106.Heat exchange pedestal 103 is owing to having hollow layer 107, and the surface therefore making heat exchange pedestal 103 contact with heat exchange coil 104 and the surface contacted with decoration panel 106 are separated by hollow layer 107, and the plate surface temperature of decoration panel 106 can be made more even.
Heat exchange coil 104 is arranged in the side of heat exchange pedestal 103 back to decoration panel 106, heat exchange coil 104 for carrying heat-transfer fluid, with can adopt between heat exchange pedestal 103 bonding, weld, the mode such as fixing clamping is fixed.Heat exchange pedestal 103 is for carrying out lateral transport by the heat of heat exchange coil 104.
During cooling operating mode, when cooling medium is through heat exchange coil 104, with the heat transfer of heat exchange coil 104, heat exchange pedestal 103, by the radiation heat transfer of heat exchange pedestal 103 with decoration panel 106, decoration panel 106 temperature is reduced, and then carry out heat exchange with indoor airflow, thus reduce heat source temperature, reach the effect of cooling.Similar for thermal condition principle, repeat no more.
Radiation heat transfer board component provided by the invention, directly forms hollow layer 107 by the heat exchange pedestal of heat exchanger components.The present invention is by replacing nonmetallic heat conductive layer of the prior art by hollow layer 107, and comparatively PVC crystal slab is higher for the infrared transmittivity of hollow layer 107, and thermal radiation effect is more remarkable, cancel this PVC material, can reduce costs, alleviate quality, nor can vary with temperature and deform.
In the present invention one specific embodiment, hollow layer 107 can be air layer, also can be vacuum layer.If air layer, so without the need to doing other process; If vacuum layer, need to vacuumize hollow layer 107.The hollow layer 107 of heat exchange pedestal 103 can be divided into multiple hollow layer by arranging support member 105 pairs of hollow layers 107, also can without the need to arranging support member 105.
In the present invention one specific embodiment, heat exchange pedestal 103 inwall parallel with decoration panel 106 is coated with infrared radiating coating.Warm-up movement between material and infra-red radiation have inherent close ties, all can emitting electromagnetic wave when material molecule does warm-up movement, and the frequency of material molecule warm-up movement is just in time in infra-red range, so the electromagnetic wave launched is exactly mainly infra-red radiation.Infrared radiating coating can improve the radiation coefficient on heat exchange pedestal 103 surface, effectively will improve diabatic process, reaches energy-conservation object.Black matrix has best radiation characteristic, and can all absorb and launch the radiation of any wavelength at any temperature, therefore infrared radiating coating is black coating.
In the present invention one specific embodiment, the present invention also can comprise outer cover 101 and heat-insulation layer 102.Wherein, outer cover 101 is arranged on decoration panel 106, for the protection of radiation heat exchange plate component internal structure; the structure of decoration panel 106 can be same as the prior art; be the box like structure of one end open, outer cover 101 is arranged at the openend of decoration panel 106, and is tightly connected with openend.Decoration panel 106 part parallel with outer cover 101 is the part in direct faced chamber.Heat-insulation layer 102 is arranged between outer cover 101 and heat exchanger components, for reducing to the heat loss through conduction on outer cover 101 direction, insulating sponge or foaming forming technique can be adopted to be incubated.
Further, the one side of outer cover 101 heat-insulation layer 102 dorsad scribbles reflector layer, for reducing external heat loss through radiation.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a radiation heat transfer board component, comprise decoration panel (106) and heat exchanger components, it is characterized in that, also comprise the support member (105) be arranged between described decoration panel (106) and described heat exchanger components, between described decoration panel (106) and described heat exchanger components, form hollow layer (107) by described support member (105).
2. radiation heat transfer board component as claimed in claim 1, it is characterized in that, described hollow layer (107) is air layer or vacuum layer.
3. radiation heat transfer board component as claimed in claim 1 or 2, it is characterized in that, described heat exchanger components comprises:
Heat exchange pedestal (103), forms described hollow layer (107) between described heat exchange pedestal (103) and described decoration panel (106);
Heat exchange coil (104), described heat exchange coil (104) is arranged in the side of described heat exchange pedestal (103) back to described support member (105).
4. radiation heat transfer board component as claimed in claim 3, it is characterized in that, described heat exchange pedestal (103) is coated with infrared radiating coating towards with the surface back to described support member (105).
5. radiation heat transfer board component as claimed in claim 3, is characterized in that, also comprise:
Be arranged on the outer cover (101) on described decoration panel (106);
Be arranged in the heat-insulation layer (102) between described outer cover (101) and described heat exchanger components.
6. radiation heat transfer board component as claimed in claim 5, is characterized in that, the one side of described outer cover (101) described heat-insulation layer (102) dorsad scribbles reflector layer.
7. a radiation heat transfer board component, comprises decoration panel (106) and heat exchanger components, it is characterized in that, described heat exchanger components comprises heat exchange pedestal (103) and heat exchange coil (104);
Described heat exchange pedestal (103) is for having the box like structure of hollow layer (107);
Described heat exchange pedestal (103) is arranged on described decoration panel (106);
Described heat exchange coil (104) is arranged in the side of described heat exchange pedestal (103) back to described decoration panel (106).
8. radiation heat transfer board component as claimed in claim 7, it is characterized in that, described hollow layer (107) is air layer or vacuum layer.
9. radiation heat transfer board component as claimed in claim 7, it is characterized in that, the inwall that described heat exchange pedestal (103) is parallel with described decoration panel (106) is coated with infrared radiating coating.
10. the radiation heat transfer board component as described in any one of claim 7-9, is characterized in that, also comprise:
Be arranged on the outer cover (101) on described decoration panel (106);
Be arranged in the heat-insulation layer (102) between described outer cover (101) and described heat exchanger components, the one side of described outer cover (101) described heat-insulation layer (102) dorsad scribbles reflector layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510450102.8A CN104990175A (en) | 2015-07-28 | 2015-07-28 | Radiation heat exchange plate assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510450102.8A CN104990175A (en) | 2015-07-28 | 2015-07-28 | Radiation heat exchange plate assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104990175A true CN104990175A (en) | 2015-10-21 |
Family
ID=54302029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510450102.8A Pending CN104990175A (en) | 2015-07-28 | 2015-07-28 | Radiation heat exchange plate assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104990175A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105744802A (en) * | 2016-01-12 | 2016-07-06 | 严继光 | Radiant air conditioning system for heating equipment |
| CN109716497A (en) * | 2016-09-22 | 2019-05-03 | 应用材料公司 | For the temperature controlled heater pedestal component of wide scope |
| CN111023551A (en) * | 2019-11-23 | 2020-04-17 | 苏州奥和通风系统有限公司 | Non-wind-induction cold and heat radiation temperature adjusting device and indoor temperature adjusting system |
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|---|---|---|---|---|
| JPH0926167A (en) * | 1995-07-12 | 1997-01-28 | Sekisui Chem Co Ltd | Radiation cooling and heating panel |
| JPH10220826A (en) * | 1997-01-31 | 1998-08-21 | Toshiba Corp | Radiation type air conditioning system |
| CN201637044U (en) * | 2010-03-26 | 2010-11-17 | 杭州源牌环境科技有限公司 | Modularized radiant panel |
| CN102162672A (en) * | 2011-04-22 | 2011-08-24 | 严继光 | Outdoor-usable radiating heat exchange plate and corresponding plate type radiating air conditioner |
| CN103822318A (en) * | 2012-11-19 | 2014-05-28 | 珠海格力电器股份有限公司 | Radiant heat exchanger plate assembly |
| CN104390263A (en) * | 2014-10-24 | 2015-03-04 | 珠海格力电器股份有限公司 | Radiation heat exchange plate and central air conditioning system |
| CN104633775A (en) * | 2015-02-04 | 2015-05-20 | 湖南大学 | Moisture condensation resistant radiant panel and manufacturing method thereof |
| CN204757240U (en) * | 2015-07-28 | 2015-11-11 | 珠海格力电器股份有限公司 | Radiation heat exchange plate assembly |
-
2015
- 2015-07-28 CN CN201510450102.8A patent/CN104990175A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0926167A (en) * | 1995-07-12 | 1997-01-28 | Sekisui Chem Co Ltd | Radiation cooling and heating panel |
| JPH10220826A (en) * | 1997-01-31 | 1998-08-21 | Toshiba Corp | Radiation type air conditioning system |
| CN201637044U (en) * | 2010-03-26 | 2010-11-17 | 杭州源牌环境科技有限公司 | Modularized radiant panel |
| CN102162672A (en) * | 2011-04-22 | 2011-08-24 | 严继光 | Outdoor-usable radiating heat exchange plate and corresponding plate type radiating air conditioner |
| CN103822318A (en) * | 2012-11-19 | 2014-05-28 | 珠海格力电器股份有限公司 | Radiant heat exchanger plate assembly |
| CN104390263A (en) * | 2014-10-24 | 2015-03-04 | 珠海格力电器股份有限公司 | Radiation heat exchange plate and central air conditioning system |
| CN104633775A (en) * | 2015-02-04 | 2015-05-20 | 湖南大学 | Moisture condensation resistant radiant panel and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105744802A (en) * | 2016-01-12 | 2016-07-06 | 严继光 | Radiant air conditioning system for heating equipment |
| WO2017121321A1 (en) * | 2016-01-12 | 2017-07-20 | 严继光 | Radiant air conditioning system for heat-producing device |
| CN105744802B (en) * | 2016-01-12 | 2018-05-11 | 严继光 | Radiation-type air conditioner system for heat-producing device |
| CN109716497A (en) * | 2016-09-22 | 2019-05-03 | 应用材料公司 | For the temperature controlled heater pedestal component of wide scope |
| CN109716497B (en) * | 2016-09-22 | 2023-09-26 | 应用材料公司 | Heater base assembly for wide range temperature control |
| CN111023551A (en) * | 2019-11-23 | 2020-04-17 | 苏州奥和通风系统有限公司 | Non-wind-induction cold and heat radiation temperature adjusting device and indoor temperature adjusting system |
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| C06 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20151021 |